Flexible circuit board, circuit assembly and electronic equipment

Abstract

The utility model relates to a flexible circuit board, a circuit assembly and electronic equipment, and the flexible circuit board comprises a dielectric layer. The wiring is arranged on the dielectric layer, the wiring is used for current circulation, the wiring at least comprises a first part and a second part which are oppositely arranged, and when the current flows through the first part and the second part, mutual inductance is generated between the first part and the second part. Wherein the wire serves as a circuit path and is used for transmitting electronic signals. When current flows through, the direction of the current in the first part is opposite to that of the current in the second part, so that induced electromotive force is caused between the first part and the second part, the routing is equivalent to an inductance element to replace a resistance element, and then the breakdown condition caused by the fact that static electricity cannot be released is avoided.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic components, and particularly relates to a flexible circuit board, a circuit assembly and an electronic device. BACKGROUND

[0002] In the related art, when a plastic or other material with poor conductivity is used as a middle frame or a shell of an electronic device, static electricity introduced on the electronic device has no discharge path, thereby breaking the electronic components inside the electronic device. CONTENT OF THE INVENTION

[0003] To overcome the problems in the related art, the present disclosure provides a flexible circuit board, a circuit assembly and an electronic device.

[0004] According to a first aspect of an embodiment of the present disclosure, a flexible circuit board is provided, comprising:

[0005] a dielectric layer;

[0006] a trace provided on the dielectric layer, the trace being used for current flow, the trace comprising at least a first part and a second part arranged oppositely, and a mutual inductance being generated between the first part and the second part when the current flows through the first part and the second part.

[0007] In some embodiments, the flexible circuit board further comprises a conductive layer;

[0008] the conductive layer is arranged in a stack with the dielectric layer, and the trace is prepared based on the conductive layer.

[0009] In some embodiments, the flexible circuit board further comprises an isolation part;

[0010] the rest of the conductive layer except the trace is the isolation part.

[0011] In some embodiments, the conductive layer is a single-layer conductive layer;

[0012] the trace has a plurality of S-shaped structures, and the first part and the second part are opposite parts of each S-shaped structure.

[0013] In some embodiments, the conductive layer is a single-layer conductive layer, and the trace has a spiral shape.

[0014] the first part and the second part are both in a spiral shape and are arranged in a staggered manner.

[0015] In some embodiments, the conductive layer comprises a first conductive layer and a second conductive layer, and the first conductive layer and the second conductive layer are respectively located on two side surfaces of the dielectric layer.

[0016] The first part is prepared based on the first conductive layer, the second part is prepared based on the second conductive layer, and the first part and the second part are electrically connected through the connecting part;

[0017] The connecting part is arranged through the dielectric layer.

[0018] In some embodiments, the first part and the second part are sequentially connected end to end through the connecting part to form a wire-wound inductor.

[0019] In some embodiments, the first part and the second part are both spiral-shaped.

[0020] The first part is located at one end of the spiral-shaped center and is electrically connected to one end of the second part at the spiral-shaped center through the connecting part.

[0021] In some embodiments, the dielectric layer has a preset dielectric constant.

[0022] In some embodiments, the trace has a preset width and a preset thickness.

[0023] According to a second aspect of the embodiments of the present disclosure, a circuit assembly is provided, comprising:

[0024] The flexible circuit board of any one of the above first aspects further comprises a pin;

[0025] A control component is arranged on the flexible circuit board, and the control component is electrically connected to the pin and the trace respectively.

[0026] In some embodiments, the control component is a key.

[0027] In some embodiments, the pin comprises a first pin, a second pin, a third pin and a fourth pin.

[0028] The control component comprises a first control component, a second control component and a third control component.

[0029] The first pin is electrically connected to a first end of the first control component, a first end of the second control component and a first end of the third control component through the trace.

[0030] The second pin is electrically connected to a second end of the first control component.

[0031] The third pin is electrically connected to a second end of the second control component.

[0032] The fourth pin is electrically connected to a second end of the third control component.

[0033] According to a third aspect of embodiments of the present disclosure, an electronic device is provided, comprising:

[0034] a shell, a material of the shell being a non-metal material;

[0035] the flexible circuit board of any one of the first aspect, the flexible circuit board being arranged inside the shell; and / or

[0036] the circuit assembly of any one of the second aspect, the circuit assembly being arranged inside the shell.

