Wafer polishing device
By improving the structural design of the wafer polishing device, uniform spraying and application of polishing fluid were achieved, solving the problem of uneven polishing, improving polishing quality and device stability, and reducing costs.
Patent Information
- Application Number
- CN202423323999.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2034-12-31
AI Technical Summary
In existing wafer polishing equipment, the polishing slurry is sprayed at a fixed position, resulting in uneven distribution of the polishing slurry on the wafer, causing uneven polishing rate and affecting the surface quality of the wafer.
By setting up a placement plate, polishing pad, second motor, reciprocating screw, and spray head, combined with a hydraulic cylinder and liquid pump, the polishing liquid is sprayed evenly and the spray head moves. In conjunction with the rotation of the wafer, the polishing liquid is ensured to be evenly applied. Furthermore, the polishing pad is rotated in the opposite direction by the meshing of the gear ring and the flat gear, which further improves the uniformity.
It achieves uniform polishing of wafer surfaces, improves the stability and convenience of polishing equipment, reduces operating costs, and facilitates the recycling of polishing fluid.
Smart Images
Figure CN223876762U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer processing technical field especially is a kind of wafer polishing device. BACKGROUND
[0002] When wafer is produced, in order to ensure the smoothness of wafer surface, to meet the requirements of subsequent chip manufacturing process, it needs to use polishing equipment to polish, when polishing, through polishing device, first, polishing liquid is sprayed on wafer surface, then, through polishing pad, wafer is polished.
[0003] But the polishing liquid spraying position of existing wafer polishing device is relatively fixed, when wafer rotates, the landing point area is drawn on wafer to form a fixed radius area, in the area, polishing liquid is distributed too much, it can lead to the polishing rate of this part area too fast, it can lead to the surface of polished wafer to appear uneven phenomenon. UTILITY MODEL CONTENTS
[0004] Therefore, the utility model wants to solve the technical problem in the prior art, the polishing liquid spraying position of wafer polishing device is relatively fixed, when wafer rotates, the landing point area is drawn on wafer to form a fixed radius area, in the area, polishing liquid is distributed too much, it can lead to the polishing rate of this part area too fast, it can lead to the surface of polished wafer to appear uneven phenomenon.
[0005] To solve the above technical problems, the utility model provides a kind of wafer polishing device, including support frame, the first motor is fixedly connected in support frame inner side, the placing plate is fixedly connected in the first motor output, the hydraulic cylinder is fixedly connected in support frame outer side, the infusion pump is fixedly connected in the hydraulic cylinder output, the fixed frame is fixedly connected in the infusion pump outer side, the polishing pad is rotatably connected in the fixed frame outer side, the second motor is fixedly connected in the fixed frame inner side, the reciprocating screw rod is fixedly connected in the second motor output, the spraying head is screw connected in the reciprocating screw rod outer side, the spraying head and fixed frame are slidably connected, the spraying head and infusion pump are communicated, this step is placed by setting placing plate, polishing pad, second motor, reciprocating screw rod and spraying head, when polishing, wafer is placed on placing plate upper side, then, through infusion pump, polishing liquid is sprayed from spraying head to wafer, then, through first motor, placing plate and wafer are rotated, so that polishing liquid evenly sprays wafer a circle, then, second motor is started, through second motor, reciprocating screw rod is rotated, through reciprocating screw rod, spraying head is moved, so that spraying head sprays the surface of wafer not sprayed, through the movement of spraying head cooperation wafer rotation, so that polishing liquid can evenly spray on wafer surface, and through the adhesion of polishing pad and wafer, so as to polish wafer, improve the uniformity of device polishing.
[0006] In an embodiment of the utility model, the outside of the placing plate is fixedly connected with a gear ring, the outside of the polishing pad is fixedly connected with a flat gear, the gear ring and the flat gear are engaged, this step is engaged through setting up gear ring and flat gear, when the placing plate drives wafer rotation, gear ring rotation is driven simultaneously, the engagement of gear ring and flat gear makes the flat gear drive the polishing pad rotate in the opposite direction of wafer, so that the polishing pad can drive the polishing liquid to rotate, the polishing of the device is further improved the uniformity.
[0007] In an embodiment of the utility model, the surface of the gear ring is provided with a discharge groove, the discharge groove is used in cooperation with the spray head, this step is used in cooperation through setting up the discharge groove, when the spray head sprays too much polishing liquid, the overflowed polishing liquid can be discharged through the discharge groove, so that the polishing liquid is not easy to accumulate in the inside of the gear ring and affect the polishing, the stability of the device polishing is improved.
