Test seat for material burning

Abstract

The utility model discloses a test seat for material burning, which comprises a base, a top cover and a positioning connecting mechanism, fixing holes are arranged at corners of the end face of the base and used for being connected to a PCB (printed circuit board) through bolts, a groove is arranged in the middle of the upper wall of the base, a through hole is arranged in the middle of the bottom wall of the groove, and the top cover is buckled on the upper portion of the base through a pressing mechanism. The pressing mechanisms are arranged on the two sides of the bottom of the top cover, the pressing mechanisms are symmetrically distributed, the top cover is arranged as a rectangular frame, and the positioning and connecting mechanism is arranged in the through hole in a sliding mode and used for connection and positioning of chip burning. The utility model belongs to the technical field of chip test seats, and particularly relates to a burning test seat which aims at offline burning and testing of a small-size chip and is used for pressing, positioning, burning and testing the small-size chip.

Description

Technical Field

[0001] This utility model belongs to the field of chip test socket technology, and in particular relates to a test socket for material programming. Background Technology

[0002] With the rise of wearable devices, these devices are small in size, have low power consumption, and require stable operation for extended periods. This necessitates that semiconductor chips possess the characteristics of small size and low power consumption.

[0003] The most significant advantage of WLCSP (Wafer-Level Chip Packaging) is its ability to effectively reduce package size. The high integration density of WLCSP chips necessitates the use of high-precision programming and testing sockets to ensure accurate positioning of the chip solder balls and test pins, reducing solder ball breakage and improving the yield rate of WLCSP chip programming and testing. Currently, the WLCSP chips available for offline programming and testing are typically larger than 2mm x 2mm. To address the offline programming and testing of the WLCSP8 chip (0.672mm x 1.227mm), a testing socket for material programming is proposed. Utility Model Content

[0004] The technical problem to be solved by this utility model is to realize the pressing, positioning, programming and testing of small-sized chip WLCSP8 (0.672mmX1.227).

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: a test base for burning materials, including a base, a top cover and a positioning connection mechanism;

[0006] The base has fixing holes at the corners of its end face for bolting to the PCB board. The base has a groove in the middle of its upper wall and a through hole in the middle of the bottom wall of the groove.

[0007] The top cover is fastened to the upper part of the base by a pressing mechanism. The pressing mechanism is located on both sides of the bottom of the top cover and is symmetrically distributed. The top cover is a rectangular frame.

[0008] The positioning and connection mechanism is slidably disposed in the through hole and is used for connection and positioning of the chip during programming.

[0009] Furthermore, a support step is fixedly connected between the opposite inner sidewalls of the groove. The support steps are symmetrically distributed around the through hole, and a baffle is fixedly connected to the symmetrical support steps.

[0010] A limiting groove is formed in the middle of the outer side wall of the base. The limiting groove is symmetrically arranged with the groove as the center. A slot is formed in the middle of the bottom wall of the base and is connected to the slot by a through hole.

[0011] Furthermore, the positioning and connecting mechanism includes a needle plate base, a probe plate, and a probe float. The probe float is slidably disposed in the through hole and in contact with the bottom wall of the baffle. The probe plate is fixedly connected to the upper center of the needle plate base and slidably disposed in the slot with the needle plate base to support and limit the probe float.

[0012] Furthermore, a placement groove is formed at the center of the probe float, and a notch is formed on the opposite sidewall of the placement groove.

[0013] Furthermore, a connection hole is provided at the center of the needle plate base and the probe plate, and a probe is inserted into the connection hole. The connection hole corresponds to the position of the placement slot.

