Heat dissipation device

Abstract

The utility model discloses a heat dissipation device, which comprises a vapor chamber, a first liquid cooling module, a second liquid cooling module and at least one heat pipe, and is characterized in that the vapor chamber is provided with a top surface and a bottom surface, and the top surface of the vapor chamber is used for being attached to a heat source; the bottom surface of the vapor chamber is arranged on the first liquid cooling module, and first cooling fluid is arranged in the first liquid cooling module; the second liquid cooling module is arranged on one side of the vapor chamber and the first liquid cooling module, and a second cooling fluid is arranged in the second liquid cooling module; the at least one heat pipe is connected to the vapor chamber, the first liquid cooling module and the second liquid cooling module in a penetrating manner; after heat generated by the heat source is conducted to the vapor chamber and the at least one heat pipe, the first liquid cooling module and the second liquid cooling module conduct the heat of the vapor chamber and the at least one heat pipe through the first cooling fluid and the second cooling fluid.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation device, especially a heat dissipation device applicable to a high-power display adapter (VGA). BACKGROUND

[0002] The prior art uses a heat pipe or a vapor chamber (VC) heating pipe to quickly conduct heat to fins, and then uses a fan to realize forced convection of air, so that the heat pipe is blown away by air passing through the fins to realize heat dissipation function. The heat dissipation power of the vapor chamber stacked with the heat pipe has a certain limit. Therefore, in order to dissipate heat of a higher-power electronic component, the heat dissipation area of the module must be increased, which results in a larger volume and is not consistent with the current trend of thinness due to the limitation of the shell space.

[0003] At the same time, the current display adapter is composed of a heat pipe and fins, or a simple water-cooled pump (Pump) for heat dissipation. If the heat pipe and fins are used, the volume of the graphics card heat dissipation module will be very large due to the limitation of the shell space, which results in a very complex design and limits the heat dissipation efficiency. On the other hand, if only the water-cooled pump (Pump) is used for heat dissipation, the volume and manufacturing cost are relatively high.

[0004] Therefore, it is one of the problems to be solved by the researchers to develop a scheme of combining fins with liquid cooling to solve the space limitation and improve the heat dissipation efficiency of high-power display chips. UTILITY MODEL CONTENTS

[0005] The utility model provides a heat dissipation device to improve the heat dissipation efficiency of the heat dissipation device.

[0006] An embodiment of the utility model discloses a heat dissipation device, which comprises:

[0007] A vapor chamber has a top surface and a bottom surface, and the top surface of the vapor chamber is used to adhere to a heat source;

[0008] A first liquid cooling module is arranged on the bottom surface of the vapor chamber, and a first cooling fluid is arranged in the first liquid cooling module;

[0009] A second liquid cooling module is arranged on one side of the vapor chamber and the first liquid cooling module, and a second cooling fluid is arranged in the second liquid cooling module;

[0010] At least one heat pipe is connected to the vapor chamber, the first liquid cooling module and the second liquid cooling module;

[0011] Wherein, the heat generated by the heat source is conducted to the heat spreader and the at least one heat pipe, and the first liquid cooling module and the second liquid cooling module conduct the heat of the heat spreader and the at least one heat pipe through the first cooling fluid and the second cooling fluid.

[0012] The heat dissipation device, wherein the bottom surface of the heat spreader is provided with at least one through slot, and the at least one heat pipe is correspondingly arranged in the at least one through slot.

[0013] The heat dissipation device, wherein the first liquid cooling module comprises a first heat dissipation fin group comprising at least one first heat dissipation fin, and the top of each first heat dissipation fin is provided with at least one first notch corresponding to the at least one through slot, the first notch and the through slot form a first channel, and the heat pipe is arranged in the first channel.

[0014] The heat dissipation device, wherein the first liquid cooling module further comprises a first liquid cooling cavity assembly arranged on one side of the at least one first heat dissipation fin, each first heat dissipation fin has a first liquid cooling pipe, the first liquid cooling pipe has a first open end, the first open end protrudes from the side of the first heat dissipation fin and is connected to the first liquid cooling cavity assembly, and the first liquid cooling pipe and the first liquid cooling cavity assembly are used to contain the first cooling fluid.

[0015] The heat dissipation device, wherein the first liquid cooling cavity assembly comprises:

[0016] a first housing arranged on one side of the at least one first heat dissipation fin, the first housing has a first cavity and a plurality of first connecting holes connected to the first cavity, and the first open end is correspondingly inserted into the first connecting hole, so that the first cavity is connected to the first liquid cooling pipe;

[0017] a second housing arranged on the first housing and covering the first cavity.

