Ultrathin interconnection lamination module circuit board with optimized multilayer structure

Abstract

The utility model discloses an ultrathin interconnection lamination module circuit board with an optimized multi-layer structure, which comprises a plurality of conducting layers and a plurality of insulating layers, and a radiating fin is fixedly attached to the surface of the conducting layer at the topmost part; heat dissipation holes are formed among the conducting layer, the insulating layer and the heat dissipation fins in an aligned mode, a heat dissipation channel is formed among the multiple heat dissipation holes, and the inner wall of the heat dissipation channel is coated with a protective coating; the edge of the circuit board composed of the conductive layer and the insulating layer is wrapped with an outer frame, and an insulating pad is arranged between the inner wall of the outer frame and the outer side of the circuit board. According to the utility model, through the aluminum alloy radiating fins and the ceramic-based coating radiating channels, heat is rapidly conducted and heat exchange is realized, high-efficiency radiating is realized, and the stability of the circuit board is improved; an insulating layer composed of an aluminum alloy outer frame for supporting, a silicone rubber insulating pad for buffering and epoxy resin and carbon fibers is used for enhancing strength, resisting external force, reducing fracture layering and improving reliability.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of circuit board, concretely relates to a super thin interconnection lamination module circuit board of multilayer structure optimization. BACKGROUND

[0002] Under the background of the rapid development of modern electronic technology, electronic equipment is marching towards miniaturization, lightness and high performance. Whether it is a consumer electronic product such as a smart phone or a tablet computer, or an electronic product in a high-end field such as a communication base station or an aerospace device, it puts forward more and more strict requirements for the internal core component circuit board. The super thin interconnection lamination module circuit board of multilayer structure optimization emerges as the times require to meet the performance requirements of the upgrading of electronic equipment. However, the existing such circuit board still has many problems to be solved.

[0003] In terms of heat dissipation, the integration of electronic equipment is continuously improved, and electronic components are densely distributed in a small space. The heat generated during work accumulates in large quantities. The traditional heat dissipation method is difficult to meet the demand. The ordinary circuit board has a simple heat dissipation structure and only relies on natural heat dissipation or simple cooling fins, which cannot effectively cope with the high heat generated during high-power and high-frequency work. This leads to high temperature of electronic components, which further affects the performance and stability of the electronic components, and even shortens the service life. Secondly, in terms of use intensity, in order to realize lightness and thinness, the thickness of the circuit board is continuously reduced, which makes it particularly fragile when it faces external force impact, vibration or bending. The ordinary circuit board lacks effective reinforcement measures, and is prone to breakage, delamination and other situations when it is subjected to slight impact or vibration in daily use, which seriously affects the reliability and stability of the circuit board. UTILITARIAN CONTENT

[0004] The utility model aims at providing a super thin interconnection lamination module circuit board of multilayer structure optimization to solve the technical defects of the existing super thin interconnection lamination module circuit board of multilayer structure optimization in terms of heat dissipation and use intensity.

[0005] In order to achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0006] A super thin interconnection lamination module circuit board of multilayer structure optimization, comprising a plurality of conductive layers and a plurality of insulating layers, a single conductive layer and a single insulating layer are arranged alternately, the conductive layers and the insulating layers arranged alternately are fixedly connected, and a cooling fin is fixedly attached to the surface of the conductive layer located at the top; wherein a cooling hole is opened in alignment between the conductive layer, the insulating layer and the cooling fin, a plurality of cooling holes form a cooling channel, and a protective coating is coated on the inner wall of the cooling channel; the edge of the circuit board composed of the conductive layer and the insulating layer is wrapped with an outer frame, and an insulating pad is arranged between the inner wall of the outer frame and the outer side of the circuit board.

[0007] As the preferred scheme of the utility model, the insulating layer is composed of an outer separation layer and an inner reinforcing layer, and the outer separation layer is wrapped on the surface of the inner reinforcing layer.

