Radio frequency chip test fixture

Abstract

The utility model provides a radio frequency chip test clamp. The radio frequency chip test clamp comprises a main body, a heating component, a PCB, a pressing strip, a heat dissipation base and a clamp cover. A groove is formed in the middle area of the front surface of the main body; the heating component is contained in the groove and provided with a bearing area. The PCBs are fixed to the front face of the body and symmetrically arranged on the two sides of the groove in the first direction. The pressing strip is detachably connected with the body and stretches across the PCB in the second direction perpendicular to the first direction. The heat dissipation base is fixed to the back face of the body. The clamp cover is located on the front face of the main body and detachably connected with the main body, and when the clamp cover is fixed to the main body, the clamp cover is separated from the heating part, the PCB and the pressing strip. The utility model provides a novel pressing strip fixing mode, and solves the problems that the oscillation of the chip causes the failure of the device and the deformation of the two wings of the packaging body in the testing process affects the electrical performance testing result of the chip in the later period.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device testing, specifically to a radio frequency chip testing fixture. Background Technology

[0002] With the continuous development of the radio frequency (RF) and microwave technology industry, the demand for RF chip testing is becoming increasingly frequent. Two problems exist in aging test fixtures for RF chips, especially high-temperature aging test fixtures for flange-packaged chips, both domestically and internationally: 1. Insecure chip clamping leads to chip oscillation and subsequent chip failure. 2. Overly rigid fixtures cause deformation of the package's wings, affecting DC test results in subsequent tests. Both of these problems can negatively impact the high-temperature aging test results of RF chips.

[0003] Chinese patent CN111257740B provides a PCB fixture for testing radio frequency switch chips, which includes a spring, a fixture base, and a fixture cover. The fixture cover is disposed on the fixture base, which includes an upper layer and a lower layer. The upper layer is a single piece of aging board, and the spring is disposed within a spring limiting block. The lower layer is a PCB fixture base plate, and the spring limiting block is fixed to the PCB fixture base plate. The spring limiting block has rectangular slots of the same size on its four sides. A support substrate is fixed on the PCB fixture base plate at the center of the spring limiting block, and a chip support block is disposed on the support substrate. The chip support block has four spring fixing slots of the same size around its perimeter.

[0004] The aforementioned fixture for high-temperature aging testing of RF chips has a short lifespan and its loose contact can easily cause chip oscillation problems, which is not conducive to long-term high-temperature aging testing of RF chips. Utility Model Content

[0005] In view of the problems existing in the prior art described above, this application provides an RF chip test fixture, which solves the problems of chip oscillation caused by loose chip clamping during aging tests of RF chips, especially high-temperature aging test fixtures for flange packages, which lead to device failure, and the deformation of the package wings during the test caused by excessively stiff fixtures, which affects the electrical performance test results of the chip in the later stage, thereby improving the service life of the RF chip test fixture.

[0006] To achieve the above and other related objectives, this utility model provides an RF chip test fixture, which includes:

[0007] The main body has a front and a back, and a groove is provided in the middle area of ​​the front of the main body;

[0008] A heating element is housed in a groove, and the heating element has a bearing area;

[0009] The PCB board is fixed to the front of the main body and is symmetrically arranged on both sides of the groove along the first direction;

[0010] The pressure strip is detachably connected to the main body and spans across the PCB board in a second direction perpendicular to the first direction;

[0011] The heat dissipation base is fixed to the back of the main body;

[0012] The clamp cover is located on the front of the main body and is detachably connected to the main body. When the clamp cover is fixed to the main body, the clamp cover is spaced apart from the heating element, PCB board and pressure strip.

[0013] Optionally, the pressure strip includes a pressure strip groove disposed in the middle region on the side of the pressure strip opposite to the main body, and in a first direction, the length of the pressure strip groove is greater than the width of the PCB board.

[0014] Optionally, the clamp cover is recessed on the side opposite to the main body to form a hollow portion. When the clamp cover is fixed to the main body, the heating copper PCB board and the strip are located inside the hollow portion.

