Wafer polishing solution residue cleaning device

Abstract

The utility model discloses a wafer polishing solution residue cleaning device, which relates to the technical field of silicon wafer processing devices, and comprises a cleaning brush, the cleaning brush is rotatably connected in a sliding assembly, a rotary connecting block is further arranged above the sliding assembly in a matched manner, the cleaning brush comprises a cleaning brush disc, and the cleaning brush disc is provided with a plurality of rotating shafts. A rotating shaft body is fixedly connected to the cleaning brush disc, a gear is fixedly connected to the rotating shaft body, and a plurality of bristles are evenly distributed at the bottom of the cleaning brush disc; a gear is fixedly connected to a rotating shaft body of a cleaning brush, the cleaning brush can rotate in the front-back moving process of the cleaning brush through meshing of the gear and a rack, then the cleaning effect is improved, in addition, a rotating connecting block and a rotating driving assembly are arranged, rotation of a connecting column is achieved through stretching and retracting of a second telescopic rod, and therefore the cleaning effect is improved. The sliding assembly is further driven to rotate.

Description

TECHNICAL FIELD

[0001] The utility model relates to a silicon wafer processing device technical field, specifically is a wafer polishing liquid residual cleaning device. BACKGROUND

[0002] Wafer polishing equipment is the key equipment in semiconductor manufacturing, and is used for grinding and polishing wafers to obtain smooth surfaces, and provides high-quality substrates for subsequent chip manufacturing processes, and the equipment usually comprises a cavity, a sealing cover, a chuck, a stage, a polishing pad, a cleaning device and a controller and the like, but in the polishing process, the polishing liquid and its polishing debris are inevitably left on the wafer adsorption chuck, and after wafer crystallization, the chuck will be contaminated, the existing polishing device only relies on the water spraying device of the chuck itself to eliminate crystallization, and the elimination effect of crystallization is poor, so that the adsorption surface of the wafer will appear print defects in the adsorption process.

[0003] The patent CN217941043U discloses a wafer polishing liquid residual cleaning device, which is provided with a wafer adsorption chuck, one side of the wafer adsorption chuck is provided with a chuck cleaning mechanism, the chuck cleaning mechanism comprises a flushing brush arm, the tail end of the flushing brush arm is provided with a cleaning brush, and the cleaning brush is located above the wafer adsorption chuck, after the wafer polishing is completed, the wafer adsorption chuck continues to rotate, the cleaning brush slowly rotates from the side and moves to the wafer adsorption chuck, the chuck and the cleaning brush are relatively rotated to flush the surface of the chuck, and when the cleaning brush reaches the center of the chuck, the cleaning brush is moved in the reverse direction to flush the chuck again, so that the chuck is cleaned.

[0004] However, the device has the following problems in use: the device mainly brushes the polishing liquid and its polishing debris on the surface of the wafer adsorption chuck by moving the cleaning brush forward and backward, the cleaning effect is poor due to the fact that the cleaning brush cannot rotate itself, and the cleaning brush cannot clean the residual liquid in the dead angle of the wafer adsorption chuck due to the fact that the angle of the cleaning brush cannot be adjusted during the cleaning process, thereby affecting the cleaning effect.

[0005] Therefore, the wafer polishing liquid residual cleaning device is provided to solve the problems in the background art. TECHNICAL SOLUTION

[0006] The utility model discloses a wafer polishing liquid residual cleaning device to solve the problems in the background art.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0008] The utility model provides a kind of wafer polishing solution residual cleaning device, including cleaning brush, the cleaning brush is rotatably connected in sliding assembly, the sliding assembly top is also equipped with a rotatable connection block, the cleaning brush includes a cleaning brush disc, the cleaning brush disc is fixedly connected with a rotating shaft body, the rotating shaft body is fixedly connected with a gear, the bottom of the cleaning brush disc is evenly distributed with multiple bristles.

[0009] Preferably, the sliding assembly includes a moving block, a U-shaped sliding groove is formed in the moving block, a through shaft hole is provided in the moving block, a rack that cooperates with the gear is provided in the U-shaped sliding groove, a fixed block is fixedly connected to the side of the rack away from the moving block, the fixed block is connected to the fixed end of the first telescopic rod on one side, and the telescopic end of the first telescopic rod is connected to the moving block.

