Semiconductor container cleaning device

Abstract

The utility model relates to a semiconductor container cleaning device, a semiconductor container comprises a box body with an opening and a cover body capable of sealing the opening, the cleaning device comprises a loading frame and a vacuum exhaust assembly, the opening of the box body faces downwards, the box body is immersed in cleaning liquid in the form of being placed on the loading frame in an inverted buckling mode, and when the box body is immersed in the cleaning liquid, the vacuum exhaust assembly is arranged on the loading frame. The box body has a first state in which an air cavity is formed between the box body and the cleaning liquid and a second state in which the box body is completely filled with the cleaning liquid; the vacuum exhaust assembly comprises a first exhaust pipe, a vacuum generator and a second exhaust pipe, and gas in the gas cavity can be sucked and exhausted through the vacuum exhaust assembly, so that the box body is switched from the first state to the second state; gas in the gas cavity is sucked and exhausted by means of vacuum suction, under the action of vacuum negative pressure, it can be guaranteed that the gas is completely exhausted, the better exhaust effect is achieved, and the cleaning effect of the semiconductor container is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to a semiconductor container cleaning apparatus. Background Technology

[0002] Wafer boxes are widely used as specialized containers for transporting and storing wafers. They effectively prevent wafer breakage and contamination, protecting the wafer's integrity. After a period of use, particulate matter and chemical residues can easily accumulate inside the wafer box, necessitating cleaning to ensure wafer quality.

[0003] In existing technologies, wafer cassette cleaning mainly includes spray cleaning and immersion cleaning. Immersion cleaning involves immersing the wafer cassette carrier in a cleaning solution and using ultrasonic waves for cleaning. In immersion cleaning, the wafer cassette is usually immersed in the cleaning solution upside down. This not only improves the cleaning effect on the inner wall of the container but also allows the cleaning solution to drain out of the wafer cassette opening after cleaning. However, when the cleaning solution enters the wafer cassette, the air inside the wafer cassette cavity is sealed by the cleaning solution. As the cleaning solution continues to enter, the air is gradually compressed, and the pressure gradually increases. Eventually, the air will accumulate at the top of the wafer cassette, forming an isolated air cavity. The inner wall of the wafer cassette corresponding to this air cavity cannot be wetted by the cleaning solution, and the wafer cassette cannot be thoroughly cleaned.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0005] In view of this, the present application aims to provide a semiconductor container cleaning apparatus that can improve the venting effect, thereby improving the cleaning effect of the semiconductor container and increasing the cleaning efficiency.

[0006] In a first aspect, embodiments of this application provide a semiconductor container cleaning apparatus, the semiconductor container comprising a housing with an opening and a cover capable of closing the opening, the cleaning apparatus comprising:

[0007] The loading rack has the box body placed upside down on the loading rack and immersed in the cleaning solution. When the box body is immersed in the cleaning solution, the box body has a first state in which an air cavity is formed between the box body and the cleaning solution, and a second state in which the box body is completely filled with the cleaning solution.

[0008] The vacuum exhaust assembly includes a first exhaust pipe, a vacuum generator, and a second exhaust pipe. The first exhaust pipe is connected to the gas cavity in the first state of the semiconductor container. The first exhaust pipe and the second exhaust pipe are respectively connected to the vacuum generator. Under the action of the vacuum generator, the gas in the gas cavity can be drawn in through the first exhaust pipe and discharged through the second exhaust pipe, so that the container can switch from the first state to the second state.

[0009] In conjunction with the first aspect of this application, in an optional embodiment, the vacuum exhaust assembly further includes a solenoid valve, and the vacuum generator has a first interface, a second interface, and a third interface, wherein the first interface is connected to the first exhaust pipe, the second interface is connected to the second exhaust pipe, and the third interface is connected to the solenoid valve.

[0010] In conjunction with the first aspect of this application, in an optional embodiment, the cleaning device further includes a lifting frame for driving the loading frame to rise and fall. The lifting frame includes a support portion and a lifting portion connected to the support portion. The support portion is used to place the loading frame. The lifting portion is located above the support portion and can move up and down under the action of external force to drive the support portion and the loading frame to be immersed in or detached from the cleaning fluid.

