Cooling and heating device

Abstract

A cooling and heating device comprises a conduction panel, an air seat plate, a cold / heat conduction plate strip, an air duct heat exchange piece, a circulating fan, a semiconductor chilling plate, a first heat insulation cotton plate, a second heat insulation cotton plate, a box body with a rear opening, a cover plate, a cold / heat radiator and a heat radiation fan. The cover plate is buckled with the rear opening of the box body, and the semiconductor chilling plate is attached to the cold / heat dissipation device. The first heat insulation cotton plate is attached to a front wall plate of the box body, the semiconductor chilling plate is attached to the cold / heat conduction part, the longitudinal plate part is fixed to a groove in the front portion of the air duct heat exchange part and is embedded into a step of the longitudinal air duct, and the transverse plate part is embedded into a step of the transverse air duct. The conduction panel is attached to the air base plate, the air channel heat exchange part and the cold / heat conduction plate strip, the air outlet hole set is opposite to the transverse air channel, and the air return hole set is opposite to the circulating fan. The air duct heat exchange piece and the cold / heat conduction plate strip are arranged and attached to the conduction panel, so that the characteristic of fast cooling or heating is achieved; and two air outlets are arranged at the cold / heat dissipation device, so that the heat dissipation or cold dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to heating and cooling devices, and in particular to devices that can cool or heat and keep warm. Background Technology

[0002] The existing technology, Chinese patent 202222551510.0, describes a portable cooler, which includes an outer shell defining a first chamber and a second chamber. The outer shell has a first air inlet and a first air outlet communicating with the first chamber, and a second air inlet and a second air outlet communicating with the second chamber. A first heat sink and a first air blowing device are disposed in the first chamber, and a second heat sink and a second air blowing device are disposed in the second chamber. A thermoelectric cooler is disposed between the first and second heat sinks. The first heat sink dissipates heat from the hot end of the thermoelectric cooler, and the cold end of the thermoelectric cooler is cooled by the second heat sink. The problem is that the heat exchange efficiency is low on either the hot or cold side. Utility Model Content

[0003] The purpose of this invention is to provide a heating and cooling device with high heat exchange efficiency.

[0004] This utility model is implemented as follows: a heating and cooling device, characterized in that it includes a conductive panel, a fan base plate, a heat exchange component in the air duct, a circulating fan, a semiconductor refrigeration chip, a first heat insulation board, a second heat insulation board, a rear-opening box, a cover plate, a heat sink / heat radiator, a cooling fan, and heat conduction strips.

[0005] The upper part of the transmission panel is equipped with an air outlet group, and the lower part is equipped with a return air group.

[0006] The wind seat plate includes a horizontal air duct and a vertical air duct located at the top;

[0007] The heat exchange components in the air duct include the heat exchange section of the air duct and the cooling / heating section;

[0008] The housing includes cooling fin holes on the front wall panel and side air outlets on the side wall panel.

[0009] The cover plate is equipped with a front opening and air guide chambers and air inlet hole groups with openings at both ends;

[0010] The heat-conducting strip includes a longitudinal plate portion and a transverse plate portion, with the transverse plate portion located at the upper end of the longitudinal plate portion;

[0011] The heat exchange section of the air duct is located inside the longitudinal air duct. The circulating fan is located in the lower part of the longitudinal air duct and is connected to the heat exchange section. The rear surface of the air seat plate is provided with a first heat insulation cotton plate and surrounds the cooling / heating section. The heat dissipation / heat radiator and the cooling fan are located inside the air guide cavity. The cooling fan and the air inlet group are opposite each other. The semiconductor refrigeration chip is located inside the refrigeration chip hole. The second heat insulation cotton plate is attached to the inner surface of the front wall panel of the box and surrounds the semiconductor refrigeration chip. The cover plate is fastened to the rear opening of the box. The semiconductor refrigeration chip and the heat dissipation / heat radiator are attached. The first heat insulation cotton plate is attached to the front wall panel of the box. The semiconductor refrigeration chip and the cooling / heating section are attached. The longitudinal plate and the groove at the front of the air duct heat exchange section are fixed and are fitted with the step of the longitudinal air duct. The transverse plate and the step of the transverse air duct are fitted. The conductive panel is attached to the air seat plate, the air duct heat exchange section and the cooling / heating strip. The air outlet group is opposite to the transverse air duct. The return air hole group is opposite to the circulating fan.

[0012] The heating and cooling device described above is characterized in that: the longitudinal plate portion of the heat-conducting / cooling strip is provided with the transverse plate portion.

