Developing machine gluing mechanism for circuit board processing

By designing a photoresist coating mechanism for a developing machine used in circuit board processing, and employing a lead screw, threaded block, hydraulic cylinder, piston rod, storage frame, and mesh structure, the problem of traditional photoresist coating mechanisms being unable to process multiple circuit boards simultaneously was solved, thereby improving the uniformity of the photosensitive adhesive coating and production efficiency.

CN223888331UActive Publication Date: 2026-02-10YUHONGYAN TECH (SUZHOU) CO LTD
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Patent Information

Application Number
CN202520044093.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-09
Publication Date
2026-02-10
Estimated Expiration
2035-01-09

AI Technical Summary

Technical Problem

Traditional PCB dip-coating mechanisms cannot process multiple PCBs simultaneously, resulting in uneven photosensitive adhesive coating thickness and affecting the production efficiency of subsequent exposure and development processes.

Method used

A coating mechanism for a developing machine used in circuit board processing was designed. It employs a lead screw, threaded block, hydraulic cylinder, piston rod, storage frame, and mesh structure to allow multiple circuit boards to be soaked and their positions adjusted simultaneously, facilitating their transfer to subsequent workstations. Combined with a servo motor and a splitting board structure, it facilitates cleaning and maintenance.

Benefits of technology

This technology achieves uniform photosensitive adhesive coating across multiple circuit boards, improves production efficiency, ensures accurate transfer during subsequent exposure and development processes, and simplifies the circuit board handling process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a developing machine gluing mechanism for circuit board processing, which comprises a dip-coating box body, a storage box movably arranged in the dip-coating box body, an adjusting frame arranged at the top of the dip-coating box body, a screw rod arranged in the adjusting frame, a threaded block sleeved at one end part of the screw rod, and a lifting frame arranged at the top of the threaded block, a hydraulic cylinder is arranged at the top of the lifting frame, an output shaft of the hydraulic cylinder is in transmission connection with a piston rod, an arc-shaped plate is arranged at one end of the piston rod, a lead screw, a threaded block, the hydraulic cylinder, the piston rod, a storage frame and a leakage net are arranged, a circuit board is placed in the storage frame, and at the moment, the threaded block is located on one side of the adjusting frame; and after soaking is completed, along with rising of the storage frame, the servo motor continues to be started, the threaded block is driven to move left and right at one end of the lead screw, the position direction of the storage frame can be adjusted, and the soaked circuit board can be conveniently transferred to a subsequent station.
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Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and in particular to a coating mechanism for a developing machine used in circuit board processing. Background Technology

[0002] The adhesive coating mechanism of a developing machine for circuit board processing is usually used for applying adhesive during the developing process. The purpose is to ensure that a protective coating is evenly applied to the surface of the circuit board to prevent uneven development reaction of the photosensitive film after exposure. The adhesive coating mechanism includes an immersion coating mechanism, which mainly involves immersing the circuit board in the adhesive tank and removing it after the adhesive has completely coated the surface. The adhesive includes photosensitive adhesive. The uniformity of the coating is very important for subsequent exposure and developing processes.

[0003] The dip-coating mechanism directly immerses the circuit board in the photosensitive adhesive solution to achieve uniform coating of photosensitive adhesive. If each circuit board needs to be soaked and removed separately, it will greatly increase the processing time and reduce production efficiency. Traditional coating mechanisms cannot soak, process and remove multiple circuit boards at the same time. Soaking a single circuit board may result in different thicknesses of the photosensitive adhesive coating on each circuit board. Uneven coating will affect the subsequent exposure and development processes. Therefore, a coating mechanism for a developing machine for circuit board processing is designed. Utility Model Content

[0004] The purpose of this invention is to provide a coating mechanism for a developing machine used in circuit board processing, in order to solve the problem mentioned in the background art that the thickness of the photosensitive adhesive coating on each circuit board may vary due to immersion in a single circuit board, and that uneven coating may affect the subsequent exposure and development processes.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a coating mechanism for a developing machine used in circuit board processing, comprising a dipping box, a storage box movably installed inside the dipping box, an adjustment frame on the top of the dipping box, a lead screw inside the adjustment frame, a threaded block sleeved at one end of the lead screw, a lifting frame on the top of the threaded block, a hydraulic cylinder on the top of the lifting frame, a piston rod drivenly connected to the output shaft of the hydraulic cylinder, an arc-shaped plate at one end of the piston rod, an abutment rod at the top of the arc-shaped plate, a storage frame at one end of the abutment rod, and a mesh screen at the bottom of the storage frame.

[0006] As a preferred embodiment of this utility model, a limiting nut is threaded onto one end of the abutment rod, and a split plate is placed inside the storage frame.

[0007] As a preferred embodiment of this utility model, the top of the split plate is provided with two protruding strips, and the top of the storage frame is provided with two recessed holes.

