Flexible circuit board laminated structure with electromagnetic shielding function

Abstract

The utility model relates to a flexible circuit board laminated structure with an electromagnetic shielding function, which comprises a circuit board body, the circuit board body is placed in a support frame body in a lower frame, an upper frame is arranged above the lower frame, four cylinders at the top of the lower frame are respectively aligned with four circular grooves in the upper frame, and limiting rings are arranged in the circular grooves. The buckling plates on the two sides of the column body penetrate through the limiting ring, the two buckling plates deform, when the bottoms of the two buckling plates are attached to the top of the limiting ring, the upper frame is limited to the top of the lower frame, two arc-shaped protruding parts are arranged on the surface of the column body and attached to the inner wall of the limiting ring, the situation that the upper frame shakes disorderly is avoided, and when the upper frame needs to be dismantled, the two buckling plates are pressed at the same time to deform is avoided; due to the fact that the spring is arranged in the groove body of the lower frame, when the two buckle plates are pressed at the same time to enable the buckle plates to penetrate through the interior of the limiting ring, the spring can enable the upper frame to be away from the lower frame, and separation of the upper frame is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to flexible circuit board equipment technical field, concretely is flexible circuit board laminated structure with electromagnetic shielding function. BACKGROUND

[0002] PCB circuit board, that is, printed circuit board, is the provider of electrical connection of electronic components, and its design mainly is layout design, and the main advantage of adopting circuit board is that wiring and assembly errors are greatly reduced, and automation level and production labor rate are improved, before the appearance of printed circuit board, the interconnection between electronic components is directly connected by relying on electric wire to form complete circuit, in the prior art, the PCB circuit board does not have corner protection structure, and the corner is vulnerable to damage or wear by impact, which affects the service life of the circuit board, and the circuit board without electromagnetic shielding is more susceptible to external electromagnetic interference. These interferences can cause the performance of electronic components on the circuit board to decline, misoperation or failure.

[0003] For example, the authorized patent document of the flexible circuit board laminated structure disclosed in the application No. CN201721487834.5 includes a base layer, the upper and lower surfaces of the base layer are respectively provided with a copper foil layer, the outer surfaces of each copper foil layer are respectively provided with a shielding layer, and the shielding layer includes a protective layer, a conductive layer and a resin layer which are sequentially stacked.

[0004] The above-mentioned patent does not have corner protection structure, and the corner is vulnerable to damage or wear by impact, which affects the service life of the circuit board, therefore, we need to provide flexible circuit board laminated structure with electromagnetic shielding function. UTILITY MODEL CONTENT

[0005] The utility model discloses a flexible circuit board laminated structure with electromagnetic shielding function, which is characterized in that an outer frame protection mechanism is arranged on the surface of the circuit board body to protect the edge of the circuit board, thereby significantly improving the impact resistance and wear resistance of the edge of the circuit board, and facilitating the separation of the outer frame protection mechanism from the circuit board body for assembly operation, thereby solving the problem of the lack of corner protection structure in the prior art, which causes the corner to be vulnerable to damage or wear by impact and affects the service life of the circuit board.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a flexible circuit board laminated structure with electromagnetic shielding function, comprising:

[0007] a circuit board body;

[0008] The top of the circuit board body is provided with an electromagnetic shielding mechanism;

[0009] The surface of the circuit board body is provided with an outer frame protection mechanism for protecting the circuit board body.

[0010] Preferably, the electromagnetic shielding mechanism comprises a protective film layer arranged on the top of the circuit board body, the top of the protective film layer is provided with a adhesive film layer, and the top of the adhesive film layer is provided with a shielding layer.

[0011] Preferably, the top of the shielding layer is provided with an insulating layer, and the top of the insulating layer is provided with a carrier layer plate.

[0012] Preferably, the outer frame protection mechanism comprises a lower frame arranged at the bottom of the circuit board body, the inner wall of the lower frame is fixedly provided with a supporting frame body, the bottom of the circuit board body is attached to the top of the supporting frame body, the top of the lower frame is provided with an upper frame, the inner wall of the upper frame is fixedly provided with a frame sealing body attached to the carrier layer plate, and the upper frame and the lower frame are connected through a clamping assembly.