[0037] Embodiments of the present disclosure provide technical solutions that can include the following beneficial effects: the traces serve as circuit paths for the transmission of electronic signals. When current flows, the current in the first part is opposite in direction to the current in the second part, causing an induced electromotive force between the first part and the second part, making the traces equivalent inductance elements to replace resistance elements, thereby avoiding breakdown caused by the inability to discharge static electricity.

[0038] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0039] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present disclosure and, together with the specification, serve to explain the principles of the present disclosure.

[0040] Figure 1 is a structural schematic diagram of a flexible circuit board according to an exemplary embodiment.

[0041] Figure 2 is a structural schematic diagram of traces in a flexible circuit board according to an exemplary embodiment.

[0042] Figure 3 is a structural schematic diagram of traces in a flexible circuit board according to another exemplary embodiment.

[0043] Figure 4 is a structural schematic diagram of traces in a flexible circuit board according to another exemplary embodiment.

[0044] Figure 5 is a front view of a flexible circuit board according to an exemplary embodiment.

[0045] Figure 6 is a rear view of a flexible circuit board according to an exemplary embodiment.

[0046] Figure 7 is a sectional view of a flexible circuit board according to an exemplary embodiment.

[0047] Figure 8 is a front view of a circuit assembly according to an example embodiment.

[0048] Figure 9 is a front view of a circuit assembly according to another example embodiment.

[0049] Figure 10 is a front view of a circuit assembly according to another example embodiment.

[0050] Figure 11 is a Figure 10 is a rear view of the circuit assembly shown.

[0051] Figure 12 is a block diagram of an electronic device according to an example embodiment. DETAILED DESCRIPTION

[0052] The example embodiments will be described in detail herein with reference to the attached drawings. In the following description, the same numbers are used to designate the same elements, unless otherwise indicated. The embodiments described in the following example embodiments are not meant to represent all embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0053] In the related art, when an electronic device adopts plastic or other materials with poor conductivity as a middle frame or a shell, the static electricity introduced on the electronic device has no discharge path, which can break through the resistance elements on the circuit board of the electronic device and cause damage to the electronic device.

[0054] To solve the above technical problems, the present disclosure provides a flexible circuit board, a circuit assembly, and an electronic device. By winding the traces of the flexible circuit board, the equivalent inductance elements of the traces of the winding structure are used to replace the resistance elements on the circuit board of the electronic device. Since the inductance elements will generate a reverse electromotive force when the current changes, this reverse electromotive force helps to limit the sudden change of the current. Therefore, compared with the resistance elements, the equivalent inductance elements of the traces of the winding structure can effectively avoid the situation of being broken down by static electricity.

[0055] Figure 1 is a structural schematic diagram of a flexible circuit board according to an example embodiment. Figure 2 is a structural schematic diagram of traces 2 in a flexible circuit board according to an example embodiment. Figure 3 is a structural schematic diagram of traces 2 in a flexible circuit board according to another example embodiment. As Figures 1 to 3As shown, the flexible circuit board comprises a dielectric layer 12. A trace 2 is disposed on the dielectric layer 12, the trace 2 is used for current flow, the trace 2 comprises at least a first portion 21 and a second portion 22 disposed oppositely, and the first portion 21 and the second portion 22 are in mutual inductance when current flows through the first portion 21 and the second portion 22.

[0056] As shown, the trace 2 is used as a circuit path for electronic signal transmission. When current flows, the current in the first portion 21 is opposite to the current in the second portion 22, which causes an induced electromotive force between the first portion 21 and the second portion 22, so that the trace 2 is equivalent to an inductive element instead of a resistive element, thereby avoiding the breakdown caused by the inability to release static electricity.

[0057] Figure 7 is a cross-sectional view of a flexible circuit board according to an example embodiment. As shown Figure 7 As shown, the flexible circuit board further comprises a conductive layer 11 in some embodiments. The conductive layer 11 is stacked with the dielectric layer 12, and the trace 2 is prepared based on the conductive layer 11. The conductive layer 11 of the flexible circuit board is mainly used to form a circuit path for electronic signal transmission. The required circuit pattern can be formed by chemical etching or mechanical processing. The disclosure forms the trace 2 by processing the conductive layer 11 of the flexible circuit board, and forms the first portion 21 and the second portion 22 by designing the shape of the trace 2. Compared with the traditional inductive element, i.e. the patch inductor additionally arranged on the circuit board, the embodiment of the disclosure can effectively avoid the problem of element falling off caused by falling.

