Automatic optical device for detecting appearance flaws of chip through five optical paths

Abstract

The utility model discloses an automatic optical device for five-optical-path detection of chip appearance flaws, which belongs to the technical field of semiconductor chip appearance flaw detection and comprises a camera component, a reflection component, an external coaxial light source and a position adjusting mechanism, the reflection component is positioned on one side of the camera component and used for reflecting imaging light of a chip to the camera component, and the external coaxial light source is positioned on the other side of the camera component. The outer coaxial light source is arranged between the camera assembly and the reflection assembly, the outer coaxial light source is used for emitting light for chip imaging towards the reflection assembly, the reflection assembly is further used for reflecting the light of the outer coaxial light source to a chip, the position adjusting mechanism is provided with a movable end, the distance between the movable end and the reflection assembly can be adjusted, and the camera assembly is installed at the movable end. An inner coaxial light source is changed into an outer coaxial light source, the hardware defect of halo of a lamp bead is avoided, the distance between the camera assembly and the reflection assembly can be adjusted by arranging the position adjusting mechanism, and therefore the working efficiency and usability of a product are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor chip appearance flaw detection technical field especially relates to a 5 light path detection chip appearance flaw's automatic optical device. BACKGROUND

[0002] AOI (Automated Optical Inspection) detects chip appearance defect and is an automatic detection technology based on optical principle, which uses high-speed high-resolution camera and combined light source lighting technology to scan and collect images on chip surface, and then compares the collected images with standard images through image processing technology to find defects, damage, pollution and other problems on chip surface.

[0003] A kind of automatic optical detection device for detecting chip five-face appearance flaw once, application number: 2024112142844, application date: August 31, 2024 is disclosed in Chinese patent database.The automatic optical detection device for detecting chip five-face appearance flaw once, including a camera, a lens, a coaxial light group, a rhombus mirror group and a ring light source, for realizing the detection of 5 faces of chip once;Coaxial light group collects chip 1 large face by up-down reflection;Ring light source, after illuminating rhombus mirror group, the 4 sides of chip located in rhombus mirror group are reflected downward, and the 4 faces of chip are reflected and collected by coaxial light group;After reflection by coaxial light group, the light path parallel to lens passes through lens to camera imaging.

[0004] The deficiency of the above technical scheme is that: since the working distance of the lens and the first reflector is not adjustable, the position of the chip to be detected must be fixed and not adjustable, thereby reducing the ease of use of the detection device;At the same time, since the coaxial light source is located directly below the first reflector, light halo will be generated during work, thereby affecting the imaging effect, if the brightness of the lamp is adjusted, the image cannot be formed obviously, and there is a problem of affecting image calculation. UTILITY MODEL CONTENT

[0005] The automatic optical device for detecting chip appearance flaw of 5 light paths provided by the embodiment of the application is used to solve the technical problems of poor ease of use and influence of coaxial light source on appearance detection existing in the prior art optical detection device.

[0006] The automatic optical device for detecting chip appearance flaw of 5 light paths provided by the embodiment of the application comprises:

[0007] A camera assembly;

[0008] A reflection assembly is located on one side of the camera assembly, and the reflection assembly is used to reflect the imaging light of the chip to the camera assembly;

[0009] An outer coaxial light source is arranged between the camera assembly and the reflection assembly, and is used to emit the imaging light towards the reflection assembly.

[0010] A position adjusting mechanism has a movable end with adjustable distance from the reflection assembly, and the camera assembly is mounted on the movable end.

[0011] The above embodiment has the beneficial effects that the original structure of the inner coaxial light source is changed into the outer coaxial light source, the hardware defect of the light halo is avoided, the position adjusting mechanism is arranged, the distance between the camera assembly and the reflection assembly can be adjusted, and the working efficiency and the usability of the product are improved.

[0012] On the basis of the above embodiment, the embodiment of the present application can also be improved as follows:

[0013] In one embodiment of the present application, the position adjusting mechanism is an X-axis automatic sliding table.

[0014] In one embodiment of the present application, the reflection assembly comprises a box body arranged adjacent to the outer coaxial light source, and a first reflector mounted in the box body and used to reflect the imaging light and the imaging light.

[0015] In one embodiment of the present application, it further comprises a ring light reflection assembly mounted above the reflection assembly, and the ring light reflection assembly has a detection area for placing the chip in the middle, and is used to generate the imaging light on the side of the chip and reflect the imaging light on the side of the chip to the reflection assembly. The beneficial effect of this step is that the appearance imaging function of the four sides of the chip is realized through the ring light reflection assembly.

[0016] In one embodiment of the present application, the ring light reflection assembly comprises a ring light source mounted on the reflection assembly, and a second reflector mounted above the ring light source and surrounding the detection area. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed in the specific embodiments or the prior art description will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual scale.

[0018] Figure 1 It is a structural schematic diagram of an automatic optical device.

[0019] Figure 2 It is a partial structural schematic diagram of an automatic optical device.

