Cold / hot semiconductor device and portable cold / warm bag

Abstract

The cold / hot semiconductor device comprises a cold / hot release metal plate, a cold / hot aluminum block, a cold / hot batten and a semiconductor module, the cold / hot batten is fixed to the cold / hot aluminum block, and the cold / hot batten and the cold / hot aluminum block are attached to the cold / hot release metal plate to achieve cold / hot energy transfer; the other end face of the cold / hot aluminum block is attached to the semiconductor module. The cold / hot aluminum blocks, the cold / hot release metal plates and the cold / hot strips cooperate with one another, cold / heat energy is distributed on the cold / hot release metal plates, the cold / heat dissipation area is large, and efficiency is high.

Description

Technical Field

[0001] This utility model relates to a cold / hot semiconductor device. Background Technology

[0002] The existing technology, according to Chinese patent 201911417521.6, is a portable insulated box, including a box body and a box lid, with a connecting seat and a cooling component disposed on the outside of the box body; the box body includes an inner liner, an inner liner insulation layer, and an insulation layer outer shell; the inner liner insulation layer has first and second air ducts communicating with the inner liner; the insulation layer outer shell has a first air outlet corresponding to the first air duct and a first air inlet corresponding to the second air duct; the inner liner has a second air outlet corresponding to the first air duct and a second air inlet corresponding to the second air duct; the connecting seat is located on the outer surface of the insulation layer outer shell, forming a transition channel with the outer surface; the cooling component includes a cooling block, a semiconductor cooling chip, and a heat sink; the heat sink is connected to the hot end of the semiconductor cooling chip; one end of the cooling block is attached to the cold end of the semiconductor cooling chip, and the other end extends into the transition channel; a first fan is disposed in the transition channel. The cooling and heat dissipation assembly 3 includes, from the inside out, an inner conductive element 31, a semiconductor cooling chip 32, and an outer conductive element 33 that are in contact with each other. The inner conductive element 31 is in contact with the inner liner 11 to transfer energy to the inner liner 11, and the outer conductive element 33 is in contact with the semiconductor cooling chip 32 to dissipate heat to the outside. The problem is that the contact area between the inner conductive element and the back panel of the inner liner is small, resulting in low cooling efficiency. Utility Model Content

[0003] The purpose of this invention is to provide a cold / hot semiconductor device with a large cold / hot conductive area and high efficiency.

[0004] This invention is implemented as follows: a cold / hot semiconductor device, characterized in that it includes a cold / hot release metal plate, a cold / hot aluminum block, cold / hot strips, and a semiconductor module.

[0005] The cold / hot plate is fixed to the cold / hot aluminum block, and the cold / hot plate and the cold / hot aluminum block are respectively bonded to the cold / hot release metal plate to realize the transfer of cold / hot energy; the other end of the cold / hot aluminum block is bonded to the semiconductor module.

[0006] The aforementioned cold / heat semiconductor device is characterized in that: the semiconductor module includes a bottom shell with an opening at the top, a front cover, a semiconductor cooling chip, a heat sink, a fan, an inner heat insulation plate, and an outer heat insulation plate.

[0007] The bottom shell includes a fan cavity, an air duct, an air inlet, and an end plate that extends through the air outlet of the air duct into the bottom shell.

[0008] The cover includes cooling fin holes on the cover plate and air outlet slots on the end plate;

[0009] Through holes are provided on both the inner and outer heat insulation panels;

[0010] The inner and outer heat insulation plates are respectively attached to the inner and outer surfaces of the cover plate of the faceplate. The fan and the radiator are respectively fixed to the top plate of the faceplate. The faceplate and the bottom shell are fastened together. The fan and the radiator are respectively located in the fan cavity and the air duct. The air outlet end of the air duct is embedded in the air outlet groove to form an air outlet hole. One end face of the semiconductor cooling chip is attached to the radiator through the cooling chip hole and the through hole on the inner heat insulation plate. The cold / hot aluminum block is attached to the other end face of the semiconductor cooling chip through the through hole on the outer heat insulation plate.

