Pressing plate type MOS tube fixing structure

Abstract

The utility model provides a pressing plate type MOS (Metal Oxide Semiconductor) tube fixing structure, which comprises at least two MOS tubes which are arranged at intervals on a main board along a first direction, a pressing plate is integrally formed in a cavity of a heat conduction shell, any MOS tube extends into a gap formed by the inner wall of the heat conduction shell and the pressing plate, and the pressing plate is arranged in the cavity of the heat conduction shell. The fastener penetrates into the heat conduction shell from the outside of the heat conduction shell to fixedly connect the heat conduction shell with the pressing plate. The pressing plate is attached to the MOS tube and enables the MOS tube to abut against the inner wall of the heat conduction shell. When the heat conduction shell and the pressing plate are not connected through the fastening piece, the gap between the pressing plate and the inner wall of the heat conduction shell is larger than the thickness of the MOS tube, and the MOS tube can conveniently stretch into the gap between the pressing plate and the inner wall of the heat conduction shell. When the heat conduction shell and the pressing plate are connected in a fastened mode through the fastener, the pressing plate and the inner wall of the heat conduction shell are matched to enable the MOS tube to abut against and be fixed, the attaching degree of the pressing plate and the heat conduction shell and the MOS tube is improved, the heat dissipation effect is improved, and installation is stable.

Description

TECHNICAL FIELD

[0001] The utility model relates to MOS tube fixing technical field, specifically, relate to a pressboard formula MOS tube fixing structure. BACKGROUND

[0002] The controller is the core part of the electric system of the two-wheeled vehicle, and its stability determines the operation of the motor, a good controller can not only improve the motor efficiency, but also make the motor power output more stable, thereby improving the riding feeling and safety, and can also improve the service life of the motor. The core of the controller is the MOS tube, and the MOS tube is like the heart of the controller, and its quality affects the stability of the output voltage and current of the controller. The biggest problem of the MOS tube is heating, and a good heat dissipation scheme directly affects the service life and current output capacity of the controller.

[0003] The existing patent application document with the publication number CN204362474U discloses a MOS tube fixing structure, which comprises a shell body, a plurality of MOS tubes and a PCB board arranged in the shell body, and a fixing seat arranged in the shell body. The fixing seat comprises a connecting plate and a plurality of elastic components, each elastic component corresponds to one MOS tube, and the connecting plate is connected with the shell body at opposite ends and cooperates with the shell body to surround each MOS tube.

[0004] The existing MOS tube heat dissipation mode is to install the MOS tube on the shell by the connecting plate, which is inconvenient to install and has poor heat dissipation effect, and there is room for improvement. UTILITY MODEL CONTENTS

[0005] In view of the defects in the prior art, the utility model aims to provide a pressboard formula MOS tube fixing structure.

[0006] According to the pressboard formula MOS tube fixing structure, the MOS tube is arranged on the main plate in the first direction, and the two MOS tubes are arranged at intervals.

[0007] The main plate is fixedly installed in the cavity of the heat conduction shell body, the cavity of the heat conduction shell body is integrally formed with a press plate, any MOS tube extends into the gap formed by the inner wall of the heat conduction shell body and the press plate, and the fastener penetrates from the outside of the heat conduction shell body into the inside of the heat conduction shell body and fixedly connects the heat conduction shell body and the press plate.

[0008] The pressing plate is locked and attached to the MOS tube by the fastener, and the MOS tube is abutted against the inner wall of the heat-conducting shell.

[0009] Preferably, the side of any MOS tube away from the main plate is attached to the inner wall of the heat-conducting shell.

[0010] Preferably, the material of the heat-conducting shell and the pressing plate is aluminum.

[0011] Preferably, the fastener comprises self-tapping screws, which are inserted into the heat-conducting shell from the outside to the inside; the self-tapping screws inserted into the heat-conducting shell pass through the gap between the adjacent two MOS tubes and are screwed into the pressing plate, and the pressing plate is pulled backward during locking, so that the MOS tube is attached to the heat-conducting shell.

[0012] Preferably, the self-tapping screws are arranged at least two in the length direction of the pressing plate on the heat-conducting shell.

[0013] Preferably, the inner wall of the heat-conducting shell is formed with mounting grooves, and the mounting grooves are formed with one on each of the opposite two inner walls of the heat-conducting shell.