[0013] Preferably, the clamping assembly comprises four columns fixedly arranged at the top of the lower frame, the two sides of the four columns are integrally provided with deformable clamping plates, the surfaces of the four columns are provided with limiting rings, the bottom of the clamping plate is attached to the top of the limiting ring, the inside of the upper frame is provided with four circular grooves, and the four limiting rings are arranged in the four circular grooves.

[0014] Preferably, the top of the lower frame is provided with four groove bodies, the inside of the four groove bodies is clamped with springs, the top of the four springs is clamped with push plates, and the top of the four push plates is attached to the bottom of the upper frame.

[0015] Preferably, the bottom of the four push plates is fixedly provided with guide columns, and the surface of the guide column is movably sleeved with the inside of the spring.

[0016] Preferably, the two sides of the lower frame are fixedly provided with assembling plates, and the inside of the two assembling plates is provided with two reserved holes.

[0017] Compared with the prior art, the utility model has the advantages that:

[0018] The utility model discloses an outer frame protection mechanism is arranged on the surface of the circuit board body, and the circuit board edge is protected, the impact resistance and wear resistance of the circuit board edge can be improved obviously, and the outer frame protection mechanism can be separated from the circuit board body conveniently, so that the assembling operation is facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is the structure three -dimensional schematic view of the utility model;

[0020] Figure 2 It is the electromagnetic shielding mechanism three -dimensional drawing of the utility model;

[0021] Figure 3The utility model discloses a local structure perspective view of the utility model.

[0022] Figure 4 The utility model discloses a clamping assembly perspective view.

[0023] In the figure: 1, the circuit board body; 2, electromagnetic shielding mechanism; 21, protective film layer; 22, adhesive film layer; 23, shielding layer; 3, outer frame protection mechanism; 31, lower frame; 32, bracket body; 33, upper frame; 34, frame sealing body; 30, clamping assembly; 301, cylinder; 302, buckle plate; 303, limiting ring; 304, circular groove; 4, insulating layer; 5, carrier layer board; 6, groove; 7, spring; 8, push plate; 9, guide column; 10, assembly plate; 11, reserved hole. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0025] Please refer to Figures 1-4 The utility model provides a technical scheme: flexible circuit board laminated structure with electromagnetic shielding function, comprising:

[0026] Circuit board body 1;

[0027] The top of circuit board body 1 is provided with electromagnetic shielding mechanism 2;

[0028] The surface of circuit board body 1 is provided with outer frame protection mechanism 3 for protecting circuit board body 1.

[0029] Electromagnetic shielding mechanism 2 includes protective film layer 21 arranged on the top of circuit board body 1, the top of protective film layer 21 is provided with adhesive film layer 22, and the top of adhesive film layer 22 is provided with shielding layer 23;

[0030] Specifically, the surface of circuit board body 1 is provided with outer frame protection mechanism 3, the edge of circuit board is protected, the impact resistance and wear resistance of the edge of circuit board can be improved significantly, and the outer frame protection mechanism 3 can be separated from circuit board body 1, so that assembly operation is facilitated.

[0031] The top of shielding layer 23 is provided with insulating layer 4, and the top of insulating layer 4 is provided with carrier layer board 5;

[0032] In this embodiment, the shielding electric field and electromagnetic interference, protect the insulation wire and cable, semi-conductive shielding layer 23 can be uniform electric field, avoid the local discharge caused by the conductor surface is not smooth or air gap, protective film layer 21, protect the circuit board from moisture, dust, grease, corrosion and mechanical impact and other adverse factors, metal shielding layer 23 is usually made of copper belt or copper wire wrapped, further improve the shielding effect, adhesive film layer 22 provides additional mechanical strength, increase the circuit board's shock resistance and impact resistance, insulation layer 4 isolation between different electronic components, prevent short circuit or other electrical failure, body layer board as the carrier of electronic components, provide a stable platform;

[0033] Wherein, the circuit board body 1 is placed in the lower frame 31 in the frame body 32, and the upper frame 33 is arranged above the lower frame 31, the four columns 301 on the top of the lower frame 31 are aligned with the four circular grooves 304 in the upper frame 33 respectively, the limiting ring 303 is arranged in the circular groove 304, the two buckle plates 302 on both sides of the column 301 are penetrated through the limiting ring 303, the two buckle plates 302 are deformed, when the bottom of the two buckle plates 302 is in close contact with the top of the limiting ring 303, the upper frame 33 is limited on the top of the lower frame 31, and the surface of the column 301 is provided with two arc convex parts which are in close contact with the inner wall of the limiting ring 303, so as to avoid the shaking of the upper frame 33, when it is necessary to disassemble, the two buckle plates 302 are pressed at the same time to deform and separate from the limiting ring 303, so that the upper frame 33 can be separated from the lower frame 31, because the spring 7 is arranged in the groove 6 of the lower frame 31, when the two buckle plates 302 are penetrated through the inside of the limiting ring 303 by pressing at the same time, the spring 7 will move the upper frame 33 away from the lower frame 31, so as to facilitate the separation of the upper frame 33.

