Electronic device

Abstract

The embodiment of the utility model relates to the technical field of electronic equipment, and discloses electronic equipment which comprises a shell, a radiator, a mounting plate and a first connecting piece. The radiator is provided with a first surface and a second surface which are oppositely arranged in the first direction, the radiator is further provided with a first connecting hole and a first threaded hole which are sequentially formed in the first direction, in the first direction, the first connecting hole penetrates through the first surface, the first threaded hole penetrates through the second surface, and the first connecting hole is communicated with the first threaded hole. The aperture of the first connecting hole is larger than or equal to that of the first threaded hole. The mounting plate is mounted on the shell and arranged on one side of the radiator in the first direction, a first mounting hole is formed in the mounting plate, and the axis of the first mounting hole is parallel to the first direction. The first connecting piece penetrates through the first threaded hole and the first mounting hole so as to connect the mounting plate and the radiator. According to the embodiment of the invention, the installation flexibility of the radiator is improved, so that the expandability of the electronic equipment is improved, and more use requirements are met.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and more particularly to an electronic device. Background Technology

[0002] Many electronic devices are equipped with heat-generating modules and heat sinks for heat dissipation. In addition to dissipating heat from the modules, heat sinks are also often used as mounting brackets for the modules.

[0003] In related technologies, heat sinks are provided with mounting holes for mounting bolts to pass through, and the heat sink is fixed to the threaded holes of the mounting plate by the mounting bolts. However, the installation method of heat sinks in related technologies is limited and cannot meet the different space requirements of different electronic devices. Utility Model Content

[0004] In view of this, the present application provides an electronic device that is beneficial to improving the flexibility of heat sink installation in electronic devices.

[0005] In a first aspect, embodiments of this application provide an electronic device, including a housing, a heat sink, a mounting plate, and a first connector. The heat sink has a first surface and a second surface disposed opposite to each other along a first direction. The heat sink also has a first connecting hole and a first threaded hole sequentially disposed along the first direction. Along the first direction, the first connecting hole penetrates the first surface, and the first threaded hole penetrates the second surface, communicating with the first threaded hole. The diameter of the first connecting hole is greater than or equal to the diameter of the first threaded hole. The mounting plate is mounted on the housing and disposed on one side of the heat sink along the first direction. The mounting plate has a first mounting hole, the axis of which is parallel to the first direction. The first connector passes through the first threaded hole and the first mounting hole to connect the mounting plate and the heat sink.

[0006] In one or more of the above optional embodiments, the first connector is a bolt, and the first connector passes through the first mounting hole and is screwed to the first threaded hole in a direction opposite to the first direction; or the first connector is a bolt, the first mounting hole is a threaded hole, and the first connector passes through the first connecting hole and the first threaded hole in sequence in the first direction and is screwed to the first mounting hole.

[0007] In one or more of the above optional embodiments, the radiator includes a top plate, a bottom plate and a connecting part. Along a first direction, the top plate and the bottom plate are arranged opposite to each other, and there is a preset gap between the top plate and the bottom plate. The connecting part is connected to the bottom plate and the top plate. The first surface is the surface of the top plate facing away from the bottom plate, the second surface is the surface of the bottom plate facing away from the top plate, the first connecting hole is provided on the top plate, and the first threaded hole is provided on the bottom plate.

[0008] In one or more of the above optional embodiments, the base plate includes a first base plate and a second base plate, the connecting portion includes a first connecting portion and a second connecting portion, the first base plate and the second base plate are arranged at intervals along a second direction, the first connecting portion is connected between the first base plate and the top plate, the second connecting portion is connected between the second base plate and the top plate, and a first threaded hole is provided in the first base plate. The first direction is perpendicular to the second direction.

[0009] In one or more of the above optional embodiments, the heat sink further includes a second connecting hole and a second threaded hole arranged sequentially along a first direction. The second threaded hole is located on the second base plate. Along the first direction, the second connecting hole penetrates the first surface, and the second threaded hole penetrates the second surface. The second connecting hole and the second threaded hole communicate with each other. The mounting plate has a second mounting hole, the axis of which is parallel to the first direction. The electronic device also includes a second connector, which passes through the second threaded hole and the second mounting hole. Along the second direction, the heat sink includes a first end and a second end arranged opposite to each other. Along the third direction, the heat sink includes a third end and a fourth end arranged opposite to each other. The first connecting hole and the first threaded hole are located at the junction of the first end and the third end, and the second connecting hole and the second threaded hole are located at the junction of the second end and the fourth end. The first direction, the second direction, and the third direction are all perpendicular to each other.

