Wafer chuck and wafer chuck temperature control system

Abstract

The utility model relates to a wafer chuck and a wafer chuck temperature control system, and the wafer chuck comprises a chuck body which is provided with a supporting surface for supporting a wafer. The disc body is provided with a cooling channel, and the cooling channel is used for introducing a cooling medium to cool the wafer on the supporting surface; and the tray body is also provided with a heating element, and the heating element is used for heating the tray body so as to heat the wafer on the supporting surface through the tray body. According to the technical scheme of the utility model, the cooling channel is matched with the heating element, so that the temperature of the wafer on the supporting surface can be controlled within a preset range, the wafer chuck can be quickly cooled within a short time by the cooling mode, the temperature fluctuation is small, the temperature uniformity of the wafer chuck can be ensured within an error range of 1%, and the wafer chuck can be quickly cooled. And the temperature control precision is high, and the requirement of high-precision semiconductor manufacturing can be met.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer technology field especially relates to a wafer chuck and wafer chuck temperature control system. BACKGROUND

[0002] With the rapid development of semiconductor industry, the control requirement of temperature in the production and test process of wafer is higher and higher. At present, the cooling medium is passed into the cooling channel of wafer chuck by refrigerating machine to cool the wafer, but the temperature fluctuation of this kind of mode is big, and the control precision is low, so the problem needs to be solved. UTILITY MODEL CONTENTS

[0003] Therefore, the utility model provides a wafer chuck and wafer chuck temperature control system, and mainly solves the technical problem of how to reduce the temperature fluctuation of wafer chuck and improve the temperature control precision.

[0004] To achieve the above purpose, the utility model mainly provides the following technical scheme:

[0005] The embodiment of the utility model provides a wafer chuck, which comprises a disc body, the disc body has a supporting surface for supporting a wafer, a cooling channel is arranged on the disc body, and the cooling channel is used for passing in cooling medium to cool the wafer on the supporting surface.

[0006] The disc body is further provided with a heating piece, and the heating piece is used for heating the disc body to heat the wafer on the supporting surface through the disc body.

[0007] In some embodiments, the disc body has a first surface opposite to the supporting surface, and the heating piece is arranged on the first surface.

[0008] In some embodiments, the heating piece is a heating wire, the first surface is provided with a spiral mounting groove, and the heating wire is mounted along the spiral mounting groove.

[0009] In some embodiments, the wafer chuck further comprises fixing pieces, the number of the fixing pieces is two or more, and the fixing pieces are arranged along the extension direction of the heating wire in sequence, each fixing piece is used for fixing different positions of the heating wire, and each fixing piece cooperates to fix the heating wire on the first surface.

[0010] In some embodiments, each fixing piece is used for fixing two adjacent turns of the heating wire.

[0011] In some embodiments, each fixing piece has a first pressing groove and a second pressing groove, each fixing piece fixes one turn of the heating wire through the first pressing groove, and fixes another adjacent turn of the heating wire through the second pressing groove.

[0012] In some embodiments, each of the fixing pieces is fixedly connected with the disc body by a screw; wherein each through hole on each fixing piece for the screw to pass through is located between the corresponding first pressing groove and second pressing groove.

[0013] In some embodiments, the cooling channel is a channel hole arranged inside the disc body; wherein the disc body is a two-piece structure, and is a first half disc body and a second half disc body respectively; one half of the channel hole is located on the first half disc body, and the other half is located on the second half disc body.

[0014] In some embodiments, the cooling channel comprises two or more arc-shaped channel segments, each of which is arranged in sequence along the radial direction of the disc body from inside to outside; each of the arc-shaped channel segments has a first center line extending along the thickness direction of the disc body, and each of the first center lines coincides.

[0015] Wherein, each of the two adjacent arc-shaped channel segments is connected by a straight line segment, and the center lines of some straight line segments are located on the same straight line.

[0016] The utility model also provides a wafer chuck temperature control system, it includes liquid refrigerator and above any one of the wafer chuck, the liquid refrigerator has cooling medium outlet, cooling medium outlet with cooling channel intercommunication, to the cooling channel in with cooling medium.

