Semiconductor refrigerating and heating temperature adjusting blanket

Abstract

The utility model provides a semiconductor refrigeration and heating temperature adjusting blanket, and belongs to the technical field of semiconductors. The semiconductor refrigeration and heating temperature adjusting blanket comprises a switch type power supply, a digital temperature controller, a PWM control signal master control circuit, a PWM switch controller, a semiconductor refrigeration sheet, an indicator lamp, a first switch and a second switch. The switch type power supply is respectively connected with the digital temperature controller and the PWM control signal master control circuit, and the PWM control signal master control circuit is respectively connected with the digital temperature controller, the PWM switch controller and the indicator lamp; a plurality of indicating lamps are provided; the PWM switch controller is connected with the digital temperature controller, and the PWM switch controller is further connected with the semiconductor chilling plate through the first switch and the second switch. According to the invention, the accuracy of product temperature control can be improved, and the individual requirements of users are met.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of semiconductor technology, and in particular to a semiconductor refrigeration and heating temperature regulating blanket. BACKGROUND

[0002] With the rapid development of semiconductor technology, semiconductor materials and devices have shown unique advantages in the field of temperature control. Semiconductor refrigeration technology is based on the Peltier effect, which can realize bidirectional regulation of refrigeration and heating through direct current driving, and has the advantages of small size, light weight, no mechanical transmission components, no noise, fast response speed, high temperature control precision, etc.

[0003] However, there are relatively few temperature regulating products based on semiconductor refrigeration technology on the market at present, especially for semiconductor refrigeration and heating temperature regulating blankets of this kind which are directly contacted by human body. There are still many deficiencies in terms of technical maturity, performance optimization and user experience. For example, the temperature control of some existing products is not accurate enough to meet the individual needs of different users for temperature. CONTENT OF THE INVENTION

[0004] The semiconductor refrigeration and heating temperature regulating blanket provided by the embodiments of the present disclosure can improve the accuracy of product temperature control and meet the individual needs of users.

[0005] The semiconductor refrigeration and heating temperature regulating blanket provided by the embodiments of the present disclosure comprises:

[0006] a switching power supply, a digital temperature controller, a PWM control signal master circuit, a PWM switch controller, a semiconductor refrigeration piece, an indicator light, a first switch and a second switch;

[0007] The switching power supply is connected with the digital temperature controller and the PWM control signal master circuit, and the PWM control signal master circuit is connected with the digital temperature controller, the PWM switch controller and the indicator light; the indicator light has multiple indicator lights.

[0008] The PWM switch controller is connected with the digital temperature controller, and the PWM switch controller is further connected with the semiconductor refrigeration piece through the first switch and the second switch.

[0009] The medium used by the heat dissipation end of the semiconductor refrigeration piece is water, and the water is circulated and cooled by air through a water tank.

[0010] In an exemplary embodiment of the present disclosure, the PWM control signal master circuit comprises:

[0011] chip IC2, resistance R5, resistance R6, resistance R7, resistance R8, resistance R9, resistance R10, resistance R14, resistance R15, triode Q1, triode Q2, triode Q5, triode Q6, diode D2, device FS1, capacitor C6, capacitor C7 and chip IC3;

[0012] The VCC end of the chip IC2 is connected with the first end of the resistance R5, the first end of the resistance R6 and a 5V power supply respectively, the P1.1 pin of the chip IC2 is connected with the second end of the resistance R5 and the first end of the resistance R7 respectively, the P1.0 pin of the chip IC2 is connected with the second end of the resistance R6 and the first end of the resistance R8 respectively; the P3.0 pin of the chip IC2 is connected with the collector of the triode Q5, the base of the triode Q5 is connected with JW1 through the resistance R14, and the emitter of the triode Q5 is grounded; the P3.1 pin of the chip IC2 is connected with the collector of the triode Q6, the base of the triode Q6 is connected with SW1 through the resistance R15, and the emitter of the triode Q6 is grounded;

[0013] The base of the triode Q1 is connected with the second end of the resistance R7, the emitter of the triode Q1 is grounded, and the collector of the triode Q1 is connected with the first end of the device FS1 and the positive pole of the diode D2 respectively;

[0014] The base of the triode Q2 is connected with the second end of the resistance R8, the emitter of the triode Q2 is grounded, and the collector of the triode Q2 is connected with the first end of the resistance R10;

[0015] The second end of the resistance R10, the first end of the capacitor C6 and the first end of the resistance R9 are all connected with the 2nd pin of the chip IC3, and the first end of the resistance R9 is also connected with the 6th pin of the chip IC3; the second end of the device FS1, the negative pole of the diode D2, the second end of the resistance R9, the 8th pin and the 4th pin of the chip IC3 are all connected with a 12V power supply; the first end of the capacitor C7 is connected with the 5th pin of the chip IC3, and the second end of the capacitor C6 and the second end of the capacitor C7 are both grounded.

