Anti-bending printed circuit board with built-in stress buffer layer

Abstract

The utility model discloses an anti-bending printed circuit board with a built-in stress buffer layer, which comprises a substrate, the upper end of the substrate is provided with a PU (polyurethane) layer, the upper end of the PU layer is provided with a conductive layer, the upper end of the conductive layer is provided with a covering film, the lower end of the substrate is contacted with two symmetrically distributed limiting strips, and the upper end of the substrate is provided with a stress buffer layer. Two limiting strips are arranged on the base plate, two side plates are fixedly connected to the side walls of the two limiting strips respectively, the limiting strips are arranged, the base plate is supported by the two limiting strips, the side plates limit the side walls of the base plate, the two connecting plates are installed in the side plates through a plurality of connecting blocks respectively, the connecting blocks are fixed through fixing bolts, the fixing bolts are used for fixing the connecting blocks, and the base plate is fixed through the fixing bolts. The connecting plates and the side plates are connected, the base plate is convenient to assemble and disassemble, meanwhile, the limiting assemblies are used for limiting the upper ends of the base plate and other components, the device uses the limiting strips and the limiting assemblies for limiting the base plate and other components, and heat dissipation of the base plate and other components is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of anti-bending printed circuit board, specifically to the anti-bending printed circuit board of built -in stress buffer layer. BACKGROUND

[0002] The anti-bending printed circuit board of built -in stress buffer layer is an advanced circuit board technology that combines the design of printed circuit boards and stress buffer layers to improve its performance and durability. The anti-bending printed circuit board of built -in stress buffer layer is a circuit board that features the addition of a stress buffer layer designed to reduce or eliminate internal stress caused by external factors such as temperature changes, mechanical stress, etc. This circuit board not only improves the stability and reliability of the circuit, but also withstands higher bending and twisting. The stress buffer layer is a critical component of the printed circuit board, and its main function is to absorb and disperse the stress that the circuit board may encounter during manufacturing and use. This helps prevent the circuit board from bending, breaking, or other forms of mechanical damage. In addition, the stress buffer layer can also improve the overall strength and rigidity of the circuit board.

[0003] The prior art provides an anti-interference bending-resistant multilayer printed circuit board (publication number: CN216217694U), which comprises an anti-interference bending-resistant structure and a circuit board. The anti-interference bending-resistant structure comprises an anti-bending frame, a bottom plate and a top cover. The anti-bending frame has a connecting port on the upper wall of both sides. The anti-bending frame has a bottom plate on the top. The anti-bending frame has a top cover on the top. The bottom plate has a circuit board installed on the top.

[0004] However, the device still has the following defects:

[0005] When using the device, the anti-bending frame, bottom plate and top cover are used to install the circuit board. The frame is not convenient to disassemble, and the installation of the circuit board is not convenient. The anti-bending frame and the bottom plate hinder the heat dissipation, thereby affecting the heat dissipation performance of the circuit board. Therefore, we need to provide an anti-bending printed circuit board with built-in stress buffer layer. INVENTION CONTENTS

[0006] The utility model discloses a purpose of providing anti-bending printed circuit board of built -in stress buffer layer, two limit strips support the substrate, and the side plate limits the side wall of the substrate. Two connecting plates are respectively installed in the inside of the side plate through a plurality of connecting blocks. The connecting blocks are fixed by using fixing bolts. The connecting plate and the side plate are connected. The substrate can be conveniently disassembled and assembled. At the same time, the upper end of the substrate and other components is limited by using the limiting assembly. The substrate and other components are limited by using the limiting strip and the limiting assembly. The substrate and other components can be conveniently cooled. The problems in the above background art are solved.

[0007] In order to achieve the above object, the utility model provides the following technical scheme:

[0008] The bending-resistant printed circuit board with the built-in stress buffer layer comprises a substrate, a PU layer arranged at the upper end of the substrate, a conductive layer arranged at the upper end of the PU layer, a film arranged at the upper end of the conductive layer, two limiting strips symmetrically arranged at the lower end of the substrate, two side plates fixedly connected to the side walls of the two limiting strips respectively, two connecting plates symmetrically arranged and slidably connected to the interiors of the two side plates, two connecting blocks symmetrically arranged and fixedly connected to the side walls of the two connecting plates respectively, and a limiting assembly arranged at the upper end of the film and used for limiting the film.

[0009] Preferably, the interiors of the two side plates are each provided with a fixing bolt, and the fixing bolts are threadedly connected to the connecting blocks respectively.

[0010] Preferably, the limiting assembly comprises two limiting blocks arranged at the upper end of the film respectively, the limiting blocks are slidably connected to the side plates respectively, two moving plates are slidably arranged at the outer sides of the limiting blocks respectively, a plurality of triangular blocks are fixedly connected to the side walls of the moving plates uniformly, and the triangular blocks are in contact with the limiting blocks respectively.

