Portable water temperature control device based on semiconductor refrigeration piece

Abstract

The portable water temperature control device comprises a main body and a sealing cover, a plurality of placing areas are arranged in the main body, the upper surface of the main body is open, and the sealing cover covers the upper portion of the main body; a water storage cavity is formed in the main body and surrounds the outer side of the containing area, a heat conduction plate is arranged at the joint of the containing area and the water storage cavity, a heat insulation plate is arranged on the outer side of the main body, at least one semiconductor refrigeration part is arranged on the outer side of the main body, and a through groove is formed in the position, corresponding to the semiconductor refrigeration part, of the heat insulation plate. And the heat absorption surface of the semiconductor refrigeration piece is contacted with the outer side surface of the heat-conducting plate. The high specific heat capacity characteristic of water is used as a cold storage medium, and the quick response capability of the semiconductor refrigeration part is combined, so that the temperature stability is realized, the storage environment stability of drugs or samples is ensured, the temperature control is accurate, and the lasting time is long. Meanwhile, compared with a compressor, the compressor is small in size, light in weight and convenient to carry and use.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor refrigeration application technology, specifically a portable water temperature control device based on semiconductor refrigeration components. Background Technology

[0002] Portable refrigeration devices, as core equipment for maintaining low-temperature environments in mobile scenarios, have important applications in fields such as medical emergency care, biological sample transportation, and outdoor scientific research. Traditional portable refrigeration devices mostly use ice packs or compressors for cooling, which have the following drawbacks: ice packs require pre-cooling and cannot be precisely controlled in temperature, with a short cooling time; compressor-based refrigeration devices are bulky, heavy, and inconvenient to carry. To address these issues, we propose a portable water temperature control device based on a semiconductor cooling component. Utility Model Content

[0003] The technical problem to be solved by this utility model is to overcome the existing defects and provide a portable water temperature control device based on a semiconductor refrigeration device. It utilizes the high specific heat capacity of water as a cold storage medium and combines it with the rapid response capability of the semiconductor refrigeration device to achieve temperature stability, ensure a stable storage environment for medicines or samples, provide precise temperature control, and maintain the temperature for a long time. This can effectively solve the problems in the background technology.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a portable water temperature control device based on a semiconductor refrigeration element, comprising a main body and a sealing cover. The main body has several placement areas inside, and the upper surface of the main body is open. The sealing cover covers the main body. A water storage cavity is formed inside the main body, surrounding the outside of the placement areas. A heat-conducting plate is provided at the connection between the placement areas and the water storage cavity. A heat insulation plate is provided on the outside of the main body, and at least one semiconductor refrigeration element is provided on the outside of the main body. A through groove is formed on the heat insulation plate corresponding to the semiconductor refrigeration element. A heat-conducting plate is fixedly installed in the through groove. The heat-absorbing surface of the semiconductor refrigeration element is in contact with the outer surface of the heat-conducting plate, and the inner surface of the heat-conducting plate is in contact with the water in the water storage cavity.

[0005] As a preferred embodiment of this utility model, a heat-conducting cover is provided on the outer surface of the semiconductor cooling device, and a plurality of heat sinks are uniformly arranged on the outer surface of the heat-conducting cover.

[0006] As a preferred embodiment of this utility model, a sealing groove is formed on the upper surface of the main body, and a sealing gasket corresponding to the sealing groove is provided on the lower surface of the sealing cover.

[0007] As a preferred embodiment of this utility model, the upper surface of the sealing cover is provided with a vent hole, and a sealing plug is provided inside the vent hole.

[0008] As a preferred embodiment of this utility model, the outer peripheral surface of the main body is provided with a number of locking blocks, and the upper surface of the sealing cover is hinged with a number of buckles corresponding to the locking blocks.

[0009] As a preferred technical solution of this utility model, the upper surface of the main body is provided with a water inlet, and a threaded cap is threadedly connected to the water inlet.

[0010] As a preferred embodiment of this utility model, a rotating block is rotatably provided on both outer two sides of the main body, and a handle is provided between the two rotating blocks.

