Batch polishing device for micro hemispheres

Abstract

The utility model discloses a micro hemisphere batch polishing device which comprises a polishing device, a connecting assembly and an installing assembly, the installing assembly comprises an installing disc and a plurality of jigs, the installing disc is arranged on an asphalt disc, and a plurality of installing through holes corresponding to the jigs one to one are formed in the installing disc. The jigs are arranged in the corresponding installation through holes and detachably connected with the installation disc, containing holes are formed in the bottom faces of the jigs, the lower portions of the micro hemispheres extend out of the containing holes and abut against the asphalt disc, the connecting assembly comprises a mandrel, a bearing sleeve and a ball bearing, the bearing sleeve is fixed to the center of the upper surface of the installation disc, and the ball bearing is fixed in the bearing sleeve. The upper end of the mandrel is detachably connected with the polishing equipment, the lower end of the mandrel is provided with a ball head, the ball head is suspended in a center hole of the ball bearing and is in small clearance fit with the ball bearing, and when the polishing equipment is started, the mandrel is driven to swing, and then the mounting disc is driven to rotate relative to the asphalt disc so that the lip edges of the multiple micro hemispheres can be ground with the asphalt disc. According to the micro-hemisphere polishing device, efficient and high-quality batch polishing of micro-hemispheres can be achieved.

Description

Technical Field

[0001] This utility model relates to the field of hemispherical resonant gyroscope manufacturing technology, specifically to a micro-hemispherical batch polishing device. Background Technology

[0002] Micro-hemispherical gyroscopes belong to the category of hemispherical resonant gyroscopes. They are solid-state wave gyroscopes based on the Coriolis effect, offering the advantage of low cost and representing an important direction for future gyroscope development. Conventional micro-hemispherical gyroscopes are formed by blowing planar quartz sheets. Before becoming a finished product for assembly, the excess skirt after forming needs to be ground to remove excess mass, forming a smooth, chipped, and uniform lip to ensure a high quality factor (Q value).

[0003] The applicant has achieved good results in the previous exploration of grinding the edge of a micro-hemispherical hemisphere, as detailed in Chinese Invention Patent CN118559515B - "A Method for Grinding and Polishing the Edge of a Micro-hemispherical Hemisphere". After grinding the edge of the micro-hemispherical hemisphere, scratches and microcracks remain on its surface, requiring removal through a combination of mechanical and chemical polishing. This patent uses an online polishing method by replacing the resin grinding wheel after grinding to complete the mechanical polishing. However, due to the long polishing time and the fact that it polishes a single micro-hemispherical, the polishing efficiency is extremely low. Utility Model Content

[0004] In view of the problems in the background art, this utility model proposes a high-efficiency and high-quality micro-hemispherical batch polishing device.

[0005] The present invention adopts the following technical solution:

[0006] A batch polishing apparatus for micro-hemispherical surfaces includes: polishing equipment, connecting components, and mounting components.

[0007] The mounting assembly includes a mounting plate and multiple fixtures. The mounting plate is placed on the asphalt disc of the polishing equipment. The mounting plate has multiple vertically arranged mounting through holes, each corresponding to a different fixture. The fixtures are placed within their respective mounting through holes and are detachably connected to the mounting plate.

[0008] The fixture has a receiving hole on its bottom surface to receive an inverted micro-hemispherical part. The lower part of the micro-hemispherical part extends out of the receiving hole and abuts against the asphalt disc.

[0009] The connecting assembly includes a mandrel, a bearing sleeve, and a ball bearing. The bearing sleeve is fixed to the center of the upper surface of the mounting plate, and the ball bearing is fixed in the bearing sleeve. The upper end of the mandrel is detachably connected to the power mechanism of the polishing equipment, and its lower end has a ball head. The ball head is suspended in the center hole of the ball bearing and has a small clearance fit with it.