[0008] As a preferred embodiment of this utility model, one end of each of the two protruding strips is engaged with the interior of the two concave holes.

[0009] As a preferred embodiment of this utility model, a servo motor is provided on one side of the adjustment frame, and the threaded block is threaded onto one end of the lead screw.

[0010] In a preferred embodiment of this invention, the output shaft of the servo motor is connected to one end of the lead screw via a transmission connection.

[0011] As a preferred embodiment of this utility model, the storage box is filled with photosensitive adhesive, and the storage frame contains multiple circuit boards.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. This utility model discloses a coating mechanism for a developing machine used in circuit board processing. It comprises a lead screw, a threaded block, a hydraulic cylinder, a piston rod, a receiving frame, and a screen. The circuit board is placed inside the receiving frame, with the threaded block positioned on one side of the adjustment frame. As the hydraulic cylinder is activated, the piston rod drives the receiving frame to move up and down, sequentially lowering it into the storage box where it is immersed in the photosensitive adhesive injected inside. This gradually forms a photosensitive protective film on the surface of the circuit board, preparing it for subsequent exposure and developing steps, thus achieving precise transfer of the circuit pattern. After immersion, as the receiving frame rises, a servo motor is activated, driving the threaded block to move left and right at one end of the lead screw. This allows adjustment of the receiving frame's position and orientation, facilitating the transfer of the immersed circuit board to subsequent workstations.

[0014] 2. This utility model discloses a coating mechanism for a developing machine used in circuit board processing. By setting a splitting plate, recessed holes, protruding strips, and limiting nuts, the splitting plate is pulled upwards, and the two protruding strips are gradually pulled out from the corresponding recessed holes, thus achieving the disassembly of the storage frame and the splitting plate. At this time, one side of the storage frame is in a hollow state. By the operator pushing the circuit board to one side, the circuit board can be moved out through the hollow position. After the storage frame rises, the limiting nuts are rotated in the opposite direction to separate the limiting nuts from the abutment rods. Pulling the abutment rods downwards can separate the arc-shaped plate from the abutment rods, making it easy to clean and maintain the storage frame separately. Attached Figure Description

[0015] Figure 1 This is a front view structural diagram of the present utility model;

[0016] Figure 2 For the present utility model Figure 1 Enlarged view of point A in the middle;

[0017] Figure 3 This is a partial front view schematic diagram of the structure of this utility model;

[0018] Figure 4 This is a partial bottom view of the structure of this utility model.

[0019] In the diagram: 1. Dipping box; 2. Storage box; 3. Adjustment frame; 4. Lead screw; 5. Threaded block; 6. Servo motor; 7. Lifting frame; 8. Hydraulic cylinder; 9. Piston rod; 10. Arc plate; 11. Abutment rod; 12. Limit nut; 13. Storage frame; 14. Strainer; 15. Splitting plate; 16. Concave hole; 17. Raised strip. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-4 This utility model provides a technical solution for a coating mechanism of a developing machine for circuit board processing:

[0022] Example 1:

[0023] like Figure 1-3 As shown, a developing machine coating mechanism for circuit board processing includes an immersion coating chamber 1, a storage box 2 movably installed inside the immersion coating chamber 1, an adjustment frame 3 on the top of the immersion coating chamber 1, a lead screw 4 inside the adjustment frame 3, a threaded block 5 sleeved at one end of the lead screw 4, a lifting frame 7 on the top of the threaded block 5, a hydraulic cylinder 8 on the top of the lifting frame 7, a piston rod 9 connected to the output shaft of the hydraulic cylinder 8, an arc plate 10 on one end of the piston rod 9, an abutment rod 11 on the top of the arc plate 10, a receiving frame 13 on one end of the abutment rod 11, and a mesh screen 14 at the bottom of the receiving frame 13. The receiving frame 13 enters the storage box 2 sequentially and is immersed in the photosensitive adhesive injected inside, so that a photosensitive protective film is gradually formed on the surface of the circuit board, preparing for subsequent exposure and developing steps, thereby achieving accurate transfer of circuit patterns. After immersion, as the receiving frame 13 rises, the servo motor 6 is started, driving the threaded block 5 to move left and right at one end of the lead screw 4.

[0024] Example 2:

[0025] Based on Example 1, such as Figure 1 and Figure 4As shown, a servo motor 6 is provided on one side of the adjustment frame 3, and the threaded block 5 is threaded onto one end of the lead screw 4. Photosensitive adhesive is injected into the inside of the storage box 2, and multiple circuit boards are placed inside the storage frame 13. Pulling up the split plate 15, the two protrusions 17 are gradually pulled out from the inside of the corresponding recesses 16, thus realizing the disassembly of the storage frame 13 and the split plate 15. At this time, one side of the storage frame 13 is in a hollow state. By having the staff push the circuit board to one side, the circuit board can be moved out through the hollow position.