[0017] Through the above technical scheme, the wafer chuck and wafer chuck temperature control system of the utility model have at least the following beneficial effects:

[0018] 1, the cooling channel and heating piece can control the temperature of the wafer on the support surface in the preset range, the cooling method can realize the rapid cooling of the wafer chuck in a short time, the temperature fluctuation is small, the temperature uniformity of the wafer chuck can be guaranteed within 1% error range, the temperature control precision is high, can satisfy the requirement of high-precision semiconductor manufacturing.

[0019] 2, compared with traditional air refrigerator, liquid refrigerator can greatly improve the refrigeration efficiency, reduce energy consumption.In addition, liquid refrigerator can more efficiently utilize cooling liquid, reduce the waste of energy in the cooling process, thereby effectively reducing the production cost.

[0020] The above description is only a summary of the technical scheme of the utility model, in order to more clearly understand the technical means of the utility model, and can be implemented according to the content of the specification, the following preferred embodiments of the utility model are described in detail with the help of the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained according to the structures shown in these drawings without creative labor.

[0022] Figure 1 is a front view of a wafer chuck provided by an embodiment of the present application;

[0023] Figure 2 is a back view of a wafer chuck provided by an embodiment of the present application;

[0024] Figure 3 is a structure view of a fixing sheet provided by an embodiment of the present application;

[0025] Figure 4 is a structure view of a fixing sheet provided by an embodiment of the present application;

[0026] Reference signs: 1, disc body; 2, heating wire; 3, fixing sheet; 4, screw; 11, support surface; 12, cooling channel; 13, straight line segment; 14, first surface; 31, first pressing groove; 32, second pressing groove; 33, via hole; 121, arc-shaped channel segment; m, first center line. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments only constitute some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0028] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain specific posture (as shown in the drawings). If the specific posture changes, the directional indications also change accordingly.

[0029] In addition, if the description of "first", "second" and the like is involved in the embodiments of the present application, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary technical personnel in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor in the protection scope required by the present application.

[0030] As shown in Figures 1-4 An embodiment of the present application provides a wafer chuck, which comprises a disc body 1, the disc body 1 has a support surface 11 for providing support for a wafer. The disc body 1 is provided with a cooling channel 12, and the cooling channel 12 is used for passing cooling medium to cool the wafer on the support surface 11. Wherein, the disc body 1 is further provided with a heating element, and the heating element is used for heating the disc body 1 to heat the wafer on the support surface 11 through the disc body 1.

[0031] The working principle of the wafer chuck for cooling the wafer is that an external refrigeration machine such as a liquid refrigeration machine is used to pass cooling medium into the cooling channel 12 on the disc body 1, and the cooling medium flows through the cooling channel 12 to cool the wafer chuck, so as to cool the wafer through the wafer chuck. In use, the wafer on the support surface 11 can be cooled to below the preset temperature by using the cooling channel 12, and then the disc body 1 is heated by the heating element to heat the wafer on the support surface 11, so that the temperature of the wafer reaches the preset temperature. Wherein, the cooling channel 12 and the heating element can cooperate to control the temperature of the wafer on the support surface 11 within a preset range, and the cooling method can realize rapid cooling of the wafer chuck in a short time, the temperature fluctuation is small, the uniformity of the wafer chuck can be guaranteed within an error range of 1%, the temperature control precision is high, and the requirements of high-precision semiconductor manufacturing can be met.

[0032] In some embodiments, as shown in Figure 2 The aforementioned disc body 1 has a first surface 14 opposite to the support surface 11, and the aforementioned heating element is arranged on the first surface 14. Wherein, the support surface 11 is located on the front surface of the disc body 1, and the first surface 14 is located on the back surface of the disc body 1. Wherein, by arranging the heating element on the back surface of the disc body 1, the interference with the wafer on the front surface can be reduced, and the installation is also facilitated.

[0033] In some embodiments, the aforementioned heating element can be a heating wire 2, which is a commercially available component, and its structure is prior art, which will not be described here. The heating wire 2 can be a nickel-chromium heating wire or the like.

