High-performance guide pillar structure applying mold

Abstract

The utility model discloses a high-performance guide pillar structure applying a die, which comprises a guide pillar and a baffle plate arranged on the outer surface of the guide pillar, a spring is sleeved on the guide pillar and is matched with the baffle plate, a sleeve piece is sleeved on the guide pillar and is matched with the spring, a buffer pad is arranged on the baffle plate, and a lantern ring is arranged on the buffer pad and is respectively matched with the spring and the sleeve piece. According to the utility model, the spring is used for resetting the ball sleeve and is arranged on the baffle plate of the guide post, and when the spring is compressed, the bottom of the ball sleeve is in contact with the lantern ring at the upper part of the buffer pad, so that the buffer pad is extruded before the spring is completely compressed, and the lantern ring moves downwards at the same time; the spring cannot be completely compressed, so that the spring can be prevented from gradually losing the recovery effect due to excessive compression, and the service life of the spring is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of mold guide pillar technology, and in particular to a high-performance guide pillar structure for mold applications. Background Technology

[0002] Guide pillars are crucial components in molds, ensuring proper alignment between the moving and fixed molds during opening and closing. When the mold closes, the guide pillars guide the moving mold along a fixed guide sleeve, ensuring precise matching of the cavities and cores of the moving and fixed molds, preventing misalignment and collisions. Furthermore, guide pillars also support the moving mold, especially in large and complex molds, where they can withstand the weight of the moving mold and injection pressure, preventing deformation and ensuring the mold's strength and rigidity.

[0003] The entire guide post structure includes a spring, whose function is to enable the inner sleeve (such as a ball bearing sleeve) to reciprocate within the outer rigid sleeve, achieving precise matching between the cavity and core of the moving mold and the fixed mold. However, the frequent opening and closing of the upper and lower molds inevitably leads to structural fatigue of the spring, resulting in frequent replacement of the guide post structure. Utility Model Content

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0005] To address the aforementioned problems, this utility model provides the following technical solution:

[0006] The high-performance guide pillar structure for mold application includes a guide pillar and a baffle plate provided on its outer surface, a spring sleeved on the guide pillar and cooperating with the baffle plate, and a kit sleeved on the guide pillar and cooperating with the spring. The characteristic is that the baffle plate is provided with a buffer pad, and the buffer pad is provided with a collar that cooperates with the spring and the kit respectively.

[0007] Based on the above technical solution, the present invention can be further improved as follows.

[0008] As a preferred embodiment of the high-performance guide pillar structure of the application mold described in this utility model, the buffer pad has a cavity inside, and the outer surface of the buffer pad has micropores that communicate with the cavity.

[0009] As a preferred embodiment of the high-performance guide pillar structure of the application mold described in this utility model, a plurality of reset members are provided at equal intervals within the cavity.

[0010] As a preferred embodiment of the high-performance guide pillar structure of the application mold described in this utility model, wherein: a plurality of the reset members divide the cavity into multiple sub-cavities, and the sub-cavities correspond one-to-one with and are connected to the micro-holes.

[0011] As a preferred embodiment of the high-performance guide pillar structure of the application mold described in this utility model, wherein: the second aperture size of the micropore located at one end of the outer surface of the buffer pad is larger than the first aperture size located in the inner cavity.

[0012] As a preferred embodiment of the high-performance guide pillar structure of the application mold described in this utility model, the buffer pad is disposed in the receiving groove of the baffle plate, and the outer surface of the baffle plate is provided with openings and micropores.

[0013] As a preferred embodiment of the high-performance guide pillar structure of the application mold described in this utility model, the upper surface of the buffer pad is connected to the bottom of the collar, the first surface of the collar cooperates with the spring, and the second surface of the collar cooperates with the kit.

[0014] As a preferred embodiment of the high-performance guide post structure of the application mold described in this utility model, the kit includes a ball sleeve, an outer rigid sleeve, and an adapter cover. The adapter cover is disposed at both ends of the guide post, and the ball sleeve is sleeved on the outer surface of the guide post.

[0015] As a preferred embodiment of the high-performance guide pillar structure of the application mold described in this utility model, one end of the ball sleeve is engaged with a spring, the other end is engaged with an adapter cover, and the outer rigid sleeve is movably sleeved on the outer surface of the ball sleeve.