[0014] Furthermore, the pressing mechanism includes a positioning plate, a connecting frame, a rotating shaft, and a pressure claw swing arm. One end of the connecting frame is fixedly connected to both sides of the bottom wall of the top cover, and the other end of the connecting frame is inserted into the groove and located on both sides of the through hole. The rotating shaft is rotatably connected between the opposite inner side walls of the connecting frame. One end of the pressure claw swing arm is fixedly connected to the middle of the outer side wall of the rotating shaft and located between the opposite inner side walls of the connecting frame. The other end of the pressure claw swing arm is pressed onto both sides of the upper part of the probe float. The positioning plate is fixedly connected to both sides of the adjacent connecting frame on the bottom wall of the top cover, and the positioning plate is slidably inserted into the limiting groove.

[0015] Furthermore, the connecting frame is arranged in an n-shape, and the end face of the positioning plate has a positioning hole.

[0016] After adopting the above structure, the beneficial effects of this utility model are as follows: For offline programming and testing of small-sized chips, the chip is positioned and placed using a probe floating plate, and the chip is connected to the connector installed on the circuit board through the probe in the base. This enables the programmer output signal to be conducted through the PCB board and the probe contact point, while the probe contacts the chip solder ball, thereby realizing the programming and testing of small-sized chips.

[0017] The probe float is pressed and positioned in the base by the pressing mechanism on both sides below the top cover, and the probe is positioned by the positioning and connecting mechanism, so that the probe is connected between the PCB board and the chip solder ball. Attached Figure Description

[0018] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0019] Figure 1 This is a schematic diagram of the overall structure of a test socket for material burning proposed in this utility model;

[0020] Figure 2An exploded view of a test fixture for material burning proposed in this utility model;

[0021] Figure 3 This is a schematic diagram of the probe structure of a test socket for material burning proposed in this utility model;

[0022] Figure 4 This utility model provides a communication wiring diagram for a test socket used for material burning.

[0023] Figure 5 This is a schematic diagram of the top cover structure of a test socket for material burning proposed in this utility model;

[0024] Figure 6 This is a schematic diagram of the base structure of a test socket for material burning proposed in this utility model;

[0025] Figure 7 for Figure 1 Enlarged view of part A.

[0026] In the attached diagram: 1. Base, 2. Top cover, 3. Positioning and connecting mechanism, 4. Fixing hole, 5. Groove, 6. Through hole, 7. Pressing mechanism, 8. Support step, 9. Baffle, 10. Limiting groove, 11. Slot, 12. Needle plate base, 13. Probe plate, 14. Probe float, 15. Placement groove, 16. Notch, 17. Connecting hole, 18. Probe, 19. Positioning plate, 20. Connecting frame, 21. Rotating shaft, 22. Pressing claw swing arm, 23. Positioning hole. Detailed Implementation

[0027] like Figure 1-7 As shown, a test socket for material burning includes a base 1, a top cover 2, and a positioning and connecting mechanism 3. The base 1 has fixing holes 4 at its end face corners for bolting to a PCB board. A groove 5 is formed in the middle of the upper wall of the base 1, and a through hole 6 is formed in the middle of the bottom wall of the groove 5. The top cover 2 is fastened to the upper part of the base 1 by a pressing mechanism 7. The pressing mechanism 7 is located on both sides of the bottom of the top cover 2 and is symmetrically distributed. The top cover 2 is a rectangular frame. The positioning and connecting mechanism 3 is slidably disposed within the through hole 6 for connecting and positioning the chip during burning. The base 1 and the top cover 2 are fastened together, and the chip is pressed and positioned by the pressing mechanism 7 after fastening. Simultaneously, the positioning and connecting mechanism 3 installed in the base 1 supports the chip and positions the probe 18, connecting the chip solder balls to the probe 18. The probe 18 is connected to a connector via the PCB board, enabling the burning and testing of small-sized chips.

[0028] like Figure 2 , Figure 5 and Figure 6As shown, in order to facilitate the engagement of the top cover 2 and the base 1, a limiting groove 10 is opened in the middle of the outer side wall of the base 1. The limiting groove 10 is symmetrically arranged with the groove 5 as the center. A slot 11 is opened in the middle of the bottom wall of the base 1, and the slot 11 is connected to the through hole 6.

