Heat dissipation device

Abstract

The utility model provides a heat dissipation device. The embodiment of the utility model provides a heat dissipation device which is used for dissipating heat of a part to be cooled and comprises a first heat dissipation assembly and a second heat dissipation assembly. The first heat dissipation assembly comprises a first cooling box, a pipeline assembly and a heat dissipation structure, a first cooling flow channel is arranged in the first cooling box, a cooling medium flows through the first cooling flow channel, the heat dissipation structure is configured to dissipate heat of the cooling medium flowing through the first cooling flow channel, and the cooling medium flows to a part to be subjected to heat dissipation through the pipeline assembly. The second heat dissipation assembly comprises an air blowing piece and a plurality of first heat dissipation pieces. In the first direction, the multiple first heat dissipation pieces abut against the outer side of the first cooling box, the multiple first heat dissipation pieces are thermally coupled with the first cooling box, and the air blowing piece is configured to blow air to the multiple first heat dissipation pieces.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more particularly to a heat dissipation device. Background Technology

[0002] Currently, some liquid cooling structures typically incorporate heat dissipation piping. However, the relatively small size of this piping leads to pressure loss and reduced liquid flow rate. Furthermore, the flow channels in this cooling structure need to be arranged in an alternating pattern with the heat dissipation fins, a configuration that has limitations in its number, thus reducing the heat dissipation contact area and lowering cooling efficiency. Utility Model Content

[0003] To address the issues of pressure loss and low heat dissipation efficiency, embodiments of this application provide a heat dissipation device that avoids pressure loss while improving heat dissipation efficiency.

[0004] This application provides a heat dissipation device for dissipating heat from a component to be cooled. The heat dissipation device includes a first heat dissipation component and a second heat dissipation component. The first heat dissipation component includes a first cooling box, a piping assembly, and a heat dissipation structure. The first cooling box has a first cooling channel for a cooling medium to flow through. The heat dissipation structure is configured to dissipate heat from the cooling medium flowing through the first cooling channel. The cooling medium flows to the component to be cooled through the piping assembly. The second heat dissipation component includes a blower and a plurality of first heat dissipation components. Along a first direction, the plurality of first heat dissipation components abut against the outside of the first cooling box and are thermally coupled to the first cooling box. The blower is configured to blow air onto the plurality of first heat dissipation components.

[0005] Understandably, this heat dissipation device does not have heat dissipation piping, thus avoiding pressure loss and reduced liquid flow rate. Furthermore, without heat dissipation piping, the first cooling tank has more primary heat dissipation channels for the cooling medium to flow through, increasing the heat dissipation contact area and improving heat dissipation efficiency. Simultaneously, the first cooling tank is equipped with a primary heat dissipation component for thermal coupling to further dissipate heat from the cooling medium within the first cooling tank, thereby further improving heat dissipation efficiency.

[0006] In one embodiment, the heat dissipation structure includes a plurality of second heat dissipation components, which are spaced apart along a second direction. The second direction intersects with the first direction, and a first cooling channel is formed between any two adjacent second heat dissipation components.

[0007] In one embodiment, a plurality of the second heat sinks extend along a third direction, which intersects with the first direction and the second direction.

[0008] In one embodiment, the piping assembly includes a first piping and a second piping, with one end of the first piping connected to the second piping via a first cooling channel.

[0009] In one embodiment, along the third direction, the first pipeline and the second pipeline are located on the same side of the first cooling box.

[0010] In one embodiment, along the third direction, the two ends of the plurality of second heat sinks are respectively spaced apart from the inner walls on both sides of the first cooling box, so as to form two cavities at the two ends of the plurality of second heat sinks. The two cavities are connected through the first cooling channel, and the first pipe and the second pipe are connected to the same cavity.

[0011] In one embodiment, the first heat dissipation component further includes a separator disposed within one of the cavities and dividing the cavity into an inlet cavity and an outlet cavity, wherein the first pipe is connected to the inlet cavity and the second pipe is connected to the outlet cavity.

[0012] In one embodiment, a plurality of the first heat sinks are spaced apart along the third direction. The first heat sinks extend along the second direction.

[0013] In one embodiment, the heat dissipation device further includes a base, the first cooling box, a plurality of first heat dissipation components and the blower are connected to the base, and the blower and the plurality of first heat dissipation components are respectively located on both sides of the base in the second direction.

