Circuit board jointed board structure with auxiliary edge
By setting diamond-shaped or circular cutouts on the auxiliary edge of the circuit board, the problem of uneven pressure distribution during the lamination process is solved, enabling efficient production and high-quality finished products of the circuit board.
Patent Information
- Application Number
- CN202520131798.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-01-20
AI Technical Summary
In traditional circuit board manufacturing, uneven pressure distribution during the copper lamination process of the auxiliary edges leads to the formation of air bubbles, affecting the flatness of the circuit board and the yield rate, increasing production costs and reducing efficiency.
An array of cut-out areas, designed as rhombuses or circles, is set on the auxiliary edge of the circuit board. The size and spacing of these areas are controlled to facilitate the discharge of air bubbles and improve the uniformity of the pressing process.
It reduced the occurrence of minor bulging, improved the yield and quality of circuit boards, reduced production costs, and increased production efficiency.
Smart Images

Figure CN223885384U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to circuit board technical field more specifically, is related to a kind of circuit board splicing structure with auxiliary edge. BACKGROUND
[0002] Printed Circuit Board (PCB board) is also called printed circuit board, printed wiring board, and is the important component of the physical support and signal transmission of electronic product.Circuit board not only carries various electronic components, but also is responsible for signal transmission between these components, and is the basis for realizing the functional diversification and high integration of electronic equipment.With the rapid development of electronic technology, the design of PCB board is increasingly complex, from simple single-layer board to multi-layer board, from regular shape to various special-shaped design, and its manufacturing technology and requirements are also constantly improving.
[0003] In the manufacturing process of PCB board, auxiliary edge is provided to improve production efficiency and meet diversified production needs, especially for special-shaped board frame or large quadrilateral board that needs accurate positioning, which not only helps to maintain the stability and positioning accuracy of the board during manufacturing, but also plays an important role in balancing current, preventing liquid overflow or glue flow during electroplating, etching and other processes.In the past, in order to ensure the uniformity of electroplating and enhance the mechanical strength of the edge, the auxiliary edge is usually a whole piece of copper skin.
[0004] However, the auxiliary edge formed by a whole piece of copper skin has uneven pressure distribution during pressing, which causes micro-bubbles to easily form on the auxiliary edge.These bubbles gradually expand under high temperature and high pressure environment, forming slight bulges.The bulges destroy the flatness of the circuit board, also affect the yield and reliability of the circuit board, and the production cost is also high, the production efficiency is low. INVENTION CONTENTS
[0005] In order to overcome the problem that the auxiliary edge formed by a whole piece of copper skin has uneven pressure distribution during pressing, which causes micro-bubbles to easily form on the auxiliary edge.These bubbles gradually expand under high temperature and high pressure environment, forming slight bulges.The bulges destroy the flatness of the circuit board, also affect the yield and reliability of the circuit board, and the production cost is also high, the production efficiency is low.The utility model provides a kind of circuit board splicing structure with auxiliary edge.
[0006] The technical scheme of the utility model is as follows:
[0007] A kind of circuit board splicing structure with auxiliary edge, comprising a plurality of substrates, a plurality of the substrate splicing, each the substrate is laid with auxiliary edge around, the auxiliary edge is parallel with the side of the circuit board, a plurality of arrayed hollowing areas are arranged on the auxiliary edge, and each row of the hollowing area is parallel with the side of the circuit board.
[0008] According to the utility model of the above scheme, the hollow area is rhombic.
[0009] According to the utility model of the above scheme, the side length of the rhombic hollow area is 0.8-1.2mm.
[0010] According to the utility model of the above scheme, the side length of the rhombic hollow area is 1.0mm.
[0011] According to the utility model of the above scheme, the hollow area is circular.
[0012] According to the utility model of the above scheme, the diameter of the circular hollow area is 0.8-1.2mm.
[0013] According to the utility model of the above scheme, the diameter of the circular hollow area is 1.0mm.
[0014] According to the utility model of the above scheme, the distance between adjacent hollow areas is D1, and the value of D1 is not less than 0.5mm.
[0015] According to the utility model of the above scheme, the distance between the hollow area and the edge of the auxiliary edge is D2, and the value of D2 is not less than 1mm.
[0016] According to the utility model of the above scheme, the distance between the auxiliary edge and the plate edge of the substrate is D3, and the value of D3 is not less than 1mm.
[0017] According to the utility model of the above scheme, its beneficial effect lies in that the circuit board splicing structure with auxiliary edge has the following advantages: the auxiliary edge is laid around the substrate, the auxiliary edge is provided with a plurality of arrayed hollow areas, the bubbles generated when the copper sheet on the auxiliary edge is pressed together can be discharged through the hollow areas, the slight bulging condition generated during production can be reduced, thereby improving the yield and quality of the circuit board, the structure is simple, the production is convenient, the production time is short, and the production efficiency is high. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without paying creative labor.