[0010] In one or more of the above optional embodiments, the second connector is a bolt, and in a direction opposite to the first direction, the second connector passes through the second mounting hole and is screwed to the second threaded hole; or the second connector is a bolt, the second mounting hole is a threaded hole, and in a direction opposite to the first direction, the second connector passes through the second connecting hole and the second threaded hole in sequence and is screwed to the second mounting hole.

[0011] In one or more of the above optional embodiments, the first base plate is provided with a third threaded hole, which is located at the junction of the first end and the fourth end. The third threaded hole penetrates the second surface along the first direction. The mounting plate is provided with a third mounting hole, the axis of which is parallel to the first direction. The electronic device also includes a third connector, which is a bolt. The third connector is used to pass through the third mounting hole in a direction opposite to the first direction and then be screwed and fixed to the third threaded hole. And / or the second base plate is provided with a fourth threaded hole, which is located at the junction of the second end and the third end. The fourth threaded hole penetrates the second surface along the first direction. The mounting plate is provided with a fourth mounting hole, the axis of which is parallel to the first direction. The electronic device also includes a fourth connector, which is a bolt. The fourth connector is used to pass through the fourth mounting hole in a direction opposite to the first direction and then be screwed and fixed to the fourth threaded hole.

[0012] In one or more of the above optional embodiments, along the second direction, the gap between the first connecting portion and the second connecting portion forms a first heat dissipation channel penetrating the radiator along a third direction, and the gap between the first base plate and the second base plate forms a second heat dissipation channel penetrating the radiator along a third direction, and the first heat dissipation channel and the second heat dissipation channel are connected. A plurality of heat dissipation fins protrude from the side of the top plate facing away from the first surface, and the plurality of heat dissipation fins are arranged sequentially along the second direction. The first direction, the second direction, and the third direction are mutually perpendicular to each other.

[0013] In one or more of the above optional embodiments, the electronic device includes a circuit board assembly fixed to a heat sink. The circuit board assembly includes a first substrate disposed opposite to a first surface along a first direction. The first substrate has a first notch aligned with a first connection hole along the first direction, and / or the first substrate has a second notch aligned with a second connection hole along the first direction.

[0014] In one or more of the above optional embodiments, the circuit board assembly includes a second substrate and a power device. Along the first direction, there is a preset gap between the first substrate and the first surface. The second substrate is disposed between the first substrate and the first surface. The surface of the second substrate facing away from the first substrate is attached to the first surface. The power device is disposed on the surface of the first substrate facing the second substrate. The surface of the power device facing away from the first substrate is connected to the surface of the second substrate facing the first substrate.

[0015] The beneficial effects of the embodiments of this application are as follows: The electronic device provided by this application, by providing a first connecting hole and a first threaded hole sequentially arranged along a first direction on the heat sink, and the diameter of the first connecting hole being greater than or equal to the diameter of the first threaded hole, allows the first connector to be configured to pass through the first connecting hole and the first threaded hole along the first direction and then connect to the first mounting hole, or the first connector to be configured to pass through the first mounting hole in the opposite direction to the first direction and then screwed to the first threaded hole, depending on actual needs. Compared with the traditional solution where the heat sink only has mounting holes, the electronic device provided by this application allows users to choose a more suitable connection method between the heat sink and the mounting plate according to actual needs. When the electronic device needs to add components, adjust component positions, or make design changes to the housing structure, the connection method of the heat sink can be changed to ensure compatibility with the modified electronic device without redesigning the mounting structure, thereby improving the scalability of the electronic device and meeting more usage needs. Attached Figure Description

[0016] One or more embodiments are illustrated by way of example with reference to the accompanying drawings, which are not intended to limit the embodiments, and elements having the same reference numerals in the drawings are designated as similar elements.