[0026] Working Principle: The adhesive coating mechanism of a developing machine for circuit board processing is typically used for applying adhesive during the developing process. The purpose is to ensure a uniform protective coating is applied to the circuit board surface, preventing uneven development of the photosensitive film after exposure. The coating mechanism includes an immersion coating mechanism, which involves immersing the circuit board in an adhesive bath until the surface is completely coated. The adhesive includes photosensitive adhesive. The uniformity of the coating is crucial for subsequent exposure and developing processes. The immersion coating mechanism achieves uniform coating by directly immersing the circuit board in the photosensitive adhesive solution. If each circuit board needs to be individually immersed and removed... This would significantly increase processing time and reduce production efficiency. Traditional coating mechanisms cannot simultaneously immerse, process, and remove multiple circuit boards. Immersing a single circuit board may result in varying thicknesses of the photosensitive adhesive coating on each board, and uneven coating will affect subsequent exposure and development processes. Therefore, a coating mechanism for a developing machine used in circuit board processing is designed. Multiple circuit boards are placed sequentially inside the storage frame 13. At this time, the threaded block 5 is located on one side of the adjustment frame 3. With the activation of the hydraulic cylinder 8, the storage frame 13 moves up and down under the transmission of the piston rod 9. The storage frame 13 then sequentially descends into the storage box 2, which has been pre-installed... After photosensitive adhesive is injected into the storage box 2, the storage frame 13 enters the storage box 2. Through the mesh 14, multiple circuit boards are immersed in the injected photosensitive adhesive, gradually forming a photosensitive protective film on the surface of the circuit boards. This prepares the circuit boards for subsequent exposure and development steps, thus achieving precise transfer of the circuit pattern. After immersion, as the storage frame 13 rises, the servo motor 6 is activated, driving the threaded block 5 to move left and right at one end of the lead screw 4. This allows adjustment of the position and orientation of the storage frame 13, facilitating the transfer of the immersed circuit boards to the subsequent workstation. The splitting plate 15 is then pulled upwards. As the protruding strip 17 is gradually pulled out from the corresponding recess 16, the storage frame 13 and the split plate 15 can be disassembled. At this time, one side of the storage frame 13 is hollowed out. By having the staff move the circuit board to one side, the circuit board can be moved out through the hollowed-out position. After the storage frame 13 rises, the limiting nut 12 is rotated in the opposite direction to separate the limiting nut 12 from the abutment rod 11. The abutment rod 11 is pulled down to separate the arc plate 10 from the abutment rod 11, making it easier to clean and maintain the storage frame 13 separately. When the circuit board is soaked, it needs to be cured on the top of the coating box 1 for a period of time.

[0027] In the description of this utility model, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this utility model and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0028] In this utility model, unless otherwise explicitly specified and limited, for example, it can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components or an interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A coating mechanism for a developing machine used in circuit board processing, comprising a dip coating chamber (1), characterized in that: The immersion coating chamber (1) is equipped with a storage box (2) inside. An adjustment frame (3) is provided on the top of the immersion coating chamber (1). A lead screw (4) is provided inside the adjustment frame (3). A threaded block (5) is sleeved on one end of the lead screw (4). A lifting frame (7) is provided on the top of the threaded block (5). A hydraulic cylinder (8) is provided on the top of the lifting frame (7). A piston rod (9) is connected to the output shaft of the hydraulic cylinder (8). An arc plate (10) is provided on one end of the piston rod (9). An abutment rod (11) is provided on the top of the arc plate (10). A storage frame (13) is provided on one end of the abutment rod (11). A mesh (14) is provided at the bottom of the storage frame (13).

2. The adhesive coating mechanism for a developing machine in circuit board processing according to claim 1, characterized in that: One end of the abutment rod (11) is threaded with a limiting nut (12), and the storage frame (13) has a split plate (15) placed inside.

3. The adhesive coating mechanism for a developing machine in circuit board processing according to claim 2, characterized in that: The top of the split plate (15) is provided with two protruding strips (17), and the top of the storage frame (13) is provided with two recessed holes (16).

4. The adhesive coating mechanism for a developing machine in circuit board processing according to claim 3, characterized in that: One end of each of the two protrusions (17) is engaged with the interior of the two recesses (16).

5. The adhesive coating mechanism for a developing machine in circuit board processing according to claim 1, characterized in that: A servo motor (6) is provided on one side of the adjustment frame (3), and the threaded block (5) is threaded onto one end of the lead screw (4).

6. The adhesive coating mechanism for a developing machine in circuit board processing according to claim 5, characterized in that: The output shaft of the servo motor (6) is connected to one end of the lead screw (4) for transmission.

7. The adhesive coating mechanism for a developing machine in circuit board processing according to claim 1, characterized in that: The storage box (2) is filled with photosensitive adhesive, and the storage frame (13) contains multiple circuit boards.