[0014] In one embodiment, the first cooling box is provided with a cooling cavity, the cooling cavity is filled with coolant, the heat dissipation structure is immersed in the coolant, and the heat dissipation structure is thermally coupled to the first cooling box. Attached Figure Description

[0015] Figure 1 This is a perspective view of a heat dissipation device provided in an embodiment of this application.

[0016] Figure 2 An exploded view of a heat dissipation device provided in an embodiment of this application.

[0017] Figure 3 This is a side view of the second heat dissipation component of a heat dissipation device provided in an embodiment of this application.

[0018] Figure 4 A perspective view of the second heat dissipation component of a heat dissipation device provided in an embodiment of this application.

[0019] Figure 5 This is a schematic diagram of the internal structure of the first cooling box of a heat dissipation device provided in an embodiment of this application.

[0020] Figure 6 This is a cross-sectional schematic diagram of a heat dissipation device provided in an embodiment of this application.

[0021] Explanation of key component symbols:

[0022] 100. Heat dissipation device; 1. First heat dissipation component; 11. First cooling box; 110. First cooling channel; 111. Cavity; 1111. Inlet cavity; 1112. Outlet cavity; 112. Cooling cavity; 12. Piping assembly; 121. First pipe; 122. Second pipe; 13. Heat dissipation structure; 131. Second heat dissipation component; 14. Separator; 2. Second heat dissipation component; 21. Air blower; 22. First heat dissipation component; 23. Second cooling box; 230. Second cooling channel; 231. Opening; 3. Base; 4. Liquid cooling structure; 200. Component to be cooled; Z, First direction; X, Second direction; Y, Third direction.

[0023] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0024] The following description will be given with reference to the accompanying drawings for a more complete description of the present application. The drawings illustrate exemplary embodiments of the present application. However, the present application may be implemented in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided to make the present application thorough and complete, and to fully convey the scope of the present application to those skilled in the art. Similar reference numerals denote the same or similar components. The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the present application. As used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context clearly indicates otherwise. Furthermore, when used herein, “comprising” and / or “including” and / or “having,” integers, steps, operations, components, and / or components, but without excluding the presence or addition of one or more other features, regions, integers, steps, operations, components, and / or groups thereof. Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. Furthermore, unless explicitly defined herein, terms such as those defined in a general dictionary should be interpreted as having the same meaning as they have in the relevant technology and in the content of this application, and should not be interpreted as having an idealized or overly formal meaning.

[0025] like Figure 1 and Figure 2As shown in the figure, this application embodiment provides a heat dissipation device 100 for dissipating heat from a component 200 to be cooled. The heat dissipation device 100 includes a first heat dissipation component 1 and a second heat dissipation component 2. The first heat dissipation component 1 includes a first cooling tank 11, a piping assembly 12, and a heat dissipation structure 13. The first cooling tank 11 has a first cooling channel 110 for the flow of a cooling medium, which can be a liquid medium such as a coolant. The heat dissipation structure 13 is configured to dissipate heat from the cooling medium flowing through the first cooling channel 110. The cooling medium flows to the component 200 to be cooled through the piping assembly 12. The second heat dissipation component 2 includes a blower 21 and a plurality of first heat dissipation components 22.

[0026] For ease of reading, this application introduces the terms first direction Z, second direction X, and third direction Y to describe the embodiments of this application. The first direction Z, second direction X, and third direction Y can be three non-parallel straight lines in space; further, the first direction Z, second direction X, and third direction Y can be three mutually perpendicular directions in a three-dimensional coordinate system (a three-dimensional Cartesian coordinate system). In subsequent embodiments, the first direction Z is described as the Z-axis direction of the three-dimensional coordinate system, the second direction X as the X-axis direction of the three-dimensional coordinate system, and the third direction Y as the Y-axis direction of the three-dimensional coordinate system.

[0027] Along the first direction Z, a plurality of first heat sinks 22 abut against the outside of the first cooling box 11, and the plurality of first heat sinks 22 are thermally coupled to the first cooling box 11, and the blower 21 is configured to blow air onto the plurality of first heat sinks 22.

[0028] In this embodiment, the component to be cooled 200 can be a CPU, which is cooled by a liquid cooling structure 4. The liquid cooling structure 4 contains a liquid that needs to be cooled after heat exchange with the CPU, i.e., a cooling medium, which can be cooled by the cooling device 100. The cooling medium in the component to be cooled 200 enters the first cooling assembly 1 through the pipe assembly 12 for cooling, and then returns to the component to be cooled 200 through the pipe assembly 12 to complete the cooling of the component to be cooled 200. The first cooling box 11 is provided with multiple first cooling channels 110, through which the cooling medium can be cooled. The first cooling box 11 is a closed structure, and the cooling structure 13 disposed therein is not connected to the outside of the first cooling box 11, except that it can be connected to the component to be cooled 200 through the pipe assembly 12.

