Chip carrying device and testing equipment

Abstract

The utility model provides a chip carrying device and testing equipment, and relates to the technical field of chip testing. According to the utility model, each carrying part is movably connected with one first slide rail, and the two carrying parts are arranged to alternately move to the first target position to receive the tested chip and transport the tested chip to the second target position, so that the testing mechanism performs functional testing on the tested chip; the test jigs of the two carrying parts are arranged to be movable in the longitudinal direction so as to move along the corresponding first sliding rails on planes with different heights, equivalently, the two test jigs can be arranged in a longitudinal overlapping mode, and compared with the technical scheme that two test jigs are arranged side by side in the prior art, the structure of the carrying device can be more compact; the arrangement space is saved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip testing technical field, in particular to a chip's handling device and test equipment. BACKGROUND

[0002] At present, the test equipment for chip usually adopts single station to carry chip. First, the chip to be tested is taken to the station at the loading and unloading position, then the station is moved to the test position to test, after the test is completed, the station is moved to the loading and unloading position, the chip after the test is taken away first, then the next chip to be tested is put in, the whole test process is long, which leads to low test efficiency. In addition, there is also a scheme of double station to carry chip in the prior art, but the overall structure of the handling device is relatively large, and the space occupied is relatively large. SUMMARY

[0003] One object of the utility model is to provide a chip's handling device, which solves the technical problem of large space occupation of the double station handling device in the prior art.

[0004] A further object of the utility model is to improve the test efficiency.

[0005] Another further object of the utility model is to provide a chip's test equipment with the above handling device.

[0006] In particular, the utility model provides a chip's handling device, which comprises:

[0007] Two first sliding rails arranged in parallel;

[0008] Two handling components, each of which is movably connected with one of the first sliding rails and has a test fixture for placing the chip to be tested;

[0009] The two handling components are arranged to alternately move to a first target position to receive the chip to be tested and transport the chip to a second target position, so that the test mechanism can functionally test the chip to be tested; and the test fixtures of the two handling components are arranged to be movable in the longitudinal direction, so as to move along the corresponding first sliding rails on different height planes.

[0010] Optionally, each of the handling components further comprises:

[0011] A second sliding rail arranged in the longitudinal direction and connected with the corresponding first sliding rail;

[0012] A support connected with the second sliding rail and having a platform for placing the test fixture;

[0013] The platforms of the two supports are arranged to move in planes at different heights to drive the two test fixtures to move in planes at different heights, respectively.

[0014] Optionally, the second sliding rails of the two carrying components are arranged on the corresponding first sliding rails on the side close to the other first sliding rail, respectively.

[0015] The supports of the two carrying components are arranged on the second sliding rails on the side close to the other second sliding rail, respectively.

[0016] Optionally, the top of the test fixture has a plurality of mounting positions arranged side by side, and each mounting position is arranged to place a chip to be tested.

[0017] In particular, the utility model further provides a chip testing device, including at least one test flow line, each test flow line includes:

[0018] A third sliding rail extends along the conveying direction of the test flow line.

[0019] A test mechanism group includes a plurality of test mechanisms arranged side by side on the side of the third sliding rail along the conveying direction, and the plurality of test mechanisms are used for different functional tests on the chip to be tested.

[0020] A carrying device group includes the plurality of carrying devices, and each carrying device is arranged between a test mechanism and the third sliding rail.

[0021] An adsorption device group includes a plurality of adsorption devices movably connected to the third sliding rail, and at least part of the adsorption devices are arranged to adsorb the chip to be tested and transport the chip to be tested between the plurality of carrying devices.

[0022] Optionally, the utility model further includes:

[0023] A feeding machine is arranged on the side of the test flow line, and one of the adsorption devices of the adsorption device group of each test flow line is arranged to adsorb the chip to be tested from the feeding machine.

[0024] A discharging machine is arranged on the side of the test flow line away from the feeding machine, and one of the adsorption devices of the adsorption device group of each test flow line is arranged to carry the chip to be tested on the carrying device to the discharging machine.