[0034] The first surface 14 is provided with a spiral mounting groove, and the heating wire 2 is mounted along the spiral mounting groove, so that the heating wire 2 is also in a spiral shape, which is beneficial to the uniform distribution of the heating wire 2 on the first surface 14 and improves the heating efficiency of the heating wire 2 on the disc body 1.

[0035] In order to prevent the heating wire 2 from falling off the disc body 1, in some embodiments, as shown in Figure 2 The wafer chuck further includes fixing pieces 3, the number of the fixing pieces 3 can be two or more, and the fixing pieces 3 are arranged in sequence along the extension direction of the heating wire 2. Each fixing piece 3 is used to fix different positions of the heating wire 2. The fixing pieces 3 cooperate to fix the heating wire 2 on the first surface 14.

[0036] In the above example, the fixing of the heating wire 2 can be realized by the cooperation of the fixing pieces 3, so as to prevent the heating wire 2 from falling off the disc body 1.

[0037] In some embodiments, as shown in Figure 2 Each fixing piece 3 is used to fix two adjacent turns of the heating wire 2, so that the number of the fixing pieces 3 can be saved, and the cost is reduced. In a specific application example, as shown in Figure 3 Each fixing piece 3 has a first pressing groove 31 and a second pressing groove 32, each fixing piece 3 fixes one turn of the heating wire 2 through the first pressing groove 31, and fixes another adjacent turn of the heating wire 2 through the second pressing groove 32. The fixing piece 3 fixes the two adjacent turns of the heating wire 2 through the first pressing groove 31 and the second pressing groove 32.

[0038] In the above example, the pressing grooves on the fixing piece 3 are used to fix the heating wire 2, and the pressing grooves have the effect of limiting the heating wire 2, so as to reduce the shaking of the heating wire 2.

[0039] In some embodiments, as shown in Figure 2 Each fixing piece 3 is fixedly connected to the disc body 1 through a screw 4, so that each fixing piece 3 can be disassembled. When each fixing piece 3 is disassembled from the disc body 1, the heating wire 2 can also be disassembled from the disc body 1, so as to facilitate the maintenance and replacement of the heating wire 2.

[0040] In some embodiments, as shown in Figure 3 The via hole 33 for the screw 4 to pass through on each fixing piece 3 is located between the corresponding first pressing groove 31 and second pressing groove 32, so that when the screw 4 is screwed, the fixing piece 3 can apply force to the heating wire 2 in the first pressing groove 31 and the second pressing groove 32 more uniformly.

[0041] In some embodiments, as shown in Figure 4As shown, the aforementioned cooling channel 12 can be a channel hole disposed inside the disc body 1. The disc body 1 has a two-half structure, namely a first half disc body and a second half disc body 1; one half of the channel hole is located on the first half disc body, and the other half is located on the second half disc body 1.

[0042] In the above example, space can be saved by placing the cooling channel 12 inside the disk body 1. In addition, designing the disk body 1 as a two-half structure facilitates the machining of the cooling channel 12 inside the disk body 1.

[0043] In some implementations, such as Figure 4 As shown, the aforementioned cooling channel 12 may include two or more arc-shaped channel segments 121, which are arranged sequentially from the inside to the outside along the radial direction of the disk body 1. Each arc-shaped channel segment 121 has a first center line m extending along the thickness direction of the disk body 1, and all the first center lines m coincide. This arrangement of the cooling channel 12 is beneficial for uniformly distributing the cooling channel 12 inside the disk body 1, thereby improving the cooling efficiency of the cooling channel 12 on the disk body 1.

[0044] In this configuration, each pair of adjacent arc-shaped channel segments 121 is connected by a straight segment 13, and the center lines of some straight segments 13 are located on the same straight line, which is beneficial for processing and improves processing efficiency.

[0045] This invention also provides a wafer chuck temperature control system, which may include a liquid chiller and a wafer chuck as described above. The liquid chiller has a cooling medium outlet, which is connected to a cooling channel 12 to introduce cooling medium into the cooling channel 12. Because the wafer chuck temperature control system uses the aforementioned wafer chuck, it can achieve rapid cooling of the wafer chuck in a short time, with small temperature fluctuations and high control accuracy, meeting the requirements of high-precision semiconductor manufacturing.