[0029] like Figure 2 , Figure 6 and Figure 7 As shown, to achieve positioning, programming, and testing of small-sized chips, the positioning connection mechanism 3 includes a pin plate base 12, a probe plate 13, and a probe float 14. The probe float 14 is slidably disposed within the through hole 6 and contacts the bottom wall of the baffle 9. The probe plate 13 is fixedly connected to the upper center of the pin plate base 12 and slidably disposed within the slot 11 to support and limit the probe float 14. A placement groove 15 is opened at the center of the probe float 14, and a notch 16 is opened on the opposite side wall of the placement groove 15. A connection hole 17 is opened at the center of the pin plate base 12 and the probe plate 13, and a probe 18 is inserted into the connection hole 17. The connection hole 17 corresponds to the position of the placement groove 15. A support step 8 is fixedly connected between the opposite inner sidewalls of the groove 5. The support steps 8 are symmetrically distributed with the through hole 6 as the center. A baffle 9 is fixedly connected on the symmetrical support steps 8. First, the probe float 14 is slid into the through hole 6 through the slot 11 at the bottom of the base 1, so that the probe float 14 contacts the bottom wall of the baffle 9. Then, the probe is inserted into the connection hole 17 between the probe disk 13 and the needle disk base 12. Finally, the probe disk 13 and the needle disk base 12 are slid into the groove 5, so that the probe 18 passes into the placement groove 15. The probe disk 13 is used to lift the probe float 14.

[0030] like Figure 1 , Figure 2 and Figure 7As shown, to increase the connection stability between the top cover 2 and the base 1, and to position the probe float 14 and press and fix the chip, the pressing mechanism 7 includes a positioning plate 19, a connecting frame 20, a rotating shaft 21, and a pressure claw swing arm 22. One end of the connecting frame 20 is fixedly connected to both sides of the bottom wall of the top cover 2, and the other end of the connecting frame 20 is inserted into the groove 5 and located on both sides of the through hole 6. The rotating shaft 21 is rotatably connected between the opposite inner sidewalls of the connecting frame 20. One end of the pressure claw swing arm 22 is fixedly connected to the middle of the outer sidewall of the rotating shaft 21 and located between the opposite inner sidewalls of the connecting frame 20. The other end of the pressure claw swing arm 22 is pressed onto both sides of the upper part of the probe float 14. The positioning plate 19 is fixedly connected to the adjacent connecting frame on the bottom wall of the top cover 2. On both sides of 20, the positioning plate 19 is slidably inserted into the limiting groove 10. The connecting frame 20 is n-shaped. The end face of the positioning plate 19 has a positioning hole 23. The connecting frame 20 under the top cover 2 is slidably inserted into the groove 5 on both sides of the through hole 6, and the supporting step 8 is used to limit the connecting frame 20. At the same time, the positioning plate 19 is slidably inserted into the limiting groove 10 and bolted to the side wall of the base 1 using the positioning hole 23, so that the top cover 2 and the base 1 are positioned and connected. When the connecting frame 20 is slidably inserted into the groove 5, the pressure claw swing arm 22 contacts the supporting step 8 and rotates around the rotating shaft 21, so that the other end of the pressure claw swing arm 22 presses above the placement groove 15, pressing the chip into the placement groove 15 and contacting the probe 18.

[0031] In practical use, the operator first slides the probe float 14 into the through hole 6 through the slot 11 at the bottom of the base 1, so that the probe float 14 contacts the bottom wall of the baffle 9. Then, the probe 18 is inserted into the connection hole 17 between the probe disk 13 and the needle disk base 12. Finally, the probe disk 13 and the needle disk base 12 are slid into the groove 5, so that the probe 18 passes into the placement groove 15. The probe disk 13 is used to lift the probe float 14.

