Metal insert heat dissipation structure and heater
By introducing a metal insert heat dissipation structure into the ceramic heater, the heat of the IGBT module is transferred to the flow channel plate assembly, and the heat dissipation is achieved by the fluid in the flow channel, thus solving the problem of IGBT module overheating and realizing the stable operation of the heater.
Patent Information
- Application Number
- CN202520174354.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-26
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-01-26
AI Technical Summary
Existing IGBT modules use natural heat dissipation in ceramic heaters, which leads to overheating and affects operational stability.
A metal insert heat dissipation structure is adopted to transfer the heat of the IGBT module to the flow channel plate assembly through the metal insert, and the heat is carried away by the fluid in the flow channel, thereby improving the heat dissipation efficiency.
Without altering the original heater structure, the heat dissipation effect of the IGBT module is significantly improved, ensuring the operational stability and reliability of the heater.
Smart Images
Figure CN223872628U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of thermal management technology, and more specifically, to a metal insert heat dissipation structure and a heater. Background Technology
[0002] Ceramic heaters are heating devices used in automotive thermal management systems. They work by generating heat through ceramic plates at a set voltage, which is then transferred to the vehicle's coolant. The heated coolant then flows through the conventional air conditioning unit, where the air conditioning system blows air to carry the heat away, thus heating the passenger compartment or other areas. The ceramic heater includes an IGBT (Insulated Gate Bipolar Transistor) module, a switching electrical component that controls the heater's power supply.
[0003] Existing IGBT modules use natural heat dissipation; however, IGBT modules may overheat during operation, affecting their operating conditions and consequently impacting the stability of the ceramic heater. Utility Model Content
[0004] The purpose of this utility model includes, for example, providing a metal insert heat dissipation structure and heater, which can rapidly dissipate heat from IGBT modules and has a simple structure and convenient arrangement.
[0005] The embodiments of this utility model can be implemented as follows:
[0006] In a first aspect, this utility model provides a metal insert heat dissipation structure, comprising:
[0007] Housing, IGBT module, and metal inserts;
[0008] The housing includes a cylindrical body and a partition, the partition being hermetically disposed within the cylindrical body to divide the cylindrical body into a mutually enclosed upper receiving space and a lower receiving space; the upper receiving space can be used to accommodate the heating core, and the lower receiving space can be used to accommodate the IGBT module;
[0009] The partition is provided with a through hole; one end of the metal insert is provided in the lower receiving space, and the other end of the metal insert extends through the through hole to the upper receiving space;
[0010] One end of the metal insert is attached to the flow channel plate assembly of the heating core, and the IGBT module is disposed on the metal insert so that the heat generated by the IGBT module is dissipated sequentially through the metal insert and the flow channel plate assembly.
[0011] In an optional embodiment, the metal insert includes a first plate that can be fitted into the through hole; the top surface of the first plate is attached to the bottom surface of the flow channel plate assembly, and the IGBT module is disposed on the bottom surface of the first plate.
[0012] In an optional embodiment, the metal insert further includes a connecting plate and a second plate; the two ends of the connecting plate are respectively connected to the first plate and the second plate; the side wall of the housing has a slot, and the second plate is engaged in the slot.
[0013] In an optional embodiment, a thermally conductive insulating pad is also included; the top of the thermally conductive insulating pad is attached to the bottom surface of the first plate, and the bottom surface of the thermally conductive insulating pad is attached to the top surface of the IGBT module.
[0014] In an optional embodiment, the top of the IGBT module is bonded to the bottom surface of the first plate of the metal insert.
[0015] In an optional embodiment, a thermosetting adhesive film is also included; the thermosetting adhesive film is disposed between the top surface of the IGBT module and the bottom surface of the first plate.
[0016] In an optional implementation, it also includes a pressure plate and at least two support columns;
[0017] The support column is disposed at the bottom of the partition and extends in a direction away from the upper receiving space; the support column has a first end close to the partition and a second end away from the partition; the support column is located on both sides of the IGBT module.