[0019] Figure 1 It is the structural schematic diagram of the utility model;
[0020] Figure 2 It is Figure 1Enlarged structural schematic view of part A.
[0021] In the drawings, various reference numbers refer to various identified parts:
[0022] 10, substrate; 20, auxiliary edge; 21, hollowed-out area. DETAILED DESCRIPTION
[0023] In order to make the technical problems, technical solutions and beneficial effects of the present application more clear, the present application will be further described in detail below in conjunction with the drawings and examples.
[0024] It should be noted that the terms "comprising" and "having" and any variations thereof in the specification and claims of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but can optionally also include steps or units that are not listed, or can optionally also include other steps or units inherent to these processes, methods, products or devices. The terms "provided" and the like should be broadly understood, for example, it can be fixedly connected, or can be detachably connected, or can be integrated; it can be mechanically connected, or can be electrically connected; it can be directly connected, or can be indirectly connected through an intermediate medium; it can be the internal communication or interaction relationship of two elements, unless otherwise explicitly limited. The terms "up", "down", "left", "right", "front", "back", "bottom" and the like indicate the orientation or position based on the orientation or position shown in the drawings, and are only for convenience of description, and cannot be understood as a limitation on the technical solutions.
[0025] It should be noted that the printed circuit board (PCB board) is also called printed circuit board, and is an important component of physical support and signal transmission of electronic products. The circuit board not only carries various electronic components, but also is responsible for the signal transmission between these components, and is the basis for realizing the functional diversification and high integration of electronic equipment. With the rapid development of electronic technology, the design of PCB board is becoming more and more complex, from simple single-layer board to multi-layer board, from regular shape to various special-shaped design, and its manufacturing technology and requirements are also constantly improving.
[0026] In the manufacturing process of the PCB board, in order to improve the production efficiency and meet the diversified production needs, an auxiliary edge is provided, especially for special-shaped board frames or large quadrilateral boards that need precise positioning, which not only helps to maintain the stability and positioning accuracy of the board during the manufacturing process, but also plays an important role in balancing the current, preventing liquid overflow or glue flow during electroplating, etching and other processes. Traditionally, in order to ensure the uniformity of electroplating and enhance the mechanical strength of the edge, the auxiliary edge is usually a whole piece of copper skin.
[0027] However, the uneven pressure distribution in the pressing process of the whole copper sheet forming the auxiliary edge leads to the formation of micro-bubbles on the auxiliary edge. These bubbles gradually expand under high temperature and high pressure environment, forming slight bulging. The bulging destroys the flatness of the circuit board, affects the yield and reliability of the circuit board, and has high production cost and low production efficiency.
[0028] As shown in Figures 1-2 The embodiment provides a circuit board splicing structure with an auxiliary edge. The auxiliary edge 20 is laid around the substrate 10, and a plurality of arrayed hollow areas 21 are arranged on the auxiliary edge 20. The bubbles generated during the pressing of the copper sheet on the auxiliary edge 20 can be discharged through the hollow areas 21, which can reduce the slight bulging during production, thereby improving the yield and quality of the circuit board. The structure is simple, easy to process and produce, short production time, and high production efficiency.
[0029] Specifically, the circuit board splicing structure with an auxiliary edge includes a plurality of substrates 10, and the plurality of substrates 10 are spliced. Each substrate 10 is laid with an auxiliary edge 20 around the substrate 10. The auxiliary edge 20 is parallel to the side edge of the circuit board. A plurality of arrayed hollow areas 21 are arranged on the auxiliary edge 20. Each row of hollow areas 21 is parallel to the side edge of the circuit board to ensure the stability and consistency of the structure.
[0030] It should be noted that when the substrate 10 is a multi-layer structure, the auxiliary edge 20 is laid on each layer. The size of the copper sheet of each layer of auxiliary edge 20 remains the same, which can prevent the auxiliary edge 20 from deforming during lamination, and also effectively prevent the occurrence of glue flow phenomenon. More importantly, it helps to balance the electroplating process, improves the electroplating effect, and makes the plating layer on the surface of the circuit board more uniform and dense.
[0031] In one embodiment, the hollow areas 21 are rhombic. The rhombic shape helps to disperse and balance the stress, making the stress distribution more uniform, thereby improving the stability and durability of the circuit board structure. The rhombic hollow areas 21 have a relatively simple shape, which is easy to realize in the process and manufacturing process, helps to reduce production cost and improve production efficiency.
[0032] The side length of the rhombic hollow areas 21 is 0.8-1.2mm. This size range is designed to ensure that the hollow areas 21 can effectively discharge the bubbles generated during the pressing process, and will not weaken the structural strength of the auxiliary edge 20.
[0033] Specifically, the side length of the rhombic hollow areas 21 is 1.0mm. This size meets the needs of bubble discharge and ensures the overall stability and durability of the auxiliary edge 20. By controlling the shape and size of the hollow areas 21, the production efficiency can be significantly improved without sacrificing the quality of the circuit board.