[0008] In an embodiment of the utility model, the outside of the supporting frame is fixedly connected with a receiving pool, the inside of the receiving pool is provided with a filter screen, this step is used through setting up the receiving pool and the filter screen, after the excess polishing liquid is discharged from the discharge groove, it will flow into the inside of the receiving pool along the supporting frame, the polishing liquid is preliminarily filtered through the filter screen, so as to be recycled subsequently, the working cost of the device is reduced.
[0009] In an embodiment of the utility model, the outside of the fixed frame is fixedly connected with a cover plate, the cover plate is used in cooperation with the gear ring, this step is used in cooperation through setting up the cover plate, when the fixed frame moves to the maximum position, the cover plate is tightly attached to the gear ring, so as to limit the position of the fixed frame and the polishing pad, so that the polishing pad will not excessively move down and press the wafer to cause damage, the stability of the device use is improved.
[0010] In an embodiment of the utility model, the outside of the supporting frame is slidably connected with a slide rod, the outside of the slide rod is fixedly connected with a scraper, the scraper is used in cooperation with the discharge groove, this step is used through setting up the slide rod and the scraper, after the wafer is polished, it can be taken out first, then the slide rod is pushed, so that the slide rod pushes the scraper to push out the polishing liquid remaining on the upper side of the placing plate, so as to be recycled, the convenience of the device use is improved.
[0011] In an embodiment of the utility model, the surface of the fixed frame and the inside of the flat gear are provided with a slot, the inside of the slot is slidably connected with a plug rod, this step is used through setting up the slot and the plug rod, when the flat gear does not move to engage with the gear ring, the plug rod can be inserted into the inside of the slot, so as to limit the position of the flat gear, so that it is not easy to align and engage with the gear ring when it is inconvenient to move up and down due to its rotation, the stability of the device use is improved.
[0012] In an embodiment of the utility model, the scraper is semicircle plate, the scraper and the discharge groove cooperate and use, this step through setting up the scraper, through its semicircle plate's setting, when pushing out the polishing liquid, it is convenient to gather in the recessed place of semicircle plate through the design of the scraper semicircle plate shape, makes the polishing liquid convenient to gather and push out, makes the removal of polishing liquid more convenient, improves the convenience of device use.
[0013] The above technical scheme of the utility model has the following advantages compared with the prior art:
[0014] The wafer polishing device has the advantages that the polishing pad is driven to move to be close to the wafer by the hydraulic cylinder when the wafer is placed on the upper side of the placement plate during polishing, then the polishing liquid is sprayed onto the wafer from the spray head by the infusion pump, the placement plate and the wafer are rotated by the first motor, the polishing liquid is uniformly sprayed on the wafer, the second motor is started, the reciprocating screw is driven to rotate by the second motor, the spray head is driven to move by the reciprocating screw, so that the spray head sprays the surface of the wafer that has not been sprayed, the polishing liquid can be uniformly sprayed on the surface of the wafer by the movement of the spray head and the rotation of the wafer, and the wafer is polished by the adhesion of the polishing pad and the wafer, so that the uniformity of polishing of the device is improved.
[0015] The wafer polishing device has the advantages that the wafer is rotated by the placement plate, the gear ring is driven to rotate at the same time, the flat gear is driven to rotate the polishing pad in the opposite direction of the wafer by the meshing of the gear ring and the flat gear, so that the polishing pad can drive the polishing liquid to rotate, the polishing liquid is more uniformly applied, and the uniformity of polishing of the device is further improved. BRIEF DESCRIPTION OF DRAWINGS
[0016] In order to make the content of the utility model more easily understood clearly, the utility model is further described in detail in the following according to the specific embodiment of the utility model and combines the drawings.
[0017] Figure 1 It is the front view of the utility model;
[0018] Figure 2 It is the top view of the utility model;
[0019] Figure 3 It is the front view of the fixed frame structure of the utility model;
[0020] Figure 4 It is the bottom view of the fixed frame structure of the utility model;
[0021] Figure 5 It is the structure view of the placement plate of the utility model;
[0022] The description of the drawings is as follows: 1, support frame; 2, first motor; 3, placing plate; 4, hydraulic cylinder; 5, infusion pump; 6, fixed frame; 7, polishing pad; 8, second motor; 9, reciprocating screw; 10, spray head; 11, gear ring; 12, flat gear; 13, discharge groove; 14, receiving pool; 15, filter screen; 16, cover plate; 17, slide rod; 18, scraper; 19, insertion slot; 20, insertion rod. DETAILED DESCRIPTION
[0023] The utility model will be further explained in connection with the drawings and specific embodiments, so that the person skilled in the art can better understand the utility model and can be implemented, but the embodiment is not as the limitation of the utility model.
