Efficient heat dissipation device for current-conducting plate of electrolytic bath

Abstract

The utility model relates to the technical field of electrolytic baths, and discloses a high-efficiency heat dissipation device for a current-conducting plate of an electrolytic bath. Comprising current-conducting plates which are respectively welded on polar plates at two ends of an electrolytic tank and are used for wiring a power cable and electrifying the electrolytic tank, micro-channels arranged in the current-conducting plates, and a cooling circulation loop communicated with the micro-channels of the current-conducting plates, the cooling liquid circulation device is arranged on the cooling circulation loop and used for driving cooling liquid in the cooling circulation loop to flow circularly, and the cooling liquid cooling heat exchange device is connected with the cooling circulation loop and used for cooling the cooling liquid in the cooling circulation loop. According to the utility model, the defect of poor heat dissipation capability of the current-conducting plate of the traditional electrolytic bath is overcome, the comprehensive heat dissipation capability of the electrolytic bath is enhanced, the working safety and reliability of the electrolytic bath are improved, and the operation energy consumption of the electrolytic bath can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to electrolytic cell technical field, concretely relates to a kind of electrolytic cell conducting plate high-efficiency heat sink. BACKGROUND

[0002] With the development of green electricity hydrogen production technology, electrolytic cell gradually develops towards high current density (more than 9,000 A / m²). According to Joule's law Q=I2Rt, the increase of current density leads to the square growth of heat production. For example, when running at 9,000 A / m², the heat production power of single conducting plate can reach several kW / m², and if the heat dissipation is insufficient, the local temperature may exceed 150℃, which directly threatens the stable operation of electrolytic cell. The welding root of conducting plate and polar plate forms a high contact resistance area due to microstructure defects (such as pores, incomplete fusion). At high current, the heat production power of such area is much higher than that of other areas, forming a local hot spot. Experiments show that the welding root temperature can be 20~50℃ higher than that of the main body of conducting plate, which becomes the main risk point of electrolytic cell thermal failure. Breaking through the limitations of traditional heat dissipation technology, developing a high-efficiency heat dissipation system that adapts to complex structure and has dynamic response capability has become a key link to promote the large-scale application of electrolytic water hydrogen production technology.

[0003] Once the welding root temperature of electrolytic cell running process is high, such as exceeding 100℃, plus the temperature of electrolytic cell body (90±5℃), the temperature is close to or exceeds the safe working temperature of electrolytic cell sealing gasket (≤200℃), which can cause sealing gasket failure and extrusion, resulting in the risk of electrolytic cell liquid leakage.

[0004] In addition, the air cooling scheme used in traditional electrolytic cell has low upper limit of heat dissipation capacity and cannot cope with high current density scenarios, and uneven airflow distribution can cause local heat dissipation dead angle (such as welding root) and large temperature deviation (more than 10℃).

[0005] Therefore, it is necessary to improve the existing electrolytic cell heat dissipation scheme to solve the above problems. UTILITY MODEL CONTENT

[0006] In order to solve the above problems, the utility model provides a kind of electrolytic cell conducting plate high-efficiency heat sink, which aims to overcome the shortcomings of prior art, enhance the comprehensive heat dissipation capacity of electrolytic cell, and improve the safety and reliability of electrolytic cell operation. The specific technical scheme is as follows:

[0007] The utility model relates to an electrolytic cell conducting plate high -efficient heat abstractor, including respectively welding in electrolytic cell both ends pole plate for power cable and electrolytic cell power supply's conducting plate, the microchannel of setting in the conducting plate, with the microchannel of the conducting plate's intercommunication cooling circulation loop, set up in the cooling circulation loop for driving the circulating flow of cooling liquid in the cooling circulation loop cooling liquid circulating device, connect the cooling circulation loop for realizing the cooling liquid cooling of cooling circulation loop cooling liquid cooling heat exchange device.

[0008] Generally electrolytic cell's conducting plate is connected in electrolytic cell's axial both sides end pole plate.

[0009] As one of the preferred schemes of the microchannel structure of the conducting plate in the utility model, the microchannel of the conducting plate is a serpentine microchannel, a plurality of the serpentine microchannels are arranged in layers in the conducting plate, and a pair of busbars corresponding to the two ends of the conducting plate are connected, a busbar cavity for connecting the ends of each serpentine microchannel is arranged in the busbar, and the microchannel of the conducting plate is connected in series on the cooling circulation loop through the busbar cavity.

[0010] As the second preferred scheme of the microchannel structure of the conducting plate in the utility model, the microchannel of the conducting plate is a straight-through microchannel, a plurality of the straight-through microchannels are densely arranged in parallel and at intervals in the conducting plate, and a pair of busbars corresponding to the two ends of the conducting plate are connected, a busbar cavity for connecting the ends of each straight-through microchannel is arranged in the busbar, and the microchannel of the conducting plate is connected in series on the cooling circulation loop through the busbar cavity.

[0011] Preferably, the diameter of the microchannel is 0.5-1.0 mm, and the spacing is 2-4 mm; the cooling liquid flowing in the cooling circulation loop is ionized water, and the flow rate is 0.5-1.0 m / s.

[0012] Preferably, the surface of the conducting plate is sprayed with an aluminum nitride coating or a graphene-enhanced copper-based composite coating, and a temperature sensor is arranged on the surface of the conducting plate, the welding root of the conducting plate, and the outlet position of the electrolyte of the electrolytic cell, respectively.

[0013] Preferably, the temperature sensor is an optical fiber temperature sensor.