[0016] The beneficial effects of this utility model are as follows: The function of the spring is to reset the ball sleeve. It is set on the baffle of the guide post. When the spring is compressed, the bottom of the ball sleeve will contact the upper collar of the buffer pad. In this way, the buffer pad will be squeezed before the spring is fully compressed, and the collar will also move downward. When the ball sleeve stops pressing down, the spring will not be fully compressed. This can prevent the spring from gradually losing its restoring effect due to excessive compression, thereby improving its service life. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0018] Figure 1 This is a perspective view of the entire embodiment.

[0019] Figure 2 This is an example. Figure 1Assembly drawing.

[0020] Figure 3 This is an example. Figure 2 A partial schematic diagram.

[0021] Figure 4 This is an example. Figure 3 A partial schematic diagram.

[0022] Figure 5 This is a cross-sectional perspective view of the buffer pad in this embodiment.

[0023] Figure 6 This is an example. Figure 5 Top view.

[0024] Figure 7 This is an example. Figure 6 Partial sectional view.

[0025] In the diagram: guide post 100, baffle 101, buffer pad 102, collar 103, spring 104;

[0026] Storage slot 101a, opening 101b;

[0027] Cavity 102a, sub-inner cavity 102a-1, micro-hole 102b, first aperture 102b-1, second aperture 102b-2, reset component 102c;

[0028] First surface 103a, second surface 103b;

[0029] Kit 200, ball bearing sleeve 201, outer steel sleeve 202, adapter cover 203. Detailed Implementation

[0030] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0031] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0032] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0033] Example

[0034] Reference Figures 1 to 7 This embodiment of the present invention provides a high-performance guide post structure for application molds, including a guide post 100 and a baffle 101 provided on its outer surface, a spring 104 sleeved on the guide post 100 and cooperating with the baffle 101, and a kit 200 sleeved on the guide post 100 and cooperating with the spring 104. The baffle 101 is provided with a buffer pad 102, and the buffer pad 102 is provided with a collar 103 that respectively cooperates with the spring 104 and the kit 200. The kit 200 includes a ball sleeve 201, an outer rigid sleeve 202 and an adapter cover 203. The adapter cover 203 is provided at both ends of the guide post 100. The ball sleeve 201 is sleeved on the outer surface of the guide post 100. One end of the ball sleeve 201 cooperates with the spring 104 and the other end cooperates with the adapter cover 203. The outer rigid sleeve 202 is movably sleeved on the outer surface of the ball sleeve 201.

[0035] Specifically, in a common mold structure, the outer rigid sleeve 202 is installed in the hole of the upper mold, while the guide post 100 and other components are installed on the lower mold. Under normal circumstances, the guide post 100 and the ball sleeve 201 are sleeved with the outer rigid sleeve 202, so that the upper and lower molds can move within the outer rigid sleeve 202 through the ball sleeve 201, thereby achieving precise movement along the fixed guide sleeve.

[0036] The function of the spring 104 is to reset the ball sleeve 201. It is set on the baffle 101 of the guide post 100. When the spring 104 is compressed, the bottom of the ball sleeve 201 will contact the upper collar 103 of the buffer pad 102. In this way, the buffer pad 102 will be squeezed before the spring 104 is fully compressed, and the collar 103 will also move downward. When the ball sleeve 201 stops pressing down, the spring 104 will not be fully compressed. This design can prevent the spring 104 from gradually losing its restorative effect due to over-compression and improve the service life of the spring.

[0037] For example, such as Figure 3 , Figure 5 As shown, the buffer pad 102 has a cavity 102a inside, and the outer surface of the buffer pad 102 has micropores 102b that are connected to the cavity 102a. During the compression of the buffer pad 102, the gas in the cavity 102a is discharged from the micropores 102b. This setting can be designed according to the elastic potential energy of the spring 104 to make the elastic coefficient close to the elasticity of the spring when it is fully compressed, so as to avoid meeting actual requirements. This embodiment does not describe the material and elastic coefficient of the buffer pad in detail. The micropores can slow down the rate at which the gas is discharged from the inner cavity, making the buffer pad more linear and uniform when compressed.

[0038] For example, such as Figure 5As shown, a number of reset members 102c are provided at equal intervals in the cavity 102a. Here, the reset members 102c can be set to be made of the same material as the buffer pad for convenience, and the reset members 102c are arc-shaped. The purpose is to make the buffer pad more uniformly compressed and provide better support. At the same time, the arc-shaped reset members provide uniform compression and better reset characteristics.

[0039] For example, such as Figure 5 As shown, several reset components 102c divide the cavity 102a into multiple sub-cavities 102a-1. The sub-cavities 102a-1 correspond one-to-one with the micropores 102b and are connected to each other, which can make the buffer pad have better support and more linear and uniform compression and recovery characteristics.