[0011] As a preferred embodiment of this utility model, a partition is provided inside the water storage cavity, which divides the water storage cavity into two parts.

[0012] Compared with existing technologies, the advantages of this invention are as follows: Multiple placement areas are provided within the main body for placing medicines, biological samples, or other samples requiring cryopreservation. A semiconductor cooling device cools the water in the water storage chamber, thereby maintaining the placement areas surrounding the water storage chamber at a low temperature, facilitating long-term storage of medicines, biological samples, or other samples requiring cryopreservation. Utilizing the high specific heat capacity of water as the cold storage medium, combined with the rapid response capability of the semiconductor cooling device, temperature stability is achieved, ensuring a stable storage environment for medicines or samples, precise temperature control, and long-lasting effects. Furthermore, compared to compressors, it is smaller, lighter, easier to carry, and more convenient to use. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the structure of the sealing cap of this utility model;

[0015] Figure 3 This is a schematic diagram of the main structure of the present utility model;

[0016] Figure 4 This is a schematic diagram of the internal structure of the main body of this utility model;

[0017] Figure 5 This is a schematic diagram of the internal structure of another embodiment of the present invention.

[0018] In the diagram: 1 Main body, 2 Sealing cover, 3 Placement area, 4 Water storage cavity, 5 Heat insulation plate, 6 Heat conduction plate, 7 Heat conduction cover, 8 Heat sink, 9 Control panel, 10 Sealing groove, 11 Sealing gasket, 12 Vent hole, 13 Sealing plug, 14 Locking block, 15 Buckle, 16 Threaded cover, 17 Handle, 18 Partition, 19 Semiconductor cooling component. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-4 This utility model provides a technical solution: a portable water temperature control device based on a semiconductor cooling device, including a box-shaped main body 1 and a sealing cover 2. The upper surface of the main body 1 is open, and the sealing cover 2 covers the main body 1 to seal the inside of the main body 1.

[0021] The main body 1 has several placement areas 3 inside, and the size of the placement area 3 can be set according to the space required to store medicines or biological samples.

[0022] The main body 1 has a water storage cavity 4 inside, which surrounds the outside of the placement area 3. A heat-conducting plate 6 is installed at the connection between the placement area 3 and the water storage cavity 4. That is, the side wall shared by the placement area 3 and the water storage cavity 4 is made of aluminum alloy and heat-conducting plate 6. The temperature of the low temperature water in the water storage cavity 4 is conducted to the placement area 3 through the heat-conducting plate 6, which cools the placement area 3 and keeps it at a corresponding low temperature, so as to preserve medicines or biological samples for a long time.

[0023] A heat insulation board 5 is installed on the outside of the main body 1. The heat insulation board 5 is made of one or more composite boards selected from polyurethane foam, extruded polystyrene, ceramic fiber composite board, and nanoporous calcium silicate board. It is used to isolate the water storage cavity 4 from the outside heat exchange, prevent the placement area 3 from heating up, and extend the time for low-temperature preservation of medicines or biological samples.

[0024] At least one semiconductor cooling element 19 is provided on the outer side of the main body 1. A through groove is opened on the heat insulation plate 5 corresponding to the semiconductor cooling element 19. A heat-conducting plate 6 is fixedly installed in the through groove. The heat-absorbing surface of the semiconductor cooling element 19 is in contact with the outer surface of the heat-conducting plate 6, and the inner surface of the heat-conducting plate 6 is in contact with the water in the water storage cavity 4. The heat-absorbing surface of the semiconductor cooling element 19 cools the water in the water storage cavity 4 through the heat-conducting plate 6, thereby controlling the temperature of the placement area 3 and keeping the placement area 3 surrounded by the water storage cavity 4 at a low temperature, so as to facilitate long-term storage of medicines, biological samples or samples that require low-temperature preservation.

[0025] This device utilizes the high specific heat capacity of water as a cooling medium, combined with the rapid response capability of the semiconductor cooling element 19, to achieve temperature stability, ensuring a stable storage environment for medicines or samples, precise temperature control, and long-lasting temperature control. Furthermore, compared to compressors, it is smaller in size, lighter in weight, easier to carry, and more convenient to use.