[0017] Figure 1 A perspective view of an electronic device provided in an embodiment of this application;

[0018] Figure 2 A partial exploded view of an electronic device provided in an embodiment of this application;

[0019] Figure 3 A perspective view of a heat sink for an electronic device provided in an embodiment of this application;

[0020] Figure 4 Another perspective view of a heat sink for an electronic device provided in an embodiment of this application;

[0021] Figure 5 A schematic diagram of an electronic device with its heat sink connected to a mounting plate, provided as an embodiment of this application;

[0022] Figure 6 A schematic diagram showing the heat sink of another electronic device provided in this application connected to a mounting plate;

[0023] Figure 7 A schematic diagram of a heat sink for an electronic device as viewed along a first direction, provided in an embodiment of this application;

[0024] Figure 8 for Figure 7 A cross-sectional view at point CC. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and thoroughly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0026] It should be noted that when an element is described as "connected" to another element, it can be directly connected to the other element, or there may be one or more intervening elements. Furthermore, the technical features involved in the various embodiments of this application described below can be combined with each other as long as they do not constitute a conflict.

[0027] Please see Figures 1-4The electronic device 100 includes a housing 10, a heat sink 1, a mounting plate 2, and a first connector 3. The heat sink 1 has a first surface A and a second surface B arranged opposite to each other along a first direction X. The heat sink 1 also has a first connecting hole 111 and a first threaded hole 1211 arranged sequentially along the first direction X. Along the first direction X, the first connecting hole 111 penetrates the first surface A, and the first threaded hole 1211 penetrates the second surface B, communicating with each other. The mounting plate 2 is mounted on the housing 10 and is located on one side of the heat sink 1 along the first direction X. The mounting plate 2 has a first mounting hole 221, the axis of which is parallel to the first direction X. The first connector 3 passes through the first threaded hole 1211 and the first mounting hole 221 to connect the mounting plate 2 and the heat sink 1.

[0028] The electronic device 100 provided in this application, by providing a first connecting hole 111 and a first threaded hole 1211 sequentially arranged along a first direction X in the heat sink 1, allows the first connecting member 3 to be configured to pass through the first connecting hole 111 and the first threaded hole 1211 along the first direction X and then connect to the first mounting hole 221, or the first connecting member 3 to be configured to pass through the first mounting hole 221 in a direction opposite to the first direction X and then screwed to the first threaded hole 1211. Compared with the traditional solution where the heat sink only has mounting holes, the electronic device 100 provided in this application allows users to choose a more suitable connection method between the heat sink 1 and the mounting plate 2 according to the actual situation. When the electronic device 100 needs to add components, adjust component positions, or make design changes to the structure of the housing 10, the connection method of the heat sink 1 can be changed to achieve compatibility with the modified electronic device 100 without redesigning the mounting structure, thereby improving the scalability of the electronic device 100 and meeting more usage needs.

[0029] In some embodiments, electronic device 100 is a frequency converter; in other embodiments, electronic device 100 is a PLC (Programmable Logic Controller); and in still other embodiments, electronic device 100 is an industrial computer.

[0030] Please see Figure 2 and Figure 5 In some embodiments, the first connector 3 is a bolt, which passes through the first mounting hole 221 and is screwed to the first threaded hole 1211 in a direction opposite to the first direction X.

[0031] Please see Figure 2 and Figure 6In some embodiments, the first connector 3 is a bolt, and the first mounting hole 221 is a threaded hole. Along the first direction X, the first connector 3 passes through the first connecting hole 111 and the first threaded hole 1211 in sequence and is then screwed and fixed to the first mounting hole 221.

[0032] In some embodiments, the first connecting hole 111 is a through hole. It is understood that in some other embodiments, the first connecting hole 111 may also be other types of holes, such as threaded holes, provided that the first connecting hole 111 can allow the first connector 3 to pass through.

[0033] In some embodiments, the mounting plate 2 includes a plate body 21 and a first mounting nut 22. The first mounting hole 221 is a threaded hole provided in the first mounting nut 22, and the first mounting nut 22 is riveted and fixed to the plate body 21. It can be understood that when the thickness of the mounting plate 2 is small, the first mounting hole 221 can be provided at the first mounting nut 22 as described above. When the mounting plate 2 has a sufficiently large thickness, the first mounting hole 221 can also be directly opened on the mounting plate 2.

[0034] Please see Figure 3 and Figure 4 In some embodiments, the heat sink 1 includes a top plate 11, a bottom plate 12, and a connecting portion 13. Along a first direction X, the top plate 11 and the bottom plate 12 are disposed opposite each other, with a preset gap between them. The connecting portion 13 connects to both the bottom plate 12 and the top plate 11. A first surface A is the surface of the top plate 11 facing away from the bottom plate 12, and a second surface B is the surface of the bottom plate 12 facing away from the top plate 11. A first connecting hole 111 is provided on the top plate 11, and a first threaded hole 1211 is provided on the bottom plate 12. The top plate 11 is used to mount the component to be cooled, and the bottom plate 12 provides support. The space formed by the preset gap between the top plate 11 and the bottom plate 12 is beneficial for improving the heat dissipation effect of the heat sink 1.

