Liquid cooling assembly and electronic equipment
By designing the cold plates to be arranged horizontally and the manifold to be set laterally in the liquid cooling assembly, the maintainability and coolant leakage problems of the liquid cooling system in high-density electronic equipment are solved, achieving higher reliability and flexibility.
Patent Information
- Application Number
- CN202520176371.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-27
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-01-27
AI Technical Summary
In high-density electronic devices, quick-release connectors for liquid cooling systems are difficult to deploy, resulting in poor maintainability and a high risk of coolant leakage.
Design a liquid cooling assembly in which cold plates are arranged horizontally, a manifold is set on both sides of the cold plates, quick-release connectors extend in a preset direction with an included angle between 60° and 120°, the manifold is close to the edge of the equipment housing, and a non-quick-release connector and a leakage detection device are provided.
It improves the maintainability and reliability of liquid cooling systems in high-density electronic equipment, reduces the risk of coolant leakage, simplifies connector connections, and enhances deployment flexibility and heat dissipation.
Smart Images
Figure CN223885507U_ABST
Abstract
Description
Technical Field
[0001] This specification relates to the field of heat exchange technology, and in particular to a liquid cooling assembly and electronic equipment. Background Technology
[0002] With the development of electronic technology, the deployment of electronic devices is becoming increasingly dense, leading to a gradual increase in the heat generated within these devices. Air cooling has reached its limit in heat dissipation. To further improve heat dissipation capabilities, liquid cooling is being more widely applied in electronic devices.
[0003] In liquid cooling systems, the space available for liquid cooling piping and the control of coolant leaks require careful attention. When coolant is introduced into the electronic device, it is distributed via a manifold to multiple cold plates that are in contact with heat-generating components for heat dissipation. To enable rapid maintenance of the cold plates, safer and more reliable quick-release connectors suitable for liquid cooling are needed at the manifold. However, these quick-release connectors are often too long and difficult to deploy in high-density electronic devices. Therefore, achieving maintainable deployment of liquid cooling systems in high-density electronic devices is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention
[0004] To overcome the problems existing in related technologies, this specification provides a liquid cooling component and an electronic device.
[0005] According to a first aspect of the embodiments of this specification, a liquid cooling assembly is provided, comprising:
[0006] Several cold plates are arranged at least in a horizontal direction, and a first joint and a second joint are provided on the cold plates;
[0007] The first water distributor is equipped with several first quick-release connectors.
[0008] The second water distributor is equipped with several second quick-release connectors.
[0009] The first and second water distribution units are arranged horizontally on both sides of the plurality of cold plates. The first water distribution unit, the plurality of cold plates, and the second water distribution unit are connected by a first quick-release connector, a first connector, a second connector, and a second quick-release connector. The first quick-release connector, the first connector, the second connector, and the second quick-release connector extend in the same plane along a preset direction intersecting the horizontal direction. The angle A between the horizontal direction and the preset direction satisfies 60°≤A≤120°.
[0010] Optionally, the plurality of cold plates are formed into a cold plate group, and the cold plate group is arranged in a horizontal direction;
[0011] The cold plate group comprises at least two cold plates arranged in series.
[0012] Optionally, the at least two cold plates are connected in series through the first joint and the second joint.
[0013] Optionally, the cold plate further comprises a bypass joint, which is connected to the first joint.
[0014] The at least two cold plates are connected in series through the second joint and the bypass joint.
[0015] Optionally, the first water collector further comprises a first non-quick-release joint, which is located below the first quick-release joint.
[0016] The second water collector further comprises a second non-quick-release joint, which is located below the second quick-release joint.
[0017] One of the first non-quick-release joint and the second non-quick-release joint is connected to an equipment liquid inlet pipeline, and the other is connected to an equipment liquid outlet pipeline.
[0018] Optionally, the liquid cooling assembly further comprises an extended cold plate.
[0019] The first water collector further comprises a third non-quick-release joint, which is located below the first quick-release joint.
[0020] The second water collector further comprises a fourth non-quick-release joint, which is located below the second quick-release joint.
[0021] The first water collector is connected to the extended cold plate through the third non-quick-release joint, and the second water collector is connected to the extended cold plate through the fourth non-quick-release joint.