[0014] The main plate is inserted into the mounting grooves on the opposite two inner walls of the heat-conducting shell.

[0015] Preferably, the edge of the main plate is embedded in the mounting groove, and the side of the main plate close to the MOS tube and the side away from the MOS tube are not attached to the inner wall of the heat-conducting shell.

[0016] Preferably, the MOS tube is connected to the main plate by the pin, and the MOS tube body does not contact the main plate.

[0017] Preferably, the outer surface of the side wall of the heat-conducting shell attached to the MOS tube is provided with a continuous tooth-shaped structure.

[0018] Preferably, when the fastener does not connect the heat-conducting shell and the pressing plate, the gap between the pressing plate and the inner wall of the heat-conducting shell is greater than the thickness of the MOS tube.

[0019] When the fastener fastens and connects the heat-conducting shell and the pressing plate, the MOS tube is abutted and fixed by the cooperation of the pressing plate and the inner wall of the heat-conducting shell.

[0020] Compared with the prior art, the utility model has the beneficial effects that:

[0021] 1. The utility model discloses a utility model discloses a kind of MOS tube fixing structures, including heat-conducting shell, MOS tube, main plate and fastener, MOS tube is arranged at least two in first direction spacing on main plate. BRIEF DESCRIPTION OF DRAWINGS

[0022] Other features, objects and advantages of the utility model will become more apparent from the following detailed description of non-limiting embodiments, with reference to the attached drawings:

[0023] Figure 1 It is the internal structure schematic diagram of the MOS tube fixing structure as a whole that the utility model mainly embodies;

[0024] Figure 2 It is the sectional view of the MOS tube fixing structure as a whole that the utility model mainly embodies;

[0025] Figure 3 It is the installation structure schematic diagram of self-tapping screw on heat-conducting shell that the utility model mainly embodies.

[0026] Reference signs: 1, heat-conducting shell;2, MOS tube;3, self-tapping screw;4, main plate;5, pressing plate;6, installation groove. DETAILED DESCRIPTION

[0027] The utility model will be described in detail in combination with specific embodiments. The following embodiments will help the person skilled in the art to further understand the utility model, but do not limit the utility model in any form. It should be pointed out that, for ordinary skilled in the art, without departing from the concept of the utility model, a number of changes and improvements can be made. These all belong to the protection scope of the utility model.

[0028] As Figure 1 , Figure 2 and Figure 3 Indicated, according to the pressing plate type MOS tube 2 fixing structure provided by the utility model, including heat-conducting shell 1 with cavity, MOS tube 2, main plate 4 and fastener, MOS tube 2 is installed two at least in first direction spacing on main plate 4. Main plate 4 is fixedly installed in the cavity of heat-conducting shell 1, and the cavity of heat-conducting shell 1 is integrally formed with pressing plate 5, and any MOS tube 2 extends into the gap formed between the inner wall of heat-conducting shell 1 and pressing plate 5, and fastener is inserted into heat-conducting shell 1 from outside and fixedly connected with heat-conducting shell 1 and pressing plate 5.

[0029] It should be noted that the pressing plate 5 has good thermal conductivity, when the fastener does not connect the heat-conducting shell 1 and the pressing plate 5, the gap between the pressing plate 5 and the inner wall of the heat-conducting shell 1 is greater than the thickness of the MOS tube 2, so that the MOS tube 2 can be inserted into the gap between the pressing plate 5 and the inner wall of the heat-conducting shell 1. When the fastener connects the heat-conducting shell 1 and the pressing plate 5, the pressing plate 5 and the inner wall of the heat-conducting shell 1 cooperate to abut and fix the MOS tube 2, which helps to improve the fit of the heat-conducting shell 1 and the MOS tube 2, further helps to improve the heat dissipation effect, and the installation is stable.

[0030] Further, the materials of the heat-conducting shell 1 and the pressing plate 5 are both aluminum. The heat-conducting shell 1 and the pressing plate 5 are integrally formed, since aluminum has good thermal conductivity and ductility, the use of aluminum material in the technical scheme of the application not only facilitates casting and forming, but also facilitates heat conduction. When the fastener connects the heat-conducting shell 1 and the pressing plate 5, the pressing plate 5 deforms to a certain extent, the pressing plate 5 is fitted with the MOS tube 2 and abuts the MOS tube 2 on the inner wall of the heat-conducting shell 1. The MOS tube 2 is fixedly installed.

