Temperature control device for space remote sensing load electronic device

Abstract

The utility model discloses a temperature control device for a space remote sensing load electronic device, which relates to the technical field of space load thermal control, and comprises a plurality of semiconductor chilling plates, a heat conducting cable, a heat pipe and a radiation cold plate, each CMOS forming module is mounted on a circuit board bracket; the heat conducting rope is mounted at the hot ends of the plurality of semiconductor chilling plates; one end of the heat pipe is connected with the heat conducting rope; the radiation cooling plate is connected with the other end of the heat pipe and installed on a satellite platform. According to the utility model, by changing the effective voltage on the semiconductor chilling plate, the output power of the chilling plate is controlled, and the temperature stability is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to space load heat control technical field especially relates to a temperature control device for space remote sensing load electronic device. BACKGROUND

[0002] The pointing stability and attitude stability of space optical remote sensing satellite have extremely important influence on imaging quality. At present, the performance index of space optical remote sensing load is continuously improved, and the precision requirement of attitude control is increasingly strict, and star sensor gradually changes from being carried on satellite platform to being directly carried on space optical remote sensing load. Since the temperature control precision of space optical remote sensing load itself is very high, the temperature level of star sensor and the thermal disturbance of optical remote sensor caused by temperature change of star sensor need to be controlled while effectively controlling the temperature level of star sensor.

[0003] To solve the above problems, the space remote sensing load electronic device realizes temperature control through heat dissipation. The general heat dissipation mode is passive heat dissipation mode through heat conduction of heat cable-heat pipe-radiation cold plate. The heat dissipation speed of electronic device is slow, and the temperature fluctuation of device is large, thereby affecting the imaging quality.

[0004] Therefore, the technical personnel in the prior art provide a temperature control device for space remote sensing load electronic device to solve the problems raised in the above background. UTILITY MODEL CONTENT

[0005] The utility model provides a temperature control device for space remote sensing load electronic device, adopts semiconductor refrigeration piece, and the cold end surface is fixed with the surface of device. The output power of refrigeration piece is controlled by changing the effective voltage on semiconductor refrigeration piece, so that the cold face temperature of semiconductor refrigeration piece is changed, temperature is reduced, the temperature is stabilized in the required interval range, the purpose of fast heat dissipation and temperature control is achieved.

[0006] In order to realize the above purpose, the utility model provides the following technical scheme:

[0007] The utility model discloses a temperature control device for space remote sensing load electronic device, including:

[0008] A plurality of semiconductor refrigeration pieces, and the hot cold end of each semiconductor refrigeration piece is equipped on the corresponding CMOS forming module, and each CMOS forming module is installed on the circuit board support,

[0009] Heat cable, the heat cable is installed on the hot end of a plurality of semiconductor refrigeration pieces,

[0010] Heat pipe, one end of the heat pipe is connected with the heat cable,

[0011] A radiant cooling plate is connected to the other end of a heat pipe and is mounted on a satellite platform.

[0012] Furthermore, the thermoelectric cooler contains a plurality of alternately arranged N-type semiconductors and P-type semiconductors. The top of the N-type semiconductor and the top of one side of the P-type semiconductor are connected to the cold end of the thermoelectric cooler, and the bottom of the N-type semiconductor and the bottom of the other side of the P-type semiconductor are connected to the hot end of the thermoelectric cooler.

[0013] Furthermore, multiple of the semiconductor cooling chips are connected to the heat-conducting cable via a cover plate.

[0014] Furthermore, the heat-conducting rope has a first horizontal portion and a first vertical portion, the first vertical portion being connected to a plurality of semiconductor cooling chips, and the first horizontal portion being connected to one end of a heat pipe.

[0015] Furthermore, the heat-conducting cable is made of graphene.

[0016] Furthermore, the heat pipe has a second horizontal portion and a second vertical portion, the outer side of the first vertical portion is entirely connected to the second vertical portion, and the outer side of the second horizontal portion is entirely connected to the bottom surface of the cooling plate.

[0017] Furthermore, a layer of white paint is sprayed onto the side of the cooling plate away from the heat pipe.

[0018] In the above technical solution, the temperature control device for electronic devices of space remote sensing payloads provided by this utility model has the following beneficial effects:

[0019] 1. This application controls the output power of the thermoelectric cooler by changing the effective voltage on the thermoelectric cooler, thereby ensuring temperature stability.

[0020] 2. This application achieves controllable adjustment by changing the effective voltage on the semiconductor cooling chip. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0022] Figure 1 A schematic diagram of a temperature control device for electronic devices in space remote sensing payloads, provided for an embodiment of this utility model;

[0023] Figure 2 for Figure 1 A schematic diagram of the structure of a semiconductor refrigeration chip;

[0024] Figure 3 For Figure 1 The refrigeration principle diagram of the semiconductor refrigeration piece;

[0025] Figure 4 For Figure 1 The structural schematic diagram of the CMOS forming module.