[0014] The above-mentioned spraying of the conducting plate with an aluminum nitride coating or a graphene-enhanced copper-based composite coating on the surface of the conducting plate can accelerate the heat dissipation of the conducting plate, thereby reducing the temperature of the conducting plate.

[0015] Preferably, the cooling liquid cooling and heat exchange device comprises a closed cooling tower for cooling the electrolytic cell, the cooling circulation loop is a cooling circulation long stroke loop arranged between the conductive plate and the closed cooling tower, and a heat exchange coil is connected in series on the cooling circulation long stroke loop, the heat exchange coil is arranged in the closed cooling tower of the electrolytic cell; the cooling liquid circulation device is a circulating pump connected in series on the cooling circulation long stroke loop; the circulating pump and each temperature sensor are connected to the control system of the electrolytic cell.

[0016] As a further improvement of the utility model, the cooling liquid cooling and heat exchange device further comprises a cooling liquid self-circulation auxiliary cooler for reducing the operation energy consumption of the high-power electrolytic cell closed cooling tower, the cooling liquid self-circulation auxiliary cooler comprises a phase change heat exchanger arranged near the conductive plate, the phase change heat exchanger comprises a shell and a phase change material filled in the shell, the cooling circulation loop further comprises a cooling circulation short stroke loop arranged between the conductive plate and the phase change heat exchanger, and a heat exchange coil is connected in series on the cooling circulation short stroke loop, the heat exchange coil is arranged in the inner cavity of the phase change heat exchanger shell and is in contact with the phase change material; wherein the phase change heat exchanger and the conductive plate are arranged on the two sides of the cooling circulation short stroke loop, and the phase change heat exchanger is arranged at a relatively high position and the conductive plate is arranged at a relatively low position relative to the conductive plate; wherein a shared local loop is arranged between the cooling circulation long stroke loop and the cooling circulation short stroke loop at the bus connection position of the conductive plate, and a pair of electrically operated switching valves for opening or cutting off the cooling circulation long stroke loop are arranged on the two sides of the cooling circulation long stroke loop, and the electrically operated switching valves are connected to the control system.

[0017] Preferably, the cooling circulation short stroke loop is arranged vertically.

[0018] Preferably, the phase change material in the phase change heat exchanger is paraffin, and a transceiving integrated ultrasonic sensor for detecting the melting state of the internal paraffin is arranged on the shell of the phase change heat exchanger, and the transceiving integrated ultrasonic sensor is connected to the control system.

[0019] The ultrasonic sensor integrated with the transceiver on the shell can periodically send ultrasonic pulses and record the echo characteristics; as the paraffin gradually melts, the echo signal received by the ultrasonic sensor will change accordingly, so that the melting of the paraffin can be judged. A temperature sensor for measuring the temperature of the paraffin can also be provided on the shell to monitor the real-time temperature of the paraffin, and the melting of the paraffin can be comprehensively judged in combination with the echo characteristics obtained by the ultrasonic sensor. The control system can take appropriate control strategies in advance according to the melting of the paraffin. For example, when the phase change heat exchanger has sufficient continuous heat absorption capacity according to its melting, a pair of electrically operated switching valves on a cooling circulating long-stroke circuit can be cut off, so that the closed cooling tower of the electrolytic cell and the phase change heat exchanger work independently, so that the closed cooling tower of the electrolytic cell focuses on optimizing the cooling circulation of the electrolytic cell body and the electrolyte. In most cases, even if the heat generated by the conductive block fluctuates greatly, it is mainly controlled by the phase change heat exchanger, and it is not necessary to unnecessarily increase the operating power of the high-power closed cooling tower equipment for temperature control of the conductive block. Only when the temperature control capacity of the phase change heat exchanger is insufficient, the electrically operated switching valve is temporarily opened, so that the closed cooling tower of the electrolytic cell also participates in the temperature control of the conductive block, so that the best energy-saving effect can be achieved.

[0020] As one of the preferred solutions for the phase change heat exchanger to achieve heat dissipation cooling, heat dissipation fins are arranged on the shell of the phase change heat exchanger.

[0021] As the second preferred solution for the phase change heat exchanger to achieve heat dissipation cooling, a plurality of semiconductor refrigeration pieces for accelerating the cooling of the shell are arranged on the shell of the phase change heat exchanger, and the semiconductor refrigeration pieces are respectively connected to the control system.

[0022] Among them, the semiconductor refrigeration piece is a semiconductor refrigeration piece with a micro heat dissipation fan.

[0023] Preferably, the heat dissipation fins and the semiconductor refrigeration pieces are arranged on the upper and lower sides and the front and rear sides of the shell.

[0024] It should be noted that when the temperature control capacity of the phase change heat exchanger is insufficient, the low-power semiconductor refrigeration piece on the shell of the phase change heat exchanger can be preferably turned on to avoid increasing the energy consumption of the high-power closed cooling tower of the electrolytic cell. However, when the closed cooling tower of the electrolytic cell is in the lowest energy consumption operation and still has abundant refrigeration capacity, a pair of electrically operated switching valves can be preferably connected to the closed cooling tower of the electrolytic cell without turning on the semiconductor refrigeration piece, so as to achieve maximum energy saving optimization.

[0025] The cooling liquid self-circulation auxiliary cooler utilizes the sustained heat absorption of the phase change material when the temperature reaches the phase change point, can realize steady heat exchange of the cooling liquid, is conducive to reducing temperature fluctuation of the cooling liquid, and has good temperature controllability of the conductive plate.