[0016] In an exemplary embodiment of the present disclosure, the PWM control signal master circuit further comprises:

[0017] resistance R11, resistance R12, resistance R13, triode Q3 and triode Q4;

[0018] The first end of the resistor R11 is connected with the third pin of the chip IC3, and the second end of the resistor R11 is connected with the base of the transistor Q3 and the base of the transistor Q4 respectively; the collector of the transistor Q3 is connected with a 12V power supply, and the emitter of the transistor Q3 is connected with the emitter of the transistor Q4 and the first end of the resistor R12 respectively; the collector of the transistor Q4 is grounded; the second end of the resistor R12 is connected with the first end of the resistor R13 and the output terminal ZX1 respectively; and the second end of the resistor R13 is grounded.

[0019] In an exemplary embodiment of the present disclosure, the PWM control signal master circuit further comprises:

[0020] capacitor C4, capacitor C5, crystal JZ1, button AN1, button AN2 and button AN3;

[0021] The first end of the capacitor C4 and the first end of the capacitor C5 are both grounded, and the second end of the capacitor C4 and the second end of the capacitor C5 are connected across the crystal JZ1; the second end of the capacitor C4 is connected with the X2 pin of the chip IC2, and the second end of the capacitor C5 is connected with the X1 pin of the chip IC2.

[0022] The first end of the button AN1, the first end of the button AN2 and the first end of the button AN3 are all grounded, the second end of the AN1 is connected with the P3.2 pin of the chip IC2, the second end of the AN2 is connected with the P3.3 pin of the chip IC2, and the second end of the AN3 is connected with the P3.4 pin of the chip IC2.

[0023] In an exemplary embodiment of the present disclosure, the PWM control signal master circuit further comprises:

[0024] light-emitting diode LED1, light-emitting diode LED2, light-emitting diode LED3, resistor R2, resistor R3 and resistor R4;

[0025] The anode of the light-emitting diode LED1, the anode of the light-emitting diode LED2 and the anode of the light-emitting diode LED3 are all connected with a 5V power supply; the cathode of the light-emitting diode LED1 is connected with the P1.7 pin of the chip IC2 through the resistor R2, the cathode of the light-emitting diode LED2 is connected with the P1.6 pin of the chip IC2 through the resistor R3, and the cathode of the light-emitting diode LED3 is connected with the P1.5 pin of the chip IC2 through the resistor R4.

[0026] In an exemplary embodiment of the present disclosure, the PWM control signal master circuit further comprises:

[0027] Chip IC1, capacitor C1, capacitor C2, capacitor C3, button AN1 and resistor R1;

[0028] The first end of the chip IC1 is connected with a 5V power supply, the second end is connected with the ground, and the third end is connected with the positive electrode of the capacitor C1, the first end of the capacitor C2, the first end of the button AN1, the positive electrode of the capacitor C3 and the VCC end of the chip IC2 respectively;

[0029] The negative electrode of the capacitor C1 and the second end of the capacitor C2 are connected with the ground; the second end of the button AN1 is connected with the negative electrode of the capacitor C3 and the first end of the resistor R1 respectively, and the second end of the resistor R1 is connected with the ground.

[0030] In an exemplary embodiment of the present disclosure, the chip IC1 is a voltage reduction and voltage stabilization chip.

[0031] In an exemplary embodiment of the present disclosure, the triode Q4 is a PNP type triode.

[0032] In an exemplary embodiment of the present disclosure, the device FS1 is arranged in a water tank, and the device FS1 and the water tank constitute a wind-cooled water tank.