[0020] Figure 3 Structure diagram of the second mirror mounting structure between the first mounting plate and the second mounting plate;

[0021] Figure 4 First exploded structure diagram of the second mirror mounting structure;

[0022] Figure 5 Second exploded structure diagram of the second mirror mounting structure;

[0023] Figure 6 Light path diagram when the automatic optical device detects the appearance of the chip.

[0024] Wherein, 1 camera assembly, 2 reflection assembly, 201 box body, 202 first mirror, 203 first hole body, 204 second hole body, 3 outer coaxial light source, 4 position adjusting mechanism, 5 bottom plate, 6 support, 7 vertical plate, 8 clamping block, 9 pad, 10 ring light reflection assembly, 1001 detection area, 1002 ring light source, 1003 second mirror, 1004 positioning column, 1005 first mounting plate, 1006 second mounting plate. DETAILED DESCRIPTION

[0025] In the present application, unless otherwise explicitly specified and limited, the terms in the present application should be understood in a broad sense, for example, the connection can be fixed connection, or detachable connection or integral, can be directly connected, or indirectly connected through intermediate medium. If it involves power, electronic equipment, it can also be electrically connected or communication signal connection, etc. For ordinary skilled in the art, different terms in the present application can be understood according to the specific meaning of the specific circumstances, the scope of the specific meaning should be limited to the function of the present application.

[0026] In the description of the present application, it should be understood that the orientation terms or position relationship description is based on the orientation or position relationship shown in the drawings, or based on the orientation or position relationship in actual use, only for the convenience of describing the content of the present application and simplifying the description, and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore it cannot be understood as a limitation of the present application.

[0027] EMBODIMENT

[0028] As Figures 1-6As shown, an automatic optical device for detecting chip appearance defects using five optical paths includes: a camera assembly 1, a reflective assembly 2, an external coaxial light source 3, and a position adjustment mechanism 4. The reflective assembly 2 is located on one side of the camera assembly 1 and is used to reflect the imaging light of the chip to the camera assembly 1. The external coaxial light source 3 is disposed between the camera assembly 1 and the reflective assembly 2 and is used to emit chip imaging light toward the reflective assembly 2. The reflective assembly 2 is also used to reflect the light from the external coaxial light source 3 to the chip. The position adjustment mechanism 4 has a movable end that is adjustable in distance from the reflective assembly 2, and the camera assembly 1 is mounted on the movable end.

[0029] In some embodiments of this application, such as Figure 1 As shown, the automatic optical device also includes: a base plate 5, a camera assembly 1, a reflective assembly 2, an external coaxial light source 3, and a position adjustment mechanism 4, all of which are mounted on the base plate 5.

[0030] In some embodiments of this application, the position adjustment mechanism 4 is an X-axis automatic slide table, which is an existing product and can be purchased directly.

[0031] In some embodiments of this application, such as Figure 1 As shown, camera assembly 1 includes: a camera, a lens, and a support 6 mounted on the movable part of the X-axis automatic slide. The support 6 has upright plates 7 at both ends. The upright plates 7 have grooves that match the shape of the lens. The lens is placed in the grooves. A clamping block 8 is also connected above the upright plate 7. The clamping block 8 also has a groove that matches the shape of the lens. The clamping block 8 is connected to the upright plate 7, thereby positioning the lens on the X-axis automatic slide. The camera is a CCD camera, and the camera is mounted on the other side of the lens relative to the external coaxial light source 3.

[0032] In some embodiments of this application, such as Figure 1 As shown, the external coaxial light source 3 is mounted on the pad 9. The pad 9 is used to adjust the height of the external coaxial light source 3 to match the height of the lens. The external coaxial light source 3 is an existing product and can be purchased directly.

[0033] In some embodiments of this application, such as Figure 2 As shown, the reflective assembly 2 includes: a housing 201 and a first reflector 202. The housing 201 has a square structure and is arranged adjacent to the external coaxial light source 3. The first reflector 202 is installed in the housing 201. The housing 201 has a first hole 203 facing the external coaxial light source 3 and a second hole 204 on the upper surface of the housing 201. Both the first hole 203 and the second hole 204 are through holes. The first reflector 202 is arranged at a 45° angle between the first hole 203 and the second hole 204. The first reflector 202 is used to reflect imaging light and imaging light.

[0034] In some embodiments of this application, such asFigure 1 , 3 As shown, the automatic optical device also includes: a ring light reflection component 10, which is mounted above the reflection component 2. The ring light reflection component 10 has a detection area 1001 in the middle for placing the chip. The ring light reflection component 10 is used to generate imaging light on the side of the chip and reflect the imaging light on the side of the chip to the reflection component 2. The ring light reflection component 10 is used to realize the appearance imaging function of the four sides of the chip.

[0035] In some embodiments of this application, such as Figure 2 As shown, the ring light reflection assembly 10 includes: a ring light source 1002 and a second reflector 1003. The ring light source 1002 is installed on the reflection assembly 2. The ring light source 1002 is an existing product and can be purchased directly. The second reflector 1003 is installed above the ring light source 1002. The second reflector 1003 surrounds and forms the detection area 1001 where the chip is placed. The ring light source 1002 is used to emit imaging light toward the side of the chip between the second reflectors 1003.