[0015] Optionally, the PCB board includes: an insulating substrate and a conductive layer formed on the insulating substrate, wherein the insulating substrate side of the PCB board is fixed to the front side of the main body.

[0016] Optionally, the bearing area of ​​the heating element is used to house a flange, which includes:

[0017] The flange body has a chip receiving section in the middle area to hold the chip to be tested;

[0018] Flange flanges are located on opposite sides of the flange body. The flange is detachably fixed to the body. When the flange is fixed to the body, the flange body is located in the bearing area of ​​the heating element, and the flange flanges are located below the pressure strip and fixed by the pressure strip.

[0019] Optionally, in the first direction, the length of the pressure strip groove is greater than the width of the flange.

[0020] Optionally, the main body includes multiple main body screw holes and multiple edge screw holes, the main body screw holes are corresponding to the pressure strip screw holes on the pressure strip, the edge screw holes are evenly distributed on the edge of the front side of the main body, and the clamp cover includes multiple clamp cover screw holes, which are opposite to the edge screw holes.

[0021] Optionally, the RF chip test fixture also includes silicone, which is evenly disposed between the PCB board and the main body to fix the PCB board and the main body.

[0022] Optionally, the clamp cover also includes a sidewall, the thickness of which is twice the height of the screw holes in the clamp cover.

[0023] As described above, the RF chip test fixture provided by this utility model has at least the following beneficial technical effects:

[0024] This utility model discloses an RF chip test fixture comprising a main body, a heating element, a PCB board, a pressure strip, a heat sink, and a fixture cover. The main body has a front and a back side, with a groove in the middle of the front side. The heating element is housed in the groove and has a bearing area. The PCB board is fixed to the front side of the main body and symmetrically arranged on both sides of the groove along a first direction. The pressure strip is detachably connected to the main body and spans over the PCB board along a second direction perpendicular to the first direction. The heat sink is fixed to the back side of the main body. The fixture cover is located on the front side of the main body and detachably connected to it. When the fixture cover is fixed to the main body, it is spaced apart from the heating copper plate, the PCB board, and the pressure strip. The novel pressure strip fixing method provided by this utility model solves the problems of chip oscillation leading to device failure due to insecure chip clamping, especially in high-temperature aging tests of flange-packaged RF chips, and deformation of the package wings due to excessively stiff clamps, thereby improving the service life of the RF chip test fixture. Attached Figure Description

[0025] Figure 1 This is a front view of the RF chip test fixture in an embodiment of this utility model.

[0026] Figure 2 This is a left view of the RF chip test fixture in an embodiment of this utility model.

[0027] Figure 3 This is a top view of the RF chip test fixture in an embodiment of this utility model.

[0028] Figure 4 This is a top view of the RF chip test fixture without the fixture cover in an embodiment of this utility model.

[0029] Figure 5 As an embodiment of this utility model Figure 4 A cross-sectional view from the perspective of AA.

[0030] Figure 6 This is a front view of the pressure strip in an embodiment of this utility model.

[0031] Figure 7 This is a top view of the pressure strip in an embodiment of this utility model.

[0032] Figure 8 This is a structural diagram of the clamp cover in an embodiment of the present utility model.

[0033] Figure 9 This is a structural diagram of the PCB board in an embodiment of the present invention.

[0034] Figure Labels

[0035] 1. Main body; 011. Front; 012. Back; 11. Groove; 111. Heating component; 1111. Bearing area; 12. PCB board; 121. Conductive layer; 122. Insulating substrate; 13. Pressure strip; 131. Pressure strip groove; 132. Pressure strip screw hole; 14. Main body screw hole; 15. Edge screw hole; 2. Fixture cover; 21. Fixture cover screw hole; 22. Hollow part; 23. Side wall; 3. Heat dissipation base; 31. Base groove; 4. Flange; 411. Flange body; 412. Chip; 412. Chip receiving part; 42. Flange wing plate; 5. Silicone. Detailed Implementation

[0036] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0037] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Although the illustrations only show components related to this utility model and are not drawn according to the actual number, shape and size of the components, the shape, quantity, positional relationship and proportion of each component can be arbitrarily changed under the premise of realizing the technical solution of this utility model, and the layout of the components may also be more complex.