[0026] Explanation of reference signs:

[0027] 10, CMOS forming module; 11, circuit board support;

[0028] 20, semiconductor refrigeration piece; 21, N-type semiconductor; 22, P-type semiconductor; 23, cold end; 24, hot end; 25, cover plate;

[0029] 30, heat conduction cable; 31, first horizontal part; 32, first vertical part;

[0030] 40, heat pipe; 41, second horizontal part; 42, second vertical part;

[0031] 50, radiant cooling plate. DETAILED DESCRIPTION

[0032] In order for those skilled in the art to better understand the technical scheme of the utility model, the utility model will be further described in detail below in combination with the drawings.

[0033] Referring to Figures 1-2 As shown in the figure;

[0034] The temperature control device for space remote sensing load electronic device provided by the utility model embodiment comprises:

[0035] A plurality of semiconductor refrigeration pieces 20, the hot and cold ends of each semiconductor refrigeration piece 20 are arranged on the corresponding CMOS forming module 10, and each CMOS forming module 10 is installed on the circuit board support 11; the cold end 23 of the semiconductor refrigeration piece 20 is provided with an NTC resistance, and the NTC resistance is electrically connected with an STM controller;

[0036] A heat conduction cable 30 is installed on the hot end 24 of the plurality of semiconductor refrigeration pieces 20;

[0037] A heat pipe 40 is connected with the heat conduction cable 30 at one end;

[0038] A radiant cooling plate 50 is connected with the other end of the heat pipe 40, and the radiant cooling plate 50 is installed on a satellite platform.

[0039] The surface of the cold end 23 of the plurality of semiconductor refrigeration pieces 20 is fixed to the surface of the corresponding CMOS imaging module 10, and the temperature of the cold surface of the semiconductor refrigeration piece 20 is measured by using an NTC resistor as a temperature probe; the voltage across the NTC resistor is read by the STM controller, the output power of the semiconductor refrigeration piece 20 is controlled by changing the effective voltage on the semiconductor refrigeration piece 20, so as to change the temperature of the cold end 23 of the semiconductor refrigeration piece 20, thereby realizing the precise control of the temperature of the CMOS imaging module 30 in contact with the semiconductor refrigeration piece 20; the temperature of the CMOS imaging module 10 is lowered, and the temperature is stabilized in the required range, so as to ensure the imaging quality of the CMOS imaging module 10. The surface of the hot end 24 of the semiconductor refrigeration piece 20 is connected to the heat conduction rope 30, the heat generated by the semiconductor refrigeration piece 20 is timely discharged, and is discharged to the heat pipe 40 and then to the heat spreading plate 50, and is radiated to the cold black space (the temperature of the cold black space is 4K) through the heat spreading plate 50, so as to realize the effect of heat dissipation.

[0040] The CMOS imaging module 10 is a LINCE11M model produced by Teledyne e2v Company.

[0041] Further, the semiconductor refrigeration piece 20 is internally provided with a plurality of N-type semiconductors 21 and P-type semiconductors 22 arranged alternately, the top end of the N-type semiconductor 21 and the top end of the P-type semiconductor 22 on one side are connected to the cold end of the semiconductor refrigeration piece 20, and the bottom end of the N-type semiconductor 21 and the bottom end of the P-type semiconductor 22 on the other side are connected to the hot end of the semiconductor refrigeration piece 20.

[0042] When the direct current passes, energy exchange occurs at the junction of the cold end 23 and the hot end 24 of the semiconductor refrigeration piece 20 and the N-type semiconductor 21 and the P-type semiconductor 22; when the direct current is applied to the semiconductor refrigeration piece 20, the electrons pass through the P-type semiconductor 22, the cold end 23, the N-type semiconductor 21 and the hot end 24 in turn. The electrons passing through the P-type semiconductor 22 will absorb heat, that is, the temperature in the cold end 23 will drop sharply, and the electrons will release heat after passing through the N-type semiconductor 21, and the released heat will be reflected in the hot end 24, showing a relatively high temperature. Finally, the cold end 23 and the hot end 24 of the semiconductor refrigeration piece 20 are formed by the alternating action of a plurality of N-type semiconductors 21 and P-type semiconductors 22.

[0043] Further, the plurality of semiconductor refrigeration pieces 20 are connected to the heat conduction rope 30 through the cover plate 25.

[0044] Further, the heat conduction rope 30 has a first horizontal part 31 and a first vertical part 32, the first vertical part 32 is connected to the plurality of semiconductor refrigeration pieces 20, and the first horizontal part 31 is connected to one end of the heat pipe 40.

