Laser detection device for cutting equipment

Abstract

The utility model relates to the technical field of cutting processing, in particular to a laser detection device for cutting equipment, which comprises a rack, and the rack comprises a cutting table, a side frame, a sliding frame, a laser detection head, a protection frame, a chip falling groove, an air cylinder, a spring, a connecting seat and a limiting frame. The side frames are fixed to the two sides of the machine frame, the cutting table and the sliding frame are fixed to the middles of the side frames, the protection frame and the laser detection head are fixed to one sides of the side frames, the protection frame is located above the laser detection head, materials are placed on the surface of the cutting table of the machine frame, and the laser detection head calculates position coordinates of the materials. The protection frame shields the laser detection head, and the air cylinder is started to push the baffle to move on the side face of the sliding groove, so that the baffle shields the laser detection head.

Description

TECHNICAL FIELD

[0001] The utility model relates to cutting technical field, concretely is a laser detection device for cutting equipment. BACKGROUND

[0002] The profile is widely used in building industry and industrial industry, such as building door and window, curtain wall, indoor and outdoor decoration, industrial site, fence and equipment support system etc. Before use, the profile needs to be cut in length to meet the installation and use demand, and the plate position needs to be determined before cutting to ensure the correct cutting starting point and reduce material waste. One method is to install a detection camera beside the cutting head, the detection camera takes a photo of the plate, and the main control system calculates and processes the photo data to obtain the plate position coordinates. If the detection camera lens is damaged, it will directly affect the photo data, causing the calculated plate position coordinates to be incorrect, which will increase material waste during cutting, and even cause the cutting plate to be scrapped. When the laser cutting machine cuts and pierces, slag splashing is inevitable, which will damage the detection camera lens. It is also necessary to reduce the number of times that the operator enters the plate cutting area. In addition, when the protection device protects the detection head, the shell will leave some debris that need to be cleaned. SUMMARY

[0003] In view of the defects of the prior art, the utility model provides a laser detection device for cutting equipment, which has the advantages.

[0004] To achieve the above-mentioned functional purposes, the utility model provides the following technical scheme: a laser detection device for cutting equipment, including frame, its characterized in that: the frame includes cutting table, side frame, sliding frame, laser detection head, protection frame, chip removal groove, cylinder, spring, connecting seat, limiting frame, the side frame is fixed on both sides of the frame, the cutting table and the sliding frame are all fixed in the middle of the side frame, the protection frame and the laser detection head are fixed on one side of the side frame, the protection frame is located above the laser detection head, the chip removal groove is fixed on both sides of the cutting table, one side of the chip removal groove is located below the protection frame, the cylinder is fixed on one side of the protection frame, the spring is connected to the annular side surface of the telescopic end of the cylinder, the connecting seat is fixed on one side of the side frame, and the limiting frame is fixed on one side of the connecting seat.

[0005] Further, the protection frame includes a baffle, a sliding groove, a side block and a cleaning roller, the baffle is fixed on the telescopic end of the cylinder, the sliding groove is connected to the side surface of the baffle, the side block is fixed on the side surface of the sliding groove, and the cleaning roller is connected between the two side blocks.

[0006] Further, the chip removal groove includes a chip removal opening and a channel, the chip removal opening is fixed on both sides of the cutting table, and the channel is fixed on the bottom end of the chip removal opening.

[0007] Compared with the prior art, the utility model has the advantages that material is placed on the cutting table surface of the rack, the laser detection head calculates the material position coordinates, the cutting head cuts the material, the protection frame shields the laser detection head, the air cylinder pushes the baffle to displace on the chute side surface, the baffle shields the laser detection head, and the cleaning roller brush removes the debris on the baffle surface and drops the debris into the debris dropping groove 7. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 It is a kind of cutting equipment laser detection device's three-dimensional structure schematic view of the utility model;

[0009] Figure 2 It is a kind of cutting equipment laser detection device's partial three-dimensional structure schematic view of the utility model;

[0010] Figure 3 It is a kind of cutting equipment laser detection device's partial side three-dimensional structure schematic view of the utility model;

[0011] Figure 4 It is a kind of cutting equipment laser detection device protection frame structure schematic view of the utility model.

