Surface mounting process circuit board with rapid positioning structure

Abstract

The utility model discloses a surface mount technology circuit board with a rapid positioning structure, comprising a circuit board main body, the upper surface of the circuit board main body is fixedly connected with two groups of optical reference points, the two groups of optical reference points are arranged diagonally, the diameter of the optical reference points is set to be 1.0-3.0 mm, and the diameter of the optical reference points is set to be 1.0-3.0 mm. The circuit board main body is provided with a plurality of groups of positioning holes, the plurality of groups of positioning holes are asymmetrically arranged, and the aperture of the plurality of groups of positioning holes is set to be 2.0-3.0 mm. According to the utility model, a composite positioning mechanism of combining the asymmetrical positioning holes, the optical point positions and the heat balance copper layer is adopted, so that the heat balance copper layer can be combined with the optical point positions; the problems of low positioning precision, poor equipment compatibility and thermal deformation deviation of a traditional circuit board are effectively solved, high-precision mounting and high thermal deformation resistance are achieved, the SMT production efficiency and yield are remarkably improved by combining a fool-proof notch and a flexible board reinforcing structure, meanwhile, the circuit board can be prevented from being reversely installed through the design of symmetrical positioning holes, and production accidents are reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board mounting, in particular to surface mounting process circuit board with quick positioning structure. BACKGROUND

[0002] Flexible circuit board (abbreviation FPC) is a kind of printed circuit board made of flexible insulating substrate, also known as soft board or flexible circuit board, it has the characteristics of light weight, thin thickness, free bending, folding, etc., is the key component of the miniaturization, light weight, high density of electronic products, FPC can be freely bent, wound and folded, can withstand millions of dynamic bending without damaging the wire, suitable for various complex shape and space layout requirements, flexible circuit board plays a vital role in electronic equipment, provides support and connection for electronic components, is the cornerstone of normal operation of electronic equipment, with the increasingly complex function of electronic products, the mounting precision of flexible circuit board is also higher and higher.

[0003] Traditional PCB design usually relies on general positioning hole or single optical reference point to realize the positioning of SMT equipment to circuit board, and mounting deviation is caused by machining tolerance, thermal expansion or equipment compatibility, therefore we need to provide surface mounting process circuit board with quick positioning structure. UTILITY MODEL CONTENT

[0004] The utility model aims at providing surface mounting process circuit board with quick positioning structure, aims at solving the problem that general positioning hole or single optical reference point is usually relied on to realize the positioning of SMT equipment to circuit board in prior art, and mounting deviation is caused by machining tolerance, thermal expansion or equipment compatibility.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0006] Surface mounting process circuit board with quick positioning structure, including circuit board main part, the upper surface of circuit board main part is fixedly connected with two groups of optical reference points, two groups of optical reference points adopt diagonal setting, the diameter of optical reference point is set as 1.0~3.0mm, and a plurality of groups of positioning holes are set up on the circuit board main part, a plurality of groups of positioning holes adopt asymmetric setting, the aperture of a plurality of groups of positioning holes is set as 2.0~3.0mm, the lower surface of circuit board main part is provided with reinforcing layer.

[0007] Preferably, the circuit board main part is respectively reserved with copper-free area outside a plurality of groups of positioning holes, and the diameter of copper-free area exceeds the aperture of positioning hole by 0.5mm.

[0008] Preferably, a plurality of groups of foolproof notches are set up on the circuit board main part, and a plurality of groups of foolproof notches are respectively communicated with the inside of a plurality of positioning holes.

[0009] Preferably, U-shaped notches are formed on both sides of the circuit board body.

[0010] Preferably, the reinforcing layer is riveted to the lower surface of the circuit board body, and the reinforcing layer is made of stainless steel sheet.

[0011] Preferably, the circuit board body comprises a cover layer, the inner side of the cover layer is provided with a top copper layer, the inner side of the top copper layer is provided with an insulating base material layer, the inner side of the insulating base material layer is provided with a bottom copper layer, and the reinforcing layer is arranged on the top of the bottom copper layer.