[0045] Further, the heat conduction rope 30 is made of graphene, and has a heat conduction coefficient of 800 W / (m·k). The heat conduction rope 30 is connected to the surface of the hot end 24 of the semiconductor refrigeration sheet 20, and conducts heat to the heat conduction rope 30.

[0046] Further, the heat pipe 40 has a second horizontal part 41 and a second vertical part 42. The outer side of the first vertical part 32 is connected to the second vertical part 42, and the outer side of the second horizontal part 42 is connected to the bottom surface of the radiative cooling plate 50.

[0047] The heat pipe 40 is a device that conducts heat by evaporation, condensation and circulation of a working medium. The heat pipe 40 has a heat conduction coefficient of 20000 W / (m·k). The heat pipe 40 receives heat from the heat conduction rope 30, and is fixed to the radiative cooling plate 50 by a plurality of screws, and conducts heat to the radiative cooling plate 50.

[0048] Further, the radiative cooling plate 50 is sprayed with a white paint layer on the side away from the heat pipe 40. The emissivity of the white paint layer is 0.87, and the absorption rate is 0.2. The white paint layer improves the effect of radiative cooling of the radiative cooling plate 50, and greatly reduces the absorption rate of solar radiation. Therefore, the heat generated by the space remote sensing load is radiated to the cold black space (the temperature of the cold black space is 4K), so that the heat dissipation effect is achieved.

[0049] When the CMOS imaging module 10 of the space remote sensing load works, the surface temperature of the CMOS imaging module 10 is high. The surface of the cold end 23 of the semiconductor refrigeration sheet 20 is fixed to the surface of the CMOS imaging module 10, and conducts heat to the semiconductor refrigeration sheet 20. An NTC resistance is used as a temperature probe to measure the temperature of the cold surface of the semiconductor refrigeration sheet 20. An STM controller is used to read the voltage across the NTC resistance. By changing the effective voltage on the semiconductor refrigeration sheet 20, the output power of the semiconductor refrigeration sheet 20 is controlled, so that the temperature of the cold end 23 of the semiconductor refrigeration sheet 20 is changed, and the temperature of the CMOS imaging module 10 in contact with the semiconductor refrigeration sheet 20 is precisely controlled.

[0050] It should be understood by those skilled in the art that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A temperature control device for space remote sensing payload electronics, characterized in that, The utility model relates to a satellite platform cooling device, including: a plurality of semiconductor refrigeration pieces (20), the hot cold end of each semiconductor refrigeration piece (20) is equipped on the corresponding CMOS forming module (10), each CMOS forming module (10) is installed on the circuit board support (11); Heat conduction cable (30), the heat conduction cable (30) is installed on the hot end (24) of a plurality of semiconductor refrigeration pieces (20); Heat pipe (40), one end of heat pipe (40) is connected with heat conduction cable (30); Radiation cooling plate (50), the other end of heat pipe (40) is connected with radiation cooling plate (50), and the radiation cooling plate (50) is installed on the satellite platform.

2. The temperature control device for electronic devices of space remote sensing payloads according to claim 1, characterized in that: The semiconductor refrigeration piece (20) is internally provided with a plurality of N-type semiconductor (21) and P-type semiconductor (22) alternately arranged, the top end of N-type semiconductor (21) and the top end of P-type semiconductor (22) on one side are connected with the cold end of semiconductor refrigeration piece (20), and the bottom end of N-type semiconductor (21) and the bottom end of P-type semiconductor (22) on the other side are connected with the hot end of semiconductor refrigeration piece (20).

3. The temperature control device for electronic devices of space remote sensing payloads according to claim 2, characterized in that: A plurality of semiconductor refrigeration pieces (20) are connected with the heat conduction cable (30) through the cover plate (25).

4. The temperature control device for electronic devices of space remote sensing payloads according to claim 1, characterized in that: The heat conduction cable (30) has a first horizontal part (31) and a first vertical part (32), the first vertical part (32) is connected with a plurality of semiconductor refrigeration pieces (20), and the first horizontal part (31) is connected with one end of the heat pipe (40).

5. The temperature control device for electronic devices of space remote sensing payloads according to claim 4, characterized in that: The heat conduction cable (30) is made of graphene.

6. The temperature control device for electronic devices of space remote sensing payloads according to claim 4, characterized in that: The heat pipe (40) has a second horizontal part (41) and a second vertical part (42), the outer side of the first vertical part (32) is integrally connected with the second vertical part (42), and the outer side of the second horizontal part (41) is integrally connected with the bottom surface of the radiation cooling plate (50).

7. The temperature control device for electronic devices of space remote sensing payloads according to claim 1, characterized in that: The side surface of the radiation cooling plate (50) away from the heat pipe (40) is sprayed with a white paint layer.

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