Test box for testing semiconductor device

Abstract

The utility model relates to a test box for testing a semiconductor device, which is used for being matched with external test equipment to test a semiconductor, and comprises a mounting box, and the test equipment is mounted on the upper end surface of a top plate of the mounting box; a chipset and an interface assembly are installed in the installation box, the chipset comprises a plurality of semiconductor chip boards provided with semiconductor devices, the interface assembly is located on the upper end face of the chipset and connected with the semiconductor chip boards, and the interface assembly is connected with test equipment; a replacement opening is formed in the bottom of the mounting box, and an openable bottom plate is arranged at the replacement opening; overturning assemblies are arranged on the outer side faces of the two side walls, distributed in the first direction, of the mounting box and used for being connected with an external overturning support, so that the whole test box is suspended and can be overturned till the bottom plate faces upwards. According to the test box provided by the utility model, the semiconductor chip board provided with the semiconductor device to be tested is more convenient to replace, and test equipment arranged on the top plate and an internal interface assembly do not need to be operated in the whole process.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a test chamber for testing semiconductor devices. Background Technology

[0002] Existing semiconductor testing is generally achieved by combining a test chamber with testing equipment. The semiconductor devices are placed on a semiconductor chip board inside the test chamber, while the testing equipment is connected to the top of the test chamber shell. The two are connected through an interface component inside the test chamber shell, thereby enabling the testing of the semiconductor devices inside the test chamber shell.

[0003] After the semiconductor devices inside the test chamber are tested, they need to be replaced before testing can continue. However, the replacement port of the original semiconductor chip board is located on the top of the test chamber. When replacing the semiconductor chip board with the semiconductor device under test, the top plate of the chamber needs to be removed to connect the test equipment to expose the replacement port. Moreover, the connection between the test equipment and the interface components will also be disconnected. In addition, the internal interface components also need to be taken out during the replacement process, and the electrical connections after replacement need to be reconnected. This replacement process is quite troublesome, time-consuming and labor-intensive. Therefore, a test chamber for testing semiconductor devices is proposed to solve the above problems. Utility Model Content

[0004] This invention provides a test chamber for testing semiconductor devices, which makes it easier to replace the semiconductor chip board on which the semiconductor device to be tested is installed. The whole process does not require moving the test equipment installed on the top plate or the internal interface components.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A test chamber for testing semiconductor devices, used in conjunction with external test equipment to test semiconductors, includes a mounting box, wherein the test equipment is mounted on the upper surface of the top plate of the mounting box;

[0007] The aforementioned mounting box contains a chipset and an interface assembly. The chipset includes multiple semiconductor chip boards on which semiconductor devices are mounted. The interface assembly is located on the upper surface of the chipset and is connected to the semiconductor chip boards. The interface assembly is connected to the aforementioned test equipment.

[0008] The bottom of the aforementioned installation box is provided with a replacement port, and the replacement port is provided with an openable bottom plate;

[0009] The outer sides of the two side walls of the aforementioned mounting box distributed along the first direction are provided with flipping components for connecting with external flipping brackets, so that the entire test box is suspended in the air and can be flipped so that the bottom plate faces upward.

[0010] Preferably, the mounting box includes a box body and an inner fixing frame, the box body is connected to the outside of the inner fixing frame and encloses the inner fixing frame, and the chipset is connected to the inside of the inner fixing frame;

[0011] The two side walls of the aforementioned box body distributed along the first direction are provided with positioning holes, and the two aforementioned flipping components are respectively connected to the two end faces of the aforementioned inner fixing frame through the two aforementioned positioning holes.

[0012] Preferably, the flipping assembly includes positioning connecting blocks, and the two positioning connecting blocks are respectively connected to the two end faces of the inner fixing frame distributed along the first direction through the two positioning ports. The positioning connecting blocks are detachably connected to the outer flipping bracket.

[0013] Preferably, the above-mentioned flipping component includes a positioning connecting block and a connecting block;

[0014] The two aforementioned positioning connecting blocks are respectively connected to the two end faces of the aforementioned inner fixing frame through the two aforementioned positioning ports. The aforementioned positioning connecting blocks and the aforementioned connecting blocks are detachably connected. The aforementioned positioning connecting blocks and the aforementioned connecting blocks form an integral whole and are detachably connected to the external flipping component.

[0015] Preferably, the positioning connecting block is connected to the inner fixing frame by bolts, and the positioning connecting block is also provided with multiple threaded connecting holes.

[0016] Preferably, the aforementioned housing is detachably disposed on the outside of the aforementioned inner fixing frame.

[0017] Preferably, the inner fixing frame is provided with heat dissipation components at both ends along the second direction, and the two side walls of the box body distributed along the second direction are provided with heat dissipation holes, and the first direction is perpendicular to the second direction.