[0033] The semiconductor refrigeration and heating temperature regulating blanket provided by the embodiment of the present disclosure has the following beneficial effects:

[0034] The switch power supply provided by the present disclosure can stably output 12V power supply within the common input range of commercial power supply, meet the power supply requirements of each component, and ensure the reliable operation of the system. The digital temperature controller has rich functions, can accurately set the temperature interval and provide multiple signals, facilitates the user to flexibly control the blanket temperature according to the requirements, and improves the use experience. The PWM switch controller adopts a high-power field effect tube and a trigger circuit, has strong large-current and wide-voltage adaptability, can effectively adjust the power of the semiconductor refrigeration sheet, and realizes efficient refrigeration and heating. The PWM control signal master control circuit can not only accurately adjust the output power, but also automatically control the bidirectional water pump according to the temperature of the hot end, so as to ensure that the semiconductor refrigeration sheet operates in the appropriate working condition, prolongs the service life, saves energy and reduces consumption, improves the accuracy, stability and efficiency of temperature regulation as a whole, and provides a more comfortable temperature environment for the user. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor.

[0036] Figure 1is a structural schematic diagram of a semiconductor refrigeration and heating temperature regulation blanket provided by an embodiment of the present disclosure.

[0037] Figure 2 is a circuit diagram of a PWM control signal master control circuit provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0038] In order for those skilled in the art to better understand the present scheme, the technical solutions in the embodiments of the present scheme will be clearly described below in combination with the drawings in the embodiments of the present scheme. Obviously, the described embodiments are part of the embodiments of the present scheme, rather than all the embodiments. Based on the embodiments in the present scheme, all other embodiments obtained by those skilled in the art without creative labor should fall within the scope of protection of the present scheme.

[0039] The term "comprising" and other any variations thereof in the specification and claims of the present scheme and the above-mentioned drawings means "including but not limited to", which is intended to cover non-exclusive inclusion and is not limited to the examples listed in the text. In addition, the terms "first" and "second" and the like are used to distinguish different objects, rather than to describe a specific order.

[0040] The implementation of the present disclosure is described in detail below in combination with specific drawings:

[0041] Figure 1 is a structural schematic diagram of a semiconductor refrigeration and heating temperature regulation blanket provided by an embodiment of the present disclosure. Referring to Figure 1 , the semiconductor refrigeration and heating temperature regulation blanket comprises:

[0042] a switching power supply, a digital temperature controller, a PWM control signal master control circuit, a PWM switch controller, a semiconductor refrigeration piece, an indicator light, a first switch and a second switch;

[0043] The switching power supply is connected with the digital temperature controller and the PWM control signal master control circuit respectively, the PWM control signal master control circuit is connected with the digital temperature controller, the PWM switch controller and the indicator light respectively; the indicator light has a plurality of indicator lights.

[0044] The PWM switch controller is connected with the digital temperature controller, and the PWM switch controller is further connected with the semiconductor refrigeration piece through the first switch and the second switch respectively.

[0045] In the present embodiment, the input voltage of the switching power supply is 180-270V; the frequency is 50Hz; the output is 12V, the current is 15A, and the power is 180W. The switching power supply can provide power supply for the digital temperature controller, the PWM control signal master control circuit, the PWM switch controller, the semiconductor refrigeration piece and the indicator light.

[0046] The digital temperature control display can display the instant temperature of the electric blanket, set the starting and ending temperature for refrigeration or heating, and provide temperature control signals and heating or refrigeration speed adjustment signals.

[0047] The PWM switch controller is composed of two high-power field effect transistors and a trigger circuit, which can be used to adjust the power size by forming a switch tube trigger circuit. The maximum current of the circuit can reach 30A, and the maximum voltage is 5-36V. It can be used to power the semiconductor refrigeration sheet.

[0048] The PWM control signal master circuit is also connected with the hot water pump and the cold water pump.

[0049] The PWM control signal master circuit is composed of a single-chip microcomputer STC11-3a, which can drive two light-emitting diodes as refrigeration or heating state display. The number of driving trigger pulses can be adjusted according to the driving and stopping signals provided by the digital temperature controller to adjust the output power size so that the semiconductor refrigeration sheet works in the frequency modulation mode. The hot water pump and the cold water pump can also be automatically controlled according to the temperature of the hot end of the refrigerator.