[0010] Preferably, a lower fixing member is further provided below the cleaning brush, the lower fixing member includes a fixed chuck, a polishing pad is provided in the fixed chuck, a shielding cover is provided outside the polishing pad, a first water outlet hole is formed in the polishing pad, a plurality of drainage holes are formed in the inner side of the shielding cover, and a plurality of fixed mounting holes are circumferentially arranged on the surface of the fixed chuck.

[0011] Preferably, the rotatable connection block includes an L-shaped support plate, two clamping plates are symmetrically provided on one side of the L-shaped support plate, a U-shaped clamp mounting groove is formed in the clamping plate, a first pin shaft sliding groove is provided in the U-shaped clamp mounting groove, and a connecting column mounting hole is formed in the surface of the clamping plate.

[0012] Preferably, a rotating drive assembly is further provided in the rotatable connection block, the rotating drive assembly includes a second telescopic rod fixedly connected to the side of the L-shaped support plate, a U-shaped clamp is connected to the telescopic end of the second telescopic rod, a pin shaft mounting hole is formed in one end of the U-shaped clamp away from the second telescopic rod, a pin shaft is provided in the pin shaft mounting hole, a connecting key is provided in the U-shaped clamp, a second pin shaft sliding groove is provided on the connecting key, and the rotating drive assembly is connected to the sliding assembly through the connecting column.

[0013] Preferably, the size of the connecting key and the clamping plate is matched with each other.

[0014] Preferably, the rotatable connection block is fixedly connected to the bottom of the upper fixed plate, a plurality of positioning mounting holes are formed in the upper fixed plate, and a second water outlet hole is provided in the upper fixed plate.

[0015] Preferably, the shielding cover is made of transparent plastic material, and the height of the shielding cover is greater than the height of the polishing pad.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] 1. The utility model discloses a gear is fixedly connected on the rotating shaft body of cleaning brush, utilizes the meshing of gear and rack, can rotate in the process of cleaning brush's back and forth movement, and cleaning brush also will rotate, and then promotes the effect of cleaning.

[0018] 2. The utility model discloses setting up rotary connecting block and rotary drive component, utilizes the telescoping of second telescopic link, realizes the rotation of connecting column, and then drives sliding assembly rotation. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is the structural diagram of the utility model.

[0020] Figure 2 It is the explosion drawing of sliding assembly in the utility model.

[0021] Figure 3 It is the structural diagram of fixed chuck in the utility model.

[0022] Figure 4 It is the schematic diagram of sliding assembly and rotary assembly cooperation in the utility model.

[0023] Figure 5 It is the explosion drawing of rotary assembly in the utility model.

[0024] Figure 6 It is the structural diagram of upper fixed plate in the utility model.

[0025] Figure mark comment: 100, cleaning brush, 101, cleaning brush disc, 102, rotating shaft body, 103, brush, 104, gear, 200, sliding assembly, 201, moving block, 202, U-shaped slide, 203, shaft hole, 204, rack, 205, fixed block, 206, first telescopic link, 300, lower fixed part, 301, fixed chuck, 302, polishing pad, 303, shield cover, 304, first water outlet, 305, drain hole, 306, fixed mounting hole, 400, rotary connecting block, 401, L-shaped support plate, 402, clamping plate, 403, U-shaped clamp installation groove, 404, first pin shaft slide, 405, connecting column installation hole, 500, upper fixed plate, 501, positioning installation hole, 502, second water outlet, 600, rotary drive component, 601, second telescopic link, 602, U-shaped clamp, 603, pin shaft installation hole, 604, pin shaft, 605, connecting key, 606, second pin shaft slide, 607, connecting column. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantage of the utility model more clearly, the following combines the drawing and example, and further detailedly explains the utility model.

[0027] In one embodiment, as shown in Figure 1 and Figure 2 A wafer polishing solution residue cleaning device, comprising a cleaning brush 100, the cleaning brush 100 is rotatably connected in a sliding assembly 200, a rotating connecting block 400 is further matched above the sliding assembly 200, used to drive the sliding assembly 200 to rotate; the cleaning brush 100 comprises a cleaning brush disc 101, a rotating shaft body 102 is fixedly connected on the cleaning brush disc 101; a gear 104 is fixedly connected on the rotating shaft body 102, through the meshing of the gear 104 and the rack 204, the rotation of the cleaning brush 100 can be realized; a plurality of bristles 103 are uniformly distributed on the bottom of the cleaning brush disc 101.