[0025] Optionally, each test flow line further includes:

[0026] A feeding station is arranged on the side of the feeding machine close to the carrying device.

[0027] A discharging station is arranged on one side of the discharging machine close to the carrying device;

[0028] The feeding station and the discharging station each include at least one motor and at least one first carrier for placing the tested chips, each of the first carriers being installed on an output shaft of the motor to drive the tested chips to rotate when the motor works, so as to adjust the position of the tested chips.

[0029] One of the adsorption devices of the adsorption device group is used to transport the tested chips on the feeding machine to the feeding station, one of the adsorption devices is used to transport the tested chips on the last carrying device to the discharging station, and then the tested chips on the discharging station after position adjustment are transported to the discharging machine.

[0030] Optionally, each of the test pipelines further includes:

[0031] A visual correction device is arranged on one side of the feeding station close to the carrying device, and is used to adjust the position of the tested chips.

[0032] One of the adsorption devices of the adsorption device group is used to transport the tested chips on the feeding station to the visual correction device, and another adsorption device is used to transport the tested chips on the visual correction device to the carrying device closest to the feeding station.

[0033] Optionally, each of the adsorption devices includes a suction nozzle with elasticity, and each of the test pipelines further includes:

[0034] A plurality of pressure sensors are provided, each of the pressure sensors corresponds to one of the adsorption devices, and is installed close to the corresponding adsorption device, and the pressure sensor is used to calibrate the displacement amount of the suction nozzle of the adsorption device.

[0035] Optionally, the number of the test pipelines is two, and the two test pipelines are arranged side by side.

[0036] One of the adsorption devices of the two test pipelines is arranged to alternately adsorb the tested chips from the feeding machine, and another adsorption device is arranged to alternately transport the tested chips after test to the discharging machine for discharging.

[0037] In this invention, each transport component is movably connected to a first slide rail. The two transport components are configured to alternately move to a first target position to receive the chip under test and transport the chip under test to a second target position, so that the testing mechanism can perform functional testing on the chip under test. Furthermore, the test fixtures of the two transport components are configured to be longitudinally movable, so as to move along the corresponding first slide rails at different heights. This is equivalent to the two test fixtures being longitudinally overlapped. Compared with the prior art, which arranges two test fixtures side by side, the structure of the transport device is more compact and saves space.

[0038] Furthermore, the test fixture of this invention has multiple mounting positions arranged side by side on its top, and a chip under test is placed on each mounting position. The test fixture can transport multiple chips under test at the same time, which can improve testing efficiency compared with the technical solution of transporting only one chip under test at a time.

[0039] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0040] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0041] Figure 1 This is a schematic top view of a chip handling device according to an embodiment of the present invention;

[0042] Figure 2 This is a schematic structural diagram of a chip handling device according to an embodiment of the present invention;

[0043] Figure 3 This is a schematic top view of a chip testing device according to an embodiment of the present invention;

[0044] Figure 4 This is a schematic perspective view of a chip testing device according to an embodiment of the present invention;

[0045] Figure 5 This is a schematic structural diagram of a material loading station according to an embodiment of the present utility model;

[0046] Figure 6 This is a schematic structural diagram of a vision correction device according to an embodiment of the present invention;

[0047] Figure 7is a schematic structural view of the adsorption device according to an embodiment of the present application;

[0048] Figure 8 is a schematic structural view of the pressure sensor according to an embodiment of the present application.

[0049] Reference signs:

[0050] 1000-test equipment, 2000-chip to be tested, 100-conveying device, 10-first slide rail, 20-conveying part, 21-test fixture, 22-second slide rail, 23-bracket, 110-test mechanism, 200-adsorption device, 210-suction nozzle, 300-feeding station, 310-motor, 320-first loading platform, 400-discharging station, 500-third slide rail, 600-vision correction device, 610-XYR adjustment module, 620-second loading platform, 630-lens, 640-camera, 700-feeder, 800-discharger, 900-pressure sensor. DETAILED DESCRIPTION

[0051] The embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0052] In the description of the present application, it is understood that the terms "upper", "lower", "left", "right", "front", "back" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0053] The terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features, i.e. one or more of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited. When a certain feature "includes or contains" a certain or certain features, unless otherwise specifically described, it indicates that other features and can further include other features are not excluded.