[0011] In conjunction with the first aspect of this application, in an optional embodiment, the first exhaust pipe is fixedly disposed on the loading frame, and the vacuum generator is fixedly disposed on the lifting part.

[0012] In conjunction with a first aspect of this application, in an alternative embodiment, the second exhaust pipe includes a retractable spring tube.

[0013] In conjunction with the first aspect of this application, in an optional embodiment, the box body is placed at an angle on the loading rack, and along the direction of the angle of the box body, the box body has a first end and a second end, the first end being higher than the second end, and the first exhaust pipe being disposed close to the first end.

[0014] In conjunction with a first aspect of this application, in an alternative embodiment, the first exhaust pipe includes a vertical extension pipe extending along the height direction of the housing, the end of the vertical extension pipe having a suction port communicating with the air cavity, the height of the suction port being adapted to the top height of the semiconductor container.

[0015] In conjunction with the first aspect of this application, in an alternative embodiment, the first exhaust pipe includes at least two of the said vertical extension pipes.

[0016] In conjunction with the first aspect of this application, in an alternative embodiment, the first exhaust pipe further includes a lateral extension pipe, wherein the at least two vertical extension pipes are spaced apart along the lateral extension pipe and communicate with each other, and the lateral extension pipes are fixed to the loading frame.

[0017] In conjunction with the first aspect of this application, in an optional embodiment, the vacuum exhaust assembly further includes a third exhaust pipe, one end of which is connected to the lateral extension pipe and the other end of which is connected to the first interface, the third exhaust pipe extending along the height direction of the loading frame.

[0018] The semiconductor container cleaning apparatus provided in this application embodiment includes a vacuum generator, a first exhaust pipe, and a second exhaust pipe. The first exhaust pipe connects the vacuum generator to the gas chamber inside the container in the first state, and the second exhaust pipe connects the vacuum generator to a waste discharge device. This allows the negative pressure generated by the vacuum generator to draw gas from the gas chamber through the first exhaust pipe and discharge it into the waste discharge device through the second exhaust pipe, thus transitioning the container from the first state to the second state. The thorough venting allows the cleaning fluid to fully contact the inner wall of the container. Combined with the ultrasonic cleaning components, this improves the cleaning effect of the container. At the same time, the negative pressure generated by the vacuum generator allows for rapid suction within a short time, thereby improving efficiency.

[0019] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0020] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0021] Figure 1 A schematic diagram of the overall structure of the semiconductor container cleaning apparatus provided in the embodiments of this application. Figure 1 ;

[0022] Figure 2 A schematic diagram of the overall structure of the semiconductor container cleaning apparatus provided in the embodiments of this application. Figure 2 ;

[0023] Figure 3 for Figure 1 Enlarged view of point A in the middle;

[0024] Figure 4 for Figure 1 Enlarged view of point B in the middle;

[0025] Figure 5 for Figure 1Enlarged view of point C in the middle.

[0026] Figure label:

[0027] 11. Box body; 111. First end; 112. Second end; 12. Lid;

[0028] 2. Loading frame; 21. Positioning component; 211. Horizontal support surface; 212. Vertical positioning surface; 22. Fixing base; 23. Box body fixing frame; 24. Cover fixing frame;

[0029] 3. Vacuum exhaust assembly; 31. First exhaust pipe; 311. Vertical extension pipe; 3111. Suction port; 312. Horizontal extension pipe; 32. Vacuum generator; 321. First interface; 322. Second interface; 323. Third interface; 33. Second exhaust pipe; 34. Solenoid valve; 35. Third exhaust pipe; 36. Connecting pipe;

[0030] 4. Lifting frame; 41. Supporting part; 411. Limiting claw; 42. Lifting part; 43. Connecting column;

[0031] 51. Lifting drive device; 52. Lifting guide rail. Detailed Implementation

[0032] To make the technical solution and beneficial effects of this utility model more apparent and understandable, a detailed description is provided below by listing specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.

[0033] In the description of this utility model, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this utility model and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. In other words, they should not be construed as limitations on this utility model.

[0034] In this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating the relative importance of the indicated features or the number of indicated technical features. Therefore, a feature specified as "first" or "second" can explicitly indicate that at least one of those features is included. In the description of this utility model, "multiple" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise explicitly specified.