[0046] The aforementioned refrigeration unit can be a liquid refrigeration unit, such as a chimmer liquid refrigeration unit, where the cooling medium is coolant. Compared to traditional air-cooled refrigeration units, liquid refrigeration units significantly improve refrigeration efficiency and reduce energy consumption. Furthermore, liquid refrigeration units can utilize coolant more efficiently, reducing energy waste during the cooling process and thus effectively lowering production costs.

[0047] In this invention, a liquid chiller is used as the main cooling equipment for wafer temperature control. The heating wire 2 ensures the stability and accuracy of wafer chuck cooling, improves cooling efficiency and temperature control accuracy, and enables rapid and uniform cooling of the wafer chuck. In addition, this invention also integrates a temperature sensor and a control system, realizing real-time monitoring and precise control of wafer chuck temperature.

[0048] The above merely describes preferred embodiments of the present application, and is not intended to limit the patent scope of the present application, and any equivalent structural transformation or direct / indirect application in other related technical fields under the inventive concept of the present application, as described in the present application specification and drawings, is included in the patent protection scope of the present application.

Claims

1. A wafer chuck, characterized by, The wafer chuck comprises a disc body (1) having a support surface (11) for supporting a wafer; a cooling channel (12) is arranged on the disc body (1) for supplying a cooling medium to cool the wafer on the support surface (11); The disc body (1) further comprises a heating element arranged on the disc body (1) for heating the disc body (1) to heat the wafer on the support surface (11).

2. The wafer chuck according to claim 1, wherein The disc body (1) has a first surface (14) opposite to the support surface (11), and the heating element is arranged on the first surface (14).

3. The wafer chuck according to claim 2, wherein The heating element is a heating wire (2), and the first surface (14) is provided with a helical mounting groove, and the heating wire (2) is arranged along the helical mounting groove.

4. The wafer chuck of claim 3, wherein, The wafer chuck further comprises two or more fixing pieces (3) arranged along the extension direction of the heating wire (2) in sequence, each fixing piece (3) is arranged to fix a different position of the heating wire (2), and each fixing piece (3) is arranged to fix the heating wire (2) on the first surface (14).

5. The wafer chuck according to claim 4, wherein Each fixing piece (3) is arranged to fix two adjacent turns of the heating wire (2).

6. The wafer chuck according to claim 5, wherein Each fixing piece (3) has a first pressing groove (31) and a second pressing groove (32), each fixing piece (3) is arranged to fix one turn of the heating wire (2) through the first pressing groove (31), and is arranged to fix another adjacent turn of the heating wire (2) through the second pressing groove (32).

7. The wafer chuck according to claim 6, wherein Each fixing piece (3) is fixedly connected to the disc body (1) through a screw (4), and each through hole (33) of each fixing piece (3) for the screw (4) to pass through is located between the corresponding first pressing groove (31) and the second pressing groove (32).

8. The wafer chuck according to any one of claims 1-7, wherein The cooling channel (12) is a channel hole arranged inside the disc body (1), and the disc body (1) has a two-half structure and comprises a first half disc body and a second half disc body, one half of the channel hole is arranged on the first half disc body, and the other half is arranged on the second half disc body.

9. The wafer chuck according to claim 8, wherein The cooling channel (12) comprises two or more arc-shaped channel segments (121), each arc-shaped channel segment (121) is arranged in sequence and spaced apart along the radial direction of the disc body (1) from inside to outside, each arc-shaped channel segment (121) has a first center line (m) extending along the thickness direction of the disc body (1), and each first center line (m) is coincident; Each two adjacent arc-shaped channel segments (121) are connected in series through a straight line segment (13), and the center line of part of the straight line segments (13) is located on the same straight line.

10. A wafer chuck temperature control system, characterized by, A liquid cryostat and a wafer chuck according to any one of claims 1-9. The liquid cryostat has a cooling medium outlet which is in communication with the cooling channel (12) for passing cooling medium into the cooling channel (12).

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