[0026] When the temperature difference between the conductive plate and the phase change heat exchanger is large, the principle of density difference of the liquid in the closed loop caused by temperature is utilized to generate sufficient driving force to overcome the flow resistance of the liquid in the cooling circulation short stroke loop, so as to realize self-circulation of the cooling liquid in the cooling circulation short stroke loop. However, in order to enable the cooling liquid self-circulation auxiliary cooler to form stable cooling liquid circulation at the beginning, a pair of electric switching valves on the cooling circulation long stroke loop can be opened instantaneously when the electrolytic cell is started, so that the cooling liquid obtains initial driving force, thereby enabling the cooling liquid to quickly obtain the inertia of circulating flow; after the electric switching valves are closed, the self-circulation of the cooling liquid is realized on the basis of the inertia of the cooling liquid flow by relying on the principle of density difference. It can also be considered to periodically open a pair of electric switching valves on the cooling circulation long stroke loop for a short time, to increase the stability of the circulating flow of the cooling liquid.

[0027] The working principle of the cooling liquid self-circulation auxiliary cooler utilizing the density difference of the cooling liquid to realize the self-circulation of the cooling liquid is as follows:

[0028] In the closed cooling circulation short stroke loop, the cooling liquid in the low-temperature region (in the micro-channel of the conductive plate) has low density due to temperature rise, and the cooling liquid with low density will float up; the cooling liquid in the high-temperature region (in the heat exchange coil of the phase change heat exchanger) has high density due to temperature drop, and the cooling liquid with high density will sink, and the density difference between the two generates fluid driving force. Since the flow resistance of the cooling liquid in the closed cooling circulation short stroke loop is small, the fluid driving force generated by the density difference is sufficient to overcome the flow resistance of the cooling liquid, thereby driving the cooling liquid to move from the low-temperature region to the high-temperature region (cooling region→heated region), so that the heated cooling liquid rises and the cooler cooling liquid sinks in the closed loop, thereby forming a natural convection circulation of the cooling liquid.

[0029] It is noted that the self-circulation of the cooling liquid in the cooling circulation short stroke loop is realized in the closed state of a pair of electric switching valves on the cooling circulation long stroke loop. When the pair of electric switching valves is opened, the forced circulation of the cooling liquid is mainly realized by relying on the circulating pump on the cooling circulation long stroke loop.

[0030] It is noted that in order to improve the stability of the self-circulation flow of the cooling liquid in the cooling liquid self-circulation auxiliary cooler, the heat exchange coil on the cooling circulation short stroke loop can also be considered to be cancelled, and a part of the cooling circulation short stroke loop is directly placed in the shell of the phase change heat exchanger, but this needs to redesign and calculate the heat exchange efficiency of the phase change heat exchanger to ensure the reliability of the operation of the phase change heat exchanger.

[0031] The application discloses a heat dissipation method of an electrolytic cell conductive plate high-efficiency heat dissipation device, which comprises the following steps: arranging micro-channels on the conductive plate of the electrolytic cell; connecting the micro-channels on the conductive plate in series in a cooling circulation loop; arranging the cooling circulation loop as a cooling circulation long-stroke loop; connecting the cooling circulation long-stroke loop to a closed cooling tower of the electrolytic cell through a heat exchange coil for heat exchange; arranging a circulating pump on the cooling circulation long-stroke loop to drive the circulating flow of the cooling liquid in the cooling circulation long-stroke loop; and absorbing the heat of the conductive plate by the circulating cooling liquid when the circulating cooling liquid passes through the micro-channels on the conductive plate, so that the cooling and temperature reduction of the conductive plate are realized.

[0032] Preferably, the control system adjusts the cooling liquid flow of the circulating pump and the rotating speed of the heat dissipation fan on the cooling circulation long-stroke loop in real time through a PID algorithm, so that the surface temperature and the welding root temperature of the conductive plate of the electrolytic cell are not higher than the set values while the main body of the electrolytic cell and the electrolyte are cooled.

[0033] As a further improvement of the application, the micro-channels on the conductive plate are connected in series in a cooling circulation short-stroke loop, a shared local loop is arranged between the cooling circulation short-stroke loop and the cooling circulation long-stroke loop, and a pair of electrically-driven switching valves are arranged on the non-shared local loop of the cooling circulation long-stroke loop; a cooling liquid self-circulation auxiliary cooler capable of realizing the self-circulation of the cooling liquid for reducing the operation energy consumption of the high-power electrolytic cell closed cooling tower is arranged on the cooling circulation short-stroke loop; the cooling liquid self-circulation auxiliary cooler realizes the cooling and temperature reduction of the cooling liquid by using the phase change heat exchanger on the cooling circulation short-stroke loop, and drives the circulating flow of the cooling liquid in the cooling circulation short-stroke loop by using the density difference of the cooling liquid at different temperatures, so that the cooling and temperature reduction of the conductive plate are realized.

[0034] Preferably, in order to solve the problem that the sealing gasket of the electrolytic cell is easily deformed and extruded, a special electrolytic cell sealing gasket cooling device can be arranged, the electrolytic cell sealing gasket cooling device comprises micro-holes arranged on a middle annular belt of the electrolytic cell sealing gasket, a pair of annular grooves are arranged on a pair of electrolytic cell plates respectively in contact with two surfaces of the electrolytic cell sealing gasket and correspond to the middle annular belt of the electrolytic cell sealing gasket, a pair of gasket cooling channels are arranged on the outer circles of the pair of electrolytic cell plates and correspond to the annular grooves, and the pair of gasket cooling channels are connected to the closed cooling tower of the electrolytic cell through a cooling circulation long-stroke loop (which also has a heat exchange coil and a circulating pump) or connected to the cooling liquid self-circulation auxiliary cooler through a cooling circulation short-stroke loop (which also has a heat exchange coil but does not have a circulating pump).