[0035] In this utility model, unless otherwise explicitly defined, the terms "installation," "connection," "linking," "fixing," and "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0036] In this utility model, unless otherwise explicitly defined, the terms "above," "on top of," "above," "over," "below," "below," "below," or "below" for "first feature above second feature" can refer to direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Furthermore, "above," "above," and "over" for "first feature above second feature" can mean the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. Similarly, "below," "below," and "below" for "first feature below second feature" can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0037] The semiconductor container in this embodiment of the disclosure can be, for example, a wafer cassette for storing wafers. After a period of use, some particulate matter and chemical residues tend to adhere to the inside of the wafer cassette, so it is necessary to clean the wafer cassette to ensure the quality of the wafers.

[0038] The wafer cassette includes a housing 11 with an opening and a cover 12 that can close the opening. Typically, to ensure the cleaning effect of the entire wafer cassette, the housing and cover need to be separated for cleaning and drying.

[0039] This disclosure provides an embodiment of a semiconductor container cleaning apparatus, such as... Figures 1 to 5As shown, the semiconductor container cleaning device includes a loading rack 2, a tank, and an ultrasonic component (not shown) disposed within the tank. The loading rack 2 is used to load the semiconductor container, and the tank stores a cleaning solution for cleaning the semiconductor container. The loading rack 2 can immerse or detach the semiconductor container from the cleaning solution within the tank. When the loading rack immerses the semiconductor container in the cleaning solution, the ultrasonic component operates, generating high-frequency vibrations in the cleaning solution, thereby removing dirt and impurities from the surface of the semiconductor container. After cleaning, the loading rack can detach the semiconductor container from the cleaning solution to facilitate subsequent processes.

[0040] In this embodiment, the box 11 is immersed in the cleaning solution by being placed upside down on the loading rack 2. That is, the box 11 is placed on the loading rack 2 with its opening facing downwards and is immersed in the cleaning solution. The advantage of this cleaning method is that by having the box opening facing downwards, the cleaning solution can fully contact the surface of the box, achieving a better cleaning effect. At the same time, the downward-facing opening also allows the cleaning solution inside the box to drain directly from the opening after cleaning, without the need for other drainage structures.

[0041] like Figure 1 As shown, in this embodiment, the height direction of the loading rack 2, which is also the height direction of the box 11, is defined as the Z direction, the length direction of the loading rack 2 as the X direction, and the width direction of the loading rack 2 as the Y direction. The loading rack 2 can move along the Z direction, thereby allowing the box 11 to be immersed in or detached from the cleaning fluid.

[0042] like Figures 1-2 As shown, the loading rack 2 has a hollow frame structure. When the box 11 is placed upside down on the loading rack 2, the cleaning fluid can enter the box 11 through the hollow structure at the bottom of the loading rack 2. In addition to placing the box 11, the loading rack 2 can also place the cover 12 for sealing the box 11. The cover 12 is placed vertically on the loading rack 2. Moreover, in order to save space and for a reasonable layout, it is preferable to place the plane of the cover 12 parallel to the Y direction.

[0043] When the cleaning fluid enters the housing 11, the air inside the housing 11 is sealed off by the cleaning fluid. As the housing 11 moves downward, the cleaning fluid continuously enters the housing 11, and the sealed air is gradually compressed, increasing the pressure. Eventually, the air accumulates at the top of the housing 11 and can no longer be compressed, thus forming an isolated air cavity. This results in the housing 11 being in a first state where an air cavity exists between it and the cleaning fluid when it is immersed in the cleaning fluid. The existence of this air cavity prevents the housing 11 from being completely filled with the cleaning fluid, thus failing to ensure that the inner wall of the housing 11 is completely cleaned.