[0058] Figure 5 is a front view of a flexible circuit board according to an example embodiment. Figure 6 is a rear view of a flexible circuit board according to an example embodiment. As shown Figure 5 and Figure 6 As shown, the flexible circuit board further comprises an isolation portion 15 in some embodiments. The remaining part of the conductive layer 11 except the trace 2 is the isolation portion 15. That is, by reserving part of the conductive layer 11 for not being used for current flow, it is used as a ground conductor to isolate the inductive signal formed by the first portion 21 and the second portion 22, so as to reduce the interference to other elements.

[0059] For example, the trace 2 and the isolation portion 15 are respectively formed on the conductive layer 11 of the flexible circuit board by chemical etching or mechanical processing, which effectively saves the overall thickness of the flexible circuit board of the embodiment of the disclosure, and further saves the internal space of the adapted electronic device.

[0060] As shown Figure 5As shown, it also includes a cover film 13, which is stacked with the conductive layer 11. The cover film 13 is located on the side of the conductive layer 11 away from the dielectric layer 12, and is used to protect the circuit from external insulated contact and avoid short circuits.

[0061] In some embodiments, the conductive layer 11 is a single conductive layer 11, that is, the first part 21 and the second part 22 of the trace 2 are both located on the same side of the dielectric layer 12. By arranging the first part 21 and the second part 22 adjacent to each other and making the current directions in the first part 21 and the second part 22 opposite, an induced electromotive force is generated.

[0062] For example, such as Figure 2 As shown, the trace 2 has multiple S-shaped structures, and the two opposite parts of each S-shaped structure are the first part 21 and the second part 22. That is, the first part 21 and the second part 22 are electrically connected sequentially and arranged at intervals, so that the first part 21 and the second part 22 can be arranged adjacent to each other and the current direction is opposite.

[0063] For example, such as Figure 3 As shown, trace 2 is spiral-shaped. Both the first part 21 and the second part 22 are spiral-shaped and staggered. Current flows from the outer end of the first part 21 to the center end, which is electrically connected to the center end of the second part 22. Current then flows from the center end of the second part 22 to the outer end, ensuring that the first part 21 and the second part 22 are spaced apart and have opposite current directions along the width of trace 2.

[0064] Figure 5 This is a front view of a flexible circuit board according to an exemplary embodiment. Figure 6 This is a rear view of a flexible circuit board according to an exemplary embodiment. Figure 7 This is a cross-sectional view of a flexible circuit board according to an exemplary embodiment. Figures 5 to 7 As shown, in some embodiments, the conductive layer 11 includes a first conductive layer 111 and a second conductive layer 112, which are respectively located on opposite sides of the dielectric layer 12. A first portion 21 is fabricated based on the first conductive layer 111, and a second portion 22 is fabricated based on the second conductive layer 112. The first portion 21 and the second portion 22 are electrically connected via a connecting portion 14. The connecting portion 14 penetrates the dielectric layer 12. When current flows through the first portion 21 and the second portion 22, mutual inductance is generated between them.

[0065] In some embodiments, such as Figure 5As shown, the cover film 13 includes a first cover film 131 and a second cover film 132, which respectively cover the first conductive layer 111 and the second conductive layer 112.

[0066] In some embodiments, the first portions 21 and the second portions 22 are sequentially connected in a head-to-tail manner through the connecting portions 14 to form a wire inductance. That is, the wire 2 passes through the connecting portions 14 and surrounds the dielectric layer 12 to form a wire inductance.

[0067] For example, as shown in FIG. 2, the first portions 21 and the second portions 22 are arranged in a spiral manner. Figures 5 to 7 As shown, the first portions 21 in the first conductive layer 111 are arranged in parallel with each other in the length direction and are sequentially arranged in the width direction of the first portions 21, and the second portions 22 in the second conductive layer 112 are arranged in parallel with each other in the length direction and are sequentially arranged in the width direction of the second portions 22. The first portions 21 and the second portions 22 are sequentially connected in a head-to-tail manner through the connecting portions 14, so that the current in the first portions 21 located on one side of the dielectric layer 12 is opposite to the current in the second portions 22 located on the other side of the dielectric layer 12, thereby forming a wire inductance.