[0010] When the polishing equipment is started, it drives the mandrel to swing, which in turn drives the mounting plate to rotate relative to the asphalt plate, so that the lips of multiple micro-hemispherical surfaces rub against each other with the asphalt plate.

[0011] Optionally, it also includes a leveling component for calibrating the coaxiality of the mounting through-hole and the fixture within it during the detachable connection of the fixture and the mounting disc before the mounting disc is placed on the asphalt disc.

[0012] Optionally, the leveling assembly includes a leveling base and multiple leveling blocks. The multiple leveling blocks are used to abut between the mounting plate and the leveling base during the coaxiality calibration of the fixture. During the detachable connection between the fixture and the mounting plate, the lip of the micro-hemispherical part of the fixture abuts against the upper surface of the leveling base.

[0013] Optionally, the fixture is detachably connected to the mounting plate via fasteners.

[0014] Optionally, multiple threaded holes are provided on the side of the mounting plate, each threaded hole corresponding to a multiple mounting through hole, and the threaded holes are connected to the corresponding mounting through holes. After the fastener passes through the corresponding threaded hole, it abuts against the fixture.

[0015] Optionally, the side of the fixture is provided with an annular groove that mates with a corresponding fastener, and the fastener is inserted into the annular groove after passing through the threaded hole.

[0016] Optionally, the bottom center of the receiving hole extends downward to form a positioning post that mates with the anchor post cavity of the micro-hemispherical. When the inverted micro-hemispherical is placed in the receiving hole, the positioning post is inserted into the anchor post cavity of the micro-hemispherical.

[0017] Optionally, the edge of the mounting plate is provided with steps for mounting a protective cover.

[0018] Compared with the prior art, the advantages of this utility model are:

[0019] The applicant's preliminary research shows that when using a conventional polishing machine to perform batch lip polishing on the ground micro-hemisphericals, due to factors such as clamping, the micro-hemisphericals will inevitably be affected by external forces during the polishing process. These external forces can easily cause chipping or grinding tilting of the micro-hemispherical lip, thereby affecting the quality factor Q value of the micro-hemisphericals.

[0020] This invention designs a connecting assembly including a mandrel, a bearing sleeve, and a ball bearing. The cylindrical end of the mandrel is detachably connected to the power mechanism of the polishing machine. The ball end of the mandrel, with its ball head, is suspended in the inner hole of the ball bearing through a small clearance fit. The bearing sleeve, which mounts the ball bearing, is fixed to the center of the upper surface of the micro-hemispherical mounting plate. This connection method effectively isolates the micro-hemisphericals from the vibration and vertical pressure generated during the polishing machine's operation, enabling mutual grinding between the asphalt disc and the leveled micro-hemisphericals on the mounting plate. This allows the micro-hemispherical mounting plate to perform self-weight polishing of a batch of micro-hemisphericals, resulting in simultaneous flatness polishing of both the asphalt disc and the micro-hemisphericals. Practice shows that this invention can ultimately achieve a flatness polishing of the lip edge of a batch of micro-hemisphericals to within 0.005µm within 10–15 minutes. Attached Figure Description

[0021] To facilitate understanding of this invention, it will be described in more detail with reference to the specific embodiments shown in the accompanying drawings. These drawings depict only typical embodiments of this invention and should not be considered as limiting the scope of protection of this invention.

[0022] Figure 1 This is a three-dimensional structural diagram of the micro-hemispherical batch polishing device of Embodiment 1 of this utility model.

[0023] Figure 2 This is a three-dimensional structural diagram of the micro-hemispherical batch polishing device of Embodiment 1 of this utility model (without the frame).

[0024] Figure 3 This is a partial three-dimensional structural diagram of the micro-hemispherical batch polishing device of Embodiment 1 of this utility model.

[0025] Figure 4 This is a partial three-dimensional exploded view of the micro-hemispherical batch polishing device of Embodiment 1 of this utility model.