[0044] To solve the above-mentioned technical problems, the semiconductor container cleaning apparatus of this disclosure, such as... Figures 1-5As shown, the device includes a vacuum exhaust assembly 3, which comprises a first exhaust pipe 31, a vacuum generator 32, and a second exhaust pipe 33. The first exhaust pipe 31 is connected to the gas chamber in the first state of the container 11, and the first exhaust pipe 31 and the second exhaust pipe 33 are respectively connected to the vacuum generator 32. The vacuum exhaust assembly 3 can exhaust the gas in the gas chamber. Specifically, under the action of the vacuum generator 32, the gas in the gas chamber can be drawn in through the first exhaust pipe 31 and discharged through the second exhaust pipe 33, so that the container 11 is in a second state completely filled with cleaning liquid. In other words, compared with the prior art, the present embodiment can ensure that the gas is completely exhausted under the action of vacuum negative pressure, which has a better exhaust effect. As a result, the inner cavity of the container can be completely filled with cleaning liquid, improving the cleaning effect, and can control rapid suction in a shorter time, thereby improving efficiency.

[0045] In some alternative embodiments, such as Figure 4 As shown, the first exhaust pipe 31 includes a vertical extension pipe 311, which extends along the height direction of the housing 11, i.e., the Z direction. The end of the vertical extension pipe 311 has a suction port 3111 communicating with the air chamber. The height of the suction port 3111 is adapted to the top height of the housing 11. The vertical extension pipe 311 can be inserted through the opening of the housing 11. When the housing 11 is immersed in the cleaning fluid, the suction port 3111 of the vertical extension pipe 311 communicates with the air chamber, thereby suctioning the gas in the air chamber. Those skilled in the art will understand that "the height of the suction port 3111 is adapted to the top height of the housing 11" means that the suction port 3111 is as close as possible to the top of the housing 11 to ensure that all the gas is suctioned, thus completely filling the housing 11 with the cleaning fluid. This avoids the suction port 3111 being prematurely blocked by the cleaning fluid before all the gas is suctioned, thus affecting subsequent suction operations. Furthermore, it should be noted that when the box 11 is completely filled with cleaning fluid, a small amount of cleaning fluid will inevitably enter the first exhaust pipe 31 through the suction port 3111. In this case, the small amount of cleaning fluid entering the first exhaust pipe 31 can be suctioned by the vacuum generator 32 and then discharged through the second exhaust pipe 33. Alternatively, a corresponding drainage structure can be provided on the first exhaust pipe 31. For example, an openable and closable drainage port can be provided in the first exhaust pipe 31. After cleaning is completed, the drainage port is opened, and the cleaning fluid entering the first exhaust pipe 31 will be discharged through the drainage port. After the cleaning fluid is completely discharged, the drainage port is closed so that the first exhaust pipe 31 can perform the next suction and exhaust. Of course, in other optional embodiments, after cleaning is completed, the first exhaust pipe 31 can be directly flipped over to pour out the cleaning fluid that entered the first exhaust pipe 31.

[0046] In some alternative embodiments, such as Figures 1-2As shown, the vacuum exhaust assembly 3 also includes a solenoid valve 34, such as Figure 5 As shown, the vacuum generator 32 has a first interface 321, a second interface 322, and a third interface 323. The first interface 321 is connected to the first exhaust pipe 31, the second interface 322 is connected to the second exhaust pipe 33, and the third interface 323 is connected to the solenoid valve 34. The vacuum generator 32 uses compressed air to generate negative pressure, and has the advantages of small size and high efficiency. By connecting the first interface 321 of the vacuum generator 32 to the first exhaust pipe 31, negative pressure is generated in the air chamber, and the gas in the air chamber is drawn in. The drawn-in gas is discharged to the outside through the second exhaust pipe 33. The vacuum generator 32 is connected to the solenoid valve 34 through its third interface 323. The generation and breaking of vacuum are achieved by controlling the on and off of the solenoid valve 34. Figures 1-2 As shown, the vacuum exhaust assembly 3 also includes a connecting pipe 36. The third interface 323 of the vacuum generator 32 is connected to the solenoid valve 34 through the connecting pipe 36, thereby realizing the connection between the third interface 323 and the solenoid valve 34. In other optional embodiments, the vacuum exhaust assembly 3 may also use components such as a miniature vacuum pump to achieve vacuum.