[0050] The semiconductor refrigeration sheet TEC12706 is a refrigeration and heating device powered by a voltage of 12V and a maximum current of 6A. In normal state, the temperature difference between the cold and hot sides is 40 degrees, and in application, the suitable temperature needs to be selected through heat dissipation measures. The medium used for heat dissipation at the heat dissipation end of the semiconductor refrigeration sheet is water, which is circulated and air-cooled by the water tank. In this embodiment, the refrigeration temperature is set to 25-28 degrees Celsius, and the heating temperature is set to 33-36 degrees Celsius.

[0051] From the above, it can be concluded that the switch power supply provided by the disclosure can stably output 12V power within the normal input range of commercial power, meet the power supply requirements of various components, and ensure reliable operation of the system. The digital temperature controller has rich functions, can accurately set the temperature range and provide various signals, and is convenient for users to flexibly control the temperature of the blanket according to the requirements, and improves the use experience. The PWM switch controller uses high-power field effect transistors and trigger circuits, which have strong current and wide voltage adaptability, can effectively adjust the power of the semiconductor refrigeration sheet, and realize efficient refrigeration and heating. The PWM control signal master circuit not only can accurately adjust the output power, but also can automatically control the bidirectional water pump according to the temperature of the hot end, so as to ensure that the semiconductor refrigeration sheet operates in the appropriate working condition, prolongs the service life, saves energy and reduces consumption, and improves the accuracy, stability and efficiency of temperature regulation as a whole, so as to provide a more comfortable temperature environment for users.

[0052] In one embodiment of the disclosure, with reference to Figure 2 , the PWM control signal master circuit comprises:

[0053] chip IC2, resistance R5, resistance R6, resistance R7, resistance R8, resistance R9, resistance R10, resistance R14, resistance R15, triode Q1, triode Q2, triode Q5, triode Q6, diode D2, device FS1, capacitor C6, capacitor C7 and chip IC3;

[0054] The VCC end of the chip IC2 is connected with the first end of the resistance R5, the first end of the resistance R6 and a 5V power supply respectively, the P1.1 pin of the chip IC2 is connected with the second end of the resistance R5 and the first end of the resistance R7 respectively, the P1.0 pin of the chip IC2 is connected with the second end of the resistance R6 and the first end of the resistance R8 respectively; the P3.0 pin of the chip IC2 is connected with the collector of the triode Q5, the base of the triode Q5 is connected with JW1 through the resistance R14, and the emitter of the triode Q5 is grounded; the P3.1 pin of the chip IC2 is connected with the collector of the triode Q6, the base of the triode Q6 is connected with SW1 through the resistance R15, and the emitter of the triode Q6 is grounded;

[0055] The base of the triode Q1 is connected with the second end of the resistance R7, the emitter of the triode Q1 is grounded, and the collector of the triode Q1 is connected with the first end of the device FS1 and the positive pole of the diode D2 respectively;

[0056] The base of the triode Q2 is connected with the second end of the resistance R8, the emitter of the triode Q2 is grounded, and the collector of the triode Q2 is connected with the first end of the resistance R10;

[0057] The second end of the resistance R10, the first end of the capacitor C6 and the first end of the resistance R9 are all connected with the 2nd pin of the chip IC3, and the first end of the resistance R9 is also connected with the 6th pin of the chip IC3; the second end of the device FS1, the negative pole of the diode D2, the second end of the resistance R9, the 8th pin and the 4th pin of the chip IC3 are all connected with a 12V power supply; the first end of the capacitor C7 is connected with the 5th pin of the chip IC3, and the second end of the capacitor C6 and the second end of the capacitor C7 are both grounded.

[0058] The PWM control signal master control circuit further comprises:

[0059] Resistance R11, resistance R12, resistance R13, triode Q3 and triode Q4;

[0060] The first end of the resistance R11 is connected with the 3rd pin of the chip IC3, and the second end of the resistance R11 is connected with the base of the triode Q3 and the base of the triode Q4 respectively; the collector of the triode Q3 is connected with a 12V power supply, the emitter of the triode Q3 is connected with the emitter of the triode Q4 and the first end of the resistance R12 respectively; the collector of the triode Q4 is grounded; the second end of the resistance R12 is connected with the first end of the resistance R13 and the output terminal ZX1 respectively; the second end of the resistance R13 is grounded.