[0018] The heat dissipation device, wherein the second liquid cooling module comprises a second heat dissipation fin group comprising at least one second heat dissipation fin, each second heat dissipation fin is provided with at least one first through hole, at least one first through hole forms a second channel, and at least one heat pipe is also arranged in the second channel.

[0019] The aforementioned heat dissipation device further includes a second liquid cooling module, which is mounted on one side of at least one of the second heat dissipation fins. Each of the second heat dissipation fins has a second liquid cooling pipe, which has a second open end. The second open end protrudes from the side of the second heat dissipation fin and communicates with the second liquid cooling cavity assembly. The second liquid cooling pipe and the second liquid cooling cavity assembly are used to contain the second cooling fluid.

[0020] The aforementioned heat dissipation device, wherein the second liquid cooling cavity assembly includes:

[0021] A third housing is installed on one side of at least one of the second heat dissipation fins. The third housing has a second cavity and a plurality of second connecting holes communicating with the second cavity. The second open end is correspondingly inserted into the second connecting hole so that the second cavity is communicating with the second liquid cooling pipe.

[0022] A fourth housing is installed on the third housing and covers the second cavity.

[0023] The aforementioned heat dissipation device further includes: a third heat dissipation fin group disposed between the first liquid cooling module and the second liquid cooling module, and at least one of the heat pipes passing through the third heat dissipation fin group.

[0024] In the aforementioned heat dissipation device, at least one of the heat pipes is a straight heat pipe.

[0025] In the aforementioned heat dissipation device, at least one of the heat pipes is a bent heat pipe.

[0026] In the above-mentioned heat dissipation device, at least one of the heat pipes includes at least one straight heat pipe and at least one bent heat pipe, and a bent heat pipe is disposed between adjacent straight heat pipes.

[0027] In the aforementioned heat dissipation device, the third heat dissipation fin group includes at least one third heat dissipation fin, each of the third heat dissipation fins has a second through hole for the straight heat pipe to pass through, and each of the third heat dissipation fins has a second notch for the curved heat pipe to pass through, and between the two second through holes.

[0028] The heat dissipation device of this utility model adopts a structure of heat dissipation fins and liquid cooling pipes in the graphics card heatsink. It can break through the original heat dissipation capacity within the limited heat dissipation module structure and effective space. At the same time, the liquid cooling module can be changed to maintain or improve the heat dissipation capacity of the heat dissipation module according to the power increase requirements during product iteration and subsequent maintenance.

[0029] The above description of the contents of the present application and the following description of the embodiments are intended to demonstrate and explain the principles of the present application, and to provide further explanation of the scope of the patent application of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is a perspective view of a heat dissipation device according to a first embodiment of the present application.

[0031] Figure 2 is a perspective view of a heat dissipation device according to a first embodiment of the present application.

[0032] Figure 3 is a perspective view of a heat dissipation device according to a first embodiment of the present application. Figure 1

[0033] Figure 4 is a structural view of an embodiment of a first heat dissipation fin.

[0034] Figure 5 is a structural view of another embodiment of a first heat dissipation fin.

[0035] Figure 6 is a structural view of an embodiment of a second heat dissipation fin.

[0036] Figure 7 is a structural view of another embodiment of a second heat dissipation fin.

[0037] Figure 8 is a perspective view of a heat dissipation device according to a second embodiment of the present application.

[0038] Figure 9 is a structural view of a third heat dissipation fin.

[0039] Figure 10 is a perspective view of a heat dissipation device according to a third embodiment of the present application.

[0040] Figure 11 is a structural view of another embodiment of a second heat dissipation fin.