[0047] In some alternative embodiments, such as Figures 1-4 As shown, the semiconductor container cleaning apparatus also includes a lifting frame 4 for driving the loading frame 2 to move up and down along the Z-axis. The lifting frame 4 includes a support part 41 and a lifting part 42 connected to the support part 41. The support part 41 is used to place the loading frame 2, and the lifting part 42 is located above the support part 41. By setting the lifting frame 4, it can move up and down under the action of external force to drive the support part 41, the loading frame 2 and the semiconductor container located thereon to be immersed in or removed from the cleaning solution. Specifically, a limiting claw 411 is provided in the circumferential direction of the support part 41 to limit the loading frame 2 when it is placed on the support part 41. A connecting column 43 is provided at each of the four corners of the support part 41. The lifting part 42 is connected to the support part 41 through the four connecting columns 43. The lifting part 42 is driven to lift by a lifting drive device 51. The lifting drive device 51 can be a lifting motor or a lifting cylinder, etc. The lifting part 42 is installed on the main frame of the semiconductor container cleaning device. A lifting guide rail 52 is provided on the main frame. The lifting part 42 has a slider structure that cooperates with the lifting guide rail 52, so that the entire loading frame 2 can be lifted and lowered smoothly.

[0048] Further optional, such as Figures 1-2As shown, the first exhaust pipe 31 is fixedly mounted on the loading frame 2, and the vacuum generator 32 is fixedly mounted on the lifting unit 42. That is, the first exhaust pipe 31 is fixed on the loading frame 2, and the vacuum generator 32 is fixed on the lifting frame 4. The vacuum generator 32 is connected to the solenoid valve 34 via a connecting pipe 36, allowing the entire vacuum exhaust assembly 3 to rise and fall with the lifting frame 4 and the loading frame 2, improving the integration of the device. Furthermore, fixing the first exhaust pipe 31 to the loading frame 2 achieves positioning of the first exhaust pipe 31. When the box 11 is also positioned on the loading frame 2, the position of the first exhaust pipe 31 relative to the box 11 is fixed, ensuring that the position and height of the suction port 3111 are adapted to the top height of the box 11 when each box 11 is placed on the loading frame 2, requiring no adjustment and facilitating operation. Additionally, as... Figure 5 As shown, the vacuum generator 32 is fixed to the outer end of the lifting part 42. Setting the vacuum generator 32 in the lifting part 42 can ensure the height of the vacuum generator 32 and prevent the vacuum generator 32 from contacting the cleaning fluid when the loading frame 2 descends.

[0049] Further optional, such as Figures 1-2 As shown, the second exhaust pipe 33 includes a retractable spring tube. After the gas and possibly a small amount of cleaning fluid in the gas chamber are drawn in, they are discharged through the second exhaust pipe 33 into the waste discharge device. The waste discharge device is used to collect and treat waste generated during semiconductor manufacturing, such as waste gas and waste liquid. The second exhaust pipe 33, together with the vacuum generator 32, is fixed to the lifting frame 4. Since the lifting frame 4 is movable, the second exhaust pipe 33 also moves up and down with it. Therefore, the second exhaust pipe 33 includes a retractable spring tube. The elastic expansion and contraction of the spring tube ensures a variable-distance connection between the second exhaust pipe 33 and the waste discharge device, and also ensures the smooth raising and lowering of the second exhaust pipe 33.

[0050] In some alternative embodiments, such as Figures 1-3As shown, the box body 11 is placed at an angle on the loading rack 2. Along the angle of inclination of the box body 11, the box body 11 has a first end 111 and a second end 112. The first end 111 is higher than the second end 112, and the first exhaust pipe 31 is located close to the first end 111. Specifically, the box body 11 is tilted upward from the second end 112 to the first end 111 in the X direction. Placing the box body 11 at an angle facilitates the accumulation of air at the first end 111. The first exhaust pipe 31 is located close to the first end 111, so that the suction port 3111 of the first exhaust pipe 31 is close to the first end 111, thereby facilitating the suction of air by the first exhaust pipe 31. Furthermore, the loading rack 2 is provided with several positioning members 21 for positioning the box 11. Each positioning member 21 has a horizontal support surface 211 and a vertical positioning surface 212. The horizontal support surface 211 and the vertical positioning surface 212 are connected to form an L-shape. The vertical positioning surface 212 is used to position the box 11 circumferentially when placing the box 11. The horizontal support surface 211 is used to support the edge of the opening of the box 11. The height of the horizontal support surface 211 of the positioning member 21 at the second end 112 is higher than the height of the horizontal support surface 211 of the positioning member 21 at the first end 111, thereby realizing the tilted placement of the box 11.