[0012] Reference signs in the drawing: rack 1, cutting table 2, side frame 3, sliding frame 4, laser detection head 5, protection frame 6, debris dropping groove 7, air cylinder 8, spring 9, connecting seat 10, limiting frame 11, baffle 61, sliding groove 62, side block 63, cleaning roller 64, debris dropping port 71, passageway 72. DETAILED DESCRIPTION

[0013] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model. Embodiments, please refer to Figures 1-4The utility model provides a kind of laser detection device for cutting equipment, including frame 1, it is characterized in that: the frame 1 includes cutting table 2, side frame 3, sliding frame 4, laser detection head 5, protection frame 6, chip removal groove 7, cylinder 8, spring 9, connecting seat 10, limiting frame 11;The side frame 3 is fixed on the both sides of frame 1, and the cutting table 2, sliding frame 4 are all fixed in the middle of side frame 3, and the protection frame 6, laser detection head 5 are fixed in one side of side frame 3, and the protection frame 6 is located above laser detection head 5, and the chip removal groove 7 is fixed on the both sides of cutting table 2, and one side chip removal groove 7 is located below protection frame 6, and the cylinder 8 is fixed in one side of protection frame 6, and the spring 9 is connected in the telescopic end of cylinder 8 annular side surface, and the connecting seat 10 is fixed in one side of side frame 3, and the limiting frame 11 is fixed in one side of connecting seat 10;

[0014] The protection frame 6 includes baffle 61, sliding groove 62, side block 63, cleaning roller 64;The baffle 61 is fixed in the telescopic end of cylinder 8, the sliding groove 62 is connected in the side of baffle 61, the side block 63 is fixed in the side of sliding groove 62, and the cleaning roller 64 is connected in the middle of two side blocks 63, and the annular side surface of cleaning roller is provided with bristle, and bristle is consistent in height;

[0015] The chip removal groove 7 includes chip removal port 71, passageway 72, and the chip removal port 71 is fixed on the both sides of cutting table 2, and the passageway 72 is fixed in the bottom end of chip removal port 71;

[0016] The bottom of passageway can place collection barrel to collect chippings.

[0017] Working principle: material is placed on the surface of cutting table 2 of frame 1, and laser detection head 5 calculates the position coordinates of material, and when cutting head cuts material, protection frame 6 shields laser detection head 5, and cylinder 8 is started to push baffle 61 to displace in the side of sliding groove 62, so that baffle 61 shields laser detection head, and after cutting, cylinder 8 is started to push baffle 61 to move upwards in sliding groove 62, and cleaning roller 64 is driven to clean the outer surface of baffle during the movement, and the chippings splashed on the surface of baffle fall into chip removal groove 7, and fall into passageway 72 from chip removal port 71, and are collected by the collection barrel in the bottom.

[0018] The basic principle and main features of the present application and the advantages of the present application are shown and described above, for those skilled in the art, obviously the present application is not limited to the details of the above exemplary embodiments, and can be realized in other specific forms without departing from the spirit or basic characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be considered as limiting the claims involved.

[0019] In addition, it should be understood that, although the present application is described in the form of embodiments, not every embodiment contains only one independent technical solution, the description of the specification is only for the sake of clarity, those skilled in the art should consider the specification as a whole, the technical solutions in each embodiment can also be combined appropriately to form other embodiments that those skilled in the art can understand.

Claims

1. A laser detection device for cutting equipment, comprising a frame (1), characterized in that: The rack (1) includes a cutting table (2), a side frame (3), a sliding frame (4), a laser detection head (5), a protective frame (6), a chip removal groove (7), a gas cylinder (8), a spring (9), a connecting seat (10), a limiting frame (11); the side frame (3) is fixed on both sides of the rack (1), the cutting table (2) and the sliding frame (4) are fixed in the middle of the side frame (3), the protective frame (6) and the laser detection head (5) are fixed on one side of the side frame (3), the protective frame (6) is above the laser detection head (5), the chip removal groove (7) is fixed on both sides of the cutting table (2), and one of the chip removal grooves (7) is below the protective frame (6); the gas cylinder (8) is fixed on one side of the protective frame (6), the spring (9) is connected to the annular side surface of the telescopic end of the gas cylinder (8), the connecting seat (10) is fixed on one side of the side frame (3), and the limiting frame (11) is fixed on one side of the connecting seat (10).

2. The laser detection device for a cutting apparatus according to claim 1, characterized by: The protective frame (6) includes a baffle (61), a sliding groove (62), a side block (63) and a cleaning roller (64); the baffle (61) is fixed on the telescopic end of the gas cylinder (8), the sliding groove (62) is connected to the side surface of the baffle (61), the side block (63) is fixed on the side surface of the sliding groove (62), and the cleaning roller (64) is connected to the middle of the two side blocks (63).

3. The laser detection device for a cutting apparatus according to claim 1, characterized by: The chip removal groove (7) includes a chip removal opening (71) and a channel (72), the chip removal opening (71) is fixed on both sides of the cutting table (2), and the channel (72) is fixed at the bottom end of the chip removal opening (71).

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