[0018] The top surface of the pressure plate abuts against the bottom of the IGBT module, and the second end of each support column is detachably connected to the pressure plate, so that the support column and the pressure plate together form a clamping space for clamping the IGBT module.
[0019] In an optional embodiment, a fastener is also included, wherein the pressure plate is provided with a first mating hole and the support column is provided with a second mating hole; the fastener passes through the first mating hole and the second mating hole in sequence to securely connect the pressure plate and the support column.
[0020] In an optional embodiment, a flexible element is also included; the end face of the pressure plate near the support column is provided with a receiving groove, the flexible element is disposed in the receiving groove, and the end of the flexible element away from the pressure plate abuts against the bottom of the IGBT module.
[0021] Secondly, the present invention provides a heater, the heater comprising any one of the foregoing embodiments.
[0022] The beneficial effects of this utility model embodiment include, for example:
[0023] This metal insert heat dissipation structure includes a housing, IGBT modules, and a metal insert. A partition divides the housing into an upper space for accommodating the heating element and a lower space for accommodating the IGBT modules. The metal insert extends through a through-hole into the upper space and connects to the flow channel plate assembly, transferring heat from the IGBT modules mounted on the metal insert to the flow channel plate assembly. The heat is then carried away by the fluid within the flow channel, improving the IGBT's heat dissipation efficiency. The other end of the metal insert extends through a through-hole into the upper space, enabling contact heat dissipation between the IGBT modules and the flow channel plate assembly on both sides of the partition. This simple modification improves the heat dissipation efficiency of the IGBT modules without altering the original heater structure. This metal insert heat dissipation structure is convenient to install, simple in structure, and low in modification cost, significantly improving the heat dissipation effect of the IGBT modules and thus ensuring the stability and reliability of the heater operation. Attached Figure Description
[0024] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0025] Figure 1 This is a cross-sectional schematic diagram of the heat dissipation structure of the metal insert according to an embodiment of the present utility model;
[0026] Figure 2 This is a schematic diagram of the metal insert heat dissipation structure according to an embodiment of the present utility model;
[0027] Figure 3 This is a cross-sectional view of the heat dissipation structure of the metal insert according to an embodiment of the present utility model.
[0028] Figure 4 This is a schematic diagram of the metal insert heat dissipation structure from another perspective, representing an embodiment of the present invention.
[0029] Icons: 10-Metal insert heat dissipation structure; 100-House; 101-Upper receiving space; 102-Lower receiving space; 110-Cylinder; 111-Slot; 112-First through hole; 120-Baffle; 121-Through hole; 200-IGBT module; 300-Metal insert; 310-First plate; 320-Second plate; 322-Second through hole; 330-Connecting plate; 400-Thermal conductive insulating pad; 510-Pressure plate; 511-First mating hole; 512-Accommodation groove; 520-Support column; 530-Flexible component; 20-Heating core; 21-Flow channel plate assembly; 31-Bolt. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0031] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0033] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0034] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.
[0035] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.
[0036] Please refer to Figure 1 This embodiment provides a metal insert heat dissipation structure 10, including:
[0037] Housing 100, IGBT module 200, and metal insert 300;
[0038] The housing 100 includes a cylindrical body 110 and a partition 120. The partition 120 is disposed in the cylindrical body 110 in a closed manner to divide the cylindrical body 110 into an upper receiving space 101 and a lower receiving space 102 that are closed to each other. The upper receiving space 101 can be used to receive the heating core 20, and the lower receiving space 102 can be used to receive the IGBT module 200.
[0039] The partition 120 is provided with a through hole 121; one end of the metal insert 300 is provided in the lower receiving space 102, and the other end of the metal insert 300 extends through the through hole 121 to the upper receiving space 101.
[0040] One end of the metal insert 300 is attached to the flow channel plate assembly 21 of the heating core 20, and the IGBT module 200 is disposed on the metal insert 300 so that the heat generated by the IGBT module 200 is dissipated sequentially through the metal insert 300 and the flow channel plate assembly 21.