[0026] Figure 5 This is a partial cross-sectional structural diagram of the micro-hemispherical batch polishing device of Embodiment 1 of this utility model.

[0027] Figure 6 A schematic diagram of the structure for calibrating the flatness of a micro-hemispherical surface.

[0028] Figure 7 This is a schematic diagram of the cross-sectional structure of a micro-hemispherical device fixed in a fixture.

[0029] Figure 8 for Figure 6 A schematic diagram of the AA cross-sectional structure.

[0030] Figure 9 The flowchart illustrates a method for batch polishing of micro-hemispherical surfaces using the apparatus of Embodiment 1 of this utility model.

[0031] Figure label:

[0032] 1. Connecting assembly; 11. Mandrel; 111. Ball head; 12. Bearing sleeve; 13. Ball bearing;

[0033] 2. Mounting components; 21. Mounting plate; 211. Mounting through hole; 212. Threaded hole; 213. Step; 22. Fixture; 221. Receiving hole; 222. Annular groove; 223. Locating pin; 23. Fastener;

[0034] 3. Polishing equipment; 31. Asphalt disc; 32. Power mechanism; 4. Leveling components; 41. Leveling base; 42. Contour block; 5. Micro-hemispherical; 51. Lip edge; 52. Anchor column cavity. Detailed Implementation

[0035] The embodiments of the present invention are described below with reference to the accompanying drawings, so that those skilled in the art can better understand and implement the present invention. However, the listed embodiments are not intended to limit the present invention. In the absence of conflict, the following embodiments and the technical features in the embodiments can be combined with each other, wherein the same components are indicated by the same reference numerals.

[0036] Example 1:

[0037] like Figures 1-5 As shown, this embodiment provides a batch polishing device for micro-hemispherical components, including: polishing equipment 3, connecting component 1, and mounting component 2.

[0038] Mounting assembly 2 includes a mounting plate 21 and multiple fixtures 22. The mounting plate 21 is placed on the asphalt disc 31 of the polishing equipment 3. The mounting plate 21 has multiple vertically arranged mounting through holes 211, each corresponding to a different fixture 22. The fixtures 22 are placed in their respective mounting through holes 211 and are detachably connected to the mounting plate 21.

[0039] The fixture 22 has a receiving hole 221 on its bottom surface for receiving an inverted micro-hemispherical 5. The lower part of the micro-hemispherical 5 extends out of the receiving hole 221 and abuts against the asphalt disc 31.

[0040] The connecting assembly 1 includes a spindle 11, a bearing sleeve 12, and a ball bearing 13. The bearing sleeve 12 is fixed to the center of the upper surface of the mounting plate 21, and the ball bearing 13 is fixed in the bearing sleeve 12. The upper end of the spindle 11 is detachably connected to the power mechanism 32 of the polishing equipment 3, and its lower end has a ball head 111. The ball head 111 is suspended in the center hole of the ball bearing 13 and is fitted with it with a small clearance.

[0041] When the polishing equipment 3 is started, it drives the spindle 11 to swing, which in turn drives the mounting plate 21 to rotate relative to the asphalt plate 31, so that the lips 51 of the multiple micro-hemisphericals 5 and the asphalt plate 31 rub against each other.

[0042] Therefore, this utility model, through the design of a connecting assembly including a mandrel, a bearing sleeve, and a ball bearing, detachably connects the cylindrical end of the mandrel to the power mechanism of the polishing machine. The ball end of the mandrel, with its ball head, is suspended in the inner hole of the ball bearing via a small clearance fit. The bearing sleeve, which mounts the ball bearing, is fixed to the center of the upper surface of the micro-hemispherical mounting plate. This connection method effectively isolates the micro-hemispherical from the vibration and vertical extrusion force generated during the polishing machine's operation, enabling mutual grinding between the asphalt disc and the leveled micro-hemisphericals on the mounting plate. This achieves self-weight polishing of a batch of micro-hemisphericals by the mounting plate, resulting in simultaneous flatness polishing of both the asphalt disc and the micro-hemisphericals. Practice shows that this utility model can ultimately achieve a flatness polishing of the lip edge of a batch of micro-hemisphericals to within 0.005µm within 10-15 minutes.