[0011] The cold / heat semiconductor device is characterized in that: the cold / heat release metal plate has a hollow cavity with a lower opening and is provided with an annular edge plate;

[0012] The annular edge plate is attached and fixed to the outer heat insulation plate, and the cavity and the outer heat insulation plate form a cold / hot cavity; the cold / hot strip and the cold / hot aluminum block are respectively attached to the top plate of the cavity.

[0013] The cold / heat semiconductor device is characterized in that the cold / heat strip is hollow and filled with a refrigerant.

[0014] The cold / hot semiconductor device is characterized in that the heat sink includes a substrate and several parallel fins, and the gap between two adjacent fins forms a heat exchange channel.

[0015] The cold / heat semiconductor device is characterized in that the cold / heat release metal plate is made of aluminum.

[0016] A portable cooling / heating pack, characterized in that it includes a pack body with an inlet and outlet, a pack lid, a cooling / heating semiconductor module as described above, an air inlet hood, and an air outlet hood.

[0017] The main body of the package includes a circular fixing hole and an air outlet mounting hole provided on the wall panel in the width direction.

[0018] The air inlet of the cooling / heating semiconductor module is equipped with an air inlet interface;

[0019] The cover is pivotally connected to the main body of the bag and fastened to the inlet and outlet. The cold / warm semiconductor module is located inside the main body of the bag. The air inlet is inserted into the circular fixing hole. The air inlet cover and the air inlet are detachably connected. The air outlet cover is connected to the air outlet through the air outlet mounting hole. The main body of the bag and the cover are detachable.

[0020] The portable cooling / warming pack is characterized in that: the inlet and outlet are located at the top of the pack body, the circular fixing hole is located at one end of the bottom plate of the pack body, the air outlet mounting hole is located on one end wall plate, and an inner fixing plate is provided on the inner wall of the pack body;

[0021] The air inlet is equipped with a locking block.

[0022] The air inlet hood includes a hood body, a hood interface, and a flange. The hood interface is equipped with a locking buckle.

[0023] The air outlet cover includes a cylindrical interface body, and the cylindrical interface body is provided with a hook;

[0024] It also includes a ring-shaped pressure plate and a handle.

[0025] The cover interface is inserted into the air inlet interface, and the locking buckle and locking block are locked together. The flange is attached to the base plate. The cylindrical interface body is inserted into the air outlet through the air outlet mounting hole, and the hook is fastened to the wall panel inside the air outlet. The inner fixing plate is attached to the cooling / heating semiconductor module. The annular pressure plate is set on the inner fixing plate, and the screw passes through the annular pressure plate and is screwed into the cooling / heating semiconductor module. The handle is set on the cover.

[0026] The portable cooling / warming pack is characterized by the fact that it also includes a support column, which is located on the bottom plate of the pack body.

[0027] The portable cooling / warming pack is characterized in that: the inlet and outlet are located at the front of the pack body, the circular fixing hole is located on the back panel of the pack body, and the air outlet mounting hole is located at the rear of the end wall panel;

[0028] The air inlet hood includes a hood body, a hood interface, and a flange. The hood interface is equipped with a locking buckle.

[0029] The air outlet cover includes a cylindrical interface body, and the cylindrical interface body is provided with a hook;

[0030] The cover interface is inserted into the air inlet interface, and the locking buckle and locking block lock together. The flange fits against the base plate. The cylindrical interface body is inserted into the air outlet through the air outlet mounting hole, and the hook is fastened to the wall panel inside the air outlet. The screw passes through the back plate of the main body of the bag and screws into the cold / warm semiconductor module. A handle is provided on the top plate of the main body of the bag.

[0031] This utility model discloses a cold / heat semiconductor device in which a cold / heat aluminum block, a cold / heat release metal plate, and a cold / heat strip work together. The cold / heat energy is distributed on the cold / heat release metal plate, resulting in a large cooling / heat dissipation area and high efficiency. Attached Figure Description

[0032] Figure 1 This is a cross-sectional view of the present invention.

[0033] Figure 2 This is one of the exploded perspective views of this utility model.

[0034] Figure 3 This is the second exploded perspective view of this utility model.

[0035] Figure 4 This is the third exploded perspective view of this utility model.

[0036] Figure 5 This is a cross-sectional view of the second embodiment of this utility model.

[0037] Figure 6 This is a perspective view of the second embodiment of this utility model.