[0054] Unless otherwise explicitly specified and limited, the terms "connected", "mounted", and the like should be interpreted broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication of two elements or interaction relationship between two elements, unless otherwise explicitly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in the present application according to the specific circumstances.

[0055] Unless otherwise limited, all terms used in the description of the embodiments (including technical terms and scientific terms) have the same meaning as generally understood by those skilled in the art to which the present application belongs.

[0056] Figure 1 is a schematic top view of the chip carrying device 100 according to an embodiment of the present application, Figure 2 is a schematic structural view of the chip carrying device 100 according to an embodiment of the present application. As shown in Figure 1 and Figure 2 In one specific embodiment, the chip carrying device 100 includes two first sliding rails 10 and two carrying components 20 arranged in parallel. Each carrying component 20 is movably connected with one first sliding rail 10 and has a test fixture 21 for placing the measured chip 200. The two carrying components 20 are arranged to alternately move to a first target position to receive the measured chip 200 and transport the measured chip 200 to a second target position to enable the test mechanism to perform functional testing on the measured chip 2000; and the test fixtures 21 of the two carrying components 20 are arranged to be movable in the longitudinal direction to move along the corresponding first sliding rail 10 at different heights.

[0057] The embodiment is equivalent to that the two test fixtures 21 can be arranged longitudinally overlapped, compared with the prior art technical solution that the two test fixtures 21 are arranged side by side, the structure of the carrying device 100 can be more compact, and the arrangement space can be saved. In addition, the embodiment can improve the carrying efficiency of the measured chip 2000 by alternately carrying the measured chip 2000 by the two carrying components 20, compared with the technical solution that only one carrying component 20 is arranged, thereby improving the testing efficiency.

[0058] In some embodiments, referring to Figure 1 , the position of the upper carrying component 20 is the first target position, and the position of the lower carrying component 20 is the second target position. The upper carrying component 20 moves to the first target position to receive the measured chip 2000 first, and then moves along Figure 1The upper and lower direction of the test chip 2000 is moved to the second target position to perform functional test on the test chip 2000. During the movement of the upper carrier 20 to the second target position, the lower carrier 20 is moved from the second target position to the first target position, and the test chip 2000 which has completed the functional test at the second target position is carried by the lower carrier 20. After the movement to the first target position, the test chip 2000 is unloaded, and then a new test chip 2000 is loaded. It can be understood that one carrier 20 is loading while the other carrier 20 is performing functional test on the test chip 2000, and the two carriers 20 are alternately carrying the test chip 2000, which can save time.

[0059] In some embodiments, the two first sliding rails 10 are consistent in structure. It can be understood that the movement stroke of the two first sliding rails 10 is consistent.

[0060] In some embodiments, each carrier 20 further comprises a second sliding rail 22 and a bracket 23. The second sliding rail 22 is arranged in the longitudinal direction and is connected with the corresponding first sliding rail 10. The bracket 23 is connected with the second sliding rail 22 and has a platform for placing the test fixture 21. The platforms of the two brackets 23 are arranged to move in different height planes to respectively drive the two test fixtures 21 to move in different height planes. Here, the structure of the second sliding rails 22 of the two carriers 20 is consistent, that is, the movement stroke of the two second sliding rails 22 is consistent. In this embodiment, the height of the platform and the test fixture 21 can be adjusted by controlling the bracket 23 to move along the second sliding rail 22, and the two platforms and test fixtures 21 need to be adjusted to different heights, so that the collision of the two carriers 20 can be avoided when they move at the same time.