[0041] In the drawings:

[0042] heat dissipation device: 1;

[0043] vapor chamber: 11;

[0044] top surface: S1;

[0045] convex structure: 111;

[0046] bottom surface: S2;

[0047] through groove: C;​

[0048] first liquid cooling module: 12;

[0049] first heat dissipation fin group: 121;

[0050] first heat dissipation fin: F11, F12;

[0051] perforation: K121;

[0052] first notch: G1;

[0053] first passage: T1;

[0054] first liquid cooling pipe: P1;

[0055] first open end: O1;

[0056] first liquid cooling cavity assembly: 122;

[0057] first shell: 1221;

[0058] first cavity: Q1;

[0059] first connecting hole: K1;

[0060] second shell: 1222;

[0061] second liquid cooling module: 13;

[0062] second heat dissipation fin group: 131;

[0063] second heat dissipation fin: F21, F22, F23;

[0064] second passage: T2;

[0065] first through hole: K2;

[0066] second liquid cooling pipe: P2;

[0067] second open end: O2;

[0068] bent part: Z;

[0069] second liquid cooling cavity assembly: 132;

[0070] third shell: 1321;

[0071] second cavity: Q2;

[0072] second connecting hole: K3;

[0073] fourth shell: 1322;

[0074] at least one heat pipe: 14;

[0075] Straight heat pipe: 141;

[0076] Bent heat pipe: 142;

[0077] Third heat dissipation fin group: 15;

[0078] Third heat dissipation fin: 151;

[0079] Second through hole: K4;

[0080] Second notch: G2;

[0081] Thermal conduction block: 16;

[0082] Connecting piece: 17; DETAILED DESCRIPTION

[0083] Please refer to Figures 1 to 4 . Figure 1 It is a perspective view of the heat dissipation device according to the first embodiment of the present application. Figure 2 It is a perspective view of the heat dissipation device according to the first embodiment of the present application. Figure 3 It is Figure 1 a partially exploded schematic view of the heat dissipation device. Figure 4 It is a schematic view of the structure of an embodiment of the first heat dissipation fin. As Figures 1 to 4 shown, the heat dissipation device 1 provided by the present application comprises a uniform temperature plate 11, a first liquid cooling module 12, a second liquid cooling module 13 and at least one heat pipe 14. The uniform temperature plate 11 has a top surface S1 and a bottom surface S2. The top surface S1 of the uniform temperature plate 11 is used to adhere to a heat source. The first liquid cooling module 12 is arranged on the bottom surface S2 of the uniform temperature plate 11. The first liquid cooling module 12 is provided with a first cooling fluid (not shown in the figure). The second liquid cooling module 13 is arranged on one side of the uniform temperature plate 11 and the first liquid cooling module 12. The second liquid cooling module 13 is provided with a second cooling fluid (not shown in the figure). At least one heat pipe 14 is connected to the uniform temperature plate 11, the first liquid cooling module 12 and the second liquid cooling module 13. Wherein, the heat generated by the heat source is conducted to the uniform temperature plate 11 and at least one heat pipe 14. The first liquid cooling module 12 and the second liquid cooling module 13 conduct the heat of the uniform temperature plate 11 and at least one heat pipe 14 through the first cooling fluid and the second cooling fluid.

[0084] Therefore, for application in high-power display adapters (VGA), the main heat source is generated by GPU, on a chip with a power of up to 600W or more. The present application utilizes the material properties of liquid cooling to assist in enhancing the heat dissipation effect, thereby achieving higher heat dissipation efficiency.

[0085] The bottom surface S2 of the uniform temperature plate 11 is provided with at least one groove C, and at least one heat pipe 14 is arranged in the at least one groove C.

[0086] Further, the first liquid cooling module 12 comprises a first heat dissipation fin group 121 and a first liquid cooling cavity assembly 122. The first heat dissipation fin group 121 comprises at least one first heat dissipation fin F11 arranged along the X direction. The top of each first heat dissipation fin F11 is provided with at least one first gap G1 corresponding to the at least one groove C. The first gap G1 and the groove C form a first channel T1, and the heat pipe 14 is arranged in the first channel T1. The first liquid cooling cavity assembly 122 is arranged on one side of the at least one first heat dissipation fin F11. Each first heat dissipation fin F11 has a first liquid cooling pipe P1 with a first open end O1 protruding from the side of the first heat dissipation fin F11 and connected to the first liquid cooling cavity assembly 122. The first liquid cooling pipe P1 and the first liquid cooling cavity assembly 122 are used to contain the first cooling fluid. In this embodiment, the first liquid cooling pipe P1 is formed in the first heat dissipation fin F11 and protrudes from the first heat dissipation fin F11. The first open end O1 of the first liquid cooling pipe P1 protrudes from the side of the first heat dissipation fin F11, and the first cooling fluid enters the first liquid cooling pipe P1 from the first open end O1.