[0035] In some embodiments, the base plate 12 includes a first base plate 121 and a second base plate 122, and the connecting portion 13 includes a first connecting portion 131 and a second connecting portion 132. The first base plate 121 and the second base plate 122 are arranged at intervals along a second direction Y. The first connecting portion 131 connects the first base plate 121 and the top plate 11, and the second connecting portion 132 connects the second base plate 122 and the top plate 11. A first threaded hole 1211 is provided in the first base plate 121. The first direction X is perpendicular to the second direction Y. The first base plate 121 and the second base plate 122 are arranged at intervals along the second direction Y. The first base plate 121, the second base plate 122, the first connecting portion 131, and the second connecting portion 132 together support the top plate 11, which helps to improve the structural stability of the heat sink 1.

[0036] Please see Figure 2-4 and Figure 7In some embodiments, the heat sink 1 is further provided with a second connecting hole 112 and a second threaded hole 1221 arranged sequentially along the first direction X. The second threaded hole 1221 is provided on the second base plate 122. Along the first direction X, the second connecting hole 112 penetrates the first surface A, and the second threaded hole 1221 penetrates the second surface B. The second connecting hole 112 and the second threaded hole 1221 are connected. The mounting plate 2 is provided with a second mounting hole 231. The axis of the second mounting hole 231 is parallel to the first direction X. The electronic device 100 also includes a second connector 4, which passes through the second threaded hole 1221 and the second mounting hole 231. Along the second direction Y, the heat sink 1 includes a first end 1a and a second end 1b disposed opposite to each other. Along the third direction Z, the heat sink 1 includes a third end 1c and a fourth end 1d disposed opposite to each other. A first connecting hole 111 and a first threaded hole 1211 are located at the junction of the first end 1a and the third end 1c, and a second connecting hole 112 and a second threaded hole 1221 are located at the junction of the second end 1b and the fourth end 1d. The junction of the first end 1a and the third end 1c is region S1, where the first end 1a and the third end 1c coincide along the first direction X, and the junction of the second end 1b and the fourth end 1d is region S2, where the first end 1a and the third end 1c coincide along the first direction X. In this application, the first direction X, the second direction Y, and the third direction Z are mutually perpendicular. The first connecting hole 111 and the first threaded hole 1211 are located at the junction of the first end 1a and the third end 1c, and the second connecting hole 112 and the second threaded hole 1221 are located at the junction of the second end 1b and the fourth end 1d. The first connecting hole 111 and the first threaded hole 1211 are diagonally arranged with the second connecting hole 112 and the second threaded hole 1221, which helps to improve the stability of the radiator 1 when it is installed on the mounting plate 2 through the first connector 3 and the second connector 4.

[0037] Please see Figure 2 , Figure 4 and Figure 5 In some embodiments, the second connector 4 is a bolt, which passes through the second mounting hole 231 and is screwed to the second threaded hole 1221 in a direction opposite to the first direction X.

[0038] Please see Figure 2 , Figure 4 and Figure 6 In some embodiments, the second connector 4 is a bolt, and the second mounting hole 231 is a threaded hole. Along the first direction X, the second connector 4 passes through the second connecting hole 112 and the second threaded hole 1221 in sequence and is then screwed and fixed to the second mounting hole 231.

[0039] In some embodiments, the second connecting hole 112 is a through hole. It is understood that in other embodiments, the second connecting hole 112 may also be other types of holes, such as threaded holes, provided that the second connecting hole 112 can allow the second connector 4 to pass through.

[0040] In some embodiments, the mounting plate 2 includes a plate body 21 and a second mounting nut 23. The second mounting hole 231 is a threaded hole provided in the second mounting nut 23, and the second mounting nut 23 is riveted and fixed to the mounting plate 2. It can be understood that when the thickness of the mounting plate 2 is small, the second mounting hole 231 can be provided at the second mounting nut 23 as described above. When the mounting plate 2 has a sufficiently large thickness, the second mounting hole 231 can also be directly opened on the mounting plate 2.