[0038] Figure 7 This is one of the exploded perspective views of the second embodiment of this utility model.

[0039] Figure 8 This is the second exploded perspective view of the second embodiment of this utility model.

[0040] Figure 9 This is a cross-sectional view of the third embodiment of this utility model.

[0041] Figure 10 yes Figure 9 A-A view.

[0042] Figure 11 This is one of the exploded perspective views of the third embodiment of this utility model.

[0043] Figure 12 This is the second exploded perspective view of the third embodiment of this utility model.

[0044] Figure 13 This is the third exploded perspective view of the second embodiment of this utility model.

[0045] Figure 14 This is a perspective view of the second embodiment of this utility model. Detailed Implementation

[0046] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0047] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0048] Example 1

[0049] like Figure 1 , Figure 2As shown, a cold / hot semiconductor device includes a bottom shell 1 with an upper opening, a front cover 2, a semiconductor cooling chip 3, a heat sink 4, a cold / hot aluminum block 5, a fan 6, an inner heat insulation plate 71, an outer heat insulation plate 72, a cold / hot release metal plate 8, and a cold / hot strip 9.

[0050] The bottom shell 1 includes a fan cavity 1A, a duct 1B, and an air inlet 1C. The air outlet of the duct 1B is connected to the end plate of the bottom shell 1, and the air inlet 1C is connected to the fan cavity 1A.

[0051] The faceplate 2 includes a cooling plate hole 21 on the cover plate and an air outlet slot 22 on the end plate;

[0052] Through holes are provided on the inner heat insulation plate 71 and the outer heat insulation plate 72;

[0053] The inner heat insulation plate 71 and the outer heat insulation plate 72 are respectively attached to the inner and outer surfaces of the cover plate of the cover 2. The fan 6 and the radiator 4 are respectively fixed to the top plate of the cover 2. The cover 2 and the bottom shell 1 are fastened together. The fan 6 and the radiator 4 are respectively located in the fan cavity 1A and the air duct 1B. The air outlet end of the air duct 1B is embedded in the air outlet groove 22 to form an air outlet hole. One end face of the semiconductor cooling chip 3 is attached to the radiator 4 through the cooling chip hole 21 and the through hole on the inner heat insulation plate 71. The cold / hot aluminum block 5 is attached to the other end face of the semiconductor cooling chip 3 through the through hole on the outer heat insulation plate 72. The cold / hot release plate is attached and fixed to the cold / hot aluminum block 5. The middle part of the cold / hot strip 9 is fixed to the cold / hot aluminum block 5 and attached to the cold / hot release metal plate 8. The cold / hot strip 9 is fixed to the cold / hot aluminum block 5, which quickly conducts and distributes the cold or hot energy on the cold / hot aluminum block 5 onto the cold / hot release metal plate 8, improving work efficiency; the axis of the air inlet is perpendicular to the length direction of the air duct, the fan 6 rotates, and the outside air passes through the air inlet 1C, the radiator 4 in the air duct, and finally the air outlet, improving heat exchange efficiency.

[0054] As a further improvement of this utility model: the cold / heat release metal plate 8 has a hollow cavity 81 with a lower opening and is provided with an annular edge plate 82;

[0055] The annular edge plate 82 is attached and fixed to the outer heat insulation plate 72, and the cavity 81 and the outer heat insulation plate 72 form a cold / hot cavity; the cold / hot strip 9 and the cold / hot aluminum block 5 are respectively attached to the top plate of the cavity 81.

[0056] As a further improvement of this utility model: the cold / hot strip 9 is hollow and filled with refrigerant.

[0057] As a further improvement of this utility model: the radiator 4 includes a base plate 41 and a plurality of parallel fins 42, and the gap between two adjacent fins 42 forms a heat exchange channel.

[0058] The cold / heat release metal plate 8 is made of aluminum.

[0059] Example 2

[0060] like Figure 5 , Figure 6 , Figure 7 As shown, a portable cooling / heating pack includes a pack body 10 with an inlet and outlet, a pack cover 11, a cooling / heating semiconductor module as described above, an air inlet shroud 12, and an air outlet shroud 13.

[0061] The main body 10 includes a circular fixing hole 101 and an air outlet mounting hole 102 provided on the wall panel in the width direction.