[0043] like Figures 6-8 As shown, this embodiment also includes a leveling component 4, which is used to calibrate the coaxiality of the mounting through hole 211 and the fixture 22 inside it during the process of detachably connecting the fixture 22 and the mounting plate 21 before the mounting plate 21 is placed on the asphalt plate 31.

[0044] In this embodiment, the leveling component 4 includes a leveling base 41 and a plurality of leveling blocks 42. The plurality of leveling blocks 42 are used to abut between the mounting plate 21 and the leveling base 41 during the coaxiality calibration of the fixture 22. During the detachable connection between the fixture 22 and the mounting plate 21, the lip 51 of the micro-hemispherical 5 in the fixture 22 abuts against the upper surface of the leveling base 41.

[0045] After the skirt edge of the micro-hemispherical part is ground, the fixture holding the micro-hemispherical part is removed from the grinding equipment and then installed in batches onto the mounting plate. Specifically, the mounting plate is designed with several mounting through holes that fit with the fixture with a small clearance. After the fixture is inserted into the mounting through holes, the fixture and the mounting plate need to be fixed to prevent the fixture from shaking relative to the mounting plate during the subsequent polishing of the micro-hemispherical part, which would affect the polishing quality of the micro-hemispherical part. Because the fixture and the mounting through holes have a small clearance fit, during the fastening process of the fixture and the mounting plate, it is necessary to ensure that the inverted lip edge of the micro-hemispherical part in the fixture remains parallel to the horizontal plane to avoid the fixture becoming skewed during the fastening process, which would affect the flatness of the lip edge of the micro-hemispherical part.

[0046] This invention utilizes a leveling base with good flatness and 4-6 equal-height pads to suspend the micro-hemispherical mounting chassis. Then, a fixture is installed so that the micro-hemispherical bonded in the fixture can directly contact the leveling base (10mm-20mm in height). Finally, the fixture is tightened with threads to fix the micro-hemispherical mounting base to ensure the flatness of the micro-hemispherical before polishing.

[0047] The leveling component and fixture of this utility model are also applicable to the batch polishing, leveling, and fixing of micro-hemispherical surfaces that have undergone skirt grinding through other methods. They have a wide range of applications and are easy to promote. The specific leveling and fixing method is as follows:

[0048] The micro-hemispherical mounting plate is designed with multiple mounting through holes for mounting fixtures. Corresponding threaded holes are also provided on the side of the plate, connecting to these mounting through holes. This allows for easy securing of the fixtures to the mounting plate with screws after installation. The screws contact the upper and lower walls of the annular grooves on the side of the fixture, ensuring a better fit between the fixture's sidewall and the wall of the mounting through hole, guaranteeing the flatness of the micro-hemispherical mounting. Since the fixture in the central mounting through hole is controlled by the bearing's movement and will not deviate, a threaded hole is not required for this central mounting through hole.

[0049] In this embodiment, the fixture 22 is detachably connected to the mounting plate 21 via fasteners 23.

[0050] In this embodiment, a plurality of threaded holes 212 are provided on the side of the mounting plate 21. The plurality of threaded holes 212 correspond one-to-one with a plurality of mounting through holes 211, and the threaded holes 212 are connected to the corresponding mounting through holes 211. The fastener 23 passes through the corresponding threaded hole 212 and abuts against the fixture 22.

[0051] In this embodiment, the side of the fixture 22 is provided with an annular groove 222 that mates with the corresponding fastener 23. The fastener 23 passes through the threaded hole 212 and is then inserted into the annular groove 222.