[0041] It is understood that in other embodiments, a greater number of structures identical to the first connecting hole 111, the first threaded hole 1211, the first mounting hole 221, and the first connector 3 may be provided to further improve the stability of the radiator 1 installation.

[0042] Please see Figure 4 , Figure 5 and Figure 7 In some embodiments, the first base plate 121 is provided with a third threaded hole 1212, which is located at the junction of the first end 1a and the fourth end 1d. Along the first direction X, the third threaded hole 1212 penetrates the second surface B. The mounting plate 2 is provided with a third mounting hole (not shown), the axis of which is parallel to the first direction X. The electronic device 100 also includes a third connector 5, which is a bolt. The third connector 5 is used to pass through the third mounting hole in a direction opposite to the first direction X and then be screwed and fixed to the third threaded hole 1212. The junction of the first end 1a and the fourth end 1d is the region S3 where the first end 1a and the fourth end 1d coincide along the first direction X. In the embodiment where the top plate 11 is used to house the heat dissipation component, since the structure of setting, for example, the first connecting hole 111 at the top plate 11 will occupy the space of the top plate 11, the area of ​​the top plate 11 that can accommodate the heat dissipation component will be smaller. In this embodiment, by adding a third threaded hole 1212 to the first bottom plate 121, so that the third connector 5 can pass through the third mounting hole provided in the mounting plate 2 and be screwed and fixed, compared with other embodiments, in order to improve the installation stability of the heat sink 1, by adding a structure of, for example, the first connecting hole 111 and the first threaded hole 1211, it is beneficial to improve the installation stability of the heat sink 1 while reducing the space occupied by the top plate 11.

[0043] In some embodiments, the second base plate 122 is provided with a fourth threaded hole 1222, which is located at the junction of the second end 1b and the third end 1c. The fourth threaded hole 1222 penetrates the second surface B along the first direction X. The mounting plate 2 is provided with a fourth mounting hole (not shown), the axis of which is parallel to the first direction X. The electronic device 100 also includes a fourth connector 6, which is a bolt. The fourth connector 6 is used to pass through the fourth mounting hole in a direction opposite to the first direction X and then be screwed and fixed to the fourth threaded hole 1222. The junction of the second end 1b and the third end 1c is the region S4 where the second end 1b and the third end 1c coincide along the first direction X. By providing a fourth threaded hole 1222 in the first base plate 121, allowing the fourth connector 6 to pass through the fourth mounting hole in the mounting plate 2 and be screwed and fixed, the stability of the heat sink 1 installation is improved while reducing the space occupied by the top plate 11.

[0044] Please see Figure 2-6 In some embodiments, the heat sink 1 is provided with a first connecting hole 111, a first threaded hole 1211, a second connecting hole 112, a second threaded hole 1221, a third threaded hole 1212, and a fourth threaded hole 1222. The mounting plate 2 is provided with a first mounting hole 221, a second mounting hole 231, a third mounting hole, and a fourth mounting hole. Users can choose the installation scheme according to their actual needs, for example... Figure 6 In the illustrated embodiment, only the first connecting member 3 and the second connecting member 4 are used. Both the first connecting member 3 and the second connecting member 4 are bolts, and both the first mounting hole 221 and the second mounting hole 231 are threaded holes. Along the first direction X, the first connecting member 3 passes through the first connecting hole 111 and the first threaded hole 1211 in sequence and is then screwed and fixed to the first mounting hole 221. The second connecting member 4 passes through the second connecting hole 112 and the second threaded hole 1221 in sequence and is then screwed and fixed to the second mounting hole 231. For example... Figure 5 In the embodiment shown, the first connector 3, the second connector 4, the third connector 5, and the fourth connector 6 are all bolts. The first connector 3 passes through the first mounting hole 221 and is screwed and fixed to the first threaded hole 1211. The second connector 4 passes through the second mounting hole 231 and is screwed and fixed to the second threaded hole 1221. The third connector 5 passes through the third mounting hole and is screwed and fixed to the third threaded hole 1212. The fourth connector 6 passes through the fourth mounting hole and is screwed and fixed to the fourth threaded hole 1222.

[0045] Please see Figure 3 and Figure 7 In some embodiments, the first base plate 121 extends from the fourth end 1d to the third end 1c along the third direction Z, and the second base plate 122 extends from the fourth end 1d to the third end 1c along the third direction Z.