[0062] The air inlet 1C of the cooling / heating semiconductor module is equipped with an air inlet interface 1C1;

[0063] The cover 11 is pivotally connected to the main body 10 and fastened to the inlet / outlet. The cooling / heating semiconductor module is located inside the main body 10. The air inlet 1C1 is inserted into the circular fixing hole 101. The air inlet cover 12 is detachably fitted to the air inlet 1C1. The air outlet cover 13 is connected to the air outlet through the air outlet mounting hole 102. The main body 10 and the cover 11 are detachable. The main body 10 and the cover 11 are made of an inner artificial leather layer, a middle insulation cotton layer, and an outer artificial leather layer, respectively.

[0064] like Figure 5 , Figure 6 , Figure 7 As shown, the inlet and outlet are located on the top of the bag body 10, the circular fixing hole 101 is located at one end of the bottom plate of the bag body 10, the air outlet mounting hole 102 is located on one end wall plate, and an inner fixing plate 103 is provided on the inner wall of the bag body 10.

[0065] The air inlet 1C1 is equipped with a locking block 1C2.

[0066] The air inlet hood 12 includes a hood body 121, a hood interface 122 and a flange 123, and the hood interface 122 is provided with a locking buckle 1221;

[0067] The air outlet cover 13 includes a cylindrical interface body 131, and a hook 132 is provided on the cylindrical interface body 131;

[0068] It also includes an annular pressure plate 14 and a handle 15.

[0069] The cover interface 122 is inserted into the air inlet interface 1C1, and the locking buckle 1221 and locking block 1C2 are locked together. The flange 123 is attached to the bottom plate of the main body 10. The cylindrical interface body 131 is inserted into the air outlet through the air outlet mounting hole 102, and the hook 132 is fastened to the wall panel inside the air outlet. The inner fixing plate 103 is attached to the annular edge plate 82. The annular pressure plate 14 is set on the inner fixing plate 103. The screw passes through the annular pressure plate 14 and is screwed into the cold / warm semiconductor module. The handle 15 is set on the cover 11.

[0070] As a further improvement of this utility model, it also includes a support column 16, which is disposed on the bottom plate of the main body 10.

[0071] Example 3

[0072] like Figure 9 , Figure 10 As shown, the inlet and outlet are located at the front of the bag body 10, the circular fixing hole 101 is located on the back plate of the bag body 10, and the air outlet mounting hole 102 is located at the rear of the end wall plate.

[0073] The air inlet hood 12 includes a hood body 121, a hood interface 122 and a flange 123, and the hood interface 122 is provided with a locking buckle 1221;

[0074] The air outlet cover 13 includes a cylindrical interface body 131, and a hook 132 is provided on the cylindrical interface body 131;

[0075] The cover interface 122 is inserted into the air inlet interface 1C1, and the locking buckle 1221 and locking block 1C2 are locked together. The flange is attached to the bottom plate. The cylindrical interface body 131 is inserted into the air outlet through the air outlet mounting hole 102, and the hook is fastened to the wall panel inside the air outlet. The screw passes through the back plate of the bag body 10 and is screwed into the cold / warm semiconductor module. A handle 15 is provided on the top plate of the bag body 10.

[0076] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A cold / hot semiconductor device, characterized in that: Includes cold / heat release metal plates, cold / heat aluminum blocks, cold / heat strips, and semiconductor modules. The cold / hot plate is fixed to the cold / hot aluminum block, and the cold / hot plate and the cold / hot aluminum block are respectively bonded to the cold / hot release metal plate to realize the transfer of cold / hot energy; the other end of the cold / hot aluminum block is bonded to the semiconductor module.