[0035] It should be noted that the annular grooves should avoid the liquid inlet holes and air passage holes on the electrolytic cell plates.

[0036] Preferably, one of the pair of gasket cooling channels is arranged at the upper end of the outer circle of one of the electrolytic cell plates, and the other of the pair of gasket cooling channels is arranged at the lower end of the outer circle of the other electrolytic cell plate.

[0037] It should be noted that when the electrolytic cell is in intermittent operation mode (such as an electrolytic cell using wind and light fluctuation, which stops when the power is below a certain value and restarts when the power is above a certain value), the phase change heat exchanger can be designed to have sufficient heat absorption capacity, and the heat can be fully dissipated during the gap time of stopping and the heat absorption performance can be restored, so that the temperature of the cooling liquid self-circulation auxiliary cooler can be independently controlled.

[0038] The beneficial effects of the utility model are:

[0039] First, the electrolytic cell conductive plate high-efficiency heat dissipation device of the utility model realizes the cooling of the conductive plate by setting microchannels on the conductive plate and connecting the microchannels of the conductive plate in the cooling circulation loop, which has the advantages of uniform heat dissipation and high heat dissipation efficiency, is beneficial to eliminate local temperature difference, reduce thermal stress, and avoid material thermal stress fatigue, thereby overcoming the disadvantages of performance decline, instability and even failure of the traditional electrolytic cell caused by excessively high temperature of the conductive plate, and improving the safety and reliability of the electrolytic cell.

[0040] Second, the electrolytic cell conductive plate high-efficiency heat dissipation device of the utility model, the surface of the conductive plate is sprayed with a layer of aluminum nitride coating or graphene reinforced copper-based composite coating, which enhances the heat dissipation capacity of the conductive plate.

[0041] Third, the utility model discloses a kind of efficient heat sink of electrolytic cell conducting plate, the surface of conducting plate, the welding root of conducting plate and the electrolyte outlet position of electrolytic cell are respectively arranged with temperature sensor, so that control system can be according to the data measured by temperature sensor, the cooling liquid flow of circulating pump on real-time cooling circulation loop and the rotating speed of electrolytic cell heat dissipation fan are controlled by PID algorithm, to facilitate accurate temperature control, so that the surface of conducting plate and welding root temperature can be controlled below 80 DEG C (electrolyte temperature upper limit is usually 90 DEG C), avoid thermal runaway;By " accurate heat dissipation + dynamic regulation + light weight integration", the thermal runaway problem under high current density of electrolytic cell is solved.

[0042] Fourth, the utility model discloses a kind of efficient heat sink of electrolytic cell conducting plate, the further improved cooling circulation long-stroke loop and the composite cooling circulation loop of cooling circulation short-stroke loop combination's conducting plate temperature control scheme of compound cooling circulation loop, can avoid the closed cooling tower of electrolytic cell frequently in super-power consumption operating condition, to be able to produce good energy-saving effect, and can fully meet the comprehensive temperature control under intermittent working mode (such as wind and light fluctuation) of electrolytic cell.

[0043] Fifth, the utility model discloses a kind of efficient heat sink of electrolytic cell conducting plate, specially set cooling liquid self-circulation auxiliary cooler, realizes self-circulation flow using the density difference of cooling liquid under temperature difference effect, and in combination with the phase change heat exchanger with sustained heat absorption capacity, can further improve the effect of energy saving.

[0044] Sixth, the utility model discloses a kind of efficient heat sink of electrolytic cell conducting plate, sets special electrolytic cell sealing gasket cooling device, further reduces the risk of electrolytic cell sealing gasket failure, to improve the reliability of electrolytic cell work.

[0045] Seventh, the utility model discloses a kind of efficient heat sink of electrolytic cell conducting plate, can be compatible with the high-temperature operation demand of new electrode material (such as high-entropy ceramic), adapt to future technology iteration. DRAWINGS

[0046] Fig. 1 It is the structure schematic diagram of a kind of efficient heat sink of electrolytic cell conducting plate of the utility model;

[0047] Fig. 2 It is the structure schematic diagram of electrolytic cell sealing gasket cooling device (the partial bulk section view of electrolytic cell).

[0048] In the figure: 1, conductive plate, 2, microchannel, 3, cooling circulation loop, 4, cooling liquid circulation device, 5, cooling liquid cooling heat exchange device, 6, bus block, 7, bus cavity, 8, closed cooling tower, 9, cooling circulation long stroke loop, 10, heat exchange coil, 11, circulating pump, 12, cooling liquid self-circulation auxiliary cooler, 13, phase change heat exchanger, 14, shell, 15, phase change material, 16, cooling circulation short stroke loop, 17, common local loop, 18, electrically operated switching valve, 19, transceiver integrated ultrasonic sensor, 20, heat dissipation fin, 21, semiconductor refrigeration sheet, 22, temperature sensor, 23, electrolytic cell gasket cooling device, 24, polar plate, 25, gasket, 26, intermediate ring-shaped band, 27, micro-hole, 28, annular groove, 29, gasket cooling channel, 30, electrode mesh, 31, diaphragm. DETAILED DESCRIPTION

[0049] The specific embodiments of the utility model will be further described below in combination with the drawings and examples. The following examples are only used to more clearly illustrate the technical scheme of the utility model, and cannot be used to limit the protection scope of the utility model.