[0029] In this embodiment, the second heat dissipation assembly 2 may further include a second cooling box 23. Along the second direction X, one end of the second cooling box 23 may have an opening 231, allowing the interior of the second cooling box 23 to communicate with the exterior. Multiple first heat dissipation elements 22 may be disposed inside the second cooling box 23, and in this case, the first heat dissipation elements 22 may also communicate with the exterior. The first heat dissipation elements 22 may be fins for heat dissipation. Along the second direction X, the end of the second cooling box 23 opposite to the opening 231 is connected to a blower 21. The blower 21 can blow cooler air from outside the second cooling box 23 into the interior of the second cooling box 23 and blow air onto the first heat dissipation elements 22. After passing through the first heat dissipation elements 22, the hotter air is discharged from the second cooling box 23 through the opening 231, completing the heat dissipation of the interior of the second cooling box 23. The blower 21 may be a fan, capable of blowing air onto the first heat dissipation elements 22.

[0030] Both the first heat sink 22 and the first cooling box 11 are made of thermally conductive metal. Multiple first heat sinks 22 are thermally coupled to the first cooling box 11. The heat from the first cooling box 11 is transferred to the first heat sink 22. The blower 21 can dissipate heat from the first heat sink 22, thus achieving further heat dissipation from the first cooling box 11, allowing the heat of the cooling medium inside the first cooling box 11 to be further carried away.

[0031] Understandably, this heat dissipation device 100 does not have any heat dissipation piping, thus avoiding pressure loss and a decrease in liquid flow rate. Furthermore, without heat dissipation piping, the first cooling tank 11 has more first heat dissipation channels for the cooling medium to flow through, increasing the heat dissipation contact area and improving heat dissipation efficiency. Simultaneously, the first cooling element 22 is provided on the first cooling tank 11 for thermal coupling to further dissipate heat from the cooling medium within the first cooling tank 11, thereby further improving heat dissipation efficiency.

[0032] like Figures 2 to 4 As shown, in one embodiment, a plurality of first heat sinks 22 are spaced apart along a third direction Y. The first heat sinks 22 extend along a second direction X.

[0033] In this embodiment, multiple first heat sinks 22 are spaced apart along the third direction Y, and a second cooling channel 230 is formed between any two adjacent first heat sinks 22 to improve heat dissipation. Simultaneously, the first heat sinks 22 can extend along the second direction X, and a blower 21 connected to one end of the second cooling box 23 in the second direction X can blow cold air into the second cooling channel 230 for better heat dissipation. An opening 231 is located at the other end of the second cooling box 23 in the second direction X. The blower 21 can blow cold air into the second cooling box 23, where it undergoes heat exchange through the second cooling channel 230, and the heated air is then discharged through the opening 231, achieving continuous heat dissipation for the first heat sinks 22.

[0034] It is understandable that the first heat sink 22, which is spaced along the third direction Y, can form a second cooling channel 230. Multiple second cooling channels 230 can further exchange heat, resulting in better heat dissipation.

[0035] In one embodiment, the heat dissipation device 100 further includes a base 3, a first cooling box 11, a plurality of first heat dissipation components 22 and a blower 21 connected to the base 3, and the blower 21 and the plurality of first heat dissipation components 22 are respectively located on both sides of the base 3 in the second direction X.

[0036] In this embodiment, the first cooling box 11 and multiple first heat sinks 22 are respectively connected to both sides of the base 3 in the first direction Z, while the blower 21 and multiple first heat sinks 22 are respectively connected to both sides of the base 3 in the second direction X, so as to realize the connection between the first cooling box 11, multiple heat sinks, blower 21 and base 3. At this time, a second cooling box 23 can be provided, with multiple first heat sinks 22 located inside the second cooling box 23, and the second cooling box 23 is connected to one side of the base 3 in the second direction X.

[0037] Understandably, the base 3 allows both the first heat dissipation component 1 and the second heat dissipation component 2 to be connected to the base 3. At the same time, the second cooling box 23 and the blower 21 are respectively connected to both sides of the base 3 in the second direction X, so that the blower 21 and the second cooling box 23 can be connected while the connection between the two is relatively good, which is convenient for use.