[0087] Further, the first liquid cooling cavity assembly 122 comprises a first shell 1221 and a second shell 1222. The first shell 1221 is arranged on one side of the at least one first heat dissipation fin F11. The first shell 1221 has a first cavity Q1 and a plurality of first connecting holes K1 connected to the first cavity Q1. The first open end O1 is arranged in the first connecting hole K1, so that the first cavity Q1 is connected to the first liquid cooling pipe P1. The second shell 1222 is arranged on the first shell 1221 and covers the first cavity Q1.

[0088] In an embodiment of the present application, the second shell 1222 is arranged on the first shell 1221 and is sealingly connected to the first shell 1221.

[0089] Please refer to Figure 5 , Figure 5 The structure diagram of another embodiment of the first heat dissipation fin. Figure 5 The first heat dissipation fin F12 shown in the figure is different from the first heat dissipation fin F11 shown in the figure. Figure 4The structure of the first liquid cooling pipe P1 of the first heat dissipation fin F11 is the same as shown, and thus will not be described here. In the present embodiment, the first heat dissipation fin group 121 includes at least one first heat dissipation fin F12 arranged along the X direction and disposed on the side of the at least one first heat dissipation fin F11 away from the second liquid cooling module 13. The height of the first heat dissipation fin F12 is greater than that of the first heat dissipation fin F11. The upper portion of the first heat dissipation fin F12 has a plurality of perforations K121 located in the groove C, and one end of the at least one heat pipe passes through the perforations K121.

[0090] In an embodiment of the present application, the heights of the at least one second heat dissipation fin are the same.

[0091] Please refer to Figure 6 and combine Figures 1 to 4 , Figure 6 for the structural schematic diagram of an embodiment of the second heat dissipation fin. As shown in Figures 1 to 4 and Figure 6 , the second liquid cooling module 13 includes a second heat dissipation fin group 131 and a second liquid cooling cavity assembly 132. The second heat dissipation fin group 131 includes at least one second heat dissipation fin F21 arranged along the Y direction. Each of the second heat dissipation fins F21 has at least one first through hole K2 formed therein, and the at least one first through hole K2 forms a second channel T2. The at least one heat pipe 14 also passes through the second channel T2. The second liquid cooling cavity assembly 132 is disposed on one side of the at least one second heat dissipation fin F21. Each of the second heat dissipation fins F21 has a second liquid cooling pipe P2 with a second open end O2 protruding from the side of the second heat dissipation fin F21 and communicating with the second liquid cooling cavity assembly 132. The second liquid cooling pipe P2 and the second liquid cooling cavity assembly 132 are used to contain the second cooling fluid. In the present embodiment, the second liquid cooling pipe P2 is formed in the second heat dissipation fin F21 and protrudes from the second heat dissipation fin F21, while the first open end O2 of the first liquid cooling pipe P2 protrudes from the side of the second heat dissipation fin F21. The second cooling fluid enters the second liquid cooling pipe P2 from the second open end O2.

[0092] Specifically, the second liquid cooling cavity assembly 132 includes a third housing 1321 and a fourth housing 1322. The third housing 1321 is disposed on one side of the at least one second heat dissipation fin F21. The third housing 1321 has a second cavity Q2 and a plurality of second connecting holes K3 communicating with the second cavity Q2. The second open end O2 is correspondingly inserted into the second connecting hole K3, so that the second cavity Q2 communicates with the second liquid cooling pipe P2. The fourth housing 1232 is disposed on the third housing 1231 and covers the second cavity Q2.

[0093] In an embodiment of the present application, the fourth shell 1232 is arranged on the third shell 1231 and is sealingly connected to the third shell 1231.

[0094] It should be noted that, in the present embodiment, the first liquid cooling cavity assembly 122 and the second liquid cooling cavity assembly 132 are arranged on the same side of the heat dissipation device 1, and in another embodiment of the present application, the first liquid cooling cavity assembly 122 and the second liquid cooling cavity assembly 132 can also be arranged on different sides of the heat dissipation device 1.

[0095] Please refer to Figure 7 , Figure 7 FIG. 4 is a structural schematic view of another embodiment of the second heat dissipation fin. Figure 7 The second heat dissipation fin F22 shown in FIG. 4 is different from the second heat dissipation fin F21 shown in FIG. 3 in that the second heat dissipation fin F22 has a first through hole K2 on the upper portion. Figure 6 The structure of the second liquid cooling pipeline P2 of the second heat dissipation fin F21 shown in FIG. 3 is the same as that of the second heat dissipation fin F21 shown in FIG. 3, and thus will not be described here again. In the present embodiment, the second heat dissipation fin group 131 includes at least one second heat dissipation fin F22 arranged along the Y direction and disposed on the side of the at least one second heat dissipation fin F21 away from the first liquid cooling module 12, and the height of the second heat dissipation fin F22 is greater than the height of the second heat dissipation fin F21. The first through hole K2 on the upper portion of the second heat dissipation fin F22 does not communicate with the top of the second heat dissipation fin F22.

