Temperature adjusting box
By installing multiple semiconductor heating and cooling plates and temperature sensors inside the semiconductor heating and cooling box, the problem of temperature non-uniformity in existing technologies is solved, achieving more efficient temperature regulation and uniformity, making it suitable for homes, hotels, healthcare facilities, and scientific experiments.
Patent Information
- Application Number
- CN202520281934.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-02-20
AI Technical Summary
Existing semiconductor hot and cold boxes only have one semiconductor hot and cold plate, resulting in poor temperature uniformity inside the box, making it difficult to store temperature-sensitive goods.
At least four semiconductor heating and cooling plates are arranged around the center line inside the chamber, and equipped with temperature sensors and control modules. Through the cooperation of multiple heating and cooling plates and sensors, uniform temperature regulation can be achieved.
It improves the temperature uniformity inside the container, allowing goods to be stored in a more uniform environment, thus improving the efficiency and effectiveness of temperature regulation.
Smart Images
Figure CN223896300U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of box structure technology, and in particular to a temperature regulating box. Background Technology
[0002] Semiconductor hot and cold boxes are dual-purpose boxes made using the semiconductor effect. They can be used as small refrigerators for cooling or as small insulated boxes for heating. These boxes, made using the semiconductor effect, consume little electricity, are easy to carry, and are widely used in homes, hotels, medical and healthcare facilities, and scientific experiments.
[0003] Existing semiconductor hot and cold boxes generally only have one semiconductor hot and cold plate. Therefore, whether heating or cooling the inside of the box, the temperature uniformity inside the box is poor, making it difficult to store temperature-sensitive goods.
[0004] Therefore, it is necessary to design a temperature control chamber that can effectively improve the temperature uniformity of the chamber's internal cavity.
[0005] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content
[0006] This invention provides a temperature regulating box that can effectively improve the temperature uniformity of the box's internal cavity.
[0007] To achieve the above objectives, this utility model provides the following technical solution:
[0008] A temperature control chamber, comprising:
[0009] Box;
[0010] A semiconductor heating and cooling plate, one side of which extends into the inner cavity of the housing and the other side is exposed to the outside; at least four semiconductor heating and cooling plates are arranged around the center line of the housing.
[0011] A temperature sensor is installed on the bottom wall of the inner cavity of the housing, and the temperature sensor is electrically connected to the semiconductor heating and cooling plate.
[0012] Optionally, a sliding window is installed on the wall of the enclosure, and the semiconductor hot and cold plate is slidably installed in the sliding window;
[0013] The housing is also equipped with an adjustment device for adjusting the length of the semiconductor hot and cold plate extending horizontally into the inner cavity of the housing.
[0014] Optionally, the window wall of the sliding window and the outer periphery of the semiconductor hot and cold plate can be slidably and sealed together.
[0015] Optionally, the temperature control chamber also includes a control module for controlling the heating and cooling of the semiconductor;
[0016] The control module is installed on the outer peripheral wall of the enclosure.
[0017] Optionally, a support column is also provided on the bottom wall of the inner cavity;
[0018] The top surface of the support column is higher than the temperature sensor; the support column array consists of several columns.
[0019] Optionally, the two semiconductor hot and cold plates are parallel to each other.
[0020] Optionally, an annular guide plate is provided on the bottom wall of the inner cavity of the box;
[0021] An annular airflow channel is formed between the annular guide plate and the inner peripheral wall of the housing, and fan blades for driving gas to flow along the annular airflow channel are installed in the annular airflow channel.
[0022] Optionally, a drive motor for driving the fan blades to rotate is installed on the outer periphery of the housing.
[0023] Optionally, the adjusting device is an electric telescopic device.
[0024] Optionally, the inner cavity of the box is provided with four temperature sensors, and the temperature sensors are surrounded by the annular airflow channel.
[0025] Compared with the prior art, the present invention has the following beneficial effects:
[0026] The temperature regulating box provided by this utility model has at least four semiconductor heating and cooling plates arranged around the center line of the box body, so that the goods in the inner cavity of the box can be cooled or heated from all sides at the same time; in addition, by setting a temperature sensor to detect the temperature of the inner cavity, the temperature of the inner cavity can be reasonably adjusted (raised or lowered) so that the goods can be stored in a relatively uniform and suitable environment.