[0038] like Figure 5 and Figure 6 As shown, in one embodiment, the heat dissipation structure 13 includes a plurality of second heat dissipation components 131. Along the second direction X, the plurality of second heat dissipation components 131 are spaced apart, and a first cooling flow channel 110 is formed between any two adjacent second heat dissipation components 131.

[0039] In this embodiment, the second heat sink 131 can be a fin, and multiple second heat sinks are spaced apart along the second direction X so that a first cooling channel 110 is formed between two adjacent second heat sinks 131. In this way, the heat dissipation efficiency can be further improved by multiple first cooling channels 110.

[0040] In one embodiment, the first cooling box 11 is provided with a cooling cavity 112, which is filled with coolant. The heat dissipation structure 13 is immersed in the coolant and is thermally coupled to the first cooling box 11.

[0041] In this embodiment, the coolant filling the cooling chamber 112 is the same as the cooling medium in the liquid cooling structure 4 that dissipates heat from the CPU. At this time, there is no air in the first cooling tank 11. The coolant temperature is lower than the temperature of the cooling medium flowing out of the component to be cooled 200. The cooling medium flowing out of the component to be cooled 200 exchanges heat with the coolant to lower its temperature. After the heat exchange is complete, the cooling medium flows back into the component to be cooled 200 through the pipe assembly 12. This cycle repeats continuously to dissipate heat from the component to be cooled 200 during operation.

[0042] Understandably, the cooling medium flows through the first cooling channel 110 to achieve multiple contacts with the coolant, increasing the contact area of ​​the cooling medium. At the same time, the coolant can exchange heat with the cooling medium, so that the cooling medium flowing from the first cooling tank 11 into the heat-dissipating component 200 can achieve good heat dissipation and a lower temperature.

[0043] In one embodiment, a plurality of second heat sinks 131 extend along a third direction Y.

[0044] It is understandable that the second heat sink 131 extending along the third direction Y requires the cooling medium to flow along the third direction Y after entering the first cooling box 11, thereby increasing the heat dissipation contact area of ​​the cooling medium and improving the heat dissipation efficiency.

[0045] Furthermore, the multiple second heat dissipation components 131 of the heat dissipation structure 13 are all immersed in the coolant, and the multiple second heat dissipation components 131 are in contact with at least one side wall of the cooling cavity 112 to achieve thermal coupling between them. When the coolant enters the first cooling channel 110 and exchanges heat with the second heat dissipation components 131, the second heat dissipation components 131 can exchange heat through the first cooling box 11 which is in contact with them and thermally coupled, and can also exchange heat with the coolant filled in the cooling cavity 112. The coolant then exchanges heat through the first cooling box 11 which is in contact with it, thereby realizing that the heat dissipation structure 13 can dissipate heat in two ways at the same time, which greatly improves the heat dissipation efficiency of the heat dissipation structure 13.

[0046] In one embodiment, the piping assembly 12 includes a first piping 121 and a second piping 122, with one end of the first piping 121 connected to the second piping 122 via a first cooling channel 110.

[0047] In this embodiment, the first pipe 121 is configured so that the cooling medium in the heat-dissipating component 200 can enter the first cooling tank 11 through the first pipe 121, and the second pipe 122 is configured so that the cooling medium in the first cooling tank 11 can enter the heat-dissipating component 200 through the second pipe 122.

[0048] It is understandable that the cooling medium with a higher temperature in the heat-dissipating component 200 enters the first cooling box 11 through the first pipe 121 for heat dissipation. After the heat dissipation is completed, the cooling medium with a lower temperature enters the heat-dissipating component 200 through the second pipe 122 to complete the heat dissipation of the cooling medium in the heat-dissipating component 200.

[0049] In one embodiment, along the third direction Y, the first pipe 121 and the second pipe 122 are located on the same side of the first cooling box 11.

[0050] It is understandable that the first pipe 121 and the second pipe 122 are located on the same side of the first cooling box 11 so that the cooling medium can travel a sufficiently long path in the first cooling box 11 before being discharged, ensuring that the cooling medium has a sufficient heat dissipation contact area.

[0051] In one embodiment, along the third direction Y, the two ends of a plurality of second heat sinks 131 are respectively spaced from the inner walls of the two sides of the first cooling box 11, so as to form two cavities 111 at the two ends of the plurality of second heat sinks 131. The two cavities 111 are connected through a first cooling channel 110, and the first pipe 121 and the second pipe 122 are connected to the same cavity 111.

[0052] It is understandable that the first pipe 121 and the second pipe 122, which are connected to the same cavity 111, require the cooling medium flowing in from the first pipe 121 to flow around the first cooling tank 11 once before it can flow out through the second pipe 122, thus ensuring good heat dissipation of the cooling medium.