[0028] In one embodiment, as shown in Figure 2 The sliding assembly 200 comprises a moving block 201, a U-shaped sliding groove 202 is formed in the moving block 201, a through shaft hole 203 is arranged in the moving block 201, used to cooperate with the rotating shaft body 102, and then the rotation of the cleaning brush 100 is limited; a rack 204 matched with the gear 104 is arranged in the U-shaped sliding groove 202, a fixed block 205 is fixedly connected on the side of the rack 204 away from the moving block 201, the side of the fixed block 205 is connected with the fixed end of the first telescopic rod 206, the telescopic end of the first telescopic rod 206 is connected with the moving block 201, the moving block 201 can be driven to move forward and backward through the first telescopic rod 206, and then the cleaning brush 100 moves.

[0029] In one embodiment, as shown in Figure 3 The lower side of the cleaning brush 100 is further matched with a lower fixing part 300, the lower fixing part 300 comprises a fixed chuck 301, a polishing pad 302 is arranged in the fixed chuck 301, a shielding cover 303 is arranged on the outer side of the polishing pad 302, used to block the waste liquid and waste chips taken away by the cleaning brush 100 during cleaning, to prevent splashing; a first water outlet hole 304 is formed in the polishing pad 302, to provide a hole for an external water pipe; a plurality of drainage holes 305 are formed in the inner side of the shielding cover 303, used to drain the waste liquid in time, to prevent the waste liquid from accumulating; a plurality of fixed mounting holes 306 are circumferentially arranged on the surface of the fixed chuck 301, to facilitate the connection of the fixed chuck 301 and the wafer polishing mechanism.

[0030] In one embodiment, as shown in Figure 5As shown, the rotating connecting block 400 includes an L-shaped support plate 401, and two clamping plates 402 are symmetrically arranged on one side of the L-shaped support plate 401 to reserve space for the connecting key 605; a U-shaped clamp mounting groove 403 is arranged on the clamping plate 402, and a first pin shaft sliding groove 404 is arranged in the U-shaped clamp mounting groove 403 to facilitate left and right sliding of the pin shaft 604; and a connecting column mounting hole 405 is arranged on the surface of the clamping plate 402.

[0031] In one embodiment, as shown in Figure 4 and Figure 5 As shown, the rotating connecting block 400 is provided with a rotating driving assembly 600, the rotating driving assembly 600 includes a second telescopic rod 601 fixedly connected to the side surface of the L-shaped support plate 401 to provide power for sliding of the U-shaped clamp 602; the telescopic end of the second telescopic rod 601 is connected with the U-shaped clamp 602, a pin shaft mounting hole 603 is arranged at the end of the U-shaped clamp 602 away from the second telescopic rod 601, a pin shaft 604 is arranged in the pin shaft mounting hole 603, a connecting key 605 is arranged in the U-shaped clamp 602, and a second pin shaft sliding groove 606 is arranged on the connecting key 605; the rotating driving assembly 600 is connected with the sliding assembly 200 through a connecting column 607.

[0032] In one embodiment, as shown in Figure 5 The size of the connecting key 605 and the clamping plate 402 is matched with each other, so that the connecting key 605 can freely rotate around the connecting column mounting hole 405 between the two clamping plates 402.

[0033] In one embodiment, as shown in Figure 6 The rotating connecting block 400 is fixedly connected to the bottom of the upper fixed plate 500, a plurality of positioning mounting holes 501 are arranged on the upper fixed plate 500 to facilitate fixing of the rotating assembly, and a second water outlet hole 502 is arranged in the upper fixed plate 500 to be used for adding a water pipe to enhance the cleaning effect.

[0034] In one embodiment, as shown in Figure 6 The shielding cover 303 is made of transparent plastic material, so that the accumulated debris outside the polishing pad 302 can be observed in time, and then cleaned in time to avoid accumulation; the height of the shielding cover 303 is greater than the height of the polishing pad 302, so that a good blocking effect is achieved.