[0061] In this embodiment, IC2 chip as the core control unit, its 20 pin connected to 5V power supply positive, 10 pin connected to ground, through the internal settings, such as the frequency of 4 pin and 5 pin setting capacitor, so that a mechanical cycle of the chip is 1 microsecond, while the crystal oscillator selects 12 MHz, provides a stable clock signal for the whole system, to ensure the normal operation of the program.

[0062] IC2 chip P1.1 pin through R5 and resistor R7 for the base current of the transistor Q1 equipment FS1 for the water tank cooling. Equipment FS1 is set in the water tank, equipment FS1 and the water tank constitute the air-cooled water tank. The prior art is generally through the heat sink for cooling, this embodiment uses air-cooled water tank (with electric fan FS1) for temperature regulation, more convenient and effective. Its working principle is: when the need for output PWM signal, P1.1 pin output signal through resistor R5 and R7 connected to the base of the transistor Q1, when the signal is high, the transistor Q1 is turned on, at this time, the first end of the equipment FS1 through the transistor Q1 and diode D2 connected to the ground, the current can flow from the second end of the equipment FS1 (equipment FS1 starts working), through the transistor Q1 and diode D2 to form a loop; when the P1.1 pin signal is low, the transistor Q1 is cut off, this path is disconnected.

[0063] Chip IC2 (single chip microcomputer) output pin P1.0 (12 pin) through resistor R8 connects the base of the transistor Q2; at this time, if P1.0 is low, the base of Q2 is also low, Q2 is not turned on, and the 2, 6 pins of chip IC3 are pulled up to high level by resistor R9, and the output pin 3 of IC3 outputs low level, which is connected to the common base of output transistors Q3 and Q4 through resistor R11. Because Q4 is PNP type, it is turned on at this time. At this time, the output end ZX1 outputs low level, and also has the function of completely discharging the gate junction capacitor of the output switch tube (the junction capacitor can be discharged to reduce the switching loss of the output tube; the frequency range is expanded).

[0064] If the output pin P1.0 of chip IC2 is high (this output is programmable and can be set), the transistor Q2 is turned on through resistor R8, the 2, 6 pins of IC3 become low, the output pin 3 becomes high, the output transistor Q3 is turned on, Q4 is cut off, and the output end ZX1 of the trigger transistor is high and triggers the switch tube of the PWM controller; the high level maintenance time of this pin can be programmed and set.

[0065] The setting of the program is a control mode of gradually increasing or gradually decreasing the pulse width of the pulse, which is the duty cycle, and the output power of the PWM circuit can be controlled. The function of the machine is refrigeration and heating, and the difference between the two is that the temperature range and direction are different. When refrigerating, the upper limit of the temperature is the lowest temperature, and when heating, the upper limit of the temperature is the highest temperature.

[0066] When the upper limit temperature is selected, the temperature signal is sent to the JW1 through the resistance R14, and the base current of Q5 is provided to make Q5 conduct and P3.0 low level. The program is executed in a forward pulse width, and the duty cycle is gradually reduced, so the output power is gradually reduced. At this time, the refrigeration temperature gradually rises, and when the temperature falls to the lower limit temperature, the temperature signal SW1 is sent to the resistance, and the triode Q6 is turned on. The program is executed in a forward pulse width, and the duty cycle is gradually increased, and the refrigeration capacity is also increased. The next cycle is to maintain the temperature in the set range.

[0067] If the heating is selected, when the upper limit temperature reaches the maximum value, the temperature signal JW1 is sent to the resistance R14, and the triode Q6 is turned on. The program is executed in a forward pulse width, and the refrigeration capacity is reduced. When the temperature falls to the lower limit value, the temperature signal SW1 is sent to the resistance R15, and the triode Q6 is turned on, and P3.1 becomes low level. The program is executed in a forward pulse width, and the heating capacity is increased. The next cycle is to maintain the temperature in the set range.

[0068] From the above, it can be concluded that the PWM control signal master circuit can realize accurate power control. Through the P1.1 and P1.0 pins of the chip IC2, the control signal is output, and through the amplification and switching action of the triodes Q1 and Q2, the precise control of the device FS1 can be realized. This control method allows the working state of the device FS1 to be accurately adjusted by adjusting the duty cycle of the PWM signal, and then the power of the semiconductor refrigeration piece and other devices related thereto is controlled. The single-chip microcomputer IC2 can flexibly change the duty cycle of the output signal according to the temperature information received from the digital temperature controller, and realize fine power regulation to meet different temperature regulation requirements.