[0040] For example, such as Figure 5 , Figure 7 As shown, the second aperture 102b-2 of the micropore 102b located at one end of the outer surface of the buffer pad 102 is larger than the first aperture 102b-1 located in the inner cavity 102a-1. The aperture of the micropore 102b and the inner cavity of the buffer pad is the first aperture 102b-1. It has no smaller aperture, which is the same as the above description, which can make the buffer pad have better support and more linear and uniform compression and recovery. The second aperture 102b-2 is larger than the first aperture, which can increase the air intake space for the buffer pad recovery and accelerate the recovery rate of the buffer pad.

[0041] For example, such as Figure 3 , Figure 4 As shown, the buffer pad 102 is disposed in the receiving groove 101a of the baffle plate 101. The outer surface of the baffle plate 101 has an opening 101b that mates with a micro-hole 102b, which facilitates the fixing of the buffer pad 102 on the baffle plate 101 and limits the deformation of the buffer pad 102 to only within the receiving groove 101a. Figure 4 The middle buffer pad 102 is completely fitted into the storage groove, which can provide better stable support for the spring and ball sleeve. The opening 101b on the periphery of the baffle 101 corresponds to the micropores 102b on the buffer pad, allowing the buffer pad to smoothly vent and absorb air.

[0042] For example, such as Figure 4As shown, the upper surface of the buffer pad 102 is connected to the bottom of the collar 103. The first surface 103a of the collar 103 cooperates with the spring 104, and the second surface 103b of the collar 103 cooperates with the kit 200. The first surface 103a and the second surface 103b have a height difference. The first surface contacts the spring, and the second surface contacts the ball sleeve. The height difference determines that after the ball sleeve contacts the second surface, the spring stops being compressed, and the bottom of the second surface also contacts the upper surface of the baffle 101 and stops moving. This provides a simple and practical embodiment of the process that when the spring 104 is compressed, the bottom of the ball sleeve 201 contacts the upper collar 103 of the buffer pad 102.

[0043] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0044] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0045] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A high-performance guide pillar structure for molds, comprising a guide pillar (100) and a baffle (101) provided on its outer surface, a spring (104) sleeved on the guide pillar (100) and cooperating with the baffle (101), and a kit (200) sleeved on the guide pillar (100) and cooperating with the spring (104), characterized in that: The baffle (101) is provided with a buffer pad (102), and the buffer pad (102) is provided with a collar (103) that cooperates with the spring (104) and the kit (200) respectively.

2. The high-performance guide pillar structure for application molds as described in claim 1, characterized in that: The buffer pad (102) has a cavity (102a) inside, and the outer surface of the buffer pad (102) has micropores (102b) that are connected to the cavity (102a).

3. The high-performance guide pillar structure for application molds as described in claim 2, characterized in that: The cavity (102a) is provided with a plurality of reset members (102c) at equal intervals.

4. The high-performance guide pillar structure for application molds as described in claim 3, characterized in that: The reset components (102c) divide the cavity (102a) into multiple sub-cavities (102a-1), and the sub-cavities (102a-1) correspond one-to-one with the micropores (102b) and are connected to each other.

5. The high-performance guide pillar structure for application molds as described in claim 4, characterized in that: The second aperture (102b-2) of the micropore (102b) located at one end of the outer surface of the buffer pad (102) is larger than the first aperture (102b-1) located in the inner cavity (102a-1).

6. The high-performance guide pillar structure for application molds as described in claim 5, characterized in that: The buffer pad (102) is located in the storage groove (101a) of the baffle (101), and the outer surface of the baffle (101) is provided with an opening (101b) and a micropore (102b) that cooperate with each other.

7. The high-performance guide pillar structure for application molds as described in claim 6, characterized in that: The upper surface of the buffer pad (102) is connected to the bottom of the collar (103), the first surface (103a) of the collar (103) is engaged with the spring (104), and the second surface (103b) of the collar (103) is engaged with the kit (200).

8. The high-performance guide pillar structure for application molds as described in claim 1 or 7, characterized in that: The kit (200) includes a ball sleeve (201), an outer rigid sleeve (202), and an adapter cover (203). The adapter cover (203) is located at both ends of the guide post (100), and the ball sleeve (201) is fitted onto the outer surface of the guide post (100).

9. The high-performance guide pillar structure for application molds as described in claim 8, characterized in that: One end of the ball sleeve (201) is engaged with the spring (104), and the other end is engaged with the adapter cover (203). The outer rigid sleeve (202) is movably sleeved on the outer surface of the ball sleeve (201).

Images