[0022] Optionally, the first water collector further comprises a first liquid collecting groove, which is located at the bottom edge of the first water collector.
[0023] The second water collector further comprises a second liquid collecting groove, which is located at the bottom edge of the second water collector.
[0024] Optionally, a liquid leakage detection device is further included, which is arranged in the first liquid collecting groove and the second liquid collecting groove.
[0025] According to a second aspect of the embodiments of the present specification, an electronic device is provided, comprising:
[0026] a circuit board; and
[0027] The liquid cooling assembly of any one of the above, wherein the plurality of cold plates are located above the circuit board, and the first and second water distributors are located outside of the circuit board.
[0028] Optionally, the electronic device further comprises an accumulation disc.
[0029] The accumulation disc is arranged below the first and second water distributors.
[0030] The technical solutions provided by the embodiments of the present specification can include the following beneficial effects:
[0031] In the liquid cooling assembly, a plurality of cold plates are arranged at least in the horizontal direction, two water distributors are arranged according to the liquid inlet pipeline and the liquid outlet pipeline of the electronic device, and the water distributors are arranged on both sides of the plurality of cold plates in the horizontal direction, closer to the box of the electronic device and along the length direction of the box, so that the quick release connector of the water distributor has a larger operation space, and the maintainability of the liquid cooling system in the high-density deployed electronic device is improved.
[0032] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present specification. BRIEF DESCRIPTION OF DRAWINGS
[0033] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present specification and serve to explain the principles of the present specification together with the specification.
[0034] Figure 1 is a structural schematic diagram of a liquid cooling assembly involved in the present application;
[0035] Figure 2 is a structural schematic diagram of a liquid cooling assembly involved in the present application;
[0036] Figure 3 is a structural schematic diagram of a liquid cooling assembly involved in the present application, wherein the cold plates are divided into cold plate groups;
[0037] Figure 4 is a structural schematic diagram of a cold plate group in a liquid cooling assembly involved in the present application, wherein a bypass joint is arranged in the cold plate;
[0038] Figure 5 is a structural schematic diagram of a water distributor in a liquid cooling assembly involved in the present application;
[0039] Figure 6is a structural schematic diagram of an electronic device related to the present application. DETAILED DESCRIPTION
[0040] The exemplary embodiments will be described in detail herein with reference to the accompanying drawings. In the following description, unless otherwise indicated, like numbers in the different drawings represent similar or analogous elements. The embodiments described in the following exemplary embodiments are not meant to represent all embodiments consistent with the present description. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the present description as detailed in the appended claims.
[0041] The terminology used in the present description is for the purpose of describing particular embodiments only and is not intended to be limiting of the present description. As used in the present description and the appended claims, the singular forms "a," "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
[0042] It will be understood that, although the terms first, second, third, etc. can be used herein to describe various information, these terms are not intended to denote a particular order or hierarchy. These terms are used merely to distinguish one from another. For example, a first information can be termed a second information, and, similarly, a second information can be termed a first information, without departing from the scope of the present description. Depending on the context, the word "if' as used herein can be interpreted to mean "when" or "in response to determining".
[0043] The present application provides a liquid cooling assembly 100, as shown in Figure 1 comprising:
[0044] a plurality of cold plates 1 arranged at least along a horizontal direction X, a first joint 10 and a second joint 11 are arranged on the cold plates 1, the arrangement direction of the cold plates 1 is the horizontal direction X, which refers to the width direction of the electronic device, in the case of a large number of cold plates 1, the cold plates 1 can be divided into a plurality of cold plate groups, each cold plate group extends along the horizontal direction X, and the cold plates in each cold plate group can extend along other directions;
[0045] a first water collector 2, a plurality of first quick-release joints 20 are arranged on the first water collector 2;
[0046] a second water collector 3, a plurality of second quick-release joints 30 are arranged on the second water collector 3, the first quick-release joint 20 and the second quick-release joint 30 can refer to joints that can reduce the risk of cold liquid leakage, and the length of the quick-release joint is generally longer than that of the non-quick-release joint;
[0047] The first manifold 2 and the second manifold 3 are arranged on both sides of the plurality of cold plates 1 in the horizontal direction X, the first manifold 2, the plurality of cold plates 1 and the second manifold 3 are connected in communication through the first quick release connector 20, the first connector 10, the second connector 11 and the second quick release connector 30, the first quick release connector 20, the first connector 10, the second connector 11 and the second quick release connector 30 extend in the preset direction Y intersecting the horizontal direction X in the same plane, and the included angle A between the horizontal direction X and the preset direction Y satisfies 60°≤A≤120°.