[0051] In some alternative embodiments, the first exhaust pipe 31 includes at least two of the vertical extension pipes 311, for example, as... Figure 4 As shown, there are three vertical extension tubes 311. The arrangement of multiple vertical extension tubes 311 allows for more comprehensive contact with the air, and the simultaneous suction of multiple vertical extension tubes 311 can also accelerate the air suction speed, thereby improving exhaust efficiency.

[0052] Further optionally, the first exhaust pipe 31 also includes a transverse extension pipe 312, wherein the aforementioned at least two vertical extension pipes 311 are spaced apart along the transverse extension pipe 312 and communicate with each other, and the transverse extension pipe 312 is fixed to the loading frame 2. Specifically, as Figure 4 As shown, the horizontal extension tube 312 extends along the Y direction, with the extension direction perpendicular to the tilt direction of the box 11. Each vertical extension tube 311 is set on the horizontal extension tube 312. The vertical extension tubes 311 are spaced apart from each other and are interconnected with the horizontal extension tubes 312. The horizontal extension tube 312 serves as both the connecting hub of the vertical extension tubes 311 and the function of installing and fixing the entire first exhaust pipe 31. A fixing seat 22 is sleeved on the horizontal extension tube 312, and the first exhaust pipe 31 is fixed to the loading frame 2 through the fixing seat 22.

[0053] Further optional, such as Figures 1-3 as well as Figure 5As shown, the vacuum exhaust assembly 3 also includes a third exhaust pipe 35. One end of the third exhaust pipe 35 is connected to the transverse extension pipe 312, and the other end is connected to the first interface 321. The third exhaust pipe 35 extends along the height direction of the loading frame 2. One end of the transverse extension pipe 312 is provided with a connector for connecting to the third exhaust pipe 35. The third exhaust pipe 35 connects the first exhaust pipe 31 and the vacuum generator 32, serving as a connection transition and facilitating the production and installation of the pipeline.

[0054] In some optional embodiments, the loading rack 2 is provided with a plurality of box placement positions and a plurality of cover placement positions. Correspondingly, the loading rack 2 is provided with a plurality of first exhaust pipes 31, second exhaust pipes 33, vacuum generators 32, and third exhaust pipes 35. Figure 1-2 As shown, the loading rack 2 has two box placement positions and two cover placement positions, which are symmetrically arranged. The two cover placement positions are located in the middle of the loading rack 2, and the two box placement positions are located at both ends of the loading rack 2. Correspondingly, a first exhaust pipe 31, a second exhaust pipe 33, a vacuum generator 32, and a third exhaust pipe 35 are respectively provided at both ends of the loading rack 2, thereby enabling the simultaneous cleaning of two sets of boxes 11 and their covers 12, improving cleaning efficiency. The two vacuum generators 32 are connected to the same solenoid valve 34 via connecting pipes 36. The two vacuum generators 32 are synchronously controlled by a single solenoid valve 34, ensuring the consistency and synchronicity of exhaust and cleaning of the two boxes 11. It should be noted that the structures of the aforementioned box placement positions and cover placement positions, as well as the corresponding first exhaust pipe 31, second exhaust pipe 33, vacuum generator 32, and third exhaust pipe 35, are all identical and will not be described again here.

[0055] Furthermore, such as Figures 1-4 As shown, in order to prevent the box body 11 and the cover body 12 from floating due to the buoyancy of the cleaning fluid, corresponding box body fixing brackets 23 and cover body fixing brackets 24 are also provided on the loading rack 2 to ensure that the box body 11 and the cover body 12 can be in full contact with the cleaning fluid.

[0056] The semiconductor container cleaning apparatus of this embodiment places and fixes a box body 11 and its cover 12 on a loading rack 2, wherein the box body 11 is placed upside down; the loading rack 2 descends to immerse the box body 11 and its cover 12 in the cleaning liquid, and descends to a first state in which the box body 11 forms an air cavity with the cleaning liquid. The solenoid valve 34 controls the vacuum generator 32 to generate negative pressure, and the air in the box body 11 is sucked out through the first exhaust pipe 31, so that the box body 11 is in a second state completely filled with the cleaning liquid, thereby achieving thorough cleaning of the box body 11.