[0061] In some embodiments, the test mechanism 110 is located on the side of the carrying device 100 close to the second target position. For the test fixtures 21 located at different heights, when the carrier 20 moves to the second target position, the test mechanism 110 can adjust its height according to the test fixtures 21 at different heights to facilitate the test on the test chips 2000 at different heights. In addition, if the test mechanism 110 cannot adjust its height, when the carrier 20 moves to the second target position, the height of the platform can be adjusted so that the distance between the test chip 2000 and the test mechanism 110 reaches the test distance. After the test chip 2000 completes the test, the height is adjusted again to the original height, and then moves along the first sliding rail 10 to the first target position.

[0062] In some embodiments, the second slide rails 22 of the two handling components 20 are respectively arranged at the side of the corresponding first slide rails 10 close to the other first slide rail 10. The supports 23 of the two handling components 20 are respectively arranged at the side of the second slide rails 22 close to the other second slide rail 22. It can be understood that the two second slide rails 22 are located between the two first slide rails 10, and the two supports 23 are located between the two second slide rails 22.

[0063] In some embodiments, the top of the test fixture 21 has a plurality of mounting positions arranged side by side, and each mounting position is provided with a chip 2000 to be tested.

[0064] The test fixture 21 in this embodiment can carry a plurality of chips 2000 to be tested at the same time, which can improve the test efficiency compared with the technical solution of carrying only one chip 2000 to be tested at a time. Here, the test mechanism 110 can also simultaneously test a plurality of chips 2000 to be tested on the test fixture 21.

[0065] Figure 3 is a schematic top view of a chip testing device 1000 according to an embodiment of the present application, Figure 4 is a schematic perspective view of a chip testing device 1000 according to an embodiment of the present application. As Figure 3 and Figure 4 shown, in one specific embodiment, the chip testing device 1000 includes at least one test pipeline, and each test pipeline includes a third slide rail 500, a test mechanism group, a handling device group, and a suction device group. The third slide rail 500 extends along the conveying direction of the test pipeline. The test mechanism group includes a plurality of test mechanisms 110 arranged side by side on one side of the third slide rail 500 along the conveying direction, and the plurality of test mechanisms are used to perform different functional tests on the chip 2000 to be tested. The handling device group includes a plurality of handling devices 100 according to any one of the above embodiments, and each handling device 100 is arranged between a test mechanism 110 and the third slide rail 500. The suction device group includes a plurality of suction devices 200 movably connected to the third slide rail 500, and at least part of the suction devices 200 are arranged to suck the chip 2000 to be tested and transport the chip 2000 to be tested between the plurality of handling devices 100.

[0066] In some embodiments, the test device 1000 further includes a feeding machine 700 and a discharging machine 800. The feeding machine 700 is arranged on one side of the test pipeline, and one of the suction devices 200 of the suction device group of each test pipeline is arranged to suck the chip 2000 to be tested from the feeding machine 700. The discharging machine 800 is arranged on the side of the test pipeline away from the feeding machine 700, and one of the suction devices 200 of the suction device group of each test pipeline is arranged to carry the chip 2000 to be tested on the handling device 100 to the discharging machine 800.

[0067] In some embodiments, the number of test pipelines is two, and the two test pipelines are arranged side by side. One of the two test pipelines is provided with an adsorption device 200 for alternately adsorbing the tested chips 2000 from the feeding machine 700, and the other of the two test pipelines is provided with an adsorption device 200 for alternately transporting the tested chips 2000 after testing to the discharging machine 800 for discharging. It can be understood that the two test pipelines are both fed from the feeding machine 700, and the two test pipelines share one feeding machine 700. The adsorption devices 200 of one group of adsorption device groups receive the tested chips 2000, and the adsorption devices 200 of another group of adsorption device groups receive the tested chips 2000, and the adsorption devices 200 of the two groups of adsorption device groups alternately receive the tested chips 2000. Compared with the technical solution of only one test pipeline, the test speed can be doubled, and the arrangement space can be saved.