[0034] In one embodiment, the hollowed-out regions 21 are circular. The edges of the circular hollowed-out regions 21 are smooth without sharp corners, which helps to reduce stress concentration and the risk of damage due to structural weakening. The circular shape is easy to process and manufacture, which can reduce production costs and improve production efficiency.
[0035] The diameter of the circular hollowed-out regions 21 is 0.8-1.2mm, which is intended to ensure that the hollowed-out regions 21 can effectively discharge the air bubbles generated during the pressing process without excessively weakening the structural strength of the auxiliary edge 20. Specifically, if the diameter of the hollowed-out regions 21 is too small, it may not be able to fully accommodate and discharge the air bubbles, thereby affecting the pressing quality of the circuit board; if the diameter is too large, it may weaken the overall structure of the auxiliary edge 20, reducing its support and stability.
[0036] Specifically, the diameter of the circular hollowed-out regions 21 is 1.0mm. This size meets the needs of air bubble discharge and ensures the overall stability and durability of the auxiliary edge 20. By controlling the shape and size of the hollowed-out regions 21, production efficiency can be significantly improved without sacrificing the quality of the circuit board.
[0037] In one embodiment, the distance between adjacent hollowed-out regions 21 is D1, and D1 is not less than 0.5mm. It is ensured that there is enough space between the hollowed-out regions 21 to prevent structural weakening due to the hollowed-out regions 21 being too dense. At the same time, the appropriate spacing can also improve the mechanical strength and durability of the circuit board, ensuring that it maintains good performance under various environmental conditions.
[0038] In one embodiment, the distance between the hollowed-out regions 21 and the edge of the auxiliary edge 20 is D2, and D2 is not less than 1mm. The hollowed-out regions 21 maintain a certain distance from the auxiliary edge 20, which can more effectively disperse and balance stress, thereby improving the overall stability and reliability of the circuit board.
[0039] In one embodiment, the distance between the auxiliary edge 20 and the edge of the substrate 10 is D3, and D3 is not less than 1mm. The auxiliary edge 20 maintains a certain distance from the edge of the substrate 10, which can prevent structural damage or deformation due to excessive proximity. At the same time, the appropriate spacing also provides enough space for the subsequent processing and assembly of the circuit board, ensuring the smooth progress of the entire production process.
[0040] It should be understood that those of ordinary skill in the art can make improvements or changes based on the above description, and all such improvements and changes shall fall within the scope of protection of the appended claims of the present utility model.
[0041] The utility model discloses has been described exemplarily above in combination with the drawing, obviously the implementation of the utility model patent is not limited by above-mentioned mode, as long as the various improvements of the method concept and technical scheme of the utility model patent are adopted, or the concept and technical scheme of the utility model patent are directly applied to other occasions without improvement, all are within the protection scope of the utility model.
Claims
1. A circuit board panel structure having an auxiliary edge, characterized by, The substrate comprises a plurality of substrates, the plurality of substrates are spliced, each of the substrates is provided with an auxiliary edge around, the auxiliary edge is parallel to the side edge of the circuit board, and a plurality of hollowed-out areas are arranged on the auxiliary edge in an array, and each row of the hollowed-out areas is parallel to the side edge of the circuit board.
2. The structure of claim 1, wherein the auxiliary edge is formed by a plurality of auxiliary edge portions. The hollowed-out area is in a rhombus shape.
3. The structure of claim 2, wherein the auxiliary edge is formed by a plurality of auxiliary edge portions. The side length of the rhombus-shaped hollowed-out area is 0.8-1.2 mm.
4. The structure of claim 3, wherein the auxiliary edge is formed by a plurality of auxiliary edge portions. The side length of the rhombus-shaped hollowed-out area is 1.0 mm.
5. The structure of claim 1, wherein the auxiliary side is formed by a plurality of auxiliary side portions. The hollowed-out area is in a circular shape.
6. The structure of claim 5, wherein the auxiliary edge is formed by a plurality of auxiliary edge portions. The diameter of the circular hollowed-out area is 0.8-1.2 mm.
7. The structure of claim 6, wherein the auxiliary edge is formed by a plurality of auxiliary edge portions. The diameter of the circular hollowed-out area is 1.0 mm.
8. The structure of claim 1-7, wherein, The distance between adjacent hollowed-out areas is D1, and D1 is not less than 0.5 mm.
9. The structure of claim 8, wherein the auxiliary edge is formed by a plurality of auxiliary edge portions. The distance between the hollowed-out area and the edge of the auxiliary edge is D2, and D2 is not less than 1 mm.
10. The structure of claim 9, wherein the auxiliary edge is formed by a plurality of auxiliary edge portions. The distance between the auxiliary edge and the edge of the substrate is D3, and D3 is not less than 1 mm.