[0050] Example 1:

[0051] As Figs. 1-2 shown is an embodiment of the utility model's electrolytic cell conductive plate high-efficiency heat dissipation device, including the conductive plate 1 for power cable connection and electrolytic cell power supply that is respectively welded on the electrolytic cell both ends polar plate 24, the microchannel 2 that is set in the conductive plate 1, the cooling circulation loop 3 that is communicated with the microchannel 2 of the conductive plate 1, the cooling liquid circulation device 4 that is set on the cooling circulation loop 3 for driving the cooling liquid circulation flow in the cooling circulation loop 3, the cooling liquid cooling heat exchange device 5 that is connected the cooling circulation loop 3 for realizing the cooling liquid cooling in the cooling circulation loop 3.

[0052] Generally, the conductive plate 1 of electrolytic cell is connected on the polar plate 24 of electrolytic cell's axial both sides end portion. When the number of the conductive plate 1 of electrolytic cell same side is set to multiple, can first set up in series or parallel after multiple conductive plate 1's microchannel 2 is set up in series, then it is connected in series in the cooling circulation loop 3.

[0053] As one of the preferred schemes of the conductive plate microchannel structure in the embodiment, the microchannel 2 of the conductive plate 1 is a serpentine microchannel, and a plurality of the serpentine microchannels are arranged in layers in the conductive plate 1 and correspondingly connected to a pair of bus blocks 6 at both ends of the conductive plate 1. The bus blocks 6 are internally provided with bus cavities 7 for communicating the ends of the serpentine microchannels. The microchannels 2 of the conductive plate 1 are connected in series on the cooling circulation loop 3 through the bus cavities 7 of the bus blocks 6.

[0054] As the second preferred scheme of the micro-channel structure of the conductive plate in the embodiment, the micro-channels 2 of the conductive plate 1 are straight-through micro-channels, a plurality of the straight-through micro-channels are densely arranged in the conductive plate 1 and are arranged in parallel and at intervals, and a pair of busbars 5 are correspondingly connected at both ends of the conductive plate 1, the busbar 6 is internally provided with a busbar cavity 7 for communicating the ends of each straight-through micro-channel, and the micro-channels 2 of the conductive plate 1 are connected in series on the cooling circulation loop 3 through the busbar cavities 7 on the busbar 6.

[0055] Preferably, the diameter of the micro-channel 2 is 0.5-1.0 mm, and the interval is 2-4 mm; the cooling liquid flowing in the cooling circulation loop 3 is ionized water, and the flow rate is 0.5-1.0 m / s.

[0056] Preferably, the surface of the conductive plate 1 is sprayed with a layer of aluminum nitride coating (AlN, thermal conductivity≥180 W / m·K) or graphene reinforced copper-based composite coating (thermal conductivity≥400 W / m·K), and a temperature sensor 22 (detection accuracy±0.5℃) is arranged on the surface of the conductive plate 1, the welding root of the conductive plate 1, and the electrolyte outlet position of the electrolytic cell, respectively.

[0057] Preferably, the temperature sensor 22 is an optical fiber temperature sensor.

[0058] The above-mentioned spraying of the surface of the conductive plate 1 with a layer of aluminum nitride coating or graphene reinforced copper-based composite coating can accelerate the heat dissipation of the conductive plate 1, thereby reducing the temperature of the conductive plate 1.

[0059] Preferably, the cooling liquid cooling heat exchange device 5 includes a closed cooling tower 8 for cooling the electrolytic cell, the cooling circulation loop 3 is a cooling circulation long-stroke loop 9 arranged between the conductive plate 1 and the closed cooling tower 8, and a heat exchange coil 10 is connected in series on the cooling circulation long-stroke loop 9, the heat exchange coil 10 is arranged in the closed cooling tower 8 of the electrolytic cell; the cooling liquid circulation device 4 is a circulating pump 11 connected in series on the cooling circulation long-stroke loop 9; the circulating pump 11 and each temperature sensor 22 are respectively connected to the control system of the electrolytic cell.

[0060] As a further improvement of the embodiment, the cooling liquid heat exchange device 5 further comprises a cooling liquid self-circulation auxiliary cooler 12 for reducing the operation energy consumption of the high-power electrolytic cell closed cooling tower 8, the cooling liquid self-circulation auxiliary cooler 12 comprises a phase change heat exchanger 13 arranged near the position of the conductive plate 1, the phase change heat exchanger 13 comprises a shell 14 and a phase change material 15 filled in the shell 14, the cooling circulation loop 3 further comprises a cooling circulation short stroke loop 16 arranged between the conductive plate 1 and the phase change heat exchanger 13, and a heat exchange coil 10 is arranged in series on the cooling circulation short stroke loop 16, the heat exchange coil 10 is arranged in the cavity of the shell 14 of the phase change heat exchanger 13 and is in contact with the phase change material 15; wherein the phase change heat exchanger 13 and the conductive plate 1 are arranged on both sides of the cooling circulation short stroke loop 16, and the phase change heat exchanger 13 is arranged at a relatively high position and the conductive plate 1 is arranged at a relatively low position relative to the conductive plate 1; wherein a shared local loop 17 is arranged between the cooling circulation long stroke loop 9 and the cooling circulation short stroke loop 16 at the connection position of the conductive plate 1 and the busbar 6, and a pair of electrically operated switching valves 18 for opening or cutting off the cooling circulation long stroke loop 9 are arranged on both sides of the cooling circulation long stroke loop 9, and the electrically operated switching valves 18 are connected to the control system.

[0061] Preferably, the cooling circulation short stroke loop 16 is arranged vertically.

[0062] Preferably, the phase change material 15 in the phase change heat exchanger 13 is paraffin, and a transceiving integrated ultrasonic sensor 19 for detecting the melting state of the internal paraffin is arranged on the shell 14 of the phase change heat exchanger 13, and the transceiving integrated ultrasonic sensor 19 is connected to the control system.