[0068] In some embodiments, an adsorption device 200 is arranged between two adjacent conveying devices 100, and each adsorption device 200 is used for transporting the tested chip 2000 on the previous conveying device 100 to the next conveying device 100.

[0069] In some embodiments, the number of conveying devices 100 is four, and in other embodiments, the number of conveying devices 100 can also be designed according to the test requirements, for example, can be five or six, etc.

[0070] Figure 5 is a schematic structural view of the feeding station 300 according to an embodiment of the present application. As shown in Figure 5 In some embodiments, each test pipeline further includes a feeding station 300 and a discharging station 400, the feeding station 300 is arranged on the side of the feeding machine 700 close to the conveying device 100. The discharging station 400 is arranged on the side of the discharging machine 800 close to the conveying device 100. The feeding station 300 and the discharging station 400 both include at least one motor 310 and at least one first loading platform 320 for placing the tested chip 2000. Each first loading platform 320 is installed on the output shaft of one motor 310 to drive the tested chip 2000 to rotate when the motor 310 works, so as to adjust the position of the tested chip 2000. One of the adsorption devices 200 of the adsorption device group is used for transporting the tested chip 2000 on the feeding machine 700 to the feeding station 300. One of the adsorption devices 200 is used for transporting the tested chip 2000 on the last conveying device 100 to the discharging station 400, and then transporting the tested chip 2000 after position adjustment on the discharging station 400 to the discharging machine 800.

[0071] In some embodiments, the feeding station 300 and the discharging station 400 include two motors 310 and two first carriages 320, each motor 310 can drive the corresponding first carriage 320 to rotate, thereby driving a measured chip 2000 to rotate, so as to adjust the position of the measured chip 2000. It can be understood that the feeding station 300 of this embodiment can simultaneously adjust the positions of two measured chips 2000. After the measured chip 2000 is tested, the position of the measured chip 2000 still needs to be adjusted through the discharging station 400, and after the adjustment, the discharging machine 800 is used for discharging.

[0072] Figure 6 is a schematic structural diagram of a visual correction device 600 according to an embodiment of the present application. As shown in Figure 6 some embodiments, each test flow line further includes a visual correction device 600, which is arranged on one side of the feeding station 300 close to the conveying device 100, and is used for adjusting the position of the measured chip 2000. One of the adsorption device groups 200 is used to transport the measured chip 2000 on the feeding station 300 to the visual correction device 600, and the other adsorption device 200 is used to transport the measured chip 2000 on the visual correction device 600 to the conveying device 100 closest to the feeding station 300.

[0073] In some embodiments, the visual correction device 600 includes an XYR adjustment module 610 and a second carriage 620, and the second carriage 620 has a mounting position for placing the measured chip 2000. The XYR adjustment module 610 is connected with the second carriage 620, and the XYR adjustment module 610 is used to drive the second carriage 620 to rotate and / or move under control, thereby adjusting the position of the measured chip 2000. Here, the XYR adjustment module 610 can realize correction in three directions, i.e., X axis, Y axis and R axis, the X axis and the Y axis are two axes of translation, and the R axis is a rotation axis.

[0074] In some embodiments, the visual correction mechanism further includes at least one camera 640 and at least one lens 630, each lens 630 is located above a mounting position, and each camera 640 is located above a lens 630. Each lens 630 is inserted with a point light source. The lens 630 is arranged to obtain the actual position of the measured chip 2000 through the point light source. The XYR adjustment module 610 is arranged to adjust the position of the measured chip 2000 according to the actual position and the target position. When different models of measured chips 2000 are switched, the visual correction device 600 can be automatically calibrated, without the need for manual recalibration, thereby saving the machine switching time.

[0075] The embodiment is equivalent to roughly adjusting the position of the measured chip 2000 through the loading station 300, and then transporting the measured chip 2000 on the loading station 300 to the vision correction mechanism for accurate adjustment. After two adjustments, the accuracy of the position adjustment of the measured chip 2000 can be improved.