[0034] The outer frame protection mechanism 3 comprises a lower frame 31 arranged at the bottom of the circuit board body 1, a frame body 32 is fixedly installed on the inner wall of the lower frame 31, the bottom of the circuit board body 1 is in close contact with the top of the frame body 32, and an upper frame 33 is arranged on the top of the lower frame 31, an enclosing frame body 34 is fixedly installed on the inner wall of the upper frame 33 and is in close contact with the carrier layer 5, and the upper frame 33 and the lower frame 31 are connected through the clamping assembly 30.

[0035] Specifically, the circuit board body 1 is placed in the frame body 32 in the lower frame 31, and the upper frame 33 is arranged above the lower frame 31, so as to effectively protect the edge of the circuit board, and the clamping assembly 30 is used to facilitate the assembly operation of the upper frame 33 and the lower frame 31.

[0036] The clamping assembly 30 comprises four columns 301 fixedly installed on the top of the lower frame 31, both sides of the four columns 301 are integrally processed with deformable buckle plates 302, the surfaces of the four columns 301 are provided with limiting rings 303, the bottoms of the buckle plates 302 are in close contact with the tops of the limiting rings 303, and the inside of the upper frame 33 is provided with four circular grooves 304, and the four limiting rings 303 are arranged in the four circular grooves 304 respectively;

[0037] Further, the four columns 301 on the top of the lower frame 31 are aligned with the four circular grooves 304 in the upper frame 33 respectively, the limiting rings 303 are arranged in the circular grooves 304, the two buckle plates 302 penetrate through the limiting rings 303, the two buckle plates 302 are deformed, when the bottoms of the two buckle plates 302 are in close contact with the tops of the limiting rings 303, the upper frame 33 is limited on the top of the lower frame 31, and the surfaces of the columns 301 are provided with two arc-shaped protrusions in close contact with the inner walls of the limiting rings 303, so that the upper frame 33 is prevented from shaking, when it needs to be disassembled, the two buckle plates 302 are pressed to deform and are separated from the limiting rings 303, so that the upper frame 33 can be separated from the lower frame 31.

[0038] The top of the lower frame 31 is provided with four groove bodies 6, the inside of each of the four groove bodies 6 is clamped with a spring 7, the top of each of the four springs 7 is clamped with a push plate 8, and the top of each of the four push plates 8 is in close contact with the bottom of the upper frame 33.

[0039] It is worth noting that since the springs 7 are arranged in the groove bodies 6 of the lower frame 31, when the two buckle plates 302 are pressed at the same time to penetrate through the inside of the limiting ring 303, the springs 7 can move the upper frame 33 away from the lower frame 31, so that the upper frame 33 is separated conveniently.

[0040] The bottom of each of the four push plates 8 is fixedly installed with a guide column 9, and the surface of the guide column 9 is movably sleeved with the inside of the spring 7.

[0041] The guide column 9 arranged in the spring 7 can protect the spring 7 to a certain extent.

[0042] Both sides of the lower frame 31 are fixedly installed with assembly plates 10, and the inside of each of the two assembly plates 10 is provided with two reserved holes 11.

[0043] Specifically, the assembly plates 10 provided with the reserved holes 11 are arranged on both sides of the lower frame 31, so that the lower frame 31 is assembled conveniently.