[0068] Figure 4 FIG. 3 is a structural schematic diagram of a wire 2 in a flexible circuit board according to another exemplary embodiment. As shown in FIG. 3, in some embodiments, the first portions 21 and the second portions 22 are arranged in a spiral manner. Figure 4 As shown, the first portions 21 and the second portions 22 are arranged in a spiral manner. The first portions 21 are located at one end of the spiral center and are electrically connected to the second portions 22 located at one end of the spiral center through the connecting portions 14. The first portions 21 can be arranged opposite to the second portions 22, or the first portions 21 can be arranged staggered to the second portions 22. The current in the first portions 21 flows from the outside to the inside in the spiral structure, and the current in the second portions 22 flows from the inside to the outside in the spiral structure, thereby generating mutual inductance between the first portions 21 and the second portions 22.

[0069] In some embodiments, the dielectric layer 12 has a preset dielectric constant. By selecting a dielectric layer 12 of different material, the dielectric constant of the capacitor is changed to achieve the purpose of changing the inductance value of the wire 2.

[0070] In some embodiments, the wire 2 has a preset width and a preset thickness. By setting the width and thickness of the wire 2, that is, changing the diameter of the wire, the inductance value of the wire 2 is changed.

[0071] In some embodiments, the size of the connecting portions 14 can be changed to change the inductance value of the wire 2.

[0072] In some embodiments, the arrangement density and / or the number of turns of the first portions 21 and the second portions 22 of the wire 2 can be changed to change the inductance value of the wire 2.

[0073] Based on the same concept, the present disclosure also provides a circuit assembly 10, Figure 9 is a front view of a circuit assembly 10 according to another exemplary embodiment. As Figure 9 shown, the circuit assembly 10 comprises the flexible circuit board 1 according to any one of the embodiments described above, and the flexible circuit board 1 further comprises a pin 101. A control component 102 is arranged on the flexible circuit board 1, and the control component 102 is electrically connected to the pin 101 and the wire 2, respectively. Compared with a resistor element, the wire 2 in the winding structure is equivalent to an inductor element, which can effectively avoid the situation of being struck by static electricity.

[0074] Figure 8 is a front view of a circuit assembly 10 according to an exemplary embodiment. Figure 9 is a front view of a circuit assembly 10 according to another exemplary embodiment. Figure 10 is a front view of a circuit assembly 10 according to another exemplary embodiment. Figure 11 is Figure 10 a rear view of the circuit assembly 10. As Figures 8 to 11 shown, in the circuit assembly 10 of the present disclosure, the wire 2 for equivalent inductor element can be arranged on one side or both sides of the flexible circuit board 1.

[0075] In some embodiments, the control component 102 is a key, which is triggered by user pressing or other actions. The signal generated after triggering is transmitted to the processing unit through the pin 101.

[0076] In some embodiments, as Figure 8 shown, the pin 101 comprises a first pin 1011, a second pin 1012, a third pin 1013 and a fourth pin 1014. The control component 102 comprises a first control component 1021, a second control component 1022 and a third control component 1023. The first pin 1011 is electrically connected to the first end of the first control component 1021, the first end of the second control component 1022, and the first end of the third control component 1023 through the wire 2, respectively. The second pin 1012 is electrically connected to the second end of the first control component 1021. The third pin 1013 is electrically connected to the second end of the second control component 1022. The fourth pin 1014 is electrically connected to the second end of the third control component 1023. The first control component 1021, the second control component 1022 and the third control component 1023 can be triggered independently.

[0077] Based on the same concept, the embodiments of the present disclosure further provide an electronic device, comprising a shell, the material of the shell is a non-metal material. The flexible circuit board 1 of any one of the above embodiments is arranged in the interior of the shell. And / or the circuit assembly of any one of the above embodiments is arranged in the interior of the shell. Through the equivalent inductance element of the wire structure, the situation that the non-metal material shell cannot release static electricity and causes static breakdown of components can be effectively avoided.

