PCBA (Printed Circuit Board Assembly) board vacuum storage packaging structure capable of preventing bonding pad from being oxidized

Abstract

The utility model discloses a PCBA board vacuum storage packaging structure capable of preventing pad oxidation, which comprises a packaging shell and a cover plate rotatably connected to the top of the packaging shell, and further comprises a vacuum pump, the outer side of the vacuum pump is fixedly connected with the top of the cover plate, the center of the cover plate is fixedly connected with a non-return assembly, and the non-return assembly is fixedly connected with the vacuum pump. Limiting assemblies are fixedly connected to the four corners of the interior of the packaging shell. The utility model relates to the technical field of vacuum storage. According to the packaging structure, through the arrangement of the non-return assembly, when the adjusting screw rod is rotated, the sliding plate can slide downwards along the inner wall of the air guide cylinder, at the moment, the elastic deformation of the compression spring is increased, the air exhaust pressure can be flexibly adjusted by adjusting the elastic force of the compression spring so as to meet the packaging requirements of various PCBA boards, and meanwhile, the elastic deformation of the compression spring is increased, so that the packaging efficiency is improved. The elastic force generated during resetting is larger, the sealing performance of the non-return assembly is enhanced, and the anti-oxidation protection effect on the PCBA board bonding pad is further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to vacuum storage technical field, concretely is PCBA board vacuum storage packaging structure of preventing oxidation of soldering pad. BACKGROUND

[0002] PCBA board is printed circuit board assembly board, and it is an important component in electronic product. In the storage and transportation process of PCBA board, as the key part of connecting electronic components, soldering pad is easy to have oxidation reaction with oxygen, water vapor and the like in air, so that the oxidation layer is formed on the surface of soldering pad, which affects its solderability and electrical performance, and further reduces the quality and reliability of electronic product.

[0003] The existing PCBA board storage mode, such as ordinary plastic bag packaging or simple sealed box packaging, although can isolate air to a certain extent, but cannot completely prevent the entry of oxygen and water vapor, and it is difficult to effectively prevent the oxidation of soldering pad. UTILITY MODEL CONTENT

[0004] (I) technical problem solved

[0005] In view of the deficiency of prior art, the utility model provides PCBA board vacuum storage packaging structure of preventing oxidation of soldering pad, and solves the problem that soldering pad is easy to oxidize when PCBA board is stored.

[0006] (II) technical scheme

[0007] In order to realize the above object, the utility model discloses the following technical scheme: PCBA board vacuum storage packaging structure of preventing oxidation of soldering pad, including packaging shell and the cover plate of rotation connection in the top of packaging shell, still include: vacuum pump, the outside of vacuum pump is fixedly connected with the top of cover plate, the center of cover plate is fixedly connected with check assembly, and the four corners in the inside of packaging shell are fixedly connected with limiting component;When PCBA board is placed in the inside of packaging shell, the limiting component in the four corners in the inside of packaging shell just clamps in the positioning hole opened in the four corners of PCBA board, and is used for limiting PCBA board.

[0008] The check assembly includes a gas guide cylinder, the bottom of the gas guide cylinder is fixedly connected with an annular baffle, the top of the inner wall of the gas guide cylinder is fixedly connected with a sliding sleeve, the inner side of the sliding sleeve is slidably connected with a sliding block, the top of the sliding block is fixedly connected with a compression spring, when the sliding block is retracted to the sliding sleeve, the bottom of the sliding block is separated from the annular baffle, at this time, the air in the packaging shell can enter the gas guide cylinder through the gap between the sliding block and the annular baffle, and finally be pumped out by the vacuum pump.

[0009] The limiting assembly comprises a limiting cylinder, a helical spring fixedly connected to the inner side of the limiting cylinder, and a desiccant adding cylinder fixedly connected to the top end of the helical spring.

[0010] Preferably, the output end of the vacuum pump is fixedly connected to the outer side of the air guide cylinder, and the outer side of the air guide cylinder is fixedly connected to the center of the cover plate.

[0011] Preferably, the inner wall of the sliding sleeve is rotationally connected with an adjusting screw, the outer wall of the adjusting screw is threadedly connected with a sliding plate, the outer wall of the adjusting screw is rotationally connected with the top of the air guide cylinder, the top end of the compression spring is fixedly connected with the bottom of the sliding plate, and the side wall of the sliding plate is slidingly connected with the inner wall of the sliding sleeve.