[0069] The PWM control signal master circuit can also realize signal stabilization and isolation. The existence of capacitors C6 and C7 helps to stabilize the working state of the chip IC3. Capacitor C6 is near the 2nd and 6th pins of chip IC3, which may participate in the formation of an RC circuit, helping to filter out noise and ensure that chip IC3 receives stable signals. Capacitor C7 at the 5th pin of chip IC3 plays a role in stabilizing the voltage of the internal circuit of chip IC3, ensuring that chip IC3 can operate stably in various working states. Diode D2 can prevent reverse current flow and avoid damaging the device FS1, thereby protecting the device FS1. At the same time, it also has the effect of isolation and protection for the circuit, improving the reliability of the entire circuit.

[0070] In an embodiment of the present disclosure, with reference to Figure 2 , the PWM control signal master circuit further comprises:

[0071] Capacitor C4, capacitor C5, crystal oscillator JZ1, button AN1, button AN2, and button AN3.

[0072] The first end of the capacitor C4 and the first end of the capacitor C5 are grounded, and the second end of the capacitor C4 and the second end of the capacitor C5 are respectively connected to the two ends of the crystal oscillator JZ1; the second end of the capacitor C4 is connected to the X2 pin of the chip IC2, and the second end of the capacitor C5 is connected to the X1 pin of the chip IC2.

[0073] The first end of the key AN1, the first end of the key AN2 and the first end of the key AN3 are grounded, the second end of the key AN1 is connected to the P3.2 pin of the chip IC2, the second end of the key AN2 is connected to the P3.3 pin of the chip IC2, and the second end of the key AN3 is connected to the P3.4 pin of the chip IC2.

[0074] The PWM control signal master control circuit further comprises:

[0075] The light-emitting diode LED1, the light-emitting diode LED2, the light-emitting diode LED3, the resistor R2, the resistor R3 and the resistor R4;

[0076] The positive electrode of the light-emitting diode LED1, the positive electrode of the light-emitting diode LED2 and the positive electrode of the light-emitting diode LED3 are connected to the 5V power supply; the negative electrode of the light-emitting diode LED1 is connected to the P1.7 pin of the chip IC2 through the resistor R2, the negative electrode of the light-emitting diode LED2 is connected to the P1.6 pin of the chip IC2 through the resistor R3, and the negative electrode of the light-emitting diode LED3 is connected to the P1.5 pin of the chip IC2 through the resistor R4.

[0077] The PWM control signal master control circuit further comprises:

[0078] The chip IC1, the capacitor C1, the capacitor C2, the capacitor C3, the key AN1 and the resistor R1;

[0079] The first end of the chip IC1 is connected to the 5V power supply, the second end is grounded, and the third end is respectively connected to the positive electrode of the capacitor C1, the first end of the capacitor C2, the first end of the key AN1, the positive electrode of the capacitor C3, the VCC end of the chip IC2;

[0080] The negative electrode of the capacitor C1 and the second end of the capacitor C2 are grounded; the second end of the key AN1 is respectively connected to the negative electrode of the capacitor C3 and the first end of the resistor R1, and the second end of the resistor R1 is grounded.

[0081] In this embodiment, the crystal oscillator JZ1 and the capacitors C4 and C5 together constitute a crystal oscillator circuit to provide a stable clock signal for the chip IC2. The oscillation signal generated by the crystal oscillator JZ1, through the cooperation of the capacitors C4 and C5, provides a clock source for the X1 and X2 pins of the chip IC2, enabling the chip IC2 to operate stably at a set frequency. This clock signal is crucial for the chip IC2 to execute programs and timing operations, ensuring the orderly execution of its internal programs and the accuracy of timing.

[0082] The keys AN1, AN2, and AN3 are connected to the P3.2, P3.3, and P3.4 pins of the chip IC2, respectively. When the user presses these keys, the level of the corresponding pin will change. For example, the key AN1 is used to start and control the indicator light of the power supply, AN2 is used to start the indicator light of the refrigeration, and AN3 is used to start the indicator light of the heating.