[0035] Working principle: when cleaning, first, the water pipe is connected to the hole of the second water outlet hole 502 and the first water outlet hole 304, and then the water is discharged, then the first telescopic rod 206 is started, the moving block 201 slides along the direction of the rack 204, at the same time, the gear 104 and the rack 204 are meshed with each other, so that the cleaning brush 100 rotates in the sliding process, the cleaning effect is improved, then the second telescopic rod 601 is started, the U-shaped clamp 602 pulls the pin shaft 604 to move back and forth along the first pin shaft sliding groove 404 track, at the same time, the pin shaft 604 also slides in the second pin shaft sliding groove 606, and then pulls the connecting column 607 to rotate around the connecting column mounting hole 405 axis, the rotation of the connecting column 607 drives the sliding assembly 200 to rotate, so that the cleaning brush 100 can move in the fan-shaped track on the surface of the polishing pad 302, when it is necessary to clean a certain position, the second telescopic rod 601 is stopped, the first telescopic rod 206 pulls the cleaning brush 100 to slide forward and backward, and the cleaning is completed.

[0036] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A wafer polishing solution residue cleaning device, comprising a cleaning brush (100) rotatably connected in a sliding assembly (200), and a rotatably connected block (400) further matched above the sliding assembly (200), characterized in that, The cleaning brush (100) comprises a cleaning brush disc (101), a rotating shaft body (102) is fixedly connected to the cleaning brush disc (101), a gear (104) is fixedly connected to the rotating shaft body (102), and a plurality of bristles (103) are uniformly distributed on the bottom of the cleaning brush disc (101).

2. The wafer polishing residue cleaning apparatus according to claim 1, wherein The sliding assembly (200) comprises a moving block (201), a U-shaped sliding groove (202) is formed in the moving block (201), a through shaft hole (203) is arranged in the moving block (201), a rack (204) matched with the gear (104) is arranged in the U-shaped sliding groove (202), a fixed block (205) is fixedly connected to the side, away from the moving block (201), of the rack (204), and the fixed block (205) is connected with the fixed end of the first telescopic rod (206); and the telescopic end of the first telescopic rod (206) is connected with the moving block (201).

3. The wafer polishing residue cleaning apparatus according to claim 1, wherein The cleaning brush (100) is further provided with a lower fixing part (300) matched therebelow, the lower fixing part (300) comprises a fixed chuck (301), a polishing pad (302) is arranged in the fixed chuck (301), a shielding cover (303) is arranged outside the polishing pad (302), a first water outlet hole (304) is formed in the polishing pad (302), a plurality of drainage holes (305) are formed in the inner side of the shielding cover (303), and a plurality of fixed mounting holes (306) are circumferentially arranged on the surface of the fixed chuck (301).

4. The wafer polishing residue cleaning apparatus according to claim 1, wherein The rotating connecting block (400) comprises an L-shaped supporting plate (401), two clamping plates (402) are symmetrically arranged on one side of the L-shaped supporting plate (401), a U-shaped clamping mounting groove (403) is formed in the clamping plate (402), a first pin shaft sliding groove (404) is arranged in the U-shaped clamping mounting groove (403), and a connecting column mounting hole (405) is formed in the surface of the clamping plate (402).

5. The wafer polishing residue cleaning apparatus according to claim 4, wherein The rotating connecting block (400) is further provided with a rotating driving assembly (600) matched therein, the rotating driving assembly (600) comprises a second telescopic rod (601) with a fixed end connected to the side face of the L-shaped supporting plate (401), a U-shaped clamp (602) is connected to the telescopic end of the second telescopic rod (601), a pin shaft mounting hole (603) is formed in one end, away from the second telescopic rod (601), of the U-shaped clamp (602), a pin shaft (604) is matched and arranged in the pin shaft mounting hole (603), a connecting key (605) is matched and arranged in the U-shaped clamp (602), a second pin shaft sliding groove (606) is arranged on the connecting key (605), and the rotating driving assembly (600) is connected with the sliding assembly (200) through a connecting column (607).

6. The wafer polishing residue cleaning apparatus according to claim 5, wherein The connecting key (605) and the clamping plate (402) are matched in size.

7. The wafer polishing residue cleaning apparatus according to claim 1, wherein The rotating connecting block (400) is fixedly connected at the bottom of the upper fixed plate (500), a plurality of positioning installation holes (501) are formed in the upper fixed plate (500), and a second water outlet hole (502) is arranged in the upper fixed plate (500).

8. The wafer polishing residue cleaning apparatus according to claim 3, wherein The shielding cover (303) is transparent plastic material, and the height of the shielding cover (303) is greater than the height of the polishing pad (302).

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