[0012] Preferably, the insulating base material layer is made of polyimide base material, and the cover layer is reserved with holes corresponding to the positioning holes and the optical reference points.

[0013] Compared with the prior art, the utility model has the beneficial effects that:

[0014] The utility model discloses a positioning mechanism combining asymmetric positioning holes, optical points and heat balance copper layers, which effectively solves the problems of low positioning precision, poor equipment compatibility and thermal deformation deviation of traditional circuit boards, realizes high-precision mounting and strong thermal deformation resistance, significantly improves SMT production efficiency and yield by combining foolproof notches and flexible plate reinforcing structures, and the design of symmetrical positioning holes can avoid reverse installation of the circuit board and reduce production accidents. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the utility model;

[0016] Figure 2 It is a structural schematic diagram of the circuit board body and the reinforcing layer of the utility model;

[0017] Figure 3 It is a structural schematic diagram of the utility model Figure 2 It is an enlarged structural schematic diagram of A in the utility model;

[0018] Figure 4 It is a structural schematic diagram of the circuit board body of the utility model.

[0019] In the drawing: 1, circuit board body;101, cover layer;102, top copper layer;103, insulating base material layer;104, bottom copper layer;2, optical reference point;3, positioning hole;4, reinforcing layer;5, copper-free area;6, foolproof notch;7, U-shaped notch. DETAILED DESCRIPTION

[0020] Clearly and completely describe the technical scheme in the embodiments of the utility model with reference to the drawings in the embodiments of the utility model, apparently, the described embodiment is only a part of the embodiment of the utility model, and is not all the embodiment. Based on the embodiment in the utility model, all other embodiments obtained by the ordinary skill in the art without making creative labor belong to the range of protection of the utility model.

[0021] Please refer to Figures 1-4 The utility model provides a technical scheme:

[0022] The surface mount technology circuit board with quick positioning structure includes circuit board main body 1, the upper surface of circuit board main body 1 is fixedly connected with two groups of optical reference points 2, two groups of optical reference points 2 adopt diagonal setting, the diameter of optical reference point 2 is set as 1.0~3.0mm, and a plurality of groups of positioning holes 3 are set up on circuit board main body 1, a plurality of groups of positioning holes 3 adopt asymmetric setting, the aperture of a plurality of groups of positioning holes 3 is set as 2.0~3.0mm, the lower surface of circuit board main body 1 is provided with reinforcing layer 4, by adopting the composite positioning mechanism of asymmetric positioning hole 3, optical point and heat balance copper layer combination, effectively solve the problems, such as low positioning precision, poor equipment compatibility and thermal deformation deviation of traditional circuit board, realize high-precision mounting and strong thermal deformation resistance, combined with foolproof gap 6 and flexible plate reinforcing structure, significantly improve SMT production efficiency and yield, and the design of symmetric positioning hole 3 can avoid the reverse installation of circuit board, and reduce production accidents;

[0023] Further, the circuit board main body 1 is located at the outside of a plurality of groups of positioning holes 3 and is reserved with a copper-free area 5, and the diameter of the copper-free area 5 exceeds the aperture of the positioning hole 3 by 0.5 mm. In the SMT process, the copper layer is the main component of the circuit and is responsible for the conduction of current. If there is a copper layer around the positioning hole, it may be accidentally contacted due to foreign matter, debris or improper operation during installation or transportation, resulting in short circuit. The setting of the copper-free area 5 effectively isolates this risk, which provides a safe isolation zone to ensure that the circuit around the positioning hole 3 will not be short-circuited due to accidental contact. At the same time, the copper-free area 5 also helps to reduce electromagnetic interference and improve the overall performance of the circuit board.

[0024] Further, a plurality of foolproof gaps 6 are formed on the circuit board main body 1, and the plurality of foolproof gaps 6 are respectively in communication with the interiors of the plurality of positioning holes 3. By setting the foolproof gaps 6, the mounting positioning precision is further improved.

[0025] It is worth noting that U-shaped notches 7 are formed on both sides of the circuit board main body 1. The design of the U-shaped notches 7 takes into account the deformation characteristics of the circuit board when it is heated and cooled or under stress, providing a certain deformation space for the circuit board while maintaining the stability of the overall structure.