[0083] The chip IC1 is a voltage regulator chip (such as 78M05) that converts the input voltage into a stable 5V DC voltage. Its 1st end is connected to a 5V power supply, the 2nd end is connected to ground, and the 3rd end outputs a stable 5V voltage to the chip IC2 and other parts that need power supply. The capacitors C1, C2, and C3, and the key AN1 and resistor R1 together constitute a power supply filtering and reset circuit. Capacitors C1 and C2 filter the output of chip IC1, reducing the ripple and noise in the power supply and ensuring the stability of the power supply. The key AN1 and resistor R1 may be part of the reset circuit, which may trigger the reset operation of chip IC2 when the key AN1 is pressed, restoring it to the initial state.

[0084] From the above, it can be concluded that this embodiment has a stable clock source guarantee, the crystal oscillator circuit composed of the crystal oscillator JZ1 and the capacitors C4 and C5 provides a stable and accurate clock signal for the chip IC2, ensuring the stable working frequency of the chip IC2, avoiding program execution errors or functional abnormalities caused by unstable clock, improving the reliability and stability of the entire system, and ensuring the accuracy of the system in long-term operation.

[0085] This embodiment has clear state indication, the light-emitting diodes LED1, LED2, and LED3 serve as status indicator lights, which can display the running state of the system to the user in an intuitive way, enabling the user to quickly understand whether the system is in refrigeration, heating, or other states, facilitating user monitoring of system status and timely detection of system abnormalities, improving user experience and system maintainability.

[0086] The PWM control signal master control circuit in the embodiment integrates multiple function modules such as clock, key input, state display and power management, so that the whole circuit structure is compact and the function is perfect. At the same time, through the programming of the chip IC2, the system function can be flexibly adjusted and expanded, for example, the key function and the display state of the light emitting diode can be changed according to different application scenes, which improves the integration and adaptability of the system and reduces the development and maintenance cost of the system.

[0087] The above embodiments are only used to illustrate the technical solutions of the present disclosure, but not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A semi-conductor refrigeration thermal temperature regulating blanket characterized by, It includes: Switch power supply, digital temperature controller, PWM control signal master circuit, PWM switch controller, semiconductor refrigeration piece, indicator light, first switch and second switch; The switch power supply is connected with the digital temperature controller and the PWM control signal master circuit respectively, the PWM control signal master circuit is connected with the digital temperature controller, the PWM switch controller and the indicator light respectively, and the indicator light has a plurality of indicator lights. The PWM switch controller is connected with the digital temperature controller, and the PWM switch controller is also connected with the semiconductor refrigeration piece through the first switch and the second switch respectively. The medium used by the heat dissipation end of the semiconductor refrigeration piece is water, and the water is circulated and air-cooled by the water tank.

2. The semi-conductor refrigeration thermal temperature regulating blanket of claim 1, wherein, The PWM control signal master circuit includes: Chip IC2, resistor R5, resistor R6, resistor R7, resistor R8, resistor R9, resistor R10, resistor R14, resistor R15, triode Q1, triode Q2, triode Q5, triode Q6, diode D2, device FS1, capacitor C6, capacitor C7 and chip IC3. The VCC end of the chip IC2 is connected with the first end of the resistor R5, the first end of the resistor R6 and a 5V power supply respectively, the P1.1 pin of the chip IC2 is connected with the second end of the resistor R5 and the first end of the resistor R7 respectively, the P1.0 pin of the chip IC2 is connected with the second end of the resistor R6 and the first end of the resistor R8 respectively, the P3.0 pin of the chip IC2 is connected with the collector of the triode Q5, the base of the triode Q5 is connected with JW1 through the resistor R14, and the emitter of the triode Q5 is grounded, the P3.1 pin of the chip IC2 is connected with the collector of the triode Q6, the base of the triode Q6 is connected with SW1 through the resistor R15, and the emitter of the triode Q6 is grounded. The base of the triode Q1 is connected with the second end of the resistor R7, the emitter of the triode Q1 is grounded, and the collector of the triode Q1 is connected with the first end of the device FS1 and the positive electrode of the diode D2 respectively. The base of the triode Q2 is connected with the second end of the resistor R8, the emitter of the triode Q2 is grounded, and the collector of the triode Q2 is connected with the first end of the resistor R10. The second end of the resistor R10, the first end of the capacitor C6 and the first end of the resistor R9 are all connected with the 2nd pin of the chip IC3, and the first end of the resistor R9 is also connected with the 6th pin of the chip IC3; the second end of the device FS1, the negative electrode of the diode D2, the second end of the resistor R9, the 8th pin and the 4th pin of the chip IC3 are all connected with a 12V power supply; the first end of the capacitor C7 is connected with the 5th pin of the chip IC3, and the second end of the capacitor C6 and the second end of the capacitor C7 are both grounded.