[0031] Further, the MOS tube 2 of the application is arranged and installed at least two in the first direction on the mainboard 4, the number of MOS tubes 2 is not limited by the technical scheme of the application, and the number of MOS tubes 2 can be configured according to actual conditions. The first direction of the application refers to the length direction of the pressing plate 5, and the plurality of MOS tubes 2 arranged in the first direction facilitates the pressing plate 5 to abut and fix all the MOS tubes 2 on the inner wall of the heat-conducting shell 1.

[0032] Further, the fastener includes a self-tapping screw 3, which penetrates from the outside of the heat-conducting shell 1 into the inside of the heat-conducting shell 1. The self-tapping screw 3 penetrating into the heat-conducting shell 1 passes through the gap between the adjacent two MOS tubes 2 and is screwed into the pressing plate 5 to fixedly connect the heat-conducting shell 1 and the pressing plate 5. Or, the self-tapping screw 3 penetrating into the heat-conducting shell 1 passes through the gap between the MOS tube 2 and the inner wall of the heat-conducting shell 1 and is screwed into the pressing plate 5 to fixedly connect the heat-conducting shell 1 and the pressing plate 5. It should be noted that the self-tapping screw 3 needs to avoid the MOS tube 2 when connecting the heat-conducting shell 1 and the pressing plate 5 to prevent damaging the MOS tube 2. The self-tapping screw 3 is arranged at least two in the length direction of the pressing plate 5 on the heat-conducting shell 1. Preferably, one self-tapping screw 3 is arranged at each end of the length of the pressing plate 5, which helps to improve the stability of the pressing plate 5 in clamping the MOS tube 2 as a whole.

[0033] Further, the inner wall of the heat-conducting shell 1 is formed with a mounting groove 6, and one mounting groove 6 is formed on each of the opposite inner walls of the heat-conducting shell 1. The main board 4 is inserted into the mounting grooves 6 on the opposite inner walls of the heat-conducting shell 1. The edges of the main board 4 are embedded in the mounting grooves 6, and the side of the main board 4 close to the MOS tube 2 and the side of the main board 4 away from the MOS tube 2 are not in contact with the inner wall of the heat-conducting shell 1. The stable installation of the main board 4 is achieved, and the heat dissipation of the main board 4 is facilitated. The MOS tube 2 is connected with the main board 4 through the pins, and the MOS tube 2 body is not in contact with the main board 4, so that the heat generated by the main board 4 cannot be directly transmitted to the MOS tube 2.

[0034] In a preferred embodiment, the side of any MOS tube 2 away from the main board 4 is in contact with the inner wall of the heat-conducting shell 1, the contact area of the MOS tube 2 and the heat-conducting shell 1 made of aluminum is increased, and the heat dissipation effect of the MOS tube 2 is improved. The outer surface of the side wall of the heat-conducting shell 1 in contact with the MOS tube 2 is provided with a continuous tooth-shaped structure, the contact area of the heat-conducting shell 1 and the external environment is increased, the heat dissipation effect of the heat-conducting shell 1 is improved, and the heat dissipation effect of the MOS tube 2 is further improved.

[0035] It should be emphasized that: when the heat dissipation shell of the aluminum profile is formed, the aluminum pressing plate 5 is directly integrated with the heat-conducting shell 1 to form an inwardly extending plate-shaped structure, and a certain gap is left between the pressing plate 5 and the inner side wall of the heat-conducting shell 1 to facilitate the insertion of the MOS tube 2. After the main board 4 with the welded components is inserted into the heat-conducting shell 1, the MOS tube 2 will enter the gap, and the pressing plate 5 will be locked from the outside of the heat-conducting shell 1 by using the self-tapping screw 3. At this time, the pressing plate 5 will be pulled towards the MOS tube 2 under the tension of the screw, so that the MOS tube 2 is fixed on the inner side wall of the heat-conducting shell 1. The advantage of the technical scheme is that the aluminum profile can be used as the shell to reduce the amount of material, and only two screws are needed to fix multiple MOS tubes 2 on the side wall of the shell, making the operation more convenient.