[0063] The ultrasonic sensor 19 is arranged on the shell 14 to periodically send ultrasonic pulses and record the echo characteristics. As the paraffin gradually melts, the echo signal received by the ultrasonic sensor 19 will change accordingly, so that the melting of the paraffin can be determined. A temperature sensor 22 for measuring the temperature of the paraffin can also be arranged on the shell 14 to monitor the temperature of the paraffin in real time, and the melting of the paraffin can be comprehensively determined in combination with the echo characteristics obtained by the ultrasonic sensor 19. The control system can take appropriate control strategies in advance according to the melting of the paraffin. For example, when the paraffin in the phase change heat exchanger 13 has sufficient continuous heat absorption capacity according to its melting, a pair of electrically operated switching valves 18 on the cooling circulating long stroke circuit 9 can be cut off, so that the closed cooling tower 8 of the electrolytic cell and the phase change heat exchanger 13 work independently, so that the closed cooling tower 8 of the electrolytic cell focuses on optimizing the cooling circulation of the electrolytic cell body and the electrolyte. In most cases, even if the heat generated by the conductive block 1 fluctuates greatly, it is mainly controlled by the phase change heat exchanger 13, and it is not necessary to unnecessarily increase the operating power of the large-power closed cooling tower 8 equipment for the temperature control of the conductive block 1. Only when the temperature control capacity of the phase change heat exchanger 13 is insufficient, the electrically operated switching valve 18 is temporarily opened, so that the closed cooling tower 8 of the electrolytic cell also participates in the temperature control of the conductive block 1, so that the best energy-saving effect can be achieved.

[0064] As one of the preferred solutions for the phase change heat exchanger to achieve heat dissipation cooling, heat dissipation fins 20 are arranged on the shell 14 of the phase change heat exchanger 13.

[0065] As the second preferred solution for the phase change heat exchanger to achieve heat dissipation cooling, a plurality of semiconductor refrigeration pieces 21 for accelerating the cooling of the shell 14 are arranged on the shell 14 of the phase change heat exchanger 13.

[0066] Among them, the semiconductor refrigeration piece 21 is a semiconductor refrigeration piece 21 with a micro heat dissipation fan.

[0067] Preferably, the heat dissipation fins 20 and the semiconductor refrigeration pieces 21 are arranged on the upper and lower sides and the front and rear sides of the shell 14.

[0068] It is noted that when the temperature control capacity of the phase change heat exchanger 13 is insufficient, the low-power semiconductor refrigeration piece 21 on the shell 14 of the phase change heat exchanger 13 can be preferably turned on to avoid increasing the energy consumption of the large-power closed cooling tower 8 of the electrolytic cell. However, when the electrolytic cell closed cooling tower 8 is in the lowest energy consumption operation and still has abundant refrigeration capacity, the electrolytic cell closed cooling tower 8 can be preferably connected through a pair of electrically operated switching valves 18 without turning on the semiconductor refrigeration piece 21, so as to achieve the maximum energy-saving optimization.

[0069] The cooling liquid self-circulation auxiliary cooler 12 utilizes the sustained heat absorption of the phase change material when the temperature reaches the phase change point, and can realize stable heat exchange of the cooling liquid, which is conducive to reducing the temperature fluctuation of the cooling liquid, and has good temperature controllability for the conductive plate 1.

[0070] When the temperature difference between the conductive plate 1 and the phase change heat exchanger 13 is large, the principle of density difference of the liquid in the closed loop due to temperature change can be used to generate sufficient driving force to overcome the flow resistance of the liquid in the cooling circulation short stroke loop 16, so as to realize the self-circulation of the cooling liquid in the cooling circulation short stroke loop 16. However, in order to enable the cooling liquid self-circulation auxiliary cooler 12 to form a stable cooling liquid circulation at the beginning, a pair of electrically operated switching valves 18 on the cooling circulation long stroke loop 9 can be opened instantaneously when the electrolytic cell is started, so that the cooling liquid obtains an initial driving force, thereby enabling the cooling liquid to quickly obtain the inertia of circulating flow; after the electrically operated switching valves 18 are closed, the self-circulation of the cooling liquid is realized on the basis of the inertia of the cooling liquid flow and by relying on the principle of density difference. It can also be considered to periodically open a pair of electrically operated switching valves 18 on the cooling circulation long stroke loop 9 for a short time, to increase the stability of the circulating flow of the cooling liquid.

[0071] The working principle of the cooling liquid self-circulation auxiliary cooler 12 utilizing the density difference of the cooling liquid to realize the self-circulation of the cooling liquid is as follows:

[0072] In the closed cooling circulation short stroke loop 16, the cooling liquid in the low-temperature region (in the micro-channel 2 of the conductive plate 1) has a low density due to the temperature rise, and the cooling liquid with a low density will rise; the cooling liquid in the high-temperature region (in the heat exchange coil 10 of the phase change heat exchanger 13) has a high density due to the temperature drop, and the cooling liquid with a high density will drop, and the density difference between the two generates a fluid driving force. Since the flow resistance of the cooling liquid in the closed cooling circulation short stroke loop 16 is small, the fluid driving force generated by the density difference is sufficient to overcome the flow resistance of the cooling liquid, thereby driving the cooling liquid to flow from the low-temperature region to the high-temperature region (cooling region→heated region), so that the heated cooling liquid rises and the cooler cooling liquid drops in the closed loop, thereby forming a natural convection circulation of the cooling liquid.