[0026] In a preferred embodiment, the outer surface of the thermoelectric cooler 19, i.e., the heat dissipation surface, is provided with a heat-conducting cover 7 made of aluminum alloy. Thermal grease is filled between the heat-conducting cover 7 and the thermoelectric cooler 19 to fill the gaps and further improve thermal conductivity. A plurality of heat sinks 8 are uniformly arranged on the outer surface of the heat-conducting cover 7. Through the heat-conducting cover 7 and the heat sinks 8, the heat generated by the thermoelectric cooler 19 during operation can be quickly dissipated, extending the service life of the thermoelectric cooler 19.

[0027] In a preferred embodiment, a sealing groove 10 is formed on the upper surface of the main body 1, and a sealing gasket 11 corresponding to the sealing groove 10 is provided on the lower surface of the sealing cover 2. When the sealing cover 2 is placed on the main body 1, the sealing gasket 11 is engaged in the sealing groove 10, which can improve the sealing performance of the sealing cover 2 to the interior of the main body 1, reduce heat exchange between the inside and outside, and thus effectively reduce the power consumption of the semiconductor cooling component 19. The material of the sealing cover 2 can be the same as that of the heat insulation plate 5, and like the heat insulation plate 5, it is wrapped with a metal protective layer such as stainless steel, which extends the overall service life of the device while providing heat insulation.

[0028] In a further preferred embodiment, the outer peripheral surface of the main body 1 is provided with a plurality of locking blocks 14, and the upper surface of the sealing cover 2 is hinged with a plurality of buckles 15 corresponding to the locking blocks 14. After the sealing cover 2 is placed on the main body 1, it can be locked onto the locking blocks 14 by the buckles 15 to make the connection tight and press the sealing gasket 11 to ensure sealing performance.

[0029] Furthermore, the upper surface of the sealing cap 2 is provided with a vent hole 12, and a sealing plug 13 is installed inside the vent hole 12. Because the internal temperature of the main body 1 is low, the internal air pressure will decrease after a period of time, causing the sealing cap 2 to be pressed tightly against the main body 1, making it difficult to open. At this time, the sealing plug 13 can be opened first to equalize the internal and external air pressure, making it easy to open the sealing cap 2 and then retrieve the medicines or biological samples stored inside the main body 1.

[0030] An optional technical solution is that the upper surface of the main body 1 has a water inlet communicating with the water storage chamber 4, and a threaded cap 16 is threadedly connected to the water inlet. By opening the threaded cap 16, cold water can be added to the water storage chamber 4 through the water inlet, which is convenient for maintenance and simple for operation.

[0031] An optional technical solution involves rotatably mounting a rotating block on each of the outer two sides of the main body 1, with a handle 17 positioned between the two rotating blocks. The main body 1 can be easily lifted and carried using the handle 17. The handle 17 can rotate via the rotating blocks and can be lowered for easier operation when opening or closing the sealing cover 2.

[0032] Optionally, the main body 1 is provided with a temperature control switch for controlling the switching of the semiconductor cooling element 19. The temperature control switch can only control the switching of the semiconductor cooling element 19 and can automatically control the temperature of the water storage chamber 4 and the placement area 3.

[0033] A rechargeable lithium-ion battery is provided at the bottom of the main body 1 to power the semiconductor cooling element 19.

[0034] Optionally, a temperature sensor is installed in the placement area 3, and a control panel 9 is installed on the outer surface of the main body 1. The control panel 9 is equipped with a controller and a switch for controlling the controller, the semiconductor cooling element 19, and the temperature sensor or temperature control switch. The controller is preferably a commonly used microcontroller, PLC controller, or PID controller, such as an Arduino series microcontroller or a Siemens S7 series PLC controller. The temperature sensor monitors the temperature of the placement area 3 in real time, and the data is transmitted to the controller. The controller adjusts the cooling power of the semiconductor cooling element 19 through a PWM signal to maintain the temperature of the placement area 3 at the set temperature.