[0057] Under vacuum negative pressure, this semiconductor container cleaning device can ensure that the gas is completely discharged, resulting in better exhaust effect and improved cleaning effect. It can also control rapid suction in a short time, thereby improving efficiency.

[0058] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations included in the claims. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. A semiconductor container cleaning apparatus, characterized in that, The semiconductor container includes a housing (11) with an opening and a cover (12) capable of closing the opening; the cleaning device includes: The loading rack (2) is inverted and placed on the loading rack (2) with the box (11) facing downwards, and is immersed in the cleaning liquid. When the box (11) is immersed in the cleaning liquid, the box (11) has a first state in which an air cavity is formed between it and the cleaning liquid, and a second state in which it is completely filled by the cleaning liquid. The vacuum exhaust assembly (3) includes a first exhaust pipe (31), a vacuum generator (32), and a second exhaust pipe (33). The first exhaust pipe (31) is connected to the air chamber in the first state of the housing (11). The first exhaust pipe (31) and the second exhaust pipe (33) are respectively connected to the vacuum generator (32). Under the action of the vacuum generator (32), the gas in the air chamber can be drawn through the first exhaust pipe (31) and discharged through the second exhaust pipe (33), so that the housing (11) can be switched from the first state to the second state.

2. The semiconductor container cleaning apparatus according to claim 1, characterized in that, The vacuum exhaust assembly (3) further includes a solenoid valve (34). The vacuum generator (32) has a first interface (321), a second interface (322), and a third interface (323). The first interface (321) is connected to the first exhaust pipe (31), the second interface (322) is connected to the second exhaust pipe (33), and the third interface (323) is connected to the solenoid valve (34).

3. The semiconductor container cleaning apparatus according to claim 1, characterized in that, The cleaning device also includes a lifting frame (4) for lifting the loading frame (2) up and down. The lifting frame (4) includes a support part (41) and a lifting part (42) connected to the support part (41). The support part (41) is used to place the loading frame (2). The lifting part (42) is located above the support part (41) and can move up and down under the action of external force to drive the support part (41) and the loading frame (2) to be immersed in or detached from the cleaning fluid.

4. The semiconductor container cleaning apparatus according to claim 3, characterized in that, The first exhaust pipe (31) is fixedly installed on the loading frame (2), and the vacuum generator (32) is fixedly installed on the lifting part (42).

5. The semiconductor container cleaning apparatus according to claim 4, characterized in that, The second exhaust pipe (33) includes a retractable spring tube.

6. The semiconductor container cleaning apparatus according to claim 1, characterized in that, The box (11) is placed at an angle on the loading rack (2). Along the tilting direction of the box (11), the box (11) has a first end (111) and a second end (112). The first end (111) is higher than the second end (112), and the first exhaust pipe is located close to the first end (111).

7. The semiconductor container cleaning apparatus according to claim 1, characterized in that, The first exhaust pipe (31) includes a vertical extension pipe (311) that extends along the height direction of the box (11). The end of the vertical extension pipe (311) has a suction port (3111) that communicates with the air chamber. The height of the suction port (3111) is adapted to the top height of the box (11).

8. The semiconductor container cleaning apparatus according to claim 7, characterized in that, The first exhaust pipe (31) includes at least two of the vertical extension pipes (311).

9. The semiconductor container cleaning apparatus according to claim 8, characterized in that, The first exhaust pipe (31) further includes a transverse extension pipe (312), wherein at least two of the vertical extension pipes (311) are spaced apart along the transverse extension pipe (312) and communicate with each other, and the transverse extension pipe (312) is fixed to the loading frame (2).

10. The semiconductor container cleaning apparatus according to claim 9, characterized in that, The vacuum exhaust assembly (3) also includes a third exhaust pipe (35), one end of which is connected to the transverse extension pipe (312) and the other end is connected to the first interface (321) of the vacuum generator (32). The third exhaust pipe (35) extends along the height direction of the loading frame (2).

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