[0018] Preferably, the inner sidewall of the first end of the base plate is provided with an overlapping plate that overlaps the replacement port. The overlapping plate is configured as an L-shaped structure, and a lock body is provided at the other end. The second end of the base plate is connected to the replacement port by the lock body. The first end and the second end are distributed along the second direction.

[0019] Preferably, a level is provided on the top of the aforementioned box.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0021] The replacement port is located at the bottom of the chamber and can be opened or closed via the bottom plate. When it is necessary to replace the internal semiconductor device (semiconductor chip board), the entire test chamber is suspended in the air by the cooperation of the flip assembly and the flip bracket. Then, the entire test chamber is flipped 180 degrees so that the bottom of the installation box is facing upwards. The bottom plate is opened to expose the replacement port, and then the semiconductor chip board with the semiconductor device to be tested is replaced. After the replacement is completed, the bottom plate is closed, and the chamber is flipped 180 degrees to complete the replacement of the semiconductor chip board. The entire process does not require any operation of the test equipment mounted on the top plate or the internal interface components. Only the test chamber needs to be flipped, and then the replacement can be done directly through the replacement port at the bottom. The entire replacement process is more convenient and labor-saving. Attached Figure Description

[0022] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the test chamber in an embodiment of the present invention. Figure 1 ;

[0024] Figure 2 This is a schematic diagram of the bottom of the test chamber in an embodiment of this utility model;

[0025] Figure 3 This is a schematic diagram of the test chamber in an embodiment of the present invention. Figure 2 ;

[0026] Figure 4 This is a schematic diagram of the test chamber in an embodiment of the present invention. Figure 3 ;

[0027] Figure 5 This is a schematic diagram showing the connection between the flipping component and the flipping bracket in an embodiment of this utility model;

[0028] Figure 6 This is a schematic diagram of the base plate in an embodiment of this utility model;

[0029] Figure 7 This is a schematic diagram of the test chamber in an embodiment of the present invention after the bottom plate and chipset have been removed;

[0030] Figure 8 This is a schematic diagram showing the connection between the inner fixing frame and the positioning connecting block in an embodiment of this utility model.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1. Mounting box; 11. Box body; 12. Internal fixing frame; 13. Replacement port; 14. Base plate; 141. Overlap plate; 142. Lock body; 15. Positioning port; 16. Heat dissipation hole; 2. Chipset; 21. Insert frame; 22. Semiconductor chip board; 3. Interface assembly; 4. Flip assembly; 41. Positioning connecting block; 42. Connecting block; 5. Heat dissipation assembly; 6. Level; 7. Testing equipment; 8. Flip bracket; 81. Support frame; 82. Rotating device; 83. Connecting plate. Detailed Implementation

[0033] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0034] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0035] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0036] like Figures 1-8As shown, a test chamber for testing semiconductor devices is disclosed. This test chamber is used in conjunction with external testing equipment to test semiconductor devices inside the test chamber. The test chamber specifically includes a mounting box 1, and a test device 7 for testing semiconductor devices is installed on the upper surface of the top plate of the mounting box 1. Correspondingly, a chipset 2 and an interface component 3 are installed inside the mounting box 1. The chipset 2 includes a frame 21 and multiple semiconductor chip boards 22 on which semiconductor devices are installed, which are installed in the frame 21. The interface component 3 is located on the upper surface of the frame 21 and is electrically connected to the semiconductor chip boards 22. The interface component 3 is also electrically connected to the test device 7, thereby enabling the test device 7 to electrically connect with the semiconductor devices on the semiconductor chip boards 22 and perform testing on the semiconductor devices.

[0037] The replacement port 13 of the original semiconductor chip board 22 is located on the top of the test chamber. When replacing the semiconductor chip board 22 with the semiconductor device under test installed, the top plate of the housing needs to be removed to expose the replacement port 13. However, the test equipment 7 is fixed on the upper part of the test chamber housing, and the top plate is difficult to remove. Therefore, in order to solve the above problem, in this embodiment, a replacement port 13 is installed at the bottom of the mounting box 1, and an openable bottom plate 14 is installed at the replacement port 13. The bottom plate 14 has two states: closed and open. Of course, in order to facilitate the replacement of the semiconductor chip board 22 with the semiconductor device under test installed (in this embodiment, the entire chip group 2, i.e., multiple semiconductor chip boards 22, is replaced at once), a flip assembly 4 is provided on the outer side of the two side walls of the mounting box 1 distributed along the first direction. The flip assembly 4 can be connected to the external flip bracket 8. The flip bracket 8 is connected to the flip assembly 4. The entire test chamber can be suspended in mid-air. The end connecting the flip bracket 8 and the flip component 4 can rotate, allowing the entire test chamber to be flipped 180 degrees. The bottom of the installation box 1 then faces upwards, and the base plate 14 faces upwards. By opening the base plate 14, the replacement port 13 at the bottom of the installation box 1 is exposed. The operator can take out all the semiconductor chip boards 22 that have been tested, and then install the semiconductor chip board 22 with the semiconductor device to be tested. After closing the replacement port 13 through the base plate 14, the entire replacement process is complete. Then, flip it over and remove the flip component 4 from the flip bracket 8. The entire process does not require moving the test equipment 7 installed on the top plate and the internal interface component 3. It only requires flipping the test chamber and then directly replacing it through the replacement port 13 at the bottom. The entire replacement process is more convenient and labor-saving.