[0035] Alternatively, a circulation pump and circulation pipe can be installed in the water storage chamber 4 to transport the cold water in the water storage chamber 4 near the semiconductor cooler 19 to a location away from the semiconductor cooler 19, thereby circulating the cold water in the water storage chamber 4 and improving cooling efficiency. The circulation pump is electrically connected to a controller, which can adjust the cooling power of the semiconductor cooler 19 and the speed of the circulation pump according to the temperature of the placement area 3.

[0036] The controller, circulating pump, semiconductor cooling device 19, and temperature sensor or temperature control switch used in this application are all commonly used electronic components in the prior art. Their specific structures, working principles, control methods, and circuit connections are all well-known technologies and will not be described in detail here.

[0037] Please see Figure 5 This utility model also provides another embodiment, which is largely the same as the aforementioned embodiment, except that: a partition 18 is provided inside the water storage chamber 4, dividing the water storage chamber 4 into two or three parts, and the partition 18 is made of the same material as the heat insulation plate 5. Multiple semiconductor cooling elements 19 corresponding to each water storage chamber 4 are provided on the main body 1, respectively setting and maintaining corresponding temperatures for different water storage chambers 4 and placement areas 3. This device can simultaneously store medicines or biological samples requiring different storage temperatures.

[0038] The parts not disclosed in this utility model are all prior art, and their specific structures, materials, and working principles will not be described in detail. Although embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this utility model, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A portable water temperature control device based on a semiconductor cooling element, comprising a main body (1) and a sealing cap (2), characterized in that: The main body (1) has several placement areas (3) inside. The upper surface of the main body (1) is open. A sealing cover (2) covers the main body (1). A water storage cavity (4) is opened inside the main body (1). The water storage cavity (4) surrounds the outside of the placement area (3). A heat-conducting plate (6) is provided at the connection between the placement area (3) and the water storage cavity (4). A heat insulation plate (5) is provided on the outside of the main body (1). At least one semiconductor cooling element (19) is provided on the outside of the main body (1). A through groove is opened on the heat insulation plate (5) corresponding to the semiconductor cooling element (19). A heat-conducting plate (6) is fixedly installed in the through groove. The heat-absorbing surface of the semiconductor cooling element (19) is in contact with the outer surface of the heat-conducting plate (6). The inner surface of the heat-conducting plate (6) is in contact with the water in the water storage cavity (4).

2. The portable water temperature control device based on a semiconductor cooling element according to claim 1, characterized in that: The outer surface of the semiconductor cooling device (19) is provided with a heat-conducting cover (7), and a plurality of heat sinks (8) are uniformly provided on the outer surface of the heat-conducting cover (7).

3. The portable water temperature control device based on a semiconductor cooling element according to claim 1, characterized in that: The upper surface of the main body (1) has a sealing groove (10), and the lower surface of the sealing cover (2) is provided with a sealing gasket (11) corresponding to the sealing groove (10).

4. A portable water temperature control device based on a semiconductor refrigeration element according to claim 1, characterized in that: The upper surface of the sealing cover (2) is provided with a vent hole (12), and a sealing plug (13) is provided inside the vent hole (12).

5. A portable water temperature control device based on a semiconductor cooling element according to claim 1, characterized in that: The outer peripheral surface of the main body (1) is provided with a number of locking blocks (14), and the upper surface of the sealing cover (2) is hinged with a number of buckles (15) corresponding to the locking blocks (14).

6. A portable water temperature control device based on a semiconductor cooling element according to claim 1, characterized in that: The upper surface of the main body (1) is provided with a water inlet, and a threaded cap (16) is threadedly connected to the water inlet.

7. A portable water temperature control device based on a semiconductor cooling element according to claim 1, characterized in that: The outer two sides of the main body (1) are each provided with a rotating block, and a handle (17) is provided between the two rotating blocks.

8. A portable water temperature control device based on a semiconductor cooling element according to any one of claims 1-7, characterized in that: The water storage cavity (4) is provided with a partition (18), which divides the water storage cavity (4) into two parts.

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