[0024] Referring to Figures 1 to 5 The utility model discloses a wafer polishing device, including support frame 1, the support frame 1 inner side fixedly connected with first motor 2, the first motor 2 output fixedly connected with placing plate 3, the support frame 1 outer side fixedly connected with hydraulic cylinder 4, the hydraulic cylinder 4 output fixedly connected with infusion pump 5, the infusion pump 5 outer side fixedly connected with fixed frame 6, the fixed frame 6 outer side rotationally connected with polishing pad 7, the fixed frame 6 inner side fixedly connected with second motor 8, the second motor 8 output fixedly connected with reciprocating screw 9, the reciprocating screw 9 outer side screw connection has spray head 10, the spray head 10 and fixed frame 6 slidingly connected, the spray head 10 and infusion pump 5 are communicated, this step is through setting placing plate 3, polishing pad 7, second motor 8, reciprocating screw 9 and spray head 10, when polishing, places wafer on placing plate 3 upside, then through hydraulic cylinder 4 and drives polishing pad 7 to move to stick close to wafer, then through infusion pump 5 and drives polishing liquid to spray from spray head 10 to wafer, again through first motor 2 and drives placing plate 3 and wafer rotation, so that polishing liquid evenly sprays wafer a circle, then starts second motor 8, through second motor 8 and drives reciprocating screw 9 rotation, through reciprocating screw 9 and drives spray head 10 movement, so that spray head 10 sprays the surface not to wafer, through the movement of spray head 10 cooperation wafer rotation, so that polishing liquid can evenly spray on wafer surface, and through the adhesion of polishing pad 7 and wafer, thereby polishing wafer, improve the uniformity of device polishing.
[0025] Referring to Figure 4 and Figure 5As shown, the outside of the placement plate 3 is fixedly connected with a gear ring 11, the outside of the polishing pad 7 is fixedly connected with a flat gear 12, the gear ring 11 and the flat gear 12 are engaged, this step sets the gear ring 11 and the flat gear 12, when the placement plate 3 drives the wafer to rotate, the gear ring 11 will also rotate, through the engagement of the gear ring 11 and the flat gear 12, the flat gear 12 drives the polishing pad 7 to rotate in the opposite direction of the wafer, so that the polishing pad 7 can drive the polishing liquid to rotate, so that the polishing of the polishing liquid is more uniform, further improving the uniformity of the device polishing.
[0026] Referring to Figure 5 As shown, the surface of the gear ring 11 is provided with a discharge groove 13, and the discharge groove 13 is used in cooperation with the spray head 10, this step sets the discharge groove 13, when the spray head 10 sprays too much polishing liquid, the overflowed polishing liquid can be discharged through the discharge groove 13, so that the polishing liquid is not easy to accumulate inside the gear ring 11 to affect the polishing, improving the stability of the device polishing.
[0027] Referring to Figure 2 As shown, the outside of the support frame 1 is fixedly connected with a receiving pool 14, and the inside of the receiving pool 14 is provided with a filter screen 15, this step sets the receiving pool 14 and the filter screen 15, after the excess polishing liquid is discharged from the discharge groove 13, it will flow into the inside of the receiving pool 14 along the support frame 1, and the polishing liquid is preliminarily filtered through the filter screen 15, so as to be recycled for subsequent use, reducing the working cost of the device.
[0028] Referring to Figure 2 As shown, the outside of the fixed frame 6 is fixedly connected with a cover plate 16, and the cover plate 16 is used in cooperation with the gear ring 11, this step sets the cover plate 16, when the fixed frame 6 moves to the maximum position, the cover plate 16 is tightly attached to the gear ring 11, thereby limiting the position of the fixed frame 6 and the polishing pad 7, so that the polishing pad 7 will not move downward excessively to press the wafer and cause damage, improving the stability of the device in use.
[0029] Referring to Figure 1 As shown, the outside of the support frame 1 is slidingly connected with a slide rod 17, the outside of the slide rod 17 is fixedly connected with a scraper 18, and the scraper 18 is used in cooperation with the discharge groove 13, this step sets the slide rod 17 and the scraper 18, after the wafer is polished, it can be taken out first, then the slide rod 17 is pushed to push the scraper 18 to push out the polishing liquid remaining on the upper side of the placement plate 3, so as to be recycled, improving the convenience of the device in use.