[0048] The horizontal direction X can refer to the left-right direction in Figure 1 The preset direction Y can refer to the up-down direction in Figure 1 In Figure 1 In the above embodiment, only the left-right direction and the up-down direction are taken as examples, and the preset direction can be adjusted according to the arrangement direction of the liquid cooling assembly 100. The direction in which the quick release connector needs to be arranged corresponds to the preset direction.
[0049] Since the first manifold 2 and the second manifold 3 are arranged on both sides of the plurality of cold plates 1, and the first quick release connector 20, the first connector 10, the second connector 11 and the second quick release connector 30 extend in the preset direction Y, the first quick release connector 20 and the second quick release connector 30 can have more sufficient space when being plugged in or pulled out, thereby improving the maintainability of the liquid cooling system in the high-density electronic equipment.
[0050] In the electronic equipment, when the horizontal direction X is the width direction with a relatively small size, the preset direction Y can be the length direction with a relatively large size. Moreover, the included angle A between the horizontal direction X and the preset direction Y can be set to a certain angle range, i.e. 60° to 120°, and preferably, the included angle A can be set to 90°, that is, the preset direction Y is perpendicular to the horizontal direction X, thereby being more suitable for the length direction and the width direction of the electronic equipment. Moreover, the first connector 10, the second connector 11, the first quick release connector 20 and the second quick release connector 30 are arranged in the same direction in the preset direction Y on the cold plate 1, the first manifold 2 and the second manifold 3. Since the first quick release connector 20 and the second quick release connector 30 need to connect the first connector 10 and the second connector 11 on the cold plate 1, the arrangement in the preset direction Y can realize the simplification and convenient connection between the connectors.
[0051] In a possible implementation manner, as shown in Figure 2As shown, the number of cold plates 1 is at least two, such as four, and the four cold plates 1 are arranged in a row along the horizontal direction X, and the first and second water collectors 2 and 3 are arranged on both sides of the four cold plates 1 along the horizontal direction X. In this case, the first quick-release connector 20 is connected to one of the first and second connectors 10 and 11 through the circulation pipeline, and the second quick-release connector 30 is connected to the other of the first and second connectors 10 and 11 through the circulation pipeline, and the cold liquid flowing into the electronic device from the outside is distributed from the first water collector 2 to the plurality of cold plates 1, and then flows to the second water collector 3 through the cold plates 1, and then flows out of the electronic device, thereby forming a liquid cooling cycle in the electronic device.
[0052] In another possible implementation, optionally, the plurality of cold plates 1 form a cold plate group 4, and the cold plate group 4 is arranged along the horizontal direction; the cold plate group 4 includes at least two cold plates 1, and the at least two cold plates 1 are arranged in series. Specifically, as shown in Figure 3 As shown, in the case of a large number of cold plates 1, eight cold plates 1 can be grouped to form cold plate groups 4, i.e., cold plate group 4A, cold plate group 4B, cold plate group 4C, and cold plate group 4D, and the cold plate groups 4A, 4B, 4C, and 4D are arranged along the horizontal direction X, and the cold plates 1 in one cold plate group 4 can be arranged in a direction intersecting the horizontal direction X (such as a preset direction Y).
[0053] In the above implementation, if the cold plates are not formed into a cold plate group, the cold plates can be connected in parallel between the first and second water collectors, or the cold plates can be connected in series one by one, and if the cold plates are formed into a cold plate group, the cold plate groups can be connected in parallel, and the cold plates in one cold plate group can be connected in series.