[0026] The reinforcing layer 4 is riveted to the lower surface of the circuit board body 1, and the reinforcing layer 4 is made of stainless steel sheet, and the reinforcing layer 4, as a reinforcing structure, is usually used to enhance the mechanical strength of the circuit board, prevent it from deforming or breaking during processing, assembly or use, when the reinforcing layer 4 is used with the circuit board with the U-shaped notch 7, the interaction force between the two is effectively dispersed and transmitted, the reinforcing layer 4 provides additional support for the circuit board through its solid structure, and the U-shaped notch 7 provides precise positioning points for the support, and this cooperation ensures that the circuit board can maintain relative flatness when subjected to external force or temperature change, effectively inhibiting the occurrence of warping phenomenon;

[0027] Further, the circuit board body 1 comprises a cover layer 101, the inner side of the cover layer 101 is provided with a top copper layer 102, the inner side of the top copper layer 102 is provided with an insulating substrate layer 103, the inner side of the insulating substrate layer 103 is provided with a bottom copper layer 104, and the reinforcing layer 4 is arranged on the top of the bottom copper layer 104;

[0028] The material of the insulating substrate layer 103 is made of polyimide substrate, and the cover layer 101 is reserved with holes corresponding to the positioning hole 3 and the optical reference point 2, the polyimide substrate has very high thermal stability, and its glass transition temperature is as high as hundreds of degrees Celsius, and even in some special varieties, it can exceed 500 DEG C, which means that it can maintain the stability of physical and chemical properties in high temperature environment, and is suitable for electronic components that need to withstand high temperature, in addition, the SMT chip mounter adopts a "mechanical clamp + visual correction" mode, and the steel screen printing offset is ≤±0.05mm.

[0029] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A surface mount technology circuit board with a quick positioning structure, comprising a circuit board main body (1), characterized in that: The upper surface of the circuit board body (1) is fixedly connected with two groups of optical reference points (2), the two groups of optical reference points (2) are diagonally arranged, the diameter of the optical reference point (2) is 1.0-3.0mm, and a plurality of groups of positioning holes (3) are formed on the circuit board body (1), the plurality of groups of positioning holes (3) are asymmetrically arranged, the diameter of the plurality of groups of positioning holes (3) is 2.0-3.0mm, and the lower surface of the circuit board body (1) is provided with a reinforcing layer (4).

2. The surface mount process circuit board with quick positioning structure of claim 1, wherein: The circuit board body (1) is located outside the plurality of groups of positioning holes (3) and is provided with a copper-free area (5), and the diameter of the copper-free area (5) exceeds the hole diameter of the positioning hole (3) by 0.5mm.

3. The surface mount process circuit board with quick positioning structure of claim 1, wherein: A plurality of groups of fool-proof notches (6) are formed on the circuit board body (1), and the plurality of groups of fool-proof notches (6) are respectively in communication with the interiors of the plurality of positioning holes (3).

4. The surface mount process circuit board with quick positioning structure of claim 1, wherein: U-shaped notches (7) are respectively formed on the two sides of the circuit board body (1).

5. The surface mount process circuit board with quick positioning structure of claim 1, wherein: The reinforcing layer (4) is riveted to the lower surface of the circuit board body (1), and the reinforcing layer (4) is made of stainless steel sheet.

6. The surface mount process circuit board with quick positioning structure of claim 1, wherein: The circuit board body (1) comprises a cover layer (101), the inner side of the cover layer (101) is provided with a top copper layer (102), the inner side of the top copper layer (102) is provided with an insulating substrate layer (103), the inner side of the insulating substrate layer (103) is provided with a bottom copper layer (104), and the reinforcing layer (4) is arranged on the top of the bottom copper layer (104).

7. The surface mount process circuit board with quick positioning structure of claim 6, wherein: The material of the insulating substrate layer (103) is made of polyimide substrate, and the cover layer (101) is provided with holes corresponding to the positioning holes (3) and the optical reference points (2).

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