[0011] Preferably, a moving frame is fixedly connected to the side wall of each of the moving plates, the moving frames are slidably connected to the side plates respectively, and a spring is arranged on the side wall of each of the moving frames.

[0012] Preferably, a control plate is fixedly connected to the side wall of each of the moving frames, and the control plates are slidably connected to the side plates respectively.

[0013] Preferably, two sliding blocks symmetrically arranged are fixedly connected to the outer sides of each of the moving frames, and the sliding blocks are slidably connected to the side plates respectively.

[0014] Preferably, the side plates and the connecting plates are in contact with the substrate, the PU layer, the conductive layer and the film respectively.

[0015] Compared with the prior art, the utility model has the advantages that:

[0016] The limiting strips are arranged, the limiting strips support the substrate, the side plates limit the side walls of the substrate, the connecting plates are installed in the interiors of the side plates through the connecting blocks respectively, the connecting plates and the side plates are connected by fixing the connecting blocks by using the fixing bolts, the substrate is convenient to assemble and disassemble, the limiting assembly is used to limit the upper end of the substrate and other components, the limiting strips and the limiting assembly are used to limit the substrate and other components, and the substrate and other components are convenient to dissipate heat. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is one of structural schematic views of the utility model;

[0018] Figure 2 It is second structural schematic view of the utility model;

[0019] Figure 3 It is the unfolded structural schematic view of the utility model;

[0020] Figure 4 It is the structure of the utility model Figure 3 It is the local enlarged schematic view of A in the utility model;

[0021] Figure 5 It is the structural schematic view of the base plate, PU layer and other components of the utility model.

[0022] In the figure: 1, base plate; 2, PU layer; 3, conductive layer; 4, film; 5, limiting strip; 6, side plate; 7, connecting plate; 8, connecting block; 9, fixed bolt; 10, limiting block; 11, triangular block; 12, moving plate; 13, moving frame; 14, control panel; 15, sliding block; 16, spring. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0024] Please refer to Figures 1-5 The utility model provides a technical scheme:

[0025] The bending-resistant printed circuit board with built-in stress buffer layer comprises a base plate 1, the upper end of the base plate 1 is provided with a PU layer 2, the upper end of the PU layer 2 is provided with a conductive layer 3, the upper end of the conductive layer 3 is provided with a film 4, the lower end of the base plate 1 is in contact with two limiting strips 5 that are symmetrically distributed, two side plates 6 are fixedly connected to the side walls of the two limiting strips 5 respectively, two connecting plates 7 that are symmetrically distributed are slidingly connected to the interiors of the two side plates 6, two connecting blocks 8 that are symmetrically distributed are fixedly connected to the side walls of the two connecting plates 7 respectively, a plurality of connecting blocks 8 are slidingly connected with the two side plates 6 respectively, a fixed bolt 9 is arranged in the interior of each of the two side plates 6, a plurality of fixed bolts 9 are threadedly connected with a plurality of connecting blocks 8 respectively, and the upper end of the film 4 is provided with a limiting assembly for limiting the film 4.

[0026] Exemplarily, the substrate 1 supports the two limiting strips 5, the PU layer 2 installs the conductive layer 3 and reduces the stress inside the device, the conductive layer 3 installs the electronic element, the film 4 is attached to the outside of the electronic element to protect the electronic element, the side plate 6 limits the side wall of the substrate 1, the two connecting plates 7 are respectively installed inside the side plate 6 through the plurality of connecting blocks 8, the connecting blocks 8 are fixed by the fixing bolts 9, the connecting plate 7 and the side plate 6 are connected, and the substrate 1 is convenient to assemble and disassemble.

[0027] The limiting assembly comprises two limiting blocks 10 respectively arranged at the upper end of the film 4, the two limiting blocks 10 are respectively in sliding connection with the two side plates 6, the outer side of the two limiting blocks 10 is respectively slidably provided with two moving plates 12, a plurality of triangular blocks 11 are uniformly arranged and fixedly connected to the side wall of the plurality of moving plates 12, the two triangular blocks 11 are respectively in contact with the two limiting blocks 10, a moving frame 13 is fixedly connected to the side wall of each of the plurality of moving plates 12, the plurality of moving frames 13 are respectively in sliding connection with the side plate 6, a control plate 14 is fixedly connected to the side wall of each of the plurality of moving frames 13, the plurality of control plates 14 are respectively in sliding connection with the side plate 6, two sliding blocks 15 are symmetrically arranged and fixedly connected to the outer side of each of the plurality of moving frames 13, the plurality of sliding blocks 15 are respectively in sliding connection with the side plate 6, and a spring 16 is arranged on the side wall of each of the plurality of moving frames 13.