[0036] It should be further emphasized that: the self-tapping screw 3 is locked from the outside of the heat-conducting shell 1, and at this time the self-tapping screw 3 will be locked on the pressing plate 5 inside the heat-conducting shell 1. When the self-tapping screw 3 is continuously locked, the self-tapping screw 3 will exert a pulling force F on the pressing plate 5, causing the pressing plate 5 to deform towards the MOS tube 2. When the two self-tapping screws 3 reach a certain pre-tightening force, the pulling force F generated by the pressing plate 5 on the MOS tube 2 will tightly press the MOS tube 2 against the side wall of the shell, so as to fix the MOS tube 2, and the MOS tube 2 can smoothly dissipate heat to the outside through the heat-conducting shell 1.

[0037] In the description of the present application, it needs to be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0038] The specific embodiments of the present application are described above. It needs to be understood that the present application is not limited to the specific embodiments described above, and various changes or modifications can be made by those skilled in the art within the scope of the claims, which does not affect the essential content of the present application. In the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. A pressure plate type MOS transistor fixing structure, characterized in that, The application relates to a heat-conducting shell (1) with a cavity, MOS tubes (2), a main plate (4) and fasteners, wherein the MOS tubes (2) are arranged at least in intervals in a first direction on the main plate (4). The main plate (4) is fixedly arranged in the cavity of the heat-conducting shell (1), the cavity of the heat-conducting shell (1) is integrally formed with a pressing plate (5), any MOS tube (2) extends into the gap formed between the inner wall of the heat-conducting shell (1) and the pressing plate (5), and the fasteners are inserted from the outside of the heat-conducting shell (1) into the inside of the heat-conducting shell (1) to fixedly connect the heat-conducting shell (1) and the pressing plate (5). The pressing plate (5) is locked and attached to the MOS tube (2) by the fasteners, and the MOS tube (2) is abutted against the inner wall of the heat-conducting shell (1).

2. The press plate type MOS fixing structure according to claim 1, wherein The side of any MOS tube (2) away from the main plate (4) is attached to the inner wall of the heat-conducting shell (1).

3. The press plate type MOS fixing structure according to claim 1, wherein The materials of the heat-conducting shell (1) and the pressing plate (5) are both aluminum.

4. The structure of claim 1, wherein The fasteners include self-tapping screws (3) which are inserted from the outside of the heat-conducting shell (1) into the inside of the heat-conducting shell (1). The self-tapping screws (3) inserted into the inside of the heat-conducting shell (1) pass through the gap between the two adjacent MOS tubes (2) and are screwed into the pressing plate (5), and the pressing plate (5) is pulled backward during the locking process, so that the MOS tube (2) is attached to the heat-conducting shell (1).

5. The structure of claim 4, wherein the press plate is made of a material having a coefficient of thermal expansion of 1.5 x 10"6 or less. The self-tapping screws (3) are arranged at least in intervals in the length direction of the pressing plate (5) on the heat-conducting shell (1). ​ 6. The structure of claim 1, wherein Mounting grooves (6) are formed on the inner wall of the heat-conducting shell (1), and one mounting groove (6) is formed on each of the two opposite inner walls of the heat-conducting shell (1). The main plate (4) is inserted into the mounting grooves (6) on the two opposite inner walls of the heat-conducting shell (1).

7. The pressure plate type MOS transistor fixing structure as described in claim 6, characterized in that, The edge of the main plate (4) is embedded in the mounting groove (6), and the side of the main plate (4) close to the MOS tube (2) and the side of the main plate (4) away from the MOS tube (2) are not attached to the inner wall of the heat-conducting shell (1).

8. The structure of claim 1, wherein The MOS tube (2) is connected to the main plate (4) through a tube pin, and the MOS tube (2) body does not contact the main plate (4).

9. The structure of claim 1, wherein The outer surface of the side wall of the heat-conducting shell (1) attached to the MOS tube (2) is provided with a continuous tooth-shaped structure.

10. The structure of claim 1, wherein When the fasteners do not connect the heat-conducting shell (1) and the pressing plate (5), the gap between the pressing plate (5) and the inner wall of the heat-conducting shell (1) is greater than the thickness of the MOS tube (2); When the fasteners tightly connect the heat-conducting shell (1) and the pressing plate (5), the MOS tube (2) is abutted and fixed by the cooperation of the pressing plate (5) and the inner wall of the heat-conducting shell (1).

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