[0012] Preferably, the bottom of the limiting cylinder is fixedly connected to the inner side of the packaging shell, and the outer wall of the desiccant adding cylinder is slidingly connected with the inner side of the limiting cylinder.

[0013] Preferably, the side wall of the limiting cylinder is provided with a through hole, and the side wall of the desiccant adding cylinder is provided with a breathable hole.

[0014] (Three) beneficial effects

[0015] The PCBA board vacuum storage packaging structure provided by the utility model has the following beneficial effects:

[0016] (I) The packaging structure is provided with a check assembly, when the adjusting screw is rotated, the sliding plate can slide downward along the inner wall of the air guide cylinder, at this time, the elastic deformation of the compression spring is increased, the elastic force of the compression spring is adjusted, the air extraction pressure can be flexibly adjusted to meet the packaging requirements of various PCBA boards, at the same time, the elastic deformation of the compression spring is increased, the elastic force generated when the compression spring is reset is also larger, the sealing performance of the check assembly is enhanced, and the anti-oxidation protection effect on the PCBA board pads is further improved.

[0017] (II), the packaging structure through the setting limiting component, when the cover is in the closed state, the vent hole and the through hole are communicated at this time, the desiccant in the desiccant adding cylinder can absorb the water vapor in the air in the packaging shell, reduce the humidity of the packaging environment, play the role of moisture-proof, when the cover is opened, the vent hole and the through hole are not communicated, the desiccant can only contact with the air in the packaging shell through the limited surface, the efficiency of the desiccant will be limited. After the communication, the air can flow more smoothly in and out of the desiccant adding cylinder, so that each part of the desiccant can fully contact with the humid air, improve the utilization rate of the desiccant, can more effectively absorb the water vapor, reduce the use amount of the desiccant, reduce the use cost. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the overall structure schematic view of the utility model;

[0019] Figure 2 It is the structure schematic view of the packaging shell of the utility model;

[0020] Figure 3 It is the structure schematic view of the utility model check valve assembly;

[0021] Figure 4 It is the structure schematic view of the utility model limiting component.

[0022] In the drawing: 1, the packaging shell; 2, the cover; 3, limiting component; 4, vacuum pump; 5, check valve assembly; 31, limiting cylinder; 32, spiral spring; 33, desiccant adding cylinder; 34, vent hole; 35, through hole; 36, screw knob; 51, gas guide cylinder; 52, annular baffle; 53, sliding sleeve; 54, sliding block; 55, adjusting screw; 56, sliding plate; 57, compression spring. DETAILED DESCRIPTION

[0023] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0024] Embodiment: please refer to Figures 1-4The utility model provides a technical scheme: PCBA board vacuum storage packaging structure of anti -solder pad oxidation, including the packaging shell 1 and the cover plate 2 of rotation connection in the top of packaging shell 1 still include: vacuum pump 4, the outside of vacuum pump 4 is fixedly connected with the top of cover plate 2, the centre of cover plate 2 is fixedly connected with check assembly 5, and the four corners in the inside of packaging shell 1 are fixedly connected with limiting component 3, when PCBA board is placed in the inside of packaging shell 1, the limiting component 3 of four corners in the inside of packaging shell 1 plays the role just and is clamped in the positioning hole of four corners of PCBA board, is positioned to PCBA board, after placing PCBA board, close cover plate 2, and vacuum pump 4 forms vacuum environment by check assembly 5 and extracts the air in the inside of packaging shell 1, can make solder pad and oxygen isolation.