[0041] The metal insert heat dissipation structure 10 of this solution uses a partition 120 to divide the housing 100 into an upper receiving space 101 that can accommodate the heating core 20 and a lower receiving space 102 that can accommodate the IGBT module 200. The metal insert 300 can extend into the upper receiving space 101 through the through hole 121 and connect with the flow channel plate assembly 21, thereby transferring the heat from the IGBT module 200 mounted on the metal insert 300 to the flow channel plate assembly 21, so that the fluid in the flow channel can carry away the heat and improve the heat dissipation efficiency of the IGBT. The other end of the metal insert 300 extends into the upper receiving space 101 through the through hole 121, so that the IGBT module 200 and the flow channel plate assembly 21 on both sides of the partition 120 can be contacted for heat dissipation. Without changing the original heater structure, the heat dissipation efficiency of the IGBT module 200 can be improved through simple modification. This heat dissipation structure is convenient to set up, simple in structure, and low in modification cost, and can significantly improve the heat dissipation effect of the IGBT module 200, thereby ensuring the stability and reliability of the heater operation.
[0042] Please continue reading. Figure 1 , Figure 2 , Figure 3 and Figure 4 To learn more about the structural details of the metal insert heat dissipation structure 10.
[0043] It should be noted that, in order to maintain the stability and reliability of the IGBT module 200 operation and avoid electromagnetic interference, the IGBT module 200 will not be in direct contact with the first plate 310 during installation. Optionally, a thermally conductive insulating material may be provided between the top surface of the IGBT module 200 and the bottom surface of the first plate 310.
[0044] As can also be seen from the figure, in an optional embodiment, the metal insert 300 includes a first plate 310, which can be fitted into the through hole 121; the top surface of the first plate 310 is attached to the bottom surface of the flow channel plate assembly 21, and the IGBT module 200 is disposed on the bottom surface of the first plate 310. This ensures the airtightness between the upper receiving space 101 and the lower receiving space 102.
[0045] from Figure 2 As can be seen from the optional embodiment, the metal insert 300 further includes a connecting plate 330 and a second plate 320; the two ends of the connecting plate 330 are respectively connected to the first plate 310 and the second plate 320; the side wall of the housing 100 has a slot 111, and the second plate 320 is snapped into the slot 111. This allows the second plate 320 to be stably mounted on the housing 100. Optionally, the inner wall of the slot 111 may also be provided with a first through hole 112, and the second plate 320 may be provided with a second through hole 322. The bolt 31 passes through the first through hole 112 and the second through hole 322 in sequence, so that the second plate 320 is fastened to the slot 111, thereby further ensuring the stable connection between the metal insert 300 and the housing 100.
[0046] Optionally, the connecting plate 330 has an included angle with both the first plate 310 and the second plate 320, thus maintaining a staggered arrangement of the connecting plate 330, the first plate 310, and the second plate 320, thereby avoiding interference from the metal insert 300 to other components. It is easy to understand that in other embodiments of this utility model, the connecting plate 330 and the first plate 310 and the second plate 320 can also be parallel, coplanar, partially angled, partially parallel, or completely staggered, etc. Those skilled in the art should be able to make reasonable choices and designs according to actual needs, and no specific limitations are made here.
[0047] Optionally, the connecting plate 330 is perpendicular to the first plate 310 and the second plate 320 respectively, and the first plate 310 and the second plate 320 are kept parallel, so that the metal insert 300 can extend in the horizontal direction, thereby reducing the height of the metal insert 300 and avoiding interference with other components.
[0048] from Figure 3 and Figure 4As can be seen from the optional embodiment, the metal insert heat dissipation structure 10 further includes a thermally conductive insulating pad 400; the top of the thermally conductive insulating pad 400 is attached to the bottom surface of the first plate 310, and the bottom surface of the thermally conductive insulating pad 400 is attached to the top surface of the IGBT module 200. The thermally conductive insulating pad 400 enables heat transfer from the IGBT module 200 to the first plate 310, thereby achieving heat dissipation through the flow channel assembly; on the other hand, it can prevent electromagnetic interference from other components to the IGBT module 200 through insulation.