2. The cold / hot semiconductor device according to claim 1, characterized in that: The semiconductor module includes a bottom shell with an opening at the top, a front cover, a semiconductor cooling chip, a heat sink, a fan, an inner heat insulation plate, and an outer heat insulation plate. The bottom shell includes a fan cavity, an air duct, an air inlet, and an end plate that extends through the air outlet of the air duct into the bottom shell. The cover includes cooling fin holes on the cover plate and air outlet slots on the end plate; Through holes are provided on both the inner and outer heat insulation panels; The inner and outer heat insulation plates are respectively attached to the inner and outer surfaces of the cover plate of the face cover. The fan and radiator are respectively fixed to the top plate of the face cover. The face cover and the bottom shell are fastened together. The fan and radiator are respectively located in the fan cavity and the air duct. The air outlet end of the air duct is embedded in the air outlet groove to form an air outlet hole. One end face of the semiconductor cooling chip is attached to the heat sink through the cooling chip hole and the through hole on the inner heat insulation plate, and the cold / hot aluminum block is attached to the other end face of the semiconductor cooling chip through the through hole on the outer heat insulation plate.

3. A cold / hot semiconductor device according to claim 1 or 2, characterized in that: The cold / heat release metal plate has a hollow cavity with a bottom opening and is provided with an annular edge plate; The annular edge plate is attached and fixed to the outer heat insulation plate, and the cavity and the outer heat insulation plate form a cold / hot cavity; the cold / hot strip and the cold / hot aluminum block are respectively attached to the top plate of the cavity.

4. A cold / hot semiconductor device according to claim 1 or 2, characterized in that: The cold / hot strip is hollow and filled with refrigerant.

5. A cold / hot semiconductor device according to claim 2, characterized in that: The radiator includes a base plate and several parallel fins, with the gap between two adjacent fins forming a heat exchange channel.

6. A cold / hot semiconductor device according to claim 1 or 2, characterized in that: The cold / heat release metal plate is made of aluminum.

7. A portable cooling / warming pack, characterized in that: Includes a package body with inlet and outlet, a package cover, a cooling / heating semiconductor module as described in any one of claims 2-6, an air inlet shroud, and an air outlet shroud. The main body of the package includes a circular fixing hole and an air outlet mounting hole provided on the wall panel in the width direction. The air inlet of the cooling / heating semiconductor module is equipped with an air inlet interface; The cover is pivotally connected to the main body of the bag and fastened to the inlet and outlet. The cold / warm semiconductor module is located inside the main body of the bag. The air inlet is inserted into the circular fixing hole. The air inlet cover and the air inlet are detachably connected. The air outlet cover is connected to the air outlet through the air outlet mounting hole. The main body of the bag and the cover are detachable.

8. A portable cooling / warming pack according to claim 7, characterized in that: The inlet and outlet are located on the top of the main body of the bag, the circular fixing hole is located at one end of the bottom plate of the main body of the bag, the air outlet mounting hole is located on one end wall plate, and an inner fixing plate is provided on the inner wall of the main body of the bag. The air inlet is equipped with a locking block. The air inlet hood includes a hood body, a hood interface, and a flange. The hood interface is equipped with a locking buckle. The air outlet cover includes a cylindrical interface body, and the cylindrical interface body is provided with a hook; It also includes a ring-shaped pressure plate and a handle. The cover interface is inserted into the air inlet interface, and the locking buckle and locking block are locked together. The flange is attached to the base plate. The cylindrical interface body is inserted into the air outlet through the air outlet mounting hole, and the hook is fastened to the wall panel inside the air outlet. The inner fixing plate is attached to the cooling / heating semiconductor module. The annular pressure plate is set on the inner fixing plate, and the screw passes through the annular pressure plate and is screwed into the cooling / heating semiconductor module. The handle is set on the cover.

9. A portable cooling / warming pack according to claim 8, characterized in that: It also includes support columns, which are installed on the base plate of the main body of the package.

10. A portable cooling / warming pack according to claim 7, characterized in that: The inlet and outlet are located at the front of the main body of the bag, the circular fixing hole is located on the back plate of the main body of the bag, and the air outlet mounting hole is located at the rear of the end wall plate. The air inlet hood includes a hood body, a hood interface, and a flange. The hood interface is equipped with a locking buckle. The air outlet cover includes a cylindrical interface body, and the cylindrical interface body is provided with a hook; The cover interface is inserted into the air inlet interface, and the locking buckle and locking block lock together. The flange fits against the base plate. The cylindrical interface body is inserted into the air outlet through the air outlet mounting hole, and the hook is fastened to the wall panel inside the air outlet. The screw passes through the back plate of the main body of the bag and screws into the cold / warm semiconductor module. A handle is provided on the top plate of the main body of the bag.

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