[0027] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description
[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0029] Figure 1 This is a side view of the temperature regulating box provided in this embodiment of the utility model;
[0030] Figure 2 yes Figure 1 A schematic diagram of the AA cross-sectional structure of the medium temperature control box;
[0031] Figure 3 This is a top view schematic diagram of another temperature regulating box provided in this embodiment of the utility model;
[0032] Figure 4 This is a cross-sectional structural diagram of another temperature regulating box provided in this embodiment of the present invention.
[0033] Reference numerals: 1. Box body; 11. Sliding window; 102. Support column; 103. Annular guide plate; 104. Annular airflow channel; 2. Semiconductor hot and cold plate; 3. Temperature sensor; 4. Adjustment device; 5. Control module. Detailed Implementation
[0034] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.
[0035] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.
[0036] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.
[0037] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.
[0038] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.
[0039] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.
[0040] Similar to the understanding in the Examination Guidelines, in this application, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments in this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.
[0041] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.
[0042] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.
[0043] In view of the deficiencies of the existing insulated boxes, the applicant, based on years of practical experience and professional knowledge in the design and manufacture of such products, and in conjunction with the application of theoretical principles, actively researched and innovated in order to create a technology that could solve the deficiencies of the existing technology and make the temperature control box more practical. After continuous research, design, and repeated prototype production and improvement, this utility model with real practical value was finally created.
[0044] Please refer to Figures 1 to 4 This utility model provides a temperature regulating box, including a box body 1, a semiconductor hot and cold plate 2, and a temperature sensor 3.
[0045] The container 1 has an inner cavity for storing goods; a semiconductor heating and cooling plate 2, one side of which extends into the inner cavity of the container 1 and the other side is exposed to the outside; at least four semiconductor heating and cooling plates 2 are arranged around the center line of the container 1; a temperature sensor 3 is installed on the bottom wall of the inner cavity of the container 1 and is electrically connected to the semiconductor heating and cooling plate 2.
[0046] In this embodiment, the temperature regulating box has at least four semiconductor heating and cooling plates 2 arranged around the center line of the box body 1. Therefore, it can simultaneously cool or heat the goods inside the box cavity from all sides, making the temperature inside the cavity more uniform during the heating or cooling process. In addition, by setting a temperature sensor 3 to detect the temperature inside the cavity, the temperature inside the cavity can be reasonably adjusted to raise or lower, so that the goods can be stored in a relatively uniform and suitable environment.
[0047] In this embodiment, the temperature regulating box is equipped with multiple semiconductor hot and cold plates 2 and temperature sensors 3, which helps to maintain a more uniform temperature in the inner cavity of the box 1.
[0048] It should also be noted that semiconductor cooling plates, also known as thermoelectric cooling chips, utilize the Peltier effect (second thermoelectric effect) of semiconductor materials. When direct current passes through a coupler made of two different semiconductor materials connected in series, heat can be absorbed and released at the two ends of the coupler respectively, resulting in high reliability.
[0049] Optionally, a sliding window 11 is installed on the wall of the housing 1, and the semiconductor hot and cold plate 2 is slidably installed in the sliding window 11; the housing 1 is also equipped with an adjustment device 4 for adjusting the length of the semiconductor hot and cold plate 2 extending horizontally into the inner cavity of the housing 1.
[0050] As the semiconductor heating and cooling plate 2 slides along the sliding window 11, the size of the inner cavity changes. This change in the inner cavity volume affects the temperature change rate of the gas and cargo within the cavity. Therefore, when the cargo is small, the inner cavity volume can be appropriately reduced to achieve faster heating or cooling.
[0051] Optionally, the window wall of the sliding window 11 and the outer periphery of the semiconductor hot and cold plate 2 can be slidably sealed to prevent the leakage of high-temperature gas or low-temperature gas.
[0052] Optionally, the temperature control chamber also includes a control module 5 for controlling the heating and cooling of the semiconductor; the control module 5 is mounted on the outer peripheral wall of the chamber 1. The control module 5 is located outside the temperature control chamber, thus having less impact on the temperature of the internal cavity and resulting in a smaller overall size of the temperature control chamber.