[0054] In addition, in the above cold plate or cold plate group, the order of connection of the circulation pipeline and the cold plate can be adjusted, so that the arrangement of the circulation pipeline has a larger space to realize bending, and the damage of the circulation pipeline caused by too small bending angle is avoided. For example, in the structure as shown in Figure 3 As shown, the first quick-release connector 20 can be connected to the cold plate group 4A and the cold plate group 4D from the front side, and connected to the cold plate group 4B and the cold plate group 4C from the back side, and the second quick-release connector 30 can be connected to the cold plate group 4B and the cold plate group 4C from the front side, and connected to the cold plate group 4A and the cold plate group 4D from the front side, thereby reducing the layering of the circulation pipeline in the vertical direction, and reducing the deployment difficulty of the circulation pipeline.
[0055] For the liquid cooling assembly 100 as shown in Figure 2 The same connection mode can also be used in the liquid cooling assembly 100 as shown, and will not be described again.
[0056] Optionally, as shown in Figure 3As shown, the at least two cold plates 1 are connected in series via the first connector 10 and the second connector 11. For example, in each cold plate group 4, cold plate 1A and cold plate 1B are connected in series via the first connector 10B and the second connector 11A. The first connector 10A is connected to the first manifold 2, and the second connector 11B is connected to the second manifold 3. For one cold plate group 4, the coolant flowing in from outside the electronic device is distributed from the first manifold 2 to multiple cold plate groups 4, first flowing into cold plate 1A and then to cold plate 1B. The coolant reaches the second manifold 3 for collection and flows out of the electronic device, thereby forming a liquid cooling cycle within the electronic device.
[0057] Optionally, the cold plate 1 further includes a bypass connector 12, which is connected to the first connector 10;
[0058] The at least two cold plates 1 are connected in series via the second connector 11 and the bypass connector 12.
[0059] For example, such as Figure 4 As shown, the second connector 11 is also connected to the cold liquid cavity, the bypass connector 12 is connected to the first connector 10, and is also connected to the cold liquid cavity (not shown) inside the cold plate 1. That is, the first connector 10, the bypass connector 12 and the cold liquid cavity form a three-way structure.
[0060] When the coolant flows through the first manifold 2 to the first connector 10A, a portion of the coolant flows into the coolant cavity of the cold plate 1A, while the other portion flows through the bypass connector 12A to the second connector 11B of the cold plate 1B. After heat exchange, the coolant flowing into the cold plate 1A flows from the second connector 11A to the bypass connector 12B of the cold plate 1B. After heat exchange, the coolant flowing into the cold plate 1B flows out of the coolant cavity, mixes with the coolant flowing into the bypass connector 12B, and finally flows from the first connector 10B of the cold plate 1B to the second manifold 3 and out of the electronic equipment.
[0061] By setting a bypass connector 12 in the cold plate 1 of the cold plate group 4, the low-temperature coolant can flow evenly into the different cold plates 1 of the cold plate group 4, and after heat dissipation, it can be collected and flow out to complete the circulation, thereby improving the heat dissipation effect of the liquid cooling component 100.
[0062] Through such Figures 2-4 The setup shown allows the cold plates to be standardized, thereby improving the flexibility of using cold plates with the same structure.
[0063] Optional, such as Figure 1 , 5 As shown, the first water distribution unit 2 also includes a first non-quick-release connector 21, which is located below the first quick-release connector 20.
[0064] The second manifold 3 further comprises a second non-quick-release connector 31, which is located below the second quick-release connector 30.
[0065] One of the first non-quick-release connector 21 and the second non-quick-release connector 31 is connected to the equipment liquid inlet pipeline 50, and the other is connected to the equipment liquid outlet pipeline 51.
[0066] In the liquid cooling assembly 100, the equipment liquid inlet pipeline 50 and the equipment liquid outlet pipeline 51 need to be shut down when maintenance is performed, and there is no quick-release requirement, so that the non-quick-release connector can be arranged on the first manifold 2 and the second manifold 3 to meet the requirement, and the non-quick-release connector is arranged below the quick-release connector on the manifold.
[0067] Optionally, the liquid cooling assembly 100, as shown in Figure 1 、 5 further comprises an extended cold plate 60, 61;
[0068] The first manifold 2 further comprises a third non-quick-release connector 22, which is located below the first quick-release connector 20.