[0025] Check assembly 5 includes air guide cylinder 51, and the bottom of air guide cylinder 51 is fixedly connected with annular baffle 52, and the top of the inner wall of air guide cylinder 51 is fixedly connected with sliding sleeve 53, and the inner side of sliding sleeve 53 is slidably connected with sliding block 54, and the top of sliding block 54 is fixedly connected with compression spring 57;The output end of vacuum pump 4 is fixedly connected with the outside of air guide cylinder 51, and the outside of air guide cylinder 51 is fixedly connected with the centre of cover plate 2, and the inner wall of sliding sleeve 53 is rotatably connected with adjusting screw 55, and the outer wall of adjusting screw 55 is threadedly connected with sliding plate 56, and the outer wall of adjusting screw 55 is rotatably connected with the top of air guide cylinder 51, and the top end of compression spring 57 is fixedly connected with the bottom of sliding plate 56, and the side wall of sliding plate 56 is slidably connected with the inner wall of sliding sleeve 53, when vacuum pump 4 works, negative pressure environment is formed in the inside of air guide cylinder 51, under the action of atmospheric pressure, sliding block 54 is retracted to the inside of sliding sleeve 53, so that the bottom of sliding block 54 is separated from annular baffle 52, at this moment, the air in the inside of packaging shell 1 can enter the inside of air guide cylinder 51 through the gap between sliding block 54 and annular baffle 52, and be finally extracted by vacuum pump 4;When adjusting screw 55 is rotated, sliding plate 56 can slide down along the inner wall of air guide cylinder 51, at this moment, the elastic deformation of compression spring 57 increases, by adjusting the elastic force of compression spring 57, the air extraction pressure can be flexibly adjusted to meet the packaging needs of various PCBA boards, simultaneously, the elastic deformation of compression spring 57 increases, and the elastic force produced when resetting is also greater, the sealing performance of check assembly 5 is enhanced, and the anti -oxidation protection effect of PCBA board solder pad is further improved.

[0026] The limiting assembly 3 comprises a limiting cylinder 31, the inner side of the limiting cylinder 31 is fixedly connected with a spiral spring 32, the top end of the spiral spring 32 is fixedly connected with a desiccant adding cylinder 33, the top of the desiccant adding cylinder 33 is threadedly connected with a screw knob 36, the bottom of the limiting cylinder 31 is fixedly connected with the inner side of the packaging shell 1, the outer wall of the desiccant adding cylinder 33 is slidably connected with the inner side of the limiting cylinder 31, the side wall of the limiting cylinder 31 is provided with a through hole 35, and the side wall of the desiccant adding cylinder 33 is provided with a breathable hole 34; when the cover plate 2 is in the closed state, the desiccant adding cylinder 33 is pressed downward by the cover plate 2, at this time, the desiccant adding cylinder 33 slides downward along the inner wall of the limiting cylinder 31, forcing the spiral spring 32 to compress, at this time, the breathable hole 34 is in communication with the through hole 35, at this time, the desiccant in the desiccant adding cylinder 33 can absorb the water vapor in the air in the packaging shell 1, reduce the humidity of the packaging environment, play a moisture-proof role, and prolong the storage life of the PCBA board; wherein, when the screw knob 36 is rotated, the top of the desiccant adding cylinder 33 can be opened, so as to add and replace the desiccant, when the cover plate 2 is opened, the breathable hole 34 is not in communication with the through hole 35, and the desiccant can only contact the air in the packaging shell 1 through a limited surface, and the efficiency of absorbing water vapor is limited. After communication, air can flow more smoothly in and out of the desiccant adding cylinder 33, so that each part of the desiccant can fully contact the humid air, improve the utilization rate of the desiccant, can more effectively absorb water vapor, reduce the use amount of the desiccant, and reduce the use cost.

[0027] Working principle:

[0028] When the cover plate 2 is opened and the PCBA board is placed in the packaging shell 1, the limiting assembly 3 at the four corners in the packaging shell 1 is just clamped in the positioning hole at the four corners of the PCBA board, so as to limit the PCBA board, after the PCBA board is placed, the cover plate 2 is closed, the vacuum pump 4 forms a vacuum environment by exhausting the air in the packaging shell 1 through the check assembly 5, so that the solder pad is isolated from oxygen, thereby avoiding or significantly slowing down the occurrence of oxidation reaction, effectively maintaining the solderability and electrical performance of the solder pad, and ensuring the quality and reliability of the PCBA board in the storage and subsequent use process.

[0029] When the vacuum pump 4 works, a negative pressure environment is formed in the air guide cylinder 51, under the action of atmospheric pressure, the sliding block 54 shrinks into the sliding sleeve 53, so that the bottom of the sliding block 54 is separated from the annular baffle 52, at this time, the air in the packaging shell 1 can enter the air guide cylinder 51 through the gap between the sliding block 54 and the annular baffle 52, and finally be exhausted by the vacuum pump 4;

[0030] When the adjusting screw 55 is rotated, the sliding plate 56 can slide downward along the inner wall of the air guide cylinder 51, at this time, the elastic deformation of the compression spring 57 is increased, by adjusting the elastic force of the compression spring 57, the suction pressure can be flexibly adjusted to meet the packaging needs of various PCBA boards, at the same time, the elastic deformation of the compression spring 57 is increased, the elastic force generated when the compression spring 57 is reset is also greater, the sealing performance of the check valve assembly 5 is enhanced, and the anti-oxidation protection effect on the PCBA board pad is further improved.