[0076] Figure 7 is a schematic structural diagram of the adsorption device 200 according to an embodiment of the present application. As shown in Figure 7 , the adsorption device 200 includes two suction nozzles 210, so that two measured chips 2000 can be adsorbed at the same time. That is, the adsorption device 200 can adsorb two measured chips 2000 at one time, so two mounting positions are arranged on the loading station 300, the vision correction device 600, the conveying device 100 and the test mechanism 110 to meet the demand of testing two measured chips 2000 at the same time. Here, the suction nozzle 210 adopts vacuum adsorption and has elasticity.

[0077] Figure 8 is a schematic structural diagram of the pressure sensor 900 according to an embodiment of the present application. As shown in Figure 8 , in some embodiments, each adsorption device 200 includes a suction nozzle 210 with elasticity. Each test flow line further includes a plurality of pressure sensors 900, each pressure sensor 900 corresponding to an adsorption device 200 and being installed at a position close to the corresponding adsorption device 200, and the pressure sensor 900 is used to calibrate the displacement amount of the suction nozzle 210 of the adsorption device 200. Here, because the thickness of different models of measured chips may be different, the spring force of the suction nozzle 210 of the adsorption device 200 will change, and the displacement amount x of the suction nozzle 210 needs to be calibrated regularly. The embodiment configures one pressure sensor 900 for each adsorption device 200 of each test flow line, automatically measures the pressure when the adsorption device 200 moves above the corresponding pressure sensor 900, the pressure is a set fixed value, and when the pressure reaches the set fixed value, the vertical displacement amount of the suction nozzle 210 at this time is taken as the new displacement amount x of the suction nozzle 210, so as to recalibrate the displacement amount x of the suction nozzle 210. Here, Hooke's law F=kx, k is the spring force of the suction nozzle 210, because k changes, so the displacement amount x of the suction nozzle 210 in the vertical direction needs to be determined by measuring the pressure F.

[0078] In some embodiments, a pressure sensor 900 is installed between two adjacent conveying devices 100, a pressure sensor 900 is installed between the loading station 300 and the visual correction device 600, a pressure sensor 900 is installed between the visual correction device 600 and the nearest conveying device 100, and a pressure sensor 900 is installed between the last conveying device 100 and the unloading station 400, so that the nozzles 210 of multiple suction devices 200 can be calibrated at the same time. The chip testing device 1000 can periodically calibrate the displacement amount of the nozzle 210 of each suction device 200. When the suction device 200 moves above the corresponding pressure sensor 900, the nozzle 210 of the suction device 200 moves downward and abuts above the pressure sensor 900, and when the pressure reaches a set fixed value, the nozzle 210 stops moving downward, and at this time, the displacement amount of the nozzle 210 is the new displacement amount. When the suction device 200 picks up or places the tested chip, it moves downward by the new displacement amount, which can avoid crushing the tested chip. When the suction device 200 includes two nozzles 210, one of the nozzles 210 of the suction device 200 is first controlled to move above the pressure sensor 900, and the displacement amount of the nozzle 210 is first calibrated, and then the other nozzle 210 is controlled to move above the pressure sensor 900, and the displacement amount of the other nozzle 210 is calibrated. That is, one pressure sensor 900 can calibrate the displacement amounts of the two nozzles 210 of the suction device 200.

[0079] At this point, those skilled in the art should recognize that although the present application has been shown and described in detail in the above embodiments, many other variations or modifications can be determined or deduced directly from the disclosure of the present application according to the principles of the present application without departing from the spirit and scope of the present application. Therefore, the scope of the present application should be understood and recognized as covering all these other variations or modifications.

Claims

1. A chip handling device, characterized by The device comprises: two first sliding rails arranged in parallel; two carrying components, each of which is movably connected with one of the first sliding rails and has a test fixture for placing a chip under test; the two carrying components are arranged to alternately move to a first target position to receive the chip under test and to a second target position to transport the chip under test to a functional test mechanism for functional testing of the chip under test; and the test fixtures of the two carrying components are arranged to be movable in a longitudinal direction to move along planes at different heights along the corresponding first sliding rails.