[0046] Please see Figure 3and Figure 8 In some embodiments, along the second direction Y, the gap between the first connecting portion 131 and the second connecting portion 132 forms a first heat dissipation channel C1 penetrating the radiator 1 along the third direction Z, and the gap between the first base plate 121 and the second base plate 122 forms a second heat dissipation channel C2 penetrating the radiator 1 along the third direction Z. The first heat dissipation channel C1 and the second heat dissipation channel C2 are connected and form a heat dissipation space. A plurality of heat dissipation fins 113 protrude from the side of the top plate 11 facing away from the first surface A, and the plurality of heat dissipation fins 113 are arranged sequentially along the second direction Y. The use of the gap between the first connecting portion 131 and the second connecting portion 132, and the gap between the first base plate 121 and the second base plate 122 to form the first heat dissipation channel C1 and the second heat dissipation channel C2 is beneficial to improving the heat dissipation effect of the radiator 1. Furthermore, by setting the heat dissipation fins 113 within the heat dissipation space, the heat dissipation effect of the radiator 1 is further improved.

[0047] Please see Figure 2 , Figure 3 and Figure 6 In some embodiments, the electronic device 100 includes a circuit board assembly 7, which is fixed to the heat sink 1. The circuit board assembly 7 includes a first substrate 71, which is disposed opposite to a first surface A along a first direction X.

[0048] In some embodiments, the first substrate 71 is provided with a first notch 711, which is aligned with the first connection hole 111 along the first direction X. The first notch 711 is used to expose the first connection hole 111 so that the first connector 3 can be inserted into the first connection hole 111.

[0049] In some embodiments, the first substrate 71 is provided with a second notch 712, which is aligned with the second connection hole 112 along the first direction X. The second notch 712 is used to expose the second connection hole 112 so that the first connector 3 can be inserted into the second connection hole 112.

[0050] In some embodiments, the circuit board assembly 7 includes a second substrate 72 and a power device (not shown). Along the first direction X, a predetermined gap exists between the first substrate 71 and the first surface A. The second substrate 72 is disposed between the first substrate 71 and the first surface A, with the surface of the second substrate 72 facing away from the first substrate 71 attached to the first surface A. The power device is disposed on the surface of the first substrate 71 facing the second substrate 72, and the surface of the power device facing away from the first substrate 71 is connected to the surface of the second substrate 72 facing the first substrate 71. During operation, the heat generated by the power device is transferred to the second substrate 72, and then from the second substrate 72 to the top plate 11.

[0051] In some embodiments, the surface of the power device facing away from the first substrate 71 is bonded to the surface of the second substrate 72 facing the first substrate 71 by thermally conductive adhesive.

[0052] In some embodiments, the first substrate 71 is a printed circuit board, and the second substrate 72 is an aluminum substrate.

[0053] In some embodiments, a support post 73 is provided around the periphery of the first surface A, and the support post 73 is connected to the first substrate 71. The support post 73 supports the first substrate 71 to form a predetermined gap between the first substrate 71 and the first surface A.

[0054] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Therefore, any equivalent variations made in accordance with the claims of this application shall still fall within the scope of this application.

Claims

1. An electronic device, characterized in that, include: case; A heat sink has a first surface and a second surface arranged opposite to each other along a first direction. The heat sink is also provided with a first connecting hole and a first threaded hole arranged sequentially along the first direction. Along the first direction, the first connecting hole passes through the first surface, the first threaded hole passes through the second surface, and the first connecting hole communicates with the first threaded hole. A mounting plate is installed on the housing. The mounting plate is located on one side of the heat sink along the first direction. The mounting plate has a first mounting hole, the axis of which is parallel to the first direction. A first connector passes through the first threaded hole and the first mounting hole to connect the mounting plate and the heat sink.

2. The electronic device according to claim 1, characterized in that, The first connecting member is a bolt, and in a direction opposite to the first direction, the first connecting member passes through the first mounting hole and is screwed to the first threaded hole; or The first connector is a bolt, and the first mounting hole is a threaded hole. Along the first direction, the first connector passes through the first connecting hole and the first threaded hole in sequence and is then screwed and fixed to the first mounting hole.