[0053] Optionally, a support column 102 is also provided on the bottom wall of the inner cavity; the top surface of the support column 102 is higher than the temperature sensor 3; the array of support columns 102 includes several columns. Specifically, the support column 102 is provided so that the bottom of the goods does not contact the bottom wall of the inner cavity, allowing the cooling airflow to flow through the bottom of the goods, thereby effectively improving the overall temperature uniformity of the goods.
[0054] In this embodiment, the two opposing semiconductor hot and cold plates 2 are parallel to each other.
[0055] Optionally, an annular guide plate 103 is provided on the bottom wall of the inner cavity of the housing 1; an annular airflow channel 104 is formed between the annular guide plate 103 and the inner peripheral wall of the housing 1, and a fan blade 6 is installed in the annular airflow channel 104 to drive the gas to flow along the annular airflow channel 104. Specifically, the rotation of the fan blade 6 can cause the airflow to rotate around the center line of the housing 1, uniformly stirring the gas, thereby significantly improving the temperature uniformity of the inner cavity. It should also be noted that the annular airflow channel 104 can avoid the existence of dead airflow corners in the inner cavity of the housing.
[0056] Optionally, a drive motor for driving the fan blades 6 to rotate is installed on the outer periphery of the housing 1.
[0057] Optionally, the adjusting device 4 is an electrically telescopic device. The electrically telescopic device can push the semiconductor hot and cold plate 2 to slide along the sliding window 11.
[0058] Optionally, the inner cavity of the housing 1 is equipped with four temperature sensors 3, and the temperature sensors 3 are surrounded by an annular airflow channel 104. When one of the temperature sensors 3 detects that the temperature is outside the set range, the nearest semiconductor hot or cold plate 2 correspondingly increases its heating or cooling power.
[0059] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.
Claims
1. A temperature regulating box, characterized in that, include: Box (1); A semiconductor hot and cold plate (2) has one side extending into the inner cavity of the housing (1) and the other side exposed to the outside; at least four semiconductor hot and cold plates (2) are arranged around the center line of the housing (1); A temperature sensor (3) is installed on the bottom wall of the inner cavity of the housing (1), and the temperature sensor (3) is electrically connected to the semiconductor hot and cold plate (2).
2. The temperature regulating box according to claim 1, characterized in that, A sliding window (11) is installed on the wall of the housing (1), and the semiconductor hot and cold plate (2) is slidably installed in the sliding window (11); The housing (1) is also equipped with an adjustment device (4) for adjusting the length of the semiconductor hot and cold plate (2) extending horizontally into the inner cavity of the housing (1).
3. The temperature regulating box according to claim 2, characterized in that, The window wall of the sliding window (11) and the outer periphery of the semiconductor hot and cold plate (2) are slidably and sealed together.
4. The temperature regulating box according to claim 1, characterized in that, It also includes a control module (5) for controlling the heating and cooling of the semiconductor; The control module (5) is installed on the outer peripheral wall of the housing (1).
5. The temperature regulating box according to claim 1, characterized in that, A support column (102) is also provided on the bottom wall of the inner cavity; The top surface of the support column (102) is higher than the temperature sensor (3); the support column (102) array is provided with several columns.
6. The temperature regulating box according to claim 1, characterized in that, The two semiconductor hot and cold plates (2) are parallel to each other.
7. The temperature regulating box according to claim 1, characterized in that, An annular guide plate (103) is provided on the bottom wall of the inner cavity of the box (1); An annular airflow channel (104) is formed between the annular guide plate (103) and the inner peripheral wall of the box (1), and a fan blade (6) for driving gas to flow along the annular airflow channel (104) is installed in the annular airflow channel (104).
8. The temperature regulating box according to claim 7, characterized in that, A drive motor for driving the fan blades (6) to rotate is installed on the outer periphery of the housing (1).
9. The temperature regulating box according to claim 2, characterized in that, The regulating device (4) is an electric telescopic device.
10. The temperature regulating box according to claim 7, characterized in that, The inner cavity of the housing (1) is provided with four temperature sensors (3), and the temperature sensors (3) are surrounded by the annular airflow channel (104).