[0044] The device shields electric field and electromagnetic interference, protects insulating wire and cable, the semi-conductive shielding layer 23 can uniform electric field, avoids partial discharge caused by conductor surface roughness or air gap, the protective film layer 21, the protective circuit board is protected from moisture, dust, grease, corrosion and mechanical impact and other adverse factors, the metal shielding layer 23 is usually wrapped by copper belt or copper wire, further improves shielding effect, the adhesive film layer 22 provides additional mechanical strength, increases the shock resistance and impact resistance of the circuit board, the insulating layer 4 isolates the current between different electronic components, prevents short circuit or other electrical faults, the body layer board serves as the carrier of supporting electronic components, provides stable platform;

[0045] Wherein, the circuit board body 1 is placed in the supporting frame body 32 in the lower frame 31, and the upper frame 33 is arranged above the lower frame 31, four columns 301 on the top of the lower frame 31 are respectively aligned with four circular grooves 304 in the upper frame 33, a limiting ring 303 is arranged in the circular groove 304, the two buckle plates 302 on both sides of the column 301 are penetrated through the limiting ring 303, the two buckle plates 302 are deformed, when the bottom of the two buckle plates 302 is attached to the top of the limiting ring 303, the upper frame 33 is limited on the top of the lower frame 31, and the surface of the column 301 is provided with two arc-shaped protrusions attached to the inner wall of the limiting ring 303, so as to avoid the shaking of the upper frame 33, when disassembling, the two buckle plates 302 are simultaneously pressed to be deformed and separated from the limiting ring 303, so that the upper frame 33 can be separated from the lower frame 31, since the spring 7 is arranged in the groove 6 of the lower frame 31, when the two buckle plates 302 are simultaneously pressed to penetrate through the inside of the limiting ring 303, the spring 7 drives the upper frame 33 away from the lower frame 31, so as to facilitate the separation of the upper frame 33. Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A flexible wiring board laminated structure having an electromagnetic shielding function, characterized by, Include: Circuit board body (1); The top of the circuit board body (1) is provided with an electromagnetic shielding mechanism (2); The surface of the circuit board body (1) is mounted with an outer frame protection mechanism (3) for protecting the circuit board body (1).

2. The flexible wiring board laminated structure having electromagnetic shielding function according to claim 1, characterized by: The electromagnetic shielding mechanism (2) comprises a protective film layer (21) arranged on the top of the circuit board body (1), the top of the protective film layer (21) is provided with a glue film layer (22), and the top of the glue film layer (22) is mounted with a shielding layer (23).

3. The flexible wiring board laminated structure having electromagnetic shielding function according to claim 2, characterized by: The top of the shielding layer (23) is provided with an insulating layer (4), and the top of the insulating layer (4) is provided with a carrier layer plate (5).

4. The flexible wiring board laminated structure having electromagnetic shielding function according to claim 3, characterized by: The outer frame protection mechanism (3) comprises a lower frame (31) arranged at the bottom of the circuit board body (1), the inner wall of the lower frame (31) is fixedly mounted with a supporting frame body (32), the bottom of the circuit board body (1) is attached to the top of the supporting frame body (32), and the top of the lower frame (31) is provided with an upper frame (33), the inner wall of the upper frame (33) is fixedly mounted with a frame sealing body (34) attached to the carrier layer plate (5), and the upper frame (33) and the lower frame (31) are connected through a clamping assembly (30).

5. The flexible wiring board laminated structure having electromagnetic shielding function according to claim 4, characterized by: The clamping assembly (30) comprises four columns (301) fixedly installed on the top of the lower frame (31), the two sides of the four columns (301) are integrally processed with deformable buckle plates (302), the surfaces of the four columns (301) are provided with limiting rings (303), and the bottom of the buckle plate (302) is attached to the top of the limiting ring (303), the inside of the upper frame (33) is provided with four circular grooves (304), and the four limiting rings (303) are arranged in the four circular grooves (304) respectively.

6. The flexible wiring board laminated structure having electromagnetic shielding function according to claim 5, wherein: The top of the lower frame (31) is provided with four groove bodies (6), the inside of the four groove bodies (6) is clamped with springs (7), the top of the four springs (7) is clamped with push plates (8), and the top of the four push plates (8) is attached to the bottom of the upper frame (33).

7. The flexible wiring board laminated structure having electromagnetic shielding function according to claim 6, wherein: The bottom of the four push plates (8) is fixedly installed with guide columns (9), and the surface of the guide column (9) is movably sleeved with the spring (7).

8. The flexible wiring board laminated structure having electromagnetic shielding function according to claim 7, wherein: The two sides of the lower frame (31) are fixedly installed with assembly plates (10), and two reserved holes (11) are arranged in the inside of the two assembly plates (10).

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