[0052] Corresponding threaded holes are made on the side of the chassis, so that after the fixture is installed, it can be gently fastened to the chassis with screws. The screws contact the annular groove wall in the middle of the fixture, so that the positioning surface of the side wall of the fixture can better fit with the inner hole surface of the chassis, ensuring the flatness of the micro-hemispherical installation.

[0053] In this embodiment, in order to ensure the coaxiality of the micro-hemispherical and the fixture, the bottom center of the receiving hole 221 extends downward to form a positioning post 223 that cooperates with the anchor post cavity 52 of the micro-hemispherical 5. When the inverted micro-hemispherical is placed in the receiving hole 221, the positioning post 223 is inserted into the anchor post cavity 52 of the micro-hemispherical 5.

[0054] In this embodiment, the edge of the mounting plate 21 is provided with a step 213 for mounting a protective cover.

[0055] The remaining rounded design on the side of the mounting plate and the stepped design on top of the mounting plate are for installing a waterproof cover to prevent environmental pollution caused by polishing liquid splashing everywhere and to prevent polishing liquid from seeping into the mounting through hole, causing blockage and affecting the loading and unloading of the tooling.

[0056] like Figure 9 As shown, the method for batch polishing of micro-hemispherical surfaces using the apparatus of this embodiment includes the following steps:

[0057] S1: Insert multiple fixtures 22 with micro-hemispherical components into the mounting through holes 211 of the mounting plate 21, calibrate the coaxiality of the mounting through holes 211 and the fixtures 22 inside, and detachably connect the mounting plate 21 and the multiple fixtures 22.

[0058] S2: Place the mounting plate 21 on the asphalt plate 31 of the polishing equipment 3, fix the bearing sleeve 12 to the center of the upper surface of the mounting plate 21, suspend the ball head 111 of the mandrel 11 in the center hole of the ball bearing 13, and connect the upper end of the mandrel 11 to the polishing equipment 3.

[0059] S3: Start the polishing equipment 3, which drives the spindle 11 to swing, and then drives the mounting plate 21 to rotate relative to the asphalt plate 31, so that the lips 51 of the multiple micro-hemisphericals 5 and the asphalt plate 31 rub against each other.

[0060] In this embodiment, step S1 involves calibrating the coaxiality of the mounting through hole 211 and the fixture 22 within it, and then detachably connecting the mounting plate 21 and the multiple fixtures 22. Specifically, this includes:

[0061] Place the mounting plate 21 on a leveling base 41, and arrange multiple equal-height blocks 42 between the mounting plate 21 and the leveling base 41. Insert the fixture 22 with the micro-hemispherical 5 installed into the corresponding mounting through hole 211 and press it down so that the lip 51 of the micro-hemispherical 5 abuts against the upper surface of the leveling base 41, and fasten the mounting plate 21 and the fixture 22 together.

[0062] In this embodiment, the polishing time in step S3 is 5-10 minutes.

[0063] In this embodiment, the preparation and installation process of the asphalt disc 31 is as follows:

[0064] 1) Machining a metal mold of suitable size, with square grooves on the mold, the side length of the square grooves being approximately 5mm-8mm, and a draft angle of 0.5°-1°;

[0065] 2) Heat the metal mold and coat the surface with a layer of beeswax evenly. After the beeswax cools, pour the softened asphalt into the metal mold to the specified height (20mm-30mm) and let it cool completely.

[0066] 3) Remove the cooled asphalt disc and install it on the base of the polishing equipment with the square grid facing up.

[0067] The asphalt disc is made by using a metal mold with draft angle and rounded corners, which can effectively avoid the problem of unevenness of the asphalt disc and prevent the micro-hemispherical from being subjected to uneven external pressure during polishing.

[0068] The embodiments described above are merely preferred embodiments of this utility model. The terms "in one embodiment," "in another embodiment," "in yet another embodiment," or "in still another embodiment" used in this specification all refer to one or more of the same or different embodiments according to this disclosure. Ordinary variations and substitutions made by those skilled in the art within the scope of this utility model's technical solution should be included within the protection scope of this utility model.