3. The semi-conductor refrigeration thermal temperature regulating blanket of claim 2, wherein, The PWM control signal master circuit further includes: Resistor R11, resistor R12, resistor R13, triode Q3 and triode Q4. The first end of the resistor R11 is connected with the third pin of the chip IC3, and the second end of the resistor R11 is connected with the base of the triode Q3 and the base of the triode Q4 respectively; the collector of the triode Q3 is connected with a 12V power supply, and the emitter of the triode Q3 is connected with the emitter of the triode Q4 and the first end of the resistor R12 respectively; the collector of the triode Q4 is grounded; the second end of the resistor R12 is connected with the first end of the resistor R13 and the output terminal ZX1 respectively; and the second end of the resistor R13 is grounded.

4. The semi-conductor refrigeration thermal temperature regulating blanket of claim 2, wherein, The PWM control signal master circuit further comprises: a capacitor C4, a capacitor C5, a crystal oscillator JZ1, a button AN1, a button AN2 and a button AN3; The first end of the capacitor C4 and the first end of the capacitor C5 are both grounded, and the second end of the capacitor C4 and the second end of the capacitor C5 are connected across the crystal oscillator JZ1; the second end of the capacitor C4 is connected with the X2 pin of the chip IC2, and the second end of the capacitor C5 is connected with the X1 pin of the chip IC2; The first end of the button AN1, the first end of the button AN2 and the first end of the button AN3 are all grounded, the second end of the AN1 is connected with the P3.2 pin of the chip IC2, the second end of the AN2 is connected with the P3.3 pin of the chip IC2, and the second end of the AN3 is connected with the P3.4 pin of the chip IC2.

5. The semi-conductor refrigeration thermal temperature regulating blanket of claim 2, wherein, The PWM control signal master circuit further comprises: a light emitting diode LED1, a light emitting diode LED2, a light emitting diode LED3, a resistor R2, a resistor R3 and a resistor R4; The positive pole of the light emitting diode LED1, the positive pole of the light emitting diode LED2 and the positive pole of the light emitting diode LED3 are all connected with a 5V power supply; the negative pole of the light emitting diode LED1 is connected with the P1.7 pin of the chip IC2 through the resistor R2, the negative pole of the light emitting diode LED2 is connected with the P1.6 pin of the chip IC2 through the resistor R3, and the negative pole of the light emitting diode LED3 is connected with the P1.5 pin of the chip IC2 through the resistor R4.

6. The semi-conductor refrigeration thermal temperature regulating blanket of claim 2, wherein, The PWM control signal master circuit further comprises: a chip IC1, a capacitor C1, a capacitor C2, a capacitor C3, a button AN1 and a resistor R1; The first end of the chip IC1 is connected with a 5V power supply, the second end is grounded, and the third end is connected with the positive pole of the capacitor C1, the first end of the capacitor C2, the first end of the button AN1, the positive pole of the capacitor C3 and the VCC end of the chip IC2 respectively; The negative pole of the capacitor C1 and the second end of the capacitor C2 are grounded; the second end of the button AN1 is connected with the negative pole of the capacitor C3 and the first end of the resistor R1 respectively, and the second end of the resistor R1 is grounded.

7. The semi-conductor refrigeration thermal temperature regulating blanket of claim 6, wherein, The chip IC1 is a step-down voltage stabilizing chip.

8. The semi-conductor refrigeration thermal temperature regulating blanket of claim 3, wherein, The triode Q4 is a PNP type triode.

9. The semi-conductor refrigeration thermal temperature regulating blanket of claim 2, wherein, The device FS1 is arranged in the water tank, and the device FS1 and the water tank constitute a wind-cooled water tank.

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