[0013] The lower end of the longitudinal air duct is provided with grooves on both sides; the transverse plate and the grooves are fitted together.

[0014] The heating and cooling device is characterized in that the heat-conducting strips are hollow and filled with refrigerant.

[0015] The heating and cooling device is characterized in that the heat exchanger includes a heat exchange base plate and several parallel heat exchange plates.

[0016] The screw passes through the connecting hole on the heat exchange base plate, the front wall plate of the box, and is screwed into the cooling / heating section.

[0017] The heating and cooling device is characterized in that the circulating fan is fixed to the front wall panel of the housing.

[0018] The heating and cooling device is characterized in that the circulating fan is a centrifugal fan.

[0019] This utility model discloses a heating and cooling device, which is equipped with a heat exchange component in the air duct and a cooling / heating plate strip that is attached to the conductive panel to achieve rapid cooling or heating; the heat dissipator / heater is provided with two air outlets to improve heat dissipation or cooling efficiency. Attached Figure Description

[0020] Figure 1 This is a cross-sectional view of the present invention.

[0021] Figure 2 yes Figure 1 A-A view.

[0022] Figure 3 This is a perspective view of the present invention.

[0023] Figure 4 This is one of the exploded perspective views of this utility model.

[0024] Figure 5 This is the second exploded perspective view of this utility model.

[0025] Figure 6 This is the third exploded perspective view of this utility model. Detailed Implementation

[0026] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] like Figure 1 , Figure 2 , Figure 3 As shown, a heating and cooling device includes a conductive panel 2, a fan base plate 3, a duct heat exchange component 4, a circulating fan 51, a semiconductor cooling chip 6, a first heat insulation board 71, a second heat insulation board 72, a rear-opening box 8, a cover plate 9, a heat sink 10, a cooling fan 52, and heat-conducting strips 1.

[0029] The upper part of the transmission panel 2 is provided with an air outlet group 21, and the lower part is provided with an air return group 22.

[0030] The wind seat plate 3 includes a transverse air duct 31 and a longitudinal air duct 32 located at the top. The upper end of the longitudinal air duct 32 is connected to the middle part of the transverse air duct 31 and is arranged in a T-shape.

[0031] The air duct heat exchange component 4 includes an air duct heat exchange section 41 and a cooling / heating section 42; the air duct heat exchange section 41 is provided with an air guide hole group 411 with through holes at the top and bottom.

[0032] The housing 8 includes a cooling fin hole 81 on the front wall panel and a side air outlet 82 on the side wall panel.

[0033] The cover plate 9 is provided with a front opening and two end openings for air guide chambers 91 and an air inlet group 92;

[0034] The cooling / heating plate 1 includes a longitudinal plate portion 11 and a transverse plate portion 12, with the transverse plate portion 12 located at the upper end of the longitudinal plate portion 11;

[0035] The heat exchange section 41 is located within the longitudinal air duct 32. The circulating fan 51 is located in the lower part of the longitudinal air duct 32 and communicates with the air guide hole group 411 of the heat exchange section 41. The rear surface of the fan seat plate 3 is provided with a first heat insulation cotton plate 71 and surrounds the cooling / heating section 42. The heat dissipator 10 and the heat dissipation fan 52 are located in the air guide cavity 91, with the heat dissipation fan 52 and the air inlet hole group 92 facing each other. The semiconductor cooling chip 6 is located in the cooling chip hole 81. The second heat insulation cotton plate 72 is attached to the inner surface of the front wall panel of the box body 8 and surrounds the semiconductor cooling chip 6. The cover plate 9 is fastened to the rear opening of the box body 8. The semiconductor cooling chip 6 and the heat sink 10 are attached together; the longitudinal plate 11 and the groove at the front of the air duct heat exchange part 41 are fixed and fitted with the step of the longitudinal air duct 32, and the transverse plate 12 and the step of the transverse air duct 31 are fitted together; the conductive panel 2 is attached to the fan seat plate 3, the air duct heat exchange part 41 and the cooling / heating strip 1; the first heat insulation cotton board 71 is attached to the front wall panel of the box body 8, the semiconductor cooling chip 6 and the cooling / heating part 42 are attached together, the conductive panel 2 and the fan seat plate 3 are attached together, the air outlet group 21 and the transverse air duct 31 are opposite each other, and the return air group 22 and the circulating fan 51 are opposite each other;

[0036] The cold / heat conduction plate 1 and the air duct heat exchange part 41 are attached to the conduction panel 2, and the cold / heat energy is transferred to the conduction panel 2, which in turn transfers the cold / heat energy to the storage cavity; compared with the existing technology that only circulates cold air, the efficiency is improved.