[0049] Optionally, the area of the thermally conductive insulating pad 400 is larger than the diameter of the through hole 121, so that the thermally conductive insulating pad 400 covers the entire through hole 121. The area of the thermally conductive insulating pad 400 is also larger than the area of the first plate 310, so that the thermally conductive insulating pad 400 covers the bottom surface of the first plate 310, thereby ensuring the thermal insulation effect on the IGBT module 200.
[0050] In an optional embodiment, the top of the IGBT module 200 is bonded to the bottom surface of the first plate 310 of the metal insert 300. This arrangement ensures a stable connection between the IGBT module 200 and the first plate 310, and the bonding method improves assembly convenience. Furthermore, the bonding method allows the IGBT module 200 to fit more tightly against the surface of the first plate 310, thereby facilitating the efficient dissipation of heat from the IGBT module 200 to the first plate 310, and subsequently to the flow channel plate assembly 21 for efficient heat dissipation.
[0051] In an optional embodiment, the metal insert heat dissipation structure 10 further includes a thermosetting adhesive film; the thermosetting adhesive film is disposed between the top surface of the IGBT module 200 and the bottom surface of the first plate 310.
[0052] As can also be seen from the figure, in an optional embodiment, the metal insert heat dissipation structure 10 further includes a pressure plate 510 and at least two support pillars 520; the support pillars 520 are disposed at the bottom of the partition 120, and extend in a direction away from the upper receiving space 101; the support pillars 520 have a first end near the partition 120 and a second end away from the partition 120; the support pillars 520 are respectively located on both sides of the IGBT module 200; the top surface of the pressure plate 510 abuts against the bottom of the IGBT module 200, and the second ends of the support pillars 520 are detachably connected to the pressure plate 510, so that the support pillars 520 and the pressure plate 510 maintain a holding space for holding the IGBT module 200. The pressure plate 510 ensures that the IGBT module 200 is stably disposed in the housing 100.
[0053] In an optional embodiment, the metal insert heat dissipation structure 10 further includes fasteners. The pressure plate 510 is provided with a first mating hole 511, and the support column 520 is provided with a second mating hole. The fasteners pass through the first mating hole 511 and the second mating hole in sequence to securely connect the pressure plate 510 and the support column 520. Optionally, the fasteners are threaded into the second mating hole. This simplifies the detachable connection between the pressure plate 510 and the support column 520, facilitating installation, removal, and maintenance.
[0054] In an optional embodiment, the metal insert heat dissipation structure 10 further includes a flexible element 530; a receiving groove 512 is provided on the end face of the pressure plate 510 near the support column 520, the flexible element 530 is disposed in the receiving groove 512, and the end of the flexible element 530 away from the pressure plate 510 abuts against the bottom of the IGBT module 200. The flexible element 530 can prevent the pressure plate 510 from squeezing and damaging the IGBT module 200 during installation, thereby ensuring the safety and reliability of the IGBT module 200.
[0055] It should be noted that, in another embodiment of this utility model, the pressure plate 510 includes a plate body and a plurality of spring pieces, with the spring pieces disposed on the top surface of the plate body. Both the plate body and the spring pieces are made of metal. A first mating hole 511 is provided on the plate body. Fasteners pass through the first mating hole 511 and the second mating hole in sequence to securely connect the plate body to the support column 520. The spring pieces are used to abut against the bottom of the IGBT module 200 to provide an elastic force that moves the IGBT module 200 away from the plate body, allowing the IGBT module 200 to press against the thermally conductive insulating pad 400, thereby ensuring that the IGBT module 200 can be stably disposed on the pressure plate. Optionally, the plate body and the spring pieces are integrally formed.
[0056] Furthermore, the plate is also provided with multiple through holes, the number of which is the same as the number of spring clips. The through holes and spring clips are arranged in a one-to-one correspondence, with the through holes located below the corresponding spring clips. On the one hand, the through holes provide space for the spring clips to move; on the other hand, the spring clips are formed by stamping the plate material with the through holes.
[0057] Secondly, this utility model provides a heater, which includes any of the aforementioned embodiments.