[0008] The outer separation layer is made of epoxy resin material, and the inner reinforcing layer is made of carbon fiber material.

[0009] As the preferred scheme of the utility model, the heat dissipation fin is made of aluminum alloy material, and the edge of the heat dissipation fin abuts against the inner wall of the outer frame.

[0010] As the further scheme of the utility model, the protective coating is a ceramic-based coating, and the brushing thickness is 0.05-0.1 mm.

[0011] As the preferred scheme of the utility model, the insulating pad is made of silicone rubber material, and the insulating pad is fixedly installed on the inner wall of the outer frame.

[0012] As the further preferred scheme of the utility model, the outer frame is made of aluminum alloy material.

[0013] Compared with the prior art, the utility model provides a kind of multilayer structure optimized ultra-thin interconnection build-up module circuit board with the following beneficial effects:

[0014] 1.The heat of the conductive layer can be quickly conducted to the heat dissipation fin for dissipation by the heat dissipation fin of aluminum alloy material attached to the surface of the top conductive layer, the heat dissipation holes opened in alignment between the conductive layer, the insulating layer and the heat dissipation fin form a heat dissipation channel, and the inner wall of the heat dissipation channel is coated with a ceramic-based coating, which can quickly conduct the heat in the heat dissipation channel out on the one hand, and air or other cooling medium can flow in the heat dissipation channel to take away the heat on the other hand, so as to realize heat exchange and dissipate the heat generated by the circuit board to the surrounding environment, realize efficient heat dissipation of the circuit board and improve the stability of the circuit board in use.

[0015] 2.The outer frame of aluminum alloy material wrapped around the edge of the circuit board composed of the conductive layer and the insulating layer can provide overall structural support for the circuit board, resist external extrusion, collision and other mechanical stresses, prevent the circuit board from deforming, cracking and other damages due to external force, the insulating pad of silicone rubber material is installed between the inner wall of the outer frame and the outer side of the circuit board, which can play a buffering role when the circuit board is impacted by external force, absorb and disperse external force and reduce the influence of external force on the internal structure of the circuit board, the insulating layer is composed of the outer separation layer of epoxy resin material and the inner reinforcing layer of carbon fiber material, which enhances the mechanical strength of the insulating layer, effectively reduces the risk of cracking and delamination of the circuit board when subjected to external force and improves the reliability and stability of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only examples of the embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0017] Figure 1 The structure schematic diagram of the present application is shown in the figure.

[0018] Figure 2 The structure schematic diagram of the present application is shown in the figure.

[0019] Figure 3 The structure schematic diagram of the present application is shown in the figure. Figure 2 The structure schematic diagram of the present application is shown in the figure.

[0020] Figure 4 The structure schematic diagram of the present application is shown in the figure.

[0021] Reference signs:

[0022] 1, conductive layer; 2, insulating layer; 201, outer barrier layer; 202, inner reinforcing layer; 3, heat dissipation hole; 4, protective coating; 5, heat dissipation fin; 6, outer frame; 7, insulating pad. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0024] In the description of the embodiments of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the embodiments of the present application and simplify the description, and therefore cannot be understood as a limitation on the embodiments of the present application. The orientation, structure and operation of the device or element indicated or implied.

[0025] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, integral connection, or detachable connection; it can be the communication between the two elements; it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0026] Referring to the drawings Figures 1-4 The utility model discloses a kind of multi-layer structure optimized ultra-thin interconnection build-up module circuit board, including multiple conductive layers 1 and multiple insulating layers 2, single conductive layer 1 and single insulating layer 2 are arranged alternately, fixed connection between alternately arranged conductive layer 1 and insulating layer 2, the surface of the conductive layer 1 located in the topmost is fixedly attached with fin 5;Wherein, conductive layer 1, insulating layer 2 and fin 5 are aligned and opened with heat dissipation hole 3, and multiple heat dissipation holes 3 constitute heat dissipation channel, and protective coating 4 is coated on the inner wall of heat dissipation channel;The edge of the circuit board composed of conductive layer 1 and insulating layer 2 is wrapped with outer frame 6, and insulating pad 7 is arranged between the inner wall of outer frame 6 and the outer side of the circuit board.