[0096] In an embodiment of the present application, the heights of the at least one first heat dissipation fin are the same.

[0097] It should be noted that, in the present embodiment, the shapes of the first liquid cooling pipeline P1 and the second liquid cooling pipeline P2 are different, but the present application is not limited thereto, and in another embodiment, the shapes of the first liquid cooling pipeline P1 and the second liquid cooling pipeline P2 can also be the same.

[0098] It should be noted that, in the present embodiment, the first liquid cooling pipeline P1 is linear, and the second liquid cooling pipeline P2 is zigzag-shaped, but the present application is not limited thereto, and in another embodiment, the shapes of the first liquid cooling pipeline P1 and the second liquid cooling pipeline P2 can also be any shape, so that the cooling fluid has a longer path, thereby improving the heat dissipation effect.

[0099] Please refer to Figures 8 to 9 , Figure 8 FIG. 5 is a perspective view of the heat dissipation device according to the second embodiment of the present application. Figure 9 FIG. 6 is a structural schematic view of a third heat dissipation fin. Figures 8 to 9As shown, the heat dissipation device 1 of the embodiment further comprises a third heat dissipation fin group 15 arranged between the first liquid cooling module 12 and the second liquid cooling module 13, and at least one heat pipe 14 is arranged through the third heat dissipation fin group 15.

[0100] In the embodiment, the at least one heat pipe comprises at least one straight heat pipe 141 and at least one bent heat pipe 142, and the bent heat pipe 142 is arranged between every two adjacent straight heat pipes 141. The third heat dissipation fin group 15 comprises at least one third heat dissipation fin 151, and the second through hole K4 for the straight heat pipe 141 is arranged on each third heat dissipation fin 151. The second gap G2 for the bent heat pipe 142 is arranged on each third heat dissipation fin 151 between the two second through holes K4. It should be noted that the arrangement of the straight heat pipe 141 and the bent heat pipe 142 is not limited in the utility model.

[0101] In another embodiment of the utility model, the at least one heat pipe 14 is a straight heat pipe 141.

[0102] In another embodiment of the utility model, the at least one heat pipe 14 is a bent heat pipe 142.

[0103] Please refer to Figures 10-11 , Figure 10 It is a three-dimensional schematic view of the heat dissipation device according to the third embodiment of the utility model, Figure 11 It is a structural schematic view of another embodiment of the second heat dissipation fin. Figure 10 The heat dissipation device shown and Figure 8 The structure of the heat dissipation device shown is basically the same, so the same parts will not be described here. Now the different parts will be described as follows. In the embodiment, the heat dissipation device 1 further comprises at least one heat conduction block 16 and at least one connecting piece 17. The at least one heat conduction block 16 can be selectively arranged on the top surface S1 of the vapor chamber 11, the first liquid cooling module 12 and the second liquid cooling module 13. The heat conduction block 16 further improves the heat conduction efficiency. The at least one connecting piece 17 can be selectively arranged on the top surface S1 of the vapor chamber 11 and the heat conduction block 16, so as to facilitate the installation of the heat dissipation device 1 in the electronic device.

[0104] Among them, the top surface S1 of the vapor chamber 11 has a convex structure 111, and the heat conduction block 16 is arranged on the convex structure 111.

[0105] In the embodiment, the second heat dissipation fin group 131 further comprises a second heat dissipation fin F23, and the second heat dissipation fin F23 has a bending part Z at the top. The bending part Z can carry the heat conduction block 16.

[0106] In summary, the utility model discloses a way of adding liquid cooling pipeline on the radiating fin and pouring cooling fluid, based on the material characteristics of cooling fluid, quickly conducting the heat emitted by heat pipe and uniform temperature plate to reduce the temperature of chip, thereby can obviously reduce the temperature of display card, or let user can depend on use demand, in addition, cooperate stronger liquid cooling module.