[0038] This embodiment provides an RF chip test fixture, as shown in the reference... Figures 1 to 8 The RF chip test fixture of this application includes a main body 1, a heating component 111, a heat sink base 3, a PCB board 12, a pressure strip 13, and a fixture cover 2.

[0039] Specifically, refer to Figures 4 to 6 and Figure 8 The main body 1 has a front side 011 and a back side 012. The main body 1 has multiple main body screw holes 14 and multiple edge screw holes 15, with the edge screw holes 15 evenly distributed along the edges of the front side 011 of the main body 1. A groove 11 is provided in the middle region of the main body 1, and a heating component 111 is accommodated in the groove 11, ensuring that the heating component 111 can stably transfer heat to the RF device under test. As a heat transfer medium, the stability and thermal conductivity of the heating component 111 are crucial to the accuracy of the test results. Through the precise positioning of the groove 11, the heating component 111 can fit tightly against the main body 1, achieving efficient heat transfer. The heating component 111 has a bearing area 1111 for placing the flange 4. (Refer to...) Figure 4 and Figure 5 The flange 4 includes a flange flange 42 and a flange body 41. The flange body 41 has a chip receiving portion 412 in its central area for accommodating the chip 411 to be tested. The design of the chip receiving portion 412 not only provides a precise placement position for the chip 411 but also ensures the stability and accuracy of the chip 411 during testing. The shape and size of the chip receiving portion 412 are generally matched to the shape of the chip 411 to ensure that the chip 411 fits tightly within the chip receiving portion 412, preventing movement or misalignment during testing. The flange flange 42 is located on opposite sides of the flange body 41. The flange 4 is detachably fixed to the body 1. When the flange 4 is fixed to the body 1, the flange body 41 is located in the bearing area 1111 of the heating element 111.

[0040] Specifically, such as Figure 5 As shown, flange 4 is located in the bearing area 1111 and protrudes upward along the Z-axis direction. The upper surface of flange 4 is higher than the front surface 011 of the main body 1 in the Z-axis direction. (Refer to...) Figure 4 The Y-axis direction is defined as the first direction, and the X-axis direction as the second direction. The PCB board 12 is fixed to the front surface 011 of the main body 1 and is symmetrically arranged on both sides of the groove 11 along the first direction. Figure 5 and Figure 9 As shown, the PCB board 12 includes an insulating substrate 122 and a conductive layer 121 formed on the insulating substrate 122. The insulating substrate 122 side of the PCB board 12 is fixed to the front side 011 of the main body 1. As an important component of the PCB board 12, the conductive layer 121 is mainly responsible for transmitting current or signals. In the high-temperature aging test of the RF chip, the conductive layer 121 needs to be able to withstand certain current and signal transmission requirements while maintaining good conductivity. The insulating substrate 122 is located below the conductive layer 121 and plays a role in isolating and protecting the circuit. Since high temperature and high pressure may be generated during the high-temperature aging test of the RF chip, the insulating substrate 122 needs to have excellent insulation and high temperature resistance to ensure the safety and stability of the circuit.

[0041] Reference Figure 4 and Figure 5Silicone 5 is evenly distributed between the PCB board 12 and the main body 1. Silicone 5, as a high-performance adhesive and sealant, possesses excellent high-temperature resistance, aging resistance, and chemical corrosion resistance. It firmly adheres the PCB board 12 to the main body 1, while also providing sealing and insulation to prevent current or signal leakage, ensuring circuit stability and safety. The silicone 5 filling makes the connection between the PCB board 12 and the main body 1 more robust and reliable. Simultaneously, the sealing performance of the silicone 5 helps prevent the influence of external factors such as moisture and dust on the circuit, improving the overall protection capability of the RF chip test fixture. The silicone 5 between the PCB board and the main body 1 must have a uniform thickness to ensure that the flange flange 42 of the flange 4 does not deform during testing. The main body 1 also has multiple main body screw holes 14 and edge screw holes 15, with the edge screw holes 15 evenly distributed on the edge of the main body 1 opposite to the fixture cover 2.