[0069] The second manifold 3 further comprises a fourth non-quick-release connector 32, which is located below the second quick-release connector 30.
[0070] The first manifold 2 is connected to the extended cold plate 60, 61 through the third non-quick-release connector 22, and the second manifold 3 is connected to the extended cold plate 60, 61 through the fourth non-quick-release connector 32.
[0071] Similar to the first non-quick-release connector 21 and the second non-quick-release connector 31 connected to the equipment liquid inlet pipeline 50 and the equipment liquid outlet pipeline 51, the extended cold plate 60, 61 also has no quick-release requirement, so that the non-quick-release connector can be arranged on the first manifold 2 and the second manifold 3 to meet the requirement, and the non-quick-release connector is arranged below the quick-release connector on the manifold.
[0072] For the non-quick-release connector, being arranged below the quick-release connector can make the space on the manifold more reasonably used, and improve the deployment flexibility of the liquid cooling assembly.
[0073] Optionally, as shown in Figure 5 The first manifold 2 further comprises a first liquid collecting groove 23, which is located at the bottom edge of the first manifold 2.
[0074] The second water collector 3 further comprises a second collecting tank 33 located at the bottom edge of the second water collector 3.
[0075] By arranging the collecting tank below the water collector, the water collector can collect the cold liquid dripping from the joint, thereby reducing the risk of short circuit caused by the cold liquid dripping onto the circuit board in the electronic device, and further improving the reliability of the liquid cooling assembly.
[0076] Optionally, the liquid cooling assembly 100 further comprises a liquid leakage detection device arranged in the first collecting tank 23 and the second collecting tank 33.
[0077] By arranging the liquid leakage detection device, such as a liquid leakage detection rope, in the collecting tank and transmitting the signal generated by the liquid leakage detection rope to the controller, the alarm for the liquid leakage of the water collector is realized, and the reliability of the liquid cooling assembly is further improved.
[0078] Correspondingly, the application also provides an electronic device 200, as shown in the accompanying drawings, comprising: Figure 6
[0079] a circuit board 201; and
[0080] The liquid cooling assembly 100 of any one of the above, wherein the plurality of cold plates 1 in the liquid cooling assembly 100 are located above the circuit board 201, and the first water collector 2 and the second water collector 3 in the liquid cooling assembly 100 are located outside the circuit board 201.
[0081] Since the cold plates 1, the first water collector 2 and the second water collector 3 in the liquid cooling assembly 100 are arranged along the horizontal direction X (i.e. the width direction of the electronic device 200), the first water collector 2 and the second water collector 3 prone to liquid leakage are close to the edge of the box of the electronic device. In the case of liquid leakage, the liquid leakage can drop as much as possible outside the circuit board 201, thereby reducing the risk of short circuit caused by the cold liquid dripping onto the circuit board in the electronic device, and since the first quick release joint 20 on the first water collector 2 and the second quick release joint 30 on the second water collector 3 can be arranged along the preset direction Y, there is sufficient operation space, and the maintainability of the liquid cooling system in the high-density deployment electronic device is improved.
[0082] Optionally, the electronic device 200 further comprises a liquid accumulation tray (not shown);
[0083] The liquid accumulation tray is arranged below the first water collector 2 and the second water collector 3.
[0084] The liquid collected by the liquid collection tray arranged in the electronic device 200 drops to the bottom plate of the cabinet of the electronic device 200, avoids the cold liquid from gathering in the electronic device 200 to affect the work of the circuit board 201, and the liquid collection tray can be further provided with a flow guide opening and the like to discharge the cold liquid from the electronic device, thereby further improving the reliability of the liquid cooling system in the electronic device.
[0085] In the embodiments of the present specification, in the liquid cooling assembly, the cold plates are arranged in the horizontal direction, two water collectors are arranged according to the liquid inlet pipeline and the liquid outlet pipeline of the electronic device, and the water collectors are arranged on both sides of the cold plates in the horizontal direction and closer to the cabinet of the electronic device and along the length direction of the cabinet, so that the quick release joint of the water collector has a larger operation space, and the maintainability of the liquid cooling system in the high-density deployed electronic device is improved.