[0053] In one embodiment, the first heat dissipation assembly 1 further includes a separator 14, which is disposed in a cavity 111 and divides the cavity 111 into an inlet cavity 1111 and an outlet cavity 1112. A first pipe 121 is connected to the inlet cavity 1111 and a second pipe 122 is connected to the outlet cavity 1112.

[0054] In this embodiment, the partition 14 may be an extension of the second heat sink 131, or the partition 14 may be separately formed and connected to the second heat sink 131, or the partition 14 may be connected to the first cooling box 11 but not to the second heat sink 131. The partition 14 only needs to be able to divide the cavity 111 into the inlet cavity 1111 and the outlet cavity 1112, and no further restrictions are imposed here.

[0055] Understandably, the partition 14 ensures that the cooling medium entering the first cooling tank 11 from the first pipe 121 does not directly enter the second pipe 122 through the cavity 111. Instead, it must flow around the first cooling tank 11 via the first cooling channel 110 before re-entering the cavity 111 and then being transferred to the heat-dissipating component 200 via the second pipe 122. This prevents the cooling medium from having an excessively small contact surface, which would result in low heat dissipation efficiency.

[0056] The specific embodiments of this application have been described above with reference to the accompanying drawings. However, those skilled in the art will understand that various changes and substitutions can be made to the specific embodiments of this application without departing from the spirit and scope of this application. All such changes and substitutions fall within the scope defined by this application.

Claims

1. A heat dissipation device for dissipating heat from a component to be cooled, characterized in that, The heat dissipation device comprises: a first heat dissipation assembly comprising a first cooling box, a pipeline assembly and a heat dissipation structure, the first cooling box is provided with a first cooling flow channel therein, the first cooling flow channel is for cooling medium to flow, the heat dissipation structure is configured to dissipate heat from the cooling medium flowing through the first cooling flow channel, and the cooling medium flows to the heat dissipation object through the pipeline assembly; a second heat dissipation assembly comprising a blowing object and a plurality of first heat dissipation objects; in a first direction, the plurality of first heat dissipation objects abut the outer side of the first cooling box, and the plurality of first heat dissipation objects are thermally coupled with the first cooling box, and the blowing object is configured to blow air to the plurality of first heat dissipation objects.

2. The heat dissipating device of claim 1, wherein The heat dissipation structure comprises a plurality of second heat dissipation objects, and in a second direction, the plurality of second heat dissipation objects are arranged at intervals, the second direction intersects the first direction, and the first cooling flow channel is formed between any two adjacent second heat dissipation objects.

3. The heat dissipating device of claim 2, wherein The plurality of second heat dissipation objects each extend in a third direction, and the third direction intersects the first direction and the second direction.

4. The heat dissipating device of claim 3, wherein The pipeline assembly comprises a first pipeline and a second pipeline, and one end of the first pipeline communicates with the second pipeline through the first cooling flow channel.

5. The heat dissipating device of claim 4, wherein In the third direction, the first pipeline and the second pipeline are located on the same side of the first cooling box.

6. The heat dissipating device of claim 4, wherein In the third direction, the two ends of the plurality of second heat dissipation objects are arranged at intervals with the inner walls of the two sides of the first cooling box, so as to form two cavities at the two ends of the plurality of second heat dissipation objects, the two cavities communicate through the first cooling flow channel, and the first pipeline and the second pipeline communicate with the same cavity.

7. The heat dissipating device of claim 6, wherein The first heat dissipation assembly further comprises a partition, the partition is arranged in one of the cavities and divides the cavity into an inflow cavity and an outflow cavity, the first pipeline communicates with the inflow cavity, and the second pipeline communicates with the outflow cavity.

8. The heat dissipating device of claim 3, wherein In the third direction, the plurality of first heat dissipation objects are arranged at intervals. The first heat dissipation objects extend in the second direction.

9. The heat dissipating device of claim 2, wherein The heat dissipation device further comprises a base, the first cooling box, the plurality of first heat dissipation objects and the blowing object are connected to the base, and the blowing object and the plurality of first heat dissipation objects are respectively located on the two sides of the base in the second direction.

10. The heat dissipating device of claim 1, wherein The first cooling box is provided with a cooling cavity, the cooling cavity is filled with a cooling liquid, the heat dissipation structure is immersed in the cooling liquid, and the heat dissipation structure is thermally coupled with the first cooling box.

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