[0028] Exemplarily, the limiting block 10 is slid into the inside of the side plate 6, the limiting block 10 is in contact with the triangular block 11 to extrude the triangular block 11, the triangular block 11 drives the moving plate 12 to move, the limiting block 10 is clamped at different heights through the outer side of the triangular block 11 clamped at different positions, the limiting block 10 limits the film 4, the control plate 14 is moved, the control plate 14 drives the moving frame 13 to move, the moving frame 13 controls the position of the moving plate 12, when the moving frame 13 moves, the sliding block 15 guides the moving frame 13, and the spring 16 resets the moving frame 13.

[0029] The two side plates 6 and the two connecting plates 7 are respectively in contact with the substrate 1, the PU layer 2, the conductive layer 3 and the film 4.

[0030] Exemplarily, the two side plates 6 and the two connecting plates 7 limit the substrate 1, the PU layer 2, the conductive layer 3 and the film 4.

[0031] Working principle: the utility model uses, the base plate 1 supports two limit strip 5 to the base plate 1, PU layer 2 installs to the conductive layer 3, reduces the stress inside the device simultaneously, the conductive layer 3 installs electronic component, the film 4 is pasted on the outside of electronic component, protects electronic component, the side plate 6 limits the side wall of base plate 1, two connecting plates 7 are installed in the inside of side plate 6 respectively through multiple connecting blocks 8, in use fixed bolt 9 is fixed to connecting block 8, realizes the connection of connecting plate 7 and side plate 6, and the loading and unloading of base plate 1 is convenient;

[0032] The limiting block 10 is slid into the inside of the side plate 6, the limiting block 10 is in contact with the triangular block 11, the triangular block 11 is extruded, the triangular block 11 drives the moving plate 12 to move, the limiting block 10 is clamped on the outside of the triangular block 11 in different positions, the limiting block 10 is clamped at different heights, the limiting block 10 limits the film 4, the moving control plate 14 drives the moving frame 13 to move, the moving frame 13 controls the position of the moving plate 12, when the moving frame 13 moves, the sliding block 15 guides the moving frame 13, and the spring 16 resets the moving frame 13.

[0033] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A flexurally-rigid printed wiring board with a built-in stress buffer layer, comprising a substrate (1), characterized in that: The upper end of the substrate (1) is provided with a PU layer (2), the upper end of the PU layer (2) is provided with a conductive layer (3), the upper end of the conductive layer (3) is provided with a film (4), the lower end of the substrate (1) is in contact with two limit strips (5) distributed symmetrically, two side plates (6) are fixedly connected to the side walls of the two limit strips (5) respectively, two connecting plates (7) are slidingly connected inside the two side plates (6) and are distributed symmetrically, two connecting blocks (8) are fixedly connected to the side walls of the two connecting plates (7) respectively and are distributed symmetrically, a plurality of connecting blocks (8) are slidingly connected with the two side plates (6) respectively, and the upper end of the film (4) is provided with a limiting assembly for limiting the film (4).

2. The built-in stress buffer layer flex-resistant printed wiring board according to claim 1, wherein: The inner sides of the two side plates (6) are each provided with a fixed bolt (9), and a plurality of fixed bolts (9) are threadedly connected with a plurality of connecting blocks (8) respectively.

3. The built-in stress buffer layer flex-resistant printed wiring board according to claim 1, wherein: The limiting assembly comprises two limiting blocks (10) arranged at the upper end of the film (4), the two limiting blocks (10) are slidingly connected with the two side plates (6) respectively, the outer sides of the two limiting blocks (10) are slidingly provided with two moving plates (12) respectively, a plurality of triangular blocks (11) are fixedly connected to the side walls of the plurality of moving plates (12) and are uniformly distributed, and the two triangular blocks (11) are in contact with the two limiting blocks (10) respectively.

4. The built-up stress buffer layer flex-resistant printed wiring board of claim 3, wherein: The side walls of the plurality of moving plates (12) are each fixedly connected with a moving frame (13), the plurality of moving frames (13) are slidingly connected with the side plates (6) respectively, and the side walls of the plurality of moving frames (13) are respectively provided with springs (16).

5. The built-up stress buffer layer flex-resistant printed wiring board of claim 4, wherein: The side walls of the plurality of moving frames (13) are each fixedly connected with a control plate (14), and the plurality of control plates (14) are slidingly connected with the side plates (6) respectively.

6. The built-up stress buffer layered flexurally-rigid printed wiring board according to claim 5, wherein: The outer sides of the plurality of moving frames (13) are each fixedly connected with two sliding blocks (15) distributed symmetrically, and the plurality of sliding blocks (15) are slidingly connected with the side plates (6) respectively.

7. The built-up stress buffer layer flex-resistant printed wiring board of claim 6, wherein: The two side plates (6) and the two connecting plates (7) are in contact with the substrate (1), the PU layer (2), the conductive layer (3), and the film (4).

Images