[0078] The electronic device involved in the present disclosure can also be referred to as terminal device, user equipment (UE), mobile station (MS), mobile terminal (MT), etc., which is a device providing voice and / or data connectivity for users. For example, the electronic device can be a handheld device with wireless connectivity, a vehicle-mounted device, etc. At present, some examples of electronic devices are: smart phones, pocket personal computers (PPC), palm computers, personal digital assistants (PDA), notebook computers, tablet computers, wearable devices, or vehicle-mounted devices, etc. In addition, when it is a vehicle-to-everything (V2X) communication system, the electronic device can also be a vehicle-mounted device. It should be understood that the specific technology and specific device form of the electronic device are not limited in the embodiments of the present disclosure.

[0079] Figure 12 is a block diagram of an electronic device 800 according to an example embodiment. For example, the electronic device 800 can be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0080] Referring to Figure 12 , the electronic device 800 can include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input / output (I / O) interface 812, a sensor component 814, and a communication component 816.

[0081] The processing component 802 generally controls the overall operations of the electronic device 800, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component 802 can include one or more processors 820 to execute instructions to complete the steps of the methods described above, in whole or in part. Moreover, the processing component 802 can include one or more modules to facilitate the interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate the interaction between the multimedia component 808 and the processing component 802.

[0082] The memory 804 is configured to store various types of data to support the operations of the electronic device 800. Examples of these data include instructions to operate any applications or methods on the electronic device 800, contact data, phonebook data, messages, pictures, videos, and the like. The memory 804 can be realized by any type of volatile or non-volatile storage devices, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disc, or optical disc.

[0083] The power component 806 provides power to the various components of the electronic device 800. The power component 806 can include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the electronic device 800.

[0084] The multimedia component 808 includes a screen to provide an output interface between the electronic device 800 and a user. In some embodiments, the screen can include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes the touch panel, the screen can be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense a touch, a slide, and a gesture on the touch panel. The touch sensors can not only sense a boundary of a touching or sliding action, but also detect duration and pressure related to the touching or sliding action. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. The front camera and / or the rear camera can receive external multimedia data when the electronic device 800 is in an operation mode, such as a shooting mode or a video mode. Each of the front camera and the rear camera can be a fixed optical lens system or have a focal length and optical zoom capability.

[0085] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC) that is configured to receive an external audio signal when the electronic device 800 is in an operation mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory 804 or transmitted via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

[0086] The I / O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which can include a keypad, a click wheel, buttons, and so on. The buttons can include, but are not limited to, a home button, a volume button, a start button, and a lock button.

[0087] The sensor component 814 includes one or more sensors for providing status assessments of various aspects of the electronic device 800. For example, the sensor component 814 can detect an open / closed position of the electronic device 800, relative positioning of components, such as a display and a keypad of the electronic device 800, a change of position of the electronic device 800 or a component of the electronic device 800, presence or absence of user contact with the electronic device 800, orientation or acceleration / deceleration of the electronic device 800, and temperature changes of the electronic device 800. The sensor component 814 can include an orientation sensor, an acceleration sensor, a proximity sensor, a gesture sensor, a gravity sensor, a biometric sensor, a temperature / humidity sensor, a light sensor, and an ultraviolet (UV) sensor, an electromagnetic sensor, and so on. The sensor component 814 can also include an electronic nose sensor and / or an electronic tongue sensor.

[0088] The communication component 816 is configured to facilitate wired or wireless communication between the electronic device 800 and other devices. The electronic device 800 can access a wireless network based on a communication standard, such as WiFi, 2G, or 3G, or a combination thereof. In an example embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcasting management system via a broadcast channel. In an example embodiment, the communication component 816 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technology.

[0089] In exemplary embodiments, the electronic device 800 can be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, micro-controllers, microprocessors, or other electronic elements for performing the above-described methods.

[0090] In exemplary embodiments, a non-transitory computer-readable storage medium including instructions, such as the memory 804 including instructions, is also provided, which can be executed by the processor 820 of the electronic device 800 to complete the above-described methods. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, and an optical data storage device, etc.

[0091] It can be understood that "multiple" in the present disclosure refers to two or more, and other quantifiers are similar. The association relationship of "and / or" describing the associated objects means that there can be three relationships, for example, A and / or B can represent: A exists alone, A and B exist together, and B exists alone. The character " / " generally represents that the associated objects before and after are in an "or" relationship. The singular form "a", "said" and "the" are also intended to include the plural form, unless the context clearly indicates otherwise.