[0032] The base 1 is fixed to the PCB board of the programming socket with screws. The chip is placed in the placement slot 15 of the probe floating plate 14. The top cover 2 is fastened to the base 1. The connecting frame 20 under the top cover 2 is slidably inserted into the grooves 5 on both sides of the through hole 6, and the connecting frame 20 is limited by the support step 8. At the same time, the positioning plate 19 is slidably inserted into the limiting groove 10 and bolted to the side wall of the base 1 using the positioning hole 23, so that the top cover 2 and the base 1 are positioned and connected. When the connecting frame 20 is slidably inserted into the groove 5, the pressure claw swing arm 22 contacts the support step 8 and rotates around the pivot 21, so that the other end of the pressure claw swing arm 22 presses above the placement slot 15, so that the solder ball of the chip contacts the probe 18. The probe 18 is connected to the metal connection point on the PCB board. The connection point on the PCB board is connected to the communication pin of the programmer through the connector.

[0033] The programmer outputs SDA and SCL signals, which are connected to the probe 18 contact point through the wiring point on the PCB board. The probe 18 contact point makes contact with the solder ball of the WLCSP chip, thus realizing the programming and testing of the small chip.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents. In conclusion, if those skilled in the art, inspired by this description, design similar structural methods and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A test socket for material burning, characterized in that: Includes a base, a top cover, and a positioning and connecting mechanism; The base has fixing holes at the corners of its end face for bolting to the PCB board. The base has a groove in the middle of its upper wall and a through hole in the middle of the bottom wall of the groove. The top cover is fastened to the upper part of the base by a pressing mechanism. The pressing mechanism is located on both sides of the bottom of the top cover and is symmetrically distributed. The top cover is a rectangular frame. The positioning and connection mechanism is slidably disposed in the through hole and is used for connection and positioning of the chip during programming.

2. The test fixture for material burning according to claim 1, characterized in that: A support step is fixedly connected between the opposite inner sidewalls of the groove. The support steps are symmetrically distributed around the through hole. A baffle is fixedly connected to the symmetrical support steps. A limiting groove is formed in the middle of the outer side wall of the base. The limiting groove is symmetrically arranged with the groove as the center. A slot is formed in the middle of the bottom wall of the base and is connected to the slot by a through hole.

3. A test fixture for material burning according to claim 2, characterized in that: The positioning and connecting mechanism includes a needle plate base, a probe plate, and a probe float. The probe float is slidably disposed in the through hole and in contact with the bottom wall of the baffle. The probe plate is fixedly connected to the upper center of the needle plate base and slidably disposed in the slot with the needle plate base to support and limit the probe float.

4. A test fixture for material burning according to claim 3, characterized in that: The probe float has a placement groove at its center, and the opposite sidewall of the placement groove has a notch.

5. A test fixture for material burning according to claim 3 or 4, characterized in that: A connection hole is provided at the center of the needle plate base and the probe plate, and a probe is inserted into the connection hole. The connection hole corresponds to the position of the placement slot.

6. A test fixture for material burning according to claim 1 or 2, characterized in that: The pressing mechanism includes a positioning plate, a connecting frame, a rotating shaft, and a pressure claw swing arm. One end of the connecting frame is fixedly connected to both sides of the bottom wall of the top cover, and the other end of the connecting frame is inserted into the groove and located on both sides of the through hole. The rotating shaft is rotatably connected between the opposite inner side walls of the connecting frame. One end of the pressure claw swing arm is fixedly connected to the middle of the outer side wall of the rotating shaft and located between the opposite inner side walls of the connecting frame. The other end of the pressure claw swing arm is pressed onto both sides of the upper part of the probe float. The positioning plate is fixedly connected to both sides of the adjacent connecting frame on the bottom wall of the top cover, and the positioning plate is slidably inserted into the limiting groove.

7. A test fixture for material burning according to claim 6, characterized in that: The connecting frame is arranged in an n-shape, and the end face of the positioning plate has a positioning hole.

Images