[0086] Other embodiments of the present specification will be readily apparent to those skilled in the art upon considering the specification in its entirety. The present specification is intended to cover any variations, uses, or adaptations of the present specification following the general principles thereof and including modifications and equivalents of the present specification that are obvious to those skilled in the art. The present specification is to be regarded as illustrative rather than restrictive, and the true scope and spirit of the present specification are indicated by the following claims.
[0087] It should be understood that the present specification is not limited to the precise structures described and shown in the drawings, and that various modifications and changes can be made without departing from its scope. The scope of the present specification is limited only by the claims appended hereto.
[0088] The above is only the preferred embodiment of the present specification, and does not limit the present specification, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present specification shall be included in the scope of protection of the present specification.
Claims
1. A liquid-cooled assembly, comprising: The application relates to a liquid cooling assembly. The application comprises: a plurality of cold plates arranged at least in a horizontal direction, wherein a first joint and a second joint are arranged on the cold plates; a first water collector, wherein a plurality of first quick-release joints are arranged on the first water collector; a second water collector, wherein a plurality of second quick-release joints are arranged on the second water collector; 2. The liquid-cooling assembly of claim 1, wherein, wherein the first water collector and the second water collector are arranged on both sides of the plurality of cold plates in the horizontal direction, the first water collector, the plurality of cold plates and the second water collector are connected in communication through the first quick-release joint, the first joint, the second joint and the second quick-release joint, the first quick-release joint, the first joint, the second joint and the second quick-release joint extend in a preset direction intersecting the horizontal direction in the same plane, and the included angle A between the horizontal direction and the preset direction satisfies 60 DEG <= A <= 120 DEG. The plurality of cold plates form a cold plate group, and the cold plate group is arranged in the horizontal direction.
3. The liquid-cooling assembly of claim 2, wherein, The cold plate group comprises at least two cold plates, and the at least two cold plates are arranged in series.
4. The liquid-cooling assembly of claim 2, wherein, The at least two cold plates are connected in series through the first joint and the second joint. The cold plate further comprises a bypass joint, and the bypass joint is connected in communication with the first joint.
5. The liquid cooling assembly of claim 1, wherein, The at least two cold plates are connected in series through the second joint and the bypass joint. The first water collector further comprises a first non-quick-release joint, and the first non-quick-release joint is located on the lower side of the first quick-release joint. The second water collector further comprises a second non-quick-release joint, and the second non-quick-release joint is located on the lower side of the second quick-release joint.
6. The liquid-cooling assembly of claim 1, wherein, One of the first non-quick-release joint and the second non-quick-release joint is connected with a device liquid inlet pipeline, and the other one is connected with a device liquid outlet pipeline. The application further comprises an expansion cold plate. The first water collector further comprises a third non-quick-release joint, and the third non-quick-release joint is located on the lower side of the first quick-release joint. The second water collector further comprises a fourth non-quick-release joint, and the fourth non-quick-release joint is located on the lower side of the second quick-release joint.
7. The liquid cooling assembly of any of claims 1-6, wherein, The first water collector is connected with the expansion cold plate through the third non-quick-release joint, and the second water collector is connected with the expansion cold plate through the fourth non-quick-release joint. The first water collector further comprises a first liquid collecting groove, and the first liquid collecting groove is located on the bottom edge of the first water collector.
8. The liquid cooling assembly of claim 7, wherein, The second water collector further comprises a second liquid collecting groove, and the second liquid collecting groove is located on the bottom edge of the second water collector.
9. An electronic device, comprising: The application further comprises liquid leakage detection devices arranged in the first liquid collecting groove and the second liquid collecting groove. The application relates to a liquid cooling assembly. The application comprises: a circuit board; and 10. The electronic device of claim 9, wherein, the liquid cooling assembly according to any one of claims 1-8, wherein the plurality of cold plates in the liquid cooling assembly are located above the circuit board, and the first water collector and the second water collector in the liquid cooling assembly are located on the outer side of the circuit board. The application further comprises a liquid accumulation disc. The liquid accumulation disc is arranged below the first water collector and the second water collector.