[0027] Conductive layer 1 and insulating layer 2 are arranged alternately and fixedly connected, which guarantees the electrical insulation and signal transmission function of the circuit board, the top conductive layer 1 is attached with fin 5, and the heat dissipation channel composed of heat dissipation hole 3 and protective coating 4 can effectively improve the heat dissipation efficiency, reduce the working temperature of electronic components, and ensure the performance stability of the circuit board during high-power operation. The setting of outer frame 6 and insulating pad 7 enhances the mechanical strength of the circuit board, prevents damage from external force, and at the same time, the insulating pad 7 plays an insulating role to avoid electrical interference between the outer frame 6 and the circuit board.

[0028] The insulating layer 2 is composed of an outer separation layer 201 and an inner reinforcing layer 202, and the outer separation layer 201 is wrapped on the surface of the inner reinforcing layer 202.

[0029] The outer separation layer 201 is made of epoxy resin material, which realizes reliable electrical isolation between layers by utilizing its good electrical insulation performance. The inner reinforcing layer 202 is made of carbon fiber material, which enhances the mechanical strength of the insulating layer 2 and effectively reduces the risk of cracking and delamination of the circuit board under external force, improving the reliability and stability of the circuit board.

[0030] The fin 5 is made of aluminum alloy material, and the edge of the fin 5 abuts against the inner wall of the outer frame 6. The fin 5 made of aluminum alloy material has good heat conduction performance, which can quickly dissipate the heat generated by the circuit board. In addition, the edge of the fin 5 abuts against the inner wall of the outer frame 6, which on the one hand assists the outer frame 6 to enhance the structural stability of the overall circuit board while dissipating heat, and on the other hand, this close contact may help the heat to be further dissipated through the outer frame 6, improving the overall heat dissipation effect.

[0031] The protective coating 4 is a ceramic-based coating, and the coating thickness is 0.05-0.1 mm. The protective coating 4 is preferably coated to a thickness of 0.07 mm, and the ceramic-based coating is coated on the inner wall of the heat dissipation channel, which can prevent the interior of the heat dissipation channel from being corroded and prolong the service life of the heat dissipation channel. At the same time, at the appropriate thickness of 0.05-0.1 mm, the protective effect of the coating on the heat dissipation channel can be ensured, and the heat conduction efficiency can be enhanced, so that the heat can be dissipated more quickly through the heat dissipation channel, and the heat dissipation performance of the circuit board is improved.

[0032] The insulating pad 7 is made of silicone rubber, and is fixedly installed on the inner wall of the outer frame 6, which can effectively prevent the current from being conducted from the outer frame 6 to the circuit board, and avoid electrical faults. At the same time, the good elasticity and flexibility of the silicone rubber can play a buffering role when the circuit board is subjected to external force impact, reduce the damage of the external force to the internal structure of the circuit board, protect the circuit board from being damaged, and improve the reliability of the circuit board.

[0033] The outer frame 6 is made of aluminum alloy, which can enhance the overall rigidity and mechanical strength of the circuit board without significantly increasing the weight of the circuit board, and resist external force impact and vibration. In addition, the aluminum alloy also has certain heat conductivity, which may be helpful for heat dissipation of the circuit board, and further improve the stability and reliability of the circuit board in complex environments.