[0092] It can be further understood that the terms "first", "second", and the like are used to describe various information, but these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other, and do not indicate a particular order or importance. In fact, the expressions of "first", "second", and the like can be completely interchangeable. For example, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information without departing from the scope of the present disclosure.

[0093] It can be further understood that the terms "center", "longitudinal", "transverse", "front", "back", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation.

[0094] It can be further understood that, unless otherwise specified, "connection" includes direct connection between the two without other components, and also includes indirect connection between the two with other elements.

[0095] It will be further appreciated that embodiments of the present disclosure, although described in certain order of sequences in flowcharts of the drawings, should not be construed to require that operations be carried out in the particular order or in sequential order, or that all operations be performed to achieve desirable results. In certain circumstances, multitasking and parallel processing can be advantageous.

[0096] Other embodiments of the present disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the present disclosure cover any and all variations of the application that come within the scope of the following claims and their equivalents. It is intended that the specification and examples be considered exemplary only, with the true scope and spirit of the application indicated by the following claims.

[0097] It is to be understood that the application is not limited to the precise details of design or construction that have been described above and illustrated in the accompanying drawings. Various modifications and changes can be made thereunto without departing from the scope of the application. The scope of the application is indicated by the appended claims, rather than by the foregoing description.

Claims

1. A flexible wiring board, characterized by, The flexible circuit board comprises: a medium layer; a trace arranged on the medium layer, the trace being used for current flow, the trace comprising at least a first part and a second part arranged oppositely, and mutual inductance being generated between the first part and the second part when current flows through the first part and the second part.

2. The flexible wiring board according to claim 1, characterized by The flexible circuit board further comprises a conductive layer; the conductive layer is arranged in a stack with the medium layer, and the trace is prepared based on the conductive layer.

3. The flexible wiring board according to claim 2, characterized by, The flexible circuit board further comprises an isolation part; the rest of the trace in the conductive layer is the isolation part.

4. The flexible wiring board according to any one of claims 2 or 3, characterized by, The conductive layer is a single-layer conductive layer; the trace has a plurality of S-shaped structures, and opposite two parts of each S-shaped structure are the first part and the second part.

5. The flexible wiring board according to any one of claims 2 or 3, characterized by, The conductive layer is a single-layer conductive layer, and the trace has a spiral shape; the first part and the second part are both in a spiral shape and are arranged in a staggered manner.

6. The flexible wiring board according to any one of claims 2 or 3, characterized by, The conductive layer comprises a first conductive layer and a second conductive layer, and the first conductive layer and the second conductive layer are respectively located on two sides of the medium layer; the first part is prepared based on the first conductive layer, the second part is prepared based on the second conductive layer, and the first part and the second part are electrically connected through a connecting part; the connecting part is arranged through the medium layer.

7. The flexible wiring board according to claim 6, wherein The first part and the second part are sequentially connected head to tail through the connecting part to form a winding inductance.

8. The flexible wiring board according to claim 6, wherein The first part and the second part are both in a spiral shape; the first part is electrically connected to one end of the spiral-shaped center through the connecting part and the second part is electrically connected to one end of the spiral-shaped center.

9. The flexible wiring board according to claim 6, wherein, The medium layer has a preset dielectric constant.

10. The flexible wiring board according to claim 1, characterized by The trace has a preset width and a preset thickness.

11. A circuit assembly, characterized by The flexible circuit board of any one of claims 1 to 10 further comprises a pin; a control component is arranged on the flexible circuit board, and the control component is electrically connected to the pin and the trace respectively. The control component is a key.

12. The circuit assembly of claim 11, wherein, The pin comprises a first pin, a second pin, a third pin and a fourth pin; 13. The circuit assembly of claim 11, wherein, the control component comprises a first control component, a second control component and a third control component; the first pin is electrically connected to a first end of the first control component, a first end of the second control component and a first end of the third control component through the trace respectively; the second pin is electrically connected to a second end of the first control component; the third pin is electrically connected to a second end of the second control component; the fourth pin is electrically connected to a second end of the third control component. The circuit assembly of any one of claims 11 to 13 is arranged in the interior of the shell.

14. An electronic device, comprising: The circuit assembly of any one of claims 11 to 13 is arranged in the interior of the shell. ​ ​ ​

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