[0042] Reference Figures 4 to 6 and Figure 8 The pressure strip 13 is detachably connected to the main body 1 and spans across the PCB board 12 in a second direction perpendicular to the first direction. This design allows for easy removal or replacement of the pressure strip 13 when needed, facilitating maintenance or upgrades of the RF chip test fixture. This detachable connection is typically achieved with screws. The pressure strip 13 is provided with pressure strip screw holes 132, which are opposite to the main body screw holes 14 of the main body 1, for screws to be inserted to connect the main body 1 and the pressure strip 13. A pressure strip groove 131 is provided in the middle area of ​​the side of the pressure strip 13 opposite to the main body 1. The length L of the pressure strip groove 131 along the Y-axis is greater than the width d1 of the PCB board 12 along the Y-axis, so that the PCB board 12 can pass through the pressure strip groove 131 without obstruction. When the flange 4 is fixed to the main body 1, the flange wing plate 42 is located below the pressure strip 13 and is fixed by the pressure strip 13. Furthermore, the length L of the groove 131 along the Y-axis is greater than the width d2 of the flange wing plate 42 along the Y-axis, so that the flange wing plate 42 can pass through the groove 131 during RF chip testing. Using the pressure strip 13 to fix the flange 4 increases the contact area between the pressure strip 13 and the flange wing plate 42, reducing the risk of flange wing plate 42 deformation during fixing, thereby ensuring the accuracy and reliability of the test. The pressure strip 13 is made of polytetrafluoroethylene (PTFE), a material with excellent high-temperature resistance, corrosion resistance, and insulation properties. In high-temperature aging tests of RF devices, PTFE ensures the stability and reliability of the pressure strip 13, preventing deformation or damage due to high temperatures.

[0043] like Figure 1As shown, the heat dissipation base 3 is fixed to the back surface 012 of the main body 1. Multiple base grooves 31 are arranged side-by-side on the bottom of the heat dissipation base 3, with the openings of the base grooves 31 facing downwards. Preferably, the base grooves 31 are evenly distributed on the bottom of the heat dissipation base 3. This design significantly increases the heat dissipation area, allowing heat to dissipate into the air more quickly. The heat dissipation base 3 is made of aluminum. Aluminum can quickly absorb and conduct heat, and its lighter weight also reduces the weight of the RF chip test fixture, making it more portable. More importantly, aluminum is not easily deformed or aged after prolonged use, ensuring the durability of the heat dissipation base 3.

[0044] Reference Figure 1 , Figure 3 , Figure 4 and Figure 7 The fixture cover 2 is located on the front side 011 of the main body 1 and is detachably connected to the main body 1. When the fixture cover 2 is fixed to the main body 1, the fixture cover 2 is spaced apart from the heating component 111, the PCB board 12, and the pressure strip 13. In an optional embodiment of this example, the heating component 111 is a heating copper plate. Specifically, a hollow portion 22 is formed by recessing the side of the fixture cover 2 opposite to the main body 1. When the fixture cover 2 is fixed to the main body 1, the heating component 111, the PCB board 12, and the pressure strip 13 are located within the hollow portion 22. The fixture cover 2 includes a plurality of fixture cover screw holes 21, which are arranged opposite to the edge screw holes 15 for inserting screws to fix the main body 1 and the fixture cover 2. This screw connection method is simple and reliable, and by using a large number of screws, the stability and durability of the overall structure of the RF chip test fixture are improved, and the replacement and maintenance of components are facilitated, thereby ensuring the accuracy and reliability of the test. The fixture cover 2 also includes a sidewall 23, the thickness h of which along the Z-axis is twice the height of the screw hole 21 along the Z-axis. First, this thickness design significantly enhances the rigidity and stability of the fixture cover 2. The thickened sidewall 23 allows the fixture cover 2 to better resist stresses and deformations, thus ensuring the overall stability and accuracy of the RF chip test fixture during testing. Second, this design also helps improve the reliability and durability of the screw connection. Because the thickness of the sidewall 23 is twice the height of the screw hole 21, the screw can be inserted more deeply into the sidewall 23 when tightened, forming a more robust connection. This not only strengthens the connection between the fixture cover 2 and the main body 1 but also reduces the risk of screw loosening or falling off, thereby extending the service life of the RF chip test fixture.