[0073] It is noted that the self-circulation of the cooling liquid in the cooling circulation short stroke loop 16 is realized in the closed state of a pair of electrically operated switching valves 18 on the cooling circulation long stroke loop 9. When the pair of electrically operated switching valves 18 is opened, the forced circulation of the cooling liquid is mainly realized by the circulating pump 11 on the cooling circulation long stroke loop 9.

[0074] It is noted that in order to improve the stability of the self-circulation of the cooling liquid in the self-circulation auxiliary cooler 12, the heat exchange coil 10 on the short cooling circulation loop 16 can also be removed, and a part of the short cooling circulation loop 16 is directly arranged in the shell 14 of the phase change heat exchanger 13, but this requires redesign and calculation of the heat exchange efficiency of the phase change heat exchanger 13 to ensure the reliability of the operation of the phase change heat exchanger 13.

[0075] Embodiment 2:

[0076] A heat dissipation method of an electrolytic cell conductive plate high-efficiency heat dissipation device, a microchannel 2 is arranged on the conductive plate 1 of the electrolytic cell, the microchannel 2 on the conductive plate 1 is connected in series in a cooling circulation loop 3, the cooling circulation loop 3 is arranged as a long cooling circulation loop 9, the long cooling circulation loop 9 is connected to a closed cooling tower 8 of the electrolytic cell through a heat exchange coil 10 for heat exchange, and a circulating pump 11 is arranged on the long cooling circulation loop 9 to drive the circulation of the cooling liquid in the long cooling circulation loop 9. When the cooling liquid circulates, the cooling liquid absorbs the heat of the conductive plate 1 when passing through the microchannel 2 on the conductive plate 1, thereby cooling the conductive plate 1.

[0077] Preferably, the control system adjusts the cooling liquid flow of the circulating pump 11 and the rotating speed of the heat dissipation fan on the long cooling circulation loop 9 in real time through a PID algorithm, and the temperature fluctuation is ≤±2℃, so that the surface temperature of the conductive plate 1 and the welding root temperature of the conductive plate 1 of the electrolytic cell do not exceed the set value while the main body of the electrolytic cell and the electrolyte are cooled. By accurately controlling the temperature, the surface temperature of the conductive plate 1 is controlled below 90℃, and the welding root temperature is ≤100℃, which ensures safe operation and avoids the risk of thermal runaway. At the same time, the electrolytic voltage is reduced by 0.1~0.3 V (corresponding to a reduction of 5~10% in energy consumption), the service life of the electrolytic cell is prolonged by 30~50%, the replacement and maintenance costs are reduced, and the economy is improved.

[0078] As a further improvement of the embodiment, the microchannel 2 on the conductive plate 1 is also connected in series in a short cooling circulation loop 16, a shared local loop 17 is arranged between the short cooling circulation loop 16 and the long cooling circulation loop 9, and a pair of electrically operated switching valves 18 are arranged on the non-shared local loop of the long cooling circulation loop. A cooling liquid self-circulation auxiliary cooler 12 is arranged on the short cooling circulation loop 16, which can realize the self-circulation of the cooling liquid to reduce the operating energy consumption of the high-power electrolytic cell closed cooling tower 8. The cooling liquid self-circulation auxiliary cooler 12 cools the cooling liquid by using the phase change heat exchanger 13 on the short cooling circulation loop 16, and also drives the circulation of the cooling liquid in the short cooling circulation loop 16 by using the density difference of the cooling liquid at different temperatures, thereby cooling the conductive plate 1.

[0079] Preferably, in order to solve the problem of the easy failure and extrusion of the electrolytic cell gasket 25, a special electrolytic cell gasket cooling device 23 is provided, which comprises micro-holes 27 densely arranged on the middle annular band 26 of the electrolytic cell gasket 25, and a pair of electrolytic cell plates 24 respectively provided with annular grooves 28 corresponding to the middle annular band 26 of the electrolytic cell gasket 25 on the two sides in contact with the electrolytic cell gasket 25, and a pair of gasket cooling channels 29 corresponding to the annular grooves 28 are provided on the outer circles of the pair of electrolytic cell plates 24, and then the pair of gasket cooling channels 29 are connected to the closed cooling tower 8 of the electrolytic cell through the cooling circulation long stroke circuit 9 (which also has a heat exchange coil 10 and a circulating pump 11) or connected to the cooling liquid self-circulation auxiliary cooler 12 through the cooling circulation short stroke circuit 16 (which also has a heat exchange coil 10 but no circulating pump 11).

[0080] It should be noted that when the annular grooves 28 are arranged, the liquid inlet holes and air passage holes of the electrolytic cell plates 24 should be avoided.

[0081] Preferably, one of the pair of gasket cooling channels 29 is arranged at the upper end of the outer circle of one of the electrolytic cell plates 24, and the other of the pair of gasket cooling channels 29 is arranged at the lower end of the outer circle of the other of the electrolytic cell plates 24. During operation, the cooling liquid (ionized water) enters from the lower end of the outer circle of one of the electrolytic cell plates 24, flows into the annular groove 28 of the electrolytic cell plate 24, then passes through the micro-holes 27 on the electrolytic cell gasket 25 in the transverse direction of the electrolytic cell gasket 25, and then flows into the annular groove 28 of the other electrolytic cell plate 24 and flows out from the upper end of the outer circle of the electrolytic cell plate 24, thereby achieving the circulating flow cooling of the electrolytic cell gasket 25.