3. The electronic device according to claim 1 or 2, characterized in that, The radiator includes a top plate, a bottom plate, and a connecting part. Along the first direction, the top plate and the bottom plate are disposed opposite each other, and there is a preset gap between the top plate and the bottom plate. The connecting part is connected to the bottom plate and the top plate. The first surface is the surface of the top plate facing away from the bottom plate, and the second surface is the surface of the bottom plate facing away from the top plate. The first connecting hole is provided on the top plate, and the first threaded hole is provided on the bottom plate.

4. The electronic device according to claim 3, characterized in that, The base plate includes a first base plate and a second base plate, and the connecting part includes a first connecting part and a second connecting part. The first base plate and the second base plate are arranged at intervals along a second direction. The first connecting part is connected between the first base plate and the top plate, and the second connecting part is connected between the second base plate and the top plate. The first threaded hole is provided in the first base plate. Wherein, the first direction is perpendicular to the second direction.

5. The electronic device according to claim 4, characterized in that, The heat sink is further provided with a second connecting hole and a second threaded hole arranged sequentially along the first direction. The second threaded hole is provided on the second base plate. Along the first direction, the second connecting hole penetrates the first surface and the second threaded hole penetrates the second surface. The second connecting hole and the second threaded hole are in communication. The mounting plate is provided with a second mounting hole. The axis of the second mounting hole is parallel to the first direction. The electronic device further includes a second connector. The second connector passes through the second threaded hole and the second mounting hole. Along the second direction, the heat sink includes a first end and a second end disposed opposite to each other; along the third direction, the heat sink includes a third end and a fourth end disposed opposite to each other; the first connecting hole and the first threaded hole are located at the junction of the first end and the third end; the second connecting hole and the second threaded hole are located at the junction of the second end and the fourth end. Wherein, the first direction, the second direction, and the third direction are mutually perpendicular to each other.

6. The electronic device according to claim 5, characterized in that, The second connecting member is a bolt, and in a direction opposite to the first direction, the second connecting member passes through the second mounting hole and is screwed into the second threaded hole; or The second connector is a bolt, and the second mounting hole is a threaded hole. Along the first direction, the second connector passes through the second connecting hole and the second threaded hole in sequence and is then screwed and fixed to the second mounting hole.

7. The electronic device according to claim 5, characterized in that, The first base plate is provided with a third threaded hole, which is located at the junction of the first end and the fourth end. Along the first direction, the third threaded hole penetrates the second surface. The mounting plate is provided with a third mounting hole, the axis of which is parallel to the first direction. The electronic device further includes a third connector, which is a bolt. The third connector is used to pass through the third mounting hole in a direction opposite to the first direction and then be screwed and fixed to the third threaded hole; and / or The second base plate is provided with a fourth threaded hole, which is located at the junction of the second end and the third end. The fourth threaded hole penetrates the second surface along the first direction. The mounting plate is provided with a fourth mounting hole, the axis of which is parallel to the first direction. The electronic device also includes a fourth connector, which is a bolt. The fourth connector is used to pass through the fourth mounting hole in a direction opposite to the first direction and then be screwed and fixed to the fourth threaded hole.

8. The electronic device according to claim 4, characterized in that, Along the second direction, the gap between the first connecting part and the second connecting part forms a first heat dissipation channel that penetrates the radiator along the third direction, and the gap between the first base plate and the second base plate forms a second heat dissipation channel that penetrates the radiator along the third direction, and the first heat dissipation channel and the second heat dissipation channel are connected; The top plate has a plurality of heat sinks protruding from the side facing away from the first surface, and the plurality of heat sinks are arranged sequentially along the second direction; Wherein, the first direction, the second direction, and the third direction are mutually perpendicular to each other.

9. The electronic device according to claim 5, characterized in that, The electronic device includes a circuit board assembly fixed to the heat sink. The circuit board assembly includes a first substrate, which is disposed opposite to the first surface along the first direction. The first substrate is provided with a first notch, which is aligned with the first connecting hole along the first direction, and / or the first substrate is provided with a second notch, which is aligned with the second connecting hole along the first direction.

10. The electronic device according to claim 9, characterized in that, The circuit board assembly includes a second substrate and a power device. Along the first direction, there is a preset gap between the first substrate and the first surface. The second substrate is disposed between the first substrate and the first surface. The surface of the second substrate facing away from the first substrate is attached to the first surface. The power device is disposed on the surface of the first substrate facing the second substrate. The surface of the power device facing away from the first substrate is connected to the surface of the second substrate facing the first substrate.

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