[0058] In summary, this utility model embodiment provides a metal insert heat dissipation structure 10 and a heater, which has at least the following advantages:
[0059] The metal insert 300 extends into the core side and contacts the flow channel surface to utilize the water in the flow channel to carry away heat and improve the heat dissipation efficiency of the IGBT module 200.
[0060] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.
Claims
1. A metal insert heat dissipation structure, characterized in that, include: Housing (100), IGBT module (200), and metal insert (300); The housing (100) includes a cylindrical body (110) and a partition (120). The partition (120) is hermetically disposed in the cylindrical body (110) to divide the cylindrical body (110) into a mutually enclosed upper receiving space (101) and a lower receiving space (102). The upper receiving space (101) can be used to receive the heating core (20), and the lower receiving space (102) can be used to receive the IGBT module (200). The partition (120) is provided with a through hole (121); one end of the metal insert (300) is provided in the lower receiving space (102), and the other end of the metal insert (300) extends through the through hole (121) to the upper receiving space (101); One end of the metal insert (300) is attached to the flow channel plate assembly (21) of the heating core (20), and the IGBT module (200) is disposed on the metal insert (300) so that the heat generated by the IGBT module (200) is dissipated sequentially through the metal insert (300) and the flow channel plate assembly (21).
2. The metal insert heat dissipation structure according to claim 1, characterized in that: The metal insert (300) includes a first plate (310) that can be fitted into the through hole (121); the top surface of the first plate (310) is attached to the bottom surface of the flow channel plate assembly (21), and the IGBT module (200) is disposed on the bottom surface of the first plate (310).
3. The metal insert heat dissipation structure according to claim 2, characterized in that: The metal insert (300) further includes a connecting plate (330) and a second plate (320); the two ends of the connecting plate (330) are respectively connected to the first plate (310) and the second plate (320); the side wall of the housing (100) has a slot (111), and the second plate (320) is engaged in the slot (111).
4. The metal insert heat dissipation structure according to claim 2, characterized in that: It also includes a thermally conductive insulating pad (400); the top of the thermally conductive insulating pad (400) is attached to the bottom surface of the first plate (310), and the bottom surface of the thermally conductive insulating pad (400) is attached to the top surface of the IGBT module (200).
5. The metal insert heat dissipation structure according to claim 2, characterized in that: The top of the IGBT module (200) is bonded to the bottom surface of the first plate (310) of the metal insert (300).
6. The metal insert heat dissipation structure according to claim 5, characterized in that: It also includes a thermosetting adhesive film; the thermosetting adhesive film is disposed between the top surface of the IGBT module (200) and the bottom surface of the first plate (310).
7. The metal insert heat dissipation structure according to claim 1, characterized in that: It also includes a pressure plate (510) and at least two support columns (520); The support column (520) is disposed at the bottom of the partition (120) and extends in a direction away from the upper receiving space (101); the support column (520) has a first end close to the partition (120) and a second end away from the partition (120); the support column (520) is located on both sides of the IGBT module (200); The top surface of the pressure plate (510) abuts against the bottom of the IGBT module (200), and the second end of the support column (520) is detachably connected to the pressure plate (510) so that the support column (520) and the pressure plate (510) form a clamping space for clamping the IGBT module (200).
8. The metal insert heat dissipation structure according to claim 7, characterized in that: It also includes fasteners, the pressure plate (510) is provided with a first mating hole (511), and the support column (520) is provided with a second mating hole; the fasteners pass through the first mating hole (511) and the second mating hole in sequence, so that the pressure plate (510) and the support column (520) are fastened together.
9. The metal insert heat dissipation structure according to claim 7, characterized in that: It also includes a flexible component (530); the end face of the pressure plate (510) near the support column (520) is provided with a receiving groove (512), the flexible component (530) is disposed in the receiving groove (512), and the end of the flexible component (530) away from the pressure plate (510) abuts against the bottom of the IGBT module (200).
10. A heater, characterized in that: The heater includes a metal insert heat dissipation structure as described in any one of claims 1-9.