[0036] In some embodiments of this application, such as Figures 2-5 As shown, the ring light reflector assembly 10 also includes: a positioning post 1004, a first mounting plate 1005, and a second mounting plate 1006. The first mounting plate 1005 has a mounting groove, and the second mounting plate 1006 is connected to the mounting groove. The first mounting plate 1005 forms an integral structure and is mounted on the top of the housing 201 through the positioning post 1004. The ring light source 1002 is disposed in the gap between the first mounting plate 1005 and the housing 201. The axis of the ring light source 1002 is collinear with the center line of the second hole 204 and the detection area 1001. The bottom surface of the second mounting plate 1006 has a mounting groove around the axis of the ring light source 1002. Four second reflectors 1003 are installed in the mounting groove. Adjacent second reflectors 1003 are perpendicular to each other, and two opposite second reflectors 1003 are parallel to each other. The second reflectors 1003 are isosceles right-angle prisms, and the detection area 1001 is formed between the 45° inclined surfaces of the prisms.

[0037] In some embodiments of this application, the chip is adsorbed by the nozzle of the suction cup rod, and the chip is moved to the detection area 1001 by the suction cup rod.

[0038] The working principle of this 5-optical-path automatic optical device for detecting chip appearance defects is as follows:

[0039] (1) The chip is moved into the detection area 1001 by adsorbing it with a suction nozzle;

[0040] (2) Adjust the lens position using the X-axis automatic slide to match the chip position;

[0041] (3) Light emitted by the outer coaxial light source 3, through the first reflector 202, is irradiated to the downward surface of the chip. The reflected light of the surface is reflected into the lens through the first reflector 202 again, and is imaged by the camera;

[0042] (4) Light emitted by the ring light source 1002 is reflected to the second reflector 1003 around the four side surfaces of the chip. The second reflector 1003 reflects the light to the first reflector 202, and the first reflector 202 reflects the light into the lens, which is imaged by the camera.

[0043] Therefore, through the automatic optical device, five surfaces of the chip can be detected at one time. If another surface needs to be detected, the chip only needs to be turned over for detection.

[0044] The automatic optical device has the following advantages:

[0045] (1) The conventional AOI (Automated Optical Inspection) device cannot be self-adapted to adjust the position according to the size of the chip, so there is a waiting time for line changing and machine adjusting. The automatic sliding table structure is added in the technical scheme of the present application, the position of the camera assembly 1 is changed by the sliding table, the camera assembly 1 can be focused according to chips of different specifications and sizes, so that the detection efficiency of the automatic optical device of the present application can be greatly improved.

[0046] (2) The inner coaxial light source is changed to the outer coaxial light source 3 arranged between the lens and the reflection assembly 2, which does not have the hardware defect of light halo, has higher ease of use, and can produce better detection effect, and reduce the problem of missed detection or false detection caused by light halo and imaging problem in the detection process.

[0047] In summary, compared with similar products, the automatic optical device product is more convenient to use, has higher detection efficiency and better detection effect.

[0048] The above is only an embodiment of the present application, and the common knowledge of specific structures and properties in the scheme is not described in detail, the ordinary skilled person in the art knows all the ordinary technical knowledge in the technical field of the present application before the application date or the priority date, can know all the prior art in the field, and has the ability to apply conventional experimental means before that date, the ordinary skilled person in the art can improve and implement the present scheme under the inspiration given in the present application, and some typical known structures or known methods should not be an obstacle for the ordinary skilled person in the art to implement the present application. It should be pointed out that, for those skilled in the art, without departing from the structure of the present application, a number of modifications and improvements can be made, which should also be considered as the protection scope of the present application, which will not affect the effect and practicality of the present application.

Claims

1. An automated optical device for detecting chip appearance defects using five optical paths, characterized in that, include: Camera components; A reflective component, located on one side of the camera component, is used to reflect the imaging light from the chip to the camera component; An external coaxial light source is disposed between the camera assembly and the reflective assembly, and the external coaxial light source is used to emit light for chip imaging toward the reflective assembly; The position adjustment mechanism has a movable end that is adjustable in distance from the reflective component, and the camera component is mounted on the movable end.

2. The automatic optical device according to claim 1, characterized in that, The position adjustment mechanism is an X-axis automatic slide.

3. The automatic optical device according to claim 1, characterized in that, The reflective component includes: The housing is disposed adjacent to the external coaxial light source; A first reflecting mirror is installed in the housing and is used to reflect imaging light and imaging light.

4. The automatic optical device according to claim 1, characterized in that, Also includes: A ring light reflector is mounted above the reflector. The ring light reflector has a detection area in the middle for placing the chip. The ring light reflector is used to generate imaging light from the side of the chip and reflect the imaging light from the side of the chip back to the reflector.

5. The automatic optical device according to claim 4, characterized in that, The ring light reflector component includes: A ring-shaped light source is mounted on the reflective assembly; A second reflector is mounted above the ring light source, and the second reflector surrounds and forms a detection area.

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