[0082] It should be noted that when the electrolytic cell adopts an intermittent operation mode (such as an electrolytic cell using wind and light fluctuation, which stops when the power is below a certain value and restarts when the power is above a certain value), by reasonably designing the phase change heat exchanger 13, it can have sufficient heat absorption capacity, and by using the gap time during shutdown to fully dissipate heat and restore its continuous heat absorption performance, the temperature independent control of the cooling liquid self-circulation auxiliary cooler 12 can be realized; in this case, the cooling circulation long stroke circuit 9 can be removed and only the cooling circulation short stroke circuit 16 is retained. In addition, the semiconductor refrigeration sheet 21 on the cooling liquid self-circulation auxiliary cooler 12 can also be considered as a backup option according to actual conditions.

[0083] The above merely is the preferred implementation manner of the present application, and it should be noted that, for the ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and refinements can be made, and these improvements and refinements should also be considered as the protection scope of the present application.

Claims

1. A high-efficiency heat dissipation device for the conductive plate of an electrolytic cell, characterized in that, The device includes conductive plates welded to the electrode plates at both ends of the electrolytic cell for connecting power cables and energizing the electrolytic cell; microchannels disposed inside the conductive plates; a cooling circulation loop connected to the microchannels of the conductive plates; a cooling fluid circulation device disposed on the cooling circulation loop for driving the circulation of coolant within the cooling circulation loop; and a cooling fluid cooling heat exchange device connected to the cooling circulation loop for cooling the coolant within the cooling circulation loop.

2. The high-efficiency heat dissipation device for the conductive plate of an electrolytic cell according to claim 1, characterized in that, The conductive plate has serpentine microchannels, and multiple serpentine microchannels are arranged in layers within the conductive plate. A pair of busbars are connected to each end of the conductive plate. The busbars have internal busbar cavities for connecting the ends of each serpentine microchannel. The microchannels of the conductive plate are connected in series to the cooling circulation loop through the busbar cavities on the busbars.

3. The high-efficiency heat dissipation device for the conductive plate of an electrolytic cell according to claim 1, characterized in that, The conductive plate has a series of microchannels that are straight through. Multiple straight through microchannels are densely distributed within the conductive plate and arranged in parallel intervals. A pair of busbars are connected to each end of the conductive plate. The busbars have internal busbar cavities for connecting the ends of each straight through microchannel. The microchannels of the conductive plate are connected in series to the cooling circulation loop through the busbar cavities on the busbars.

4. A high-efficiency heat dissipation device for an electrolytic cell conductive plate according to claim 2 or 3, characterized in that, The surface of the conductive plate is coated with an aluminum nitride coating or a graphene-reinforced copper-based composite material coating, and temperature sensors are respectively arranged on the surface of the conductive plate, at the weld root of the conductive plate, and at the electrolyte outlet of the electrolytic cell.

5. The high-efficiency heat dissipation device for the conductive plate of an electrolytic cell according to claim 4, characterized in that, The cooling liquid cooling and heat exchange device includes a closed cooling tower for cooling the electrolytic cell. The cooling circulation loop is a long-stroke cooling circulation loop set between the conductive plate and the closed cooling tower, and a heat exchange coil is connected in series on the long-stroke cooling circulation loop. The heat exchange coil is placed inside the closed cooling tower of the electrolytic cell. The cooling liquid circulation device is a circulation pump connected in series on the long-stroke cooling circulation loop. The circulation pump and each of the temperature sensors are respectively connected to the control system of the electrolytic cell.

6. The high-efficiency heat dissipation device for the conductive plate of an electrolytic cell according to claim 5, characterized in that, The cooling liquid cooling and heat exchange device further includes a cooling liquid self-circulation auxiliary cooling device for reducing the operating energy consumption of the high-power electrolytic cell closed cooling tower. The cooling liquid self-circulation auxiliary cooling device includes a phase change heat exchanger located near the conductive plate. The phase change heat exchanger includes a shell and a phase change material sealed and filled within the shell. The cooling circulation loop also includes a short-stroke cooling circulation loop located between the conductive plate and the phase change heat exchanger, with a heat exchange coil connected in series in the short-stroke cooling circulation loop. The heat exchange coil is placed within the inner cavity of the phase change heat exchanger shell and is in contact with the phase change material. Contact; wherein the phase change heat exchanger and the conductive plate are respectively placed on both sides of the short-stroke cooling cycle loop, and the phase change heat exchanger is located at a relatively high position relative to the conductive plate, while the conductive plate is located at a relatively low position; wherein the long-stroke cooling cycle loop and the short-stroke cooling cycle loop are provided with a shared local loop at the quick connection point with the conductive plate, and a pair of electrically operated switching valves for opening or closing the long-stroke cooling cycle loop are correspondingly provided on both sides of the long-stroke cooling cycle loop, and the electrically operated switching valves are connected to the control system.

7. The high-efficiency heat dissipation device for the conductive plate of an electrolytic cell according to claim 6, characterized in that, The phase change material is paraffin wax. The shell of the phase change heat exchanger is equipped with an integrated ultrasonic transceiver sensor for detecting the melting state of the internal paraffin wax. The integrated ultrasonic transceiver sensor is connected to the control system.

8. The high-efficiency heat dissipation device for the conductive plate of an electrolytic cell according to claim 1, characterized in that, The microchannels have a diameter of 0.5–1.0 mm and a spacing of 2–4 mm.

9. The high-efficiency heat dissipation device for the conductive plate of an electrolytic cell according to claim 1, characterized in that, The coolant flowing in the cooling circulation loop is deionized water with a flow rate of 0.5–1.0 m / s.

10. The high-efficiency heat dissipation device for the conductive plate of an electrolytic cell according to claim 4, characterized in that, The temperature sensor is an optical fiber temperature sensor.

Images