[0045] Reference Figures 1 to 8The RF chip test fixture of this application adopts a novel clamping method, using clamping strip 13 to fix flange 4, which solves the problems of chip oscillation caused by loose chip clamping during aging tests of RF chips, especially high temperature aging tests of flange packages, which leads to device failure, and the deformation of the package wings during the test caused by excessively hard clamps, which affects the electrical performance test results of the chip in the later stage. This improves the service life of the RF chip test fixture.

[0046] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A radio frequency chip test fixture, characterized in that, include: The main body has a front and a back side, and a groove is provided in the middle area of ​​the front side of the main body; A heating element is accommodated in the groove, and the heating element has a bearing area; A PCB board is fixed to the front side of the main body and is symmetrically arranged on both sides of the groove along the first direction; A pressure strip is detachably connected to the main body and spans across the PCB board in a second direction perpendicular to the first direction; A heat dissipation base is fixed to the back of the main body; The clamp cover is located on the front of the main body and is detachably connected to the main body. When the clamp cover is fixed to the main body, the clamp cover is spaced apart from the heating component, the PCB board and the pressure strip.

2. The RF chip test fixture according to claim 1, characterized in that, The pressure strip includes a pressure strip groove disposed in the middle region on the side of the pressure strip opposite to the main body. In the first direction, the length of the pressure strip groove is greater than the width of the PCB board.

3. The RF chip test fixture according to claim 1, characterized in that, The clamp cover is recessed on the side opposite to the main body to form a hollow portion. When the clamp cover is fixed to the main body, the heating component, the PCB board, and the pressure strip are located inside the hollow portion.

4. The RF chip test fixture according to claim 1, characterized in that, The PCB board includes an insulating substrate and a conductive layer formed on the insulating substrate, wherein the insulating substrate side of the PCB board is fixed to the front side of the main body.

5. The RF chip test fixture according to claim 2, characterized in that, The bearing area of ​​the heating component is used to house a flange, the flange comprising: The flange body has a chip receiving section in the middle area to hold the chip to be tested; Flange flanges are located on opposite sides of the flange body. The flange is detachably fixed to the body. When the flange is fixed to the body, the flange body is located in the bearing area of ​​the heating element. The flange flanges are located below the pressure strip and are fixed by the pressure strip.

6. The RF chip test fixture according to claim 5, characterized in that, In the first direction, the length of the pressure strip groove is greater than the width of the flange wing plate.

7. The RF chip test fixture according to claim 1, characterized in that, The main body includes multiple main body screw holes and multiple edge screw holes. The main body screw holes are corresponding to the pressure strip screw holes on the pressure strip. The edge screw holes are evenly distributed on the edge of the front side of the main body. The clamp cover includes multiple clamp cover screw holes, which are opposite to the edge screw holes.

8. The RF chip test fixture according to claim 1, characterized in that, Also includes: Silicone is evenly distributed between the PCB board and the main body to fix the PCB board and the main body.

9. The RF chip test fixture according to claim 7, characterized in that, The clamp cover further includes a sidewall, the thickness of which is twice the height of the screw holes in the clamp cover.

Images