[0030] Referring to Figure 3As shown, the fixed frame 6 surface and the inside of the spur gear 12 are provided with a slot 19, and the slot 19 is slidably connected with a plug rod 20. By setting the slot 19 and the plug rod 20, when the spur gear 12 is not moved to engage with the gear ring 11, the plug rod 20 can be inserted into the slot 19, thereby limiting the position of the spur gear 12, so that it is not easy to rotate and cause inconvenience when moving up and down to align and engage with the gear ring 11, thereby improving the stability of the device.
[0031] Referring to Figure 2 and Figure 5 As shown, the scraper 18 is a semicircular plate, and the scraper 18 is used in cooperation with the discharge groove 13. By setting the scraper 18, the semicircular plate is set, and when the polishing liquid is pushed out, the semicircular plate shape of the scraper 18 is designed to facilitate the collection of the polishing liquid in the recess of the semicircular plate, so that the removal of the polishing liquid is more convenient, thereby improving the convenience of the device.
[0032] Working principle: when polishing, the wafer is placed on the upper side of the placement plate 3, the polishing pad 7 is moved to tightly contact the wafer by the hydraulic cylinder 4, then the polishing liquid is sprayed from the spray head 10 to the wafer by the liquid pump 5, then the placement plate 3 and the wafer are rotated by the first motor 2, so that the polishing liquid is uniformly sprayed on the wafer, then the second motor 8 is started, the reciprocating screw 9 is rotated by the second motor 8, the spray head 10 is moved by the reciprocating screw 9, so that the spray head 10 sprays the surface of the wafer which has not been sprayed, through the movement of the spray head 10 and the rotation of the wafer, the polishing liquid can be uniformly sprayed on the surface of the wafer, at the same time, the gear ring 11 is rotated by the placement plate 3, the spur gear 12 is engaged with the gear ring 11, so that the polishing pad 7 is rotated in the opposite direction of the placement plate 3 by the spur gear 12, thereby further uniformly applying the polishing liquid, until the wafer is polished.
[0033] Obviously, the above embodiments are only examples for clarity, and are not limited to the embodiments. For those skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, all the embodiments need not and cannot be exhausted. The obvious changes or variations derived therefrom are still within the protection scope of the present application.
Claims
1. A wafer polishing apparatus comprising a support frame (1), characterized in that: The support frame (1) is fixedly connected with a first motor (2) on the inner side, and the output end of the first motor (2) is fixedly connected with a placing plate (3); the outer side of the support frame (1) is fixedly connected with a hydraulic cylinder (4), and the output end of the hydraulic cylinder (4) is fixedly connected with a infusion pump (5); the outer side of the infusion pump (5) is fixedly connected with a fixed frame (6), and the outer side of the fixed frame (6) is rotatably connected with a polishing pad (7); the inner side of the fixed frame (6) is fixedly connected with a second motor (8), and the output end of the second motor (8) is fixedly connected with a reciprocating screw (9); the outer side of the reciprocating screw (9) is threadedly connected with a spray head (10), and the spray head (10) and the fixed frame (6) are slidably connected; and the spray head (10) is communicated with the infusion pump (5).
2. The wafer polishing apparatus of claim 1, wherein: The outer side of the placing plate (3) is fixedly connected with a gear ring (11), and the outer side of the polishing pad (7) is fixedly connected with a flat gear (12); and the gear ring (11) and the flat gear (12) are engaged.
3. The wafer polishing apparatus of claim 2, wherein: A discharge groove (13) is formed in the surface of the gear ring (11), and the discharge groove (13) is used in cooperation with the spray head (10).
4. The wafer polishing apparatus of claim 3, wherein: The outer side of the support frame (1) is fixedly connected with a receiving pool (14), and the inner side of the receiving pool (14) is provided with a filter screen (15).
5. The wafer polishing apparatus of claim 4, wherein: The outer side of the fixed frame (6) is fixedly connected with a cover plate (16), and the cover plate (16) is used in cooperation with the gear ring (11).
6. The wafer polishing apparatus of claim 5, wherein: The outer side of the support frame (1) is slidably connected with a sliding rod (17), and the outer side of the sliding rod (17) is fixedly connected with a scraper (18); and the scraper (18) is used in cooperation with the discharge groove (13).
7. The wafer polishing apparatus of claim 6, wherein: A plug rod (20) is slidably connected in the plug groove (19) formed in the surface of the fixed frame (6) and the inner side of the flat gear (12).