[0031] When the cover plate 2 is in the closed state, the desiccant adding cylinder 33 is pressed downward by the cover plate 2, at this time, the desiccant adding cylinder 33 slides downward along the inner wall of the limiting cylinder 31, forcing the spiral spring 32 to be compressed, at this time, the air vent hole 34 is in communication with the through hole 35, at this time, the desiccant in the desiccant adding cylinder 33 can absorb the water vapor in the air in the packaging shell 1, reduce the humidity of the packaging environment, play a moisture-proof role, and prolong the storage life of the PCBA board.

[0032] Wherein, when the threaded knob 36 is rotated, the top of the desiccant adding cylinder 33 can be opened to facilitate the addition and replacement of the desiccant, when the cover plate 2 is opened, the air vent hole 34 is not in communication with the through hole 35, and the desiccant can only contact the air in the packaging shell 1 through a limited surface, and the efficiency of the desiccant in absorbing water vapor will be limited. After being connected, the air can flow more smoothly in and out of the desiccant adding cylinder 33, so that each part of the desiccant can fully contact the humid air, improve the utilization rate of the desiccant, more effectively absorb water vapor, reduce the use amount of the desiccant, and reduce the use cost.

[0033] It should be noted that in this text, relational terms such as first and second and the like are used merely to distinguish one entity or action from another, without necessarily requiring or implying any actual such relationship or order between or among the entities or actions. Also, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, so that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, the element defined by the statement "comprises one" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0034] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A vacuum storage packaging structure for preventing oxidation of a PCBA board from soldering pads, comprising a packaging shell (1), and a cover plate (2) rotatably connected to the top of the packaging shell (1), characterized in that, Also include: Vacuum pump (4), the outer side of the vacuum pump (4) and the top of the cover plate (2) are fixedly connected, the center of the cover plate (2) is fixedly connected with check assembly (5), four corners inside the packaging shell (1) are fixedly connected with limiting assembly (3); The check assembly (5) includes a gas guide cylinder (51), the bottom of the gas guide cylinder (51) is fixedly connected with an annular baffle (52), the top of the inner wall of the gas guide cylinder (51) is fixedly connected with a sliding sleeve (53), the inner side of the sliding sleeve (53) is slidably connected with a sliding block (54), the top of the sliding block (54) is fixedly connected with a compression spring (57); The limiting assembly (3) includes a limiting cylinder (31), the inner side of the limiting cylinder (31) is fixedly connected with a spiral spring (32), the top end of the spiral spring (32) is fixedly connected with a desiccant adding cylinder (33), the top of the desiccant adding cylinder (33) is threadedly connected with a threaded knob (36).

2. The PCBA board vacuum storage package structure against pad oxidation according to claim 1, characterized in that: The output end of the vacuum pump (4) is fixedly connected with the outer side of the gas guide cylinder (51), and the outer side of the gas guide cylinder (51) is fixedly connected with the center of the cover plate (2).

3. The PCBA board vacuum storage package structure against pad oxidation according to claim 1, characterized in that: The inner wall of the sliding sleeve (53) is rotatably connected with an adjusting screw (55), the outer wall of the adjusting screw (55) is threadedly connected with a sliding plate (56), and the outer wall of the adjusting screw (55) is rotatably connected with the top of the gas guide cylinder (51).

4. The PCBA board vacuum storage package structure against pad oxidation according to claim 1, characterized in that: The top end of the compression spring (57) is fixedly connected with the bottom of the sliding plate (56), and the side wall of the sliding plate (56) is slidably connected with the inner wall of the sliding sleeve (53).

5. The PCBA board vacuum storage package structure against pad oxidation according to claim 1, characterized in that: The bottom of the limiting cylinder (31) is fixedly connected with the inner side of the packaging shell (1), and the outer wall of the desiccant adding cylinder (33) is slidably connected with the inner side of the limiting cylinder (31).

6. The PCBA board vacuum storage package structure against pad oxidation according to claim 5, characterized in that: The side wall of the limiting cylinder (31) is provided with a through hole (35), and the side wall of the desiccant adding cylinder (33) is provided with a breathable hole (34).

Images