[0037] When this utility model is in use, the circulating fan 51 operates, and the air in the storage cavity circulates through the return air hole group 22, the circulating fan 51, the air duct heat exchange section 41, the transverse air duct 31, and the air outlet group 31. The air duct heat exchange section 41 absorbs the cold and heat energy of the semiconductor cooling chip 6 through the cooling / heating section 42, which has the characteristics of rapid cooling or heating. At the same time, the heat dissipation fan 52 operates, and the ambient air enters the air guide cavity through the air inlet group 92. The air exchanges heat with the heat dissipator 10 and then is discharged from the side air outlet 82, which improves the heat exchange efficiency.

[0038] As a further improvement of this utility model: the lower end of the longitudinal plate portion 11 of the cooling / heating plate 1 is provided with the transverse plate portion 12.

[0039] The lower end of the longitudinal air duct 32 is provided with grooves 33 on both sides; the transverse plate 12 and the grooves 33 are fitted together.

[0040] As a further improvement of this utility model: the cooling / heating plate 1 is hollow and filled with refrigerant.

[0041] The heat exchanger 10 includes a heat exchange base 101 plate and a plurality of parallel heat exchange plates 102;

[0042] The screw passes through the connection hole on the heat exchange base plate 101, the front wall plate of the box body 8, and is screwed into the cooling / heating part 42.

[0043] As a further improvement of this utility model: the circulating fan 51 is fixed on the front wall panel of the box body 8.

[0044] The circulating fan 51 is a centrifugal fan.

[0045] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A heating and cooling device, characterized in that: Includes conductive panel, fan base plate, heat conduction / heat conduction strip, air duct heat exchange component, circulating fan, semiconductor refrigeration chip, first heat insulation cotton board, second heat insulation cotton board, rear-opening box, cover plate, heat sink, and cooling fan; The upper part of the transmission panel is equipped with an air outlet group, and the lower part is equipped with a return air group. The wind seat plate includes a horizontal air duct and a vertical air duct located at the top; The heat exchange components in the air duct include the heat exchange section of the air duct and the cooling / heating section; The housing includes cooling fin holes on the front wall panel and side air outlets on the side wall panels. The cover plate is equipped with a front opening and air guide chambers and air inlet hole groups with openings at both ends; The heat-conducting strip includes a longitudinal plate portion and a transverse plate portion, with the transverse plate portion located at the upper end of the longitudinal plate portion; The heat exchange section of the air duct is located inside the longitudinal air duct. The circulating fan is located in the lower part of the longitudinal air duct and is connected to the heat exchange section. The rear surface of the air seat plate is provided with a first heat insulation cotton plate and surrounds the cooling / heating section. The heat dissipation / heat radiator and the cooling fan are located inside the air guide cavity. The cooling fan and the air inlet group are opposite each other. The semiconductor refrigeration chip is located inside the refrigeration chip hole. The second heat insulation cotton plate is attached to the inner surface of the front wall panel of the box and surrounds the semiconductor refrigeration chip. The cover plate is fastened to the rear opening of the box. The semiconductor refrigeration chip and the heat dissipation / heat radiator are attached. The first heat insulation cotton plate is attached to the front wall panel of the box. The semiconductor refrigeration chip and the cooling / heating section are attached. The longitudinal plate and the groove at the front of the air duct heat exchange section are fixed and are fitted with the step of the longitudinal air duct. The transverse plate and the step of the transverse air duct are fitted. The conductive panel is attached to the air seat plate, the air duct heat exchange section and the cooling / heating strip. The air outlet group is opposite to the transverse air duct. The return air hole group is opposite to the circulating fan.

2. The heating and cooling device according to claim 1, characterized in that: The transverse plate portion is provided at the lower end of the longitudinal plate portion of the cooling / heating plate. The lower end of the longitudinal air duct is provided with grooves on both sides; the transverse plate and the grooves are fitted together.

3. A heating and cooling device according to claim 1 or 2, characterized in that: The heat-conducting strips are hollow and filled with refrigerant.

4. A heating and cooling device according to claim 1, characterized in that: The heat exchanger includes a heat exchange base plate and several parallel heat exchange plates; The screw passes through the connecting hole on the heat exchange base plate, the front wall plate of the box, and is screwed into the cooling / heating section.

5. A heating and cooling device according to claim 1, characterized in that: The circulating fan is fixed to the front wall panel of the box.

6. A heating and cooling device according to claim 1, characterized in that: The circulating fan is a centrifugal fan.

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