[0034] In use, in terms of heat dissipation, the heat generated by the electronic components in the working process is transmitted to the conductive layer 1 connected thereto. Since the heat sink 5 is attached to the surface of the top conductive layer 1, and the heat sink 5 is made of aluminum alloy and has good heat conductivity, the heat will be quickly conducted from the conductive layer 1 to the heat sink 5 for dissipation. The heat dissipation holes 3 aligned and opened between the conductive layer 1, the insulating layer 2 and the heat sink 5 constitute a heat dissipation channel, and the inner wall of the heat dissipation channel is coated with a ceramic-based coating. On the one hand, the ceramic-based coating has good heat conductivity, and can quickly conduct the heat in the heat dissipation channel away. On the other hand, air or other cooling medium can flow in the heat dissipation channel to take away the heat, so as to realize heat exchange, and thus dissipate the heat generated by the circuit board to the surrounding environment.

[0035] In terms of strength: the outer frame 6 is made of aluminum alloy material, has high strength and rigidity, is wrapped around the circuit board edge composed of the conductive layer 1 and the insulating layer 2, can provide overall structural support for the circuit board, resist external extrusion, collision and other mechanical stress, prevent the circuit board from being deformed, broken and damaged due to external force, the insulating pad 7 is made of silicone rubber material, is installed between the inner wall of the outer frame 6 and the outer side of the circuit board, when the circuit board is impacted by external force, the insulating pad 7 can play a buffering role, absorb and disperse external force, reduce the influence of external force on the internal structure of the circuit board, the insulating layer 2 is composed of the outer separation layer 201 made of epoxy resin material and the inner reinforcing layer 202 made of carbon fiber material, enhances the mechanical strength of the insulating layer 2, effectively reduces the risk of breaking and delamination of the circuit board when subjected to external force, improves the reliability and stability of the circuit board.

[0036] The above shows and describes the basic principles of the present application, the above is only the preferred embodiment of the present application, and does not limit the present application, the above embodiment and the description in the specification only illustrate the principles of the present application, any modification, equivalent replacement and improvement within the scope of the present application shall be included in the protection scope of the present application without departing from the scope of the present application.

Claims

1. A multi-layered structure optimized ultra-thin interconnect build-up module circuit board, characterized by: Including a plurality of conductive layer (1) and a plurality of insulating layer (2), a single said conductive layer (1) and a single said insulating layer (2) are arranged alternately, the said conductive layer (1) and the said insulating layer (2) are fixedly connected between alternately arranged, the surface of the topmost said conductive layer (1) is fixedly attached with a cooling fin (5); Wherein, the said conductive layer (1), the said insulating layer (2) and the said cooling fin (5) are aligned and opened between the cooling hole (3), a plurality of said cooling hole (3) constitutes a cooling channel, the said cooling channel inner wall is coated with a protective coating (4); The circuit board edge composed of the said conductive layer (1) and the said insulating layer (2) is wrapped with an outer frame (6), the inner wall of the said outer frame (6) and the circuit board outside are provided with an insulating pad (7).

2. A multi-layered, ultra-thin, interconnected build-up module circuit board of claim 1, wherein: The said insulating layer (2) is composed of an outer separation layer (201) and an inner reinforcing layer (202), the said outer separation layer (201) is wrapped on the surface of the said inner reinforcing layer (202); The said outer separation layer (201) is epoxy resin material, the said inner reinforcing layer (202) is carbon fiber material.

3. A multi-layered, ultra-thin, interconnected build-up module circuit board of claim 1, wherein: The said cooling fin (5) is aluminum alloy material, and the edge of the said cooling fin (5) abuts against the inner wall of the said outer frame (6).

4. A multi-layered, ultra-thin, interconnected build-up module circuit board of claim 3, wherein: The said protective coating (4) is ceramic base coating, and the brushing thickness is 0.05-0.1mm.

5. A multi-layered, ultra-thin, interconnected build-up module circuit board of claim 1, wherein: The said insulating pad (7) is silicone rubber material, and the said insulating pad (7) is fixedly installed on the inner wall of the said outer frame (6).

6. A multi-layered, ultra-thin, interconnected build-up module circuit board of any of claims 1-5, wherein: The said outer frame (6) is aluminum alloy material.

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