Claims

1. A batch polishing device for micro-hemispherical surfaces, characterized in that, include: Polishing equipment (3), connecting assembly (1), and mounting assembly (2), The mounting assembly (2) includes a mounting plate (21) and multiple fixtures (22). The mounting plate (21) is placed on the asphalt disc (31) of the polishing equipment (3). The mounting plate (21) has multiple vertically arranged mounting through holes (211), which correspond one-to-one with multiple fixtures (22). The fixtures (22) are placed in the corresponding mounting through holes (211) and are detachably connected to the mounting plate (21). The fixture (22) has a receiving hole (221) on its bottom surface for receiving an inverted micro-hemispherical (5). The lower part of the micro-hemispherical (5) extends out of the receiving hole (221) and abuts against the asphalt disc (31). The connecting assembly (1) includes a mandrel (11), a bearing sleeve (12), and a ball bearing (13). The bearing sleeve (12) is fixed to the center of the upper surface of the mounting plate (21), and the ball bearing (13) is fixed in the bearing sleeve (12). The upper end of the mandrel (11) is detachably connected to the power mechanism (32) of the polishing equipment (3), and its lower end has a ball head (111). The ball head (111) is suspended in the center hole of the ball bearing (13) and has a small clearance fit with it. When the polishing equipment (3) is started, it drives the spindle (11) to swing, which in turn drives the mounting plate (21) to rotate relative to the asphalt plate (31), so that the lips (51) of multiple micro-hemispherical surfaces (5) and the asphalt plate (31) rub against each other.

2. The micro-hemispherical batch polishing device according to claim 1, characterized in that, It also includes a leveling component (4) for calibrating the coaxiality of the mounting through hole (211) and the fixture (22) inside it during the process of detachably connecting the fixture (22) and the mounting plate (21) before the mounting plate (21) is placed on the asphalt plate (31).

3. The micro-hemispherical batch polishing device according to claim 2, characterized in that, The leveling component (4) includes a leveling base (41) and multiple leveling blocks (42). The multiple leveling blocks (42) are used to abut between the mounting plate (21) and the leveling base (41) during the coaxiality calibration of the fixture (22). During the detachable connection between the fixture (22) and the mounting plate (21), the lip (51) of the micro-hemispherical (5) in the fixture (22) abuts against the upper surface of the leveling base (41).

4. The micro-hemispherical batch polishing apparatus according to any one of claims 1-3, characterized in that, The fixture (22) is detachably connected to the mounting plate (21) via fasteners (23).

5. The micro-hemispherical batch polishing device according to claim 4, characterized in that, The mounting plate (21) has multiple threaded holes (212) on its side. The multiple threaded holes (212) correspond one-to-one with the multiple mounting through holes (211), and the threaded holes (212) are connected to the corresponding mounting through holes (211). The fastener (23) passes through the corresponding threaded hole (212) and abuts against the fixture (22).

6. The micro-hemispherical batch polishing device according to claim 5, characterized in that, The jig (22) has an annular groove (222) on its side that mates with a corresponding fastener (23). The fastener (23) passes through the threaded hole (212) and is then inserted into the annular groove (222).

7. The micro-hemispherical batch polishing apparatus according to any one of claims 1-3, characterized in that, The bottom center of the receiving hole (221) extends downward to form a positioning post (223) that cooperates with the anchor post cavity (52) of the micro-hemispherical (5). When the inverted micro-hemispherical is placed in the receiving hole (221), the positioning post (223) is inserted into the anchor post cavity (52) of the micro-hemispherical (5).

8. The micro-hemispherical batch polishing apparatus according to any one of claims 1-3, characterized in that, The edge of the mounting plate (21) is provided with a step (213) for installing a protective cover.

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