[0107] Although the utility model discloses the above-mentioned items of embodiment, it is not used to limit the utility model, and any relevant skilled person in the art can make some changes and adornments without departing from the spirit and scope of the utility model, so the patent protection scope of the utility model must be defined by the protection scope of the claims attached to the present application.

Claims

1. A heat dissipating device, characterized by, A heat sink includes: a top surface and a bottom surface, the top surface of the heat sink is used to fit a heat source; a first liquid cooling module is disposed on the bottom surface of the heat sink, the first liquid cooling module is provided with a first cooling fluid; a second liquid cooling module is disposed on one side of the heat sink and the first liquid cooling module, the second liquid cooling module is provided with a second cooling fluid; at least one heat pipe is connected to the heat sink, the first liquid cooling module and the second liquid cooling module; wherein the heat generated by the heat source is conducted to the heat sink and at least one heat pipe, and the first liquid cooling module and the second liquid cooling module conduct the heat of the heat sink and at least one heat pipe through the first cooling fluid and the second cooling fluid.

2. The heat dissipating device of claim 1, wherein At least one recess is provided on the bottom surface of the heat sink, and at least one heat pipe is correspondingly provided in at least one recess.

3. The heat dissipating device of claim 2, wherein The first liquid cooling module includes: a first heat dissipation fin group including at least one first heat dissipation fin, the top of each first heat dissipation fin is provided with at least one first notch corresponding to at least one recess, the first notch and the recess form a first channel, and the heat pipe is arranged in the first channel.

4. The heat dissipating device of claim 3, wherein The first liquid cooling module further includes: a first liquid cooling cavity assembly arranged on one side of at least one first heat dissipation fin, each first heat dissipation fin has a first liquid cooling pipe, the first liquid cooling pipe has a first open end, the first open end protrudes from the side of the first heat dissipation fin and is communicated with the first liquid cooling cavity assembly, and the first liquid cooling pipe and the first liquid cooling cavity assembly are used to contain the first cooling fluid.

5. The heat dissipating device of claim 4, wherein The first liquid cooling cavity assembly includes: a first shell arranged on one side of at least one first heat dissipation fin, the first shell has a first cavity and a plurality of first connecting holes communicated with the first cavity, the first open end is correspondingly inserted into the first connecting hole, so that the first cavity is communicated with the first liquid cooling pipe; a second shell arranged on the first shell and covering the first cavity.

6. The heat dissipating device of claim 4, wherein The second liquid cooling module includes: a second heat dissipation fin group including at least one second heat dissipation fin, at least one first through hole is provided on each second heat dissipation fin, at least one first through hole forms a second channel, and at least one heat pipe is also arranged in the second channel.

7. The heat dissipating device of claim 6, wherein The second liquid cooling module further includes: a second liquid cooling cavity assembly arranged on one side of at least one second heat dissipation fin, each second heat dissipation fin has a second liquid cooling pipe, the second liquid cooling pipe has a second open end, the second open end protrudes from the side of the second heat dissipation fin and is communicated with the second liquid cooling cavity assembly, and the second liquid cooling pipe and the second liquid cooling cavity assembly are used to contain the second cooling fluid.

8. The heat dissipating device of claim 7, wherein The second liquid cooling cavity assembly includes: a third shell arranged on one side of at least one second heat dissipation fin, the third shell has a second cavity and a plurality of second connecting holes communicated with the second cavity, the second open end is correspondingly inserted into the second connecting hole, so that the second cavity is communicated with the second liquid cooling pipe; A fourth housing is disposed on the third housing and covers the second cavity.

9. The heat dissipating device of claim 8, wherein Further comprising: A third heat dissipation fin group is disposed between the first liquid cooling module and the second liquid cooling module, and at least one of the heat pipes also penetrates the third heat dissipation fin group.

10. The heat dissipating device of claim 9, wherein At least one of the heat pipes is a straight heat pipe.

11. The heat dissipating device of claim 9, wherein At least one of the heat pipes is a bent heat pipe.

12. The heat dissipating device of claim 9, wherein At least one of the heat pipes includes at least one straight heat pipe and at least one bent heat pipe, and a bent heat pipe is disposed between adjacent straight heat pipes.

13. The heat dissipating device of claim 12, wherein, The third heat dissipation fin group includes at least one third heat dissipation fin, and a second through hole for the straight heat pipe to penetrate is formed on each third heat dissipation fin. A second gap for the bent heat pipe to penetrate is formed on each third heat dissipation fin between two second through holes.

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