2. The handling device of claim 1, wherein Each of the carrying components further comprises: a second sliding rail arranged in a longitudinal direction and connected with the corresponding first sliding rail; a support connected with the second sliding rail and having a platform for placing the test fixture; the platforms of the two supports are arranged to move along planes at different heights to respectively drive the two test fixtures to move along planes at different heights.

3. The carrying device according to claim 2, wherein the second sliding rails of the two carrying components are respectively arranged on the corresponding first sliding rail near the other first sliding rail; the supports of the two carrying components are respectively arranged on the second sliding rail near the other second sliding rail.

4. The carrying device according to any one of claims 1-3, wherein the top of the test fixture has a plurality of mounting positions arranged side by side, and each of the mounting positions is arranged to place one chip under test.

5. A chip testing apparatus characterized by comprising: The device comprises at least one test flow line, and each of the test flow lines comprises: a third sliding rail extending in a conveying direction of the test flow line; a test mechanism group comprising a plurality of test mechanisms arranged side by side on one side of the third sliding rail in the conveying direction, and the plurality of test mechanisms are used for different functional testing of chips under test; a carrying device group comprising a plurality of carrying devices according to any one of claims 1-4, and each of the carrying devices is arranged between one of the test mechanisms and the third sliding rail; an adsorption device group comprising a plurality of adsorption devices movably connected to the third sliding rail, and at least part of the adsorption devices are arranged to adsorb the chips under test and transport the chips under test between the plurality of carrying devices.

6. The test apparatus of claim 5, wherein, The device further comprises: a feeding machine arranged on one side of the test flow line, and one of the adsorption devices of the adsorption device group of each of the test flow lines is arranged to adsorb the chip under test from the feeding machine; a discharging machine arranged on a side of the test flow line away from the feeding machine, and one of the adsorption devices of the adsorption device group of each of the test flow lines is arranged to carry the chip under test on the carrying device to the discharging machine.

7. The test apparatus of claim 6, wherein, Each of the test flow lines further comprises: a feeding station arranged on a side of the feeding machine near the carrying device; a discharging station arranged on a side of the discharging machine near the carrying device; The upper feeding station and the lower feeding station each include at least one motor and at least one first carrier for placing the tested chip, each of the first carriers being installed on an output shaft of the motor to drive the tested chip to rotate when the motor works, so as to adjust the position of the tested chip; One of the adsorption devices of the adsorption device group is used to transport the tested chip on the upper feeding machine to the upper feeding station, one of the adsorption devices is used to transport the tested chip on the last carrying device to the lower feeding station, and then the tested chip with the adjusted position on the lower feeding station is transported to the lower feeding machine.

8. The test apparatus of claim 7, wherein, Each of the test pipelines further includes: a visual correction device arranged on one side of the upper feeding station close to the carrying device, and used to adjust the position of the tested chip; One of the adsorption devices of the adsorption device group is used to transport the tested chip on the upper feeding station to the visual correction device, and another adsorption device is used to transport the tested chip on the visual correction device to the carrying device closest to the upper feeding station.

9. The test apparatus of any of claims 6-8, wherein, Each of the adsorption devices includes a suction nozzle with elasticity, and each of the test pipelines further includes: a plurality of pressure sensors, each of the pressure sensors corresponding to one of the adsorption devices and being installed close to the corresponding adsorption device, and the pressure sensor being used to calibrate the displacement amount of the suction nozzle of the adsorption device.

10. The test device according to any one of claims 6-8, wherein, the number of the test pipelines is two, and the two test pipelines are arranged side by side; one of the adsorption devices of the two test pipelines is arranged to alternately adsorb the tested chip from the upper feeding machine, and another adsorption device is arranged to alternately transport the tested chip after the test is completed to the lower feeding machine for discharging.

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