[0038] In this embodiment, the flipping bracket 8 may specifically include a support frame 81. The upper surface of the support frame 81 has two spaced-apart mounting ends. One mounting end is provided with a rotating device 82, which may be a motor. The other mounting end is provided with a rotating shaft. The rotating shaft and the output shaft of the rotating device 82 are both connected to a connecting plate 83. The two flipping components 4 are respectively connected to the two connecting plates 83, thereby fixing the entire test chamber on the flipping bracket 8 and realizing the flipping. The support frame 81 is provided with casters below.

[0039] Specifically, in this embodiment, the mounting box 1 includes a box body 11 and an inner fixing frame 12. The inner fixing frame 12 is provided with a profile frame, wherein the box body 11 is connected to the outside of the inner fixing frame 12, enclosing the inner fixing frame 12, thereby greatly increasing the strength of the entire mounting box 1. The support strength of the entire mounting box 1 mainly relies on the inner fixing frame 12, not on the box body 11. Specifically, the chip group 2 and the interface component 3 are both connected to the inside of the inner fixing frame 12. The box body 11 has positioning holes 15 on both side walls distributed along the first direction. Two flip components 4 are located on the outside of the box body 11 and are connected to the two end faces of the inner fixing frame 12 through the two positioning holes 15, thereby setting the connection support point on the end face of the inner fixing frame 12, ensuring the stability of the entire test box connection support when the flip components 4 are connected to the external flip bracket 8.

[0040] Specifically, in this embodiment, the flipping assembly 4 includes positioning connecting blocks 41. Two positioning connecting blocks 41 are respectively bolted to the two end faces of the inner fixing frame 12 distributed along the first direction through two positioning ports 15. Correspondingly, the positioning connecting blocks 41 are detachably connected to the outer flipping bracket 8, specifically by bolting. In another embodiment, the flipping assembly 4 includes positioning connecting blocks 41 and connecting blocks 42. The two positioning connecting blocks 41 are respectively connected to the two end faces of the inner fixing frame 12 through two positioning ports 15. Specifically, they are bolted sequentially through the positioning connecting blocks and positioning ports 15 and connected to the threaded holes on the end face of the inner fixing frame 12, so that the positioning connecting blocks 41 abut against the outer wall of the housing 11. The positioning connecting blocks 41 are also provided with multiple threaded connecting holes, which are connected to the connecting blocks 42 by bolts. The positioning connecting blocks 41 and the connecting blocks 42 are bolted together to form a whole and are bolted to the connecting plate 83 inside the aforementioned outer flipping assembly 4. Specifically, a level 6 is installed on the top of the housing 11. The level 6 can be used to check whether the entire installation housing 1 is level. After the installation housing 1 is level, the positioning connecting block 41 is installed. This can further ensure that the positioning connecting block 41 can be connected to the center of the end face of the inner fixed frame 12. This ensures that after the entire flipping assembly 4 is connected to the external flipping bracket 8, the flipping center of the test chamber coincides with the center of the inner fixed frame 12, thus ensuring the stability during and after the flipping process.

[0041] Furthermore, the enclosure 11 is composed of several side walls, specifically including a top plate, a bottom side plate, and a peripheral side plate composed of several side mounting plates. All of the above plates can be detached and installed on the outside of the inner fixing frame 12, specifically connected by bolts. The mounting structure on the inner fixing frame 12 can be repaired and replaced by disassembling each plate of the enclosure 11.

[0042] Furthermore, the inner fixing frame 12 is provided with heat dissipation components 5 at both ends along the second direction. The heat dissipation components 5 can be an existing whole cooling fan group. The two side walls of the housing 11 along the second direction are provided with heat dissipation holes 16. The cooling fan dissipates heat from the semiconductor chip board 22 installed inside the inner fixing frame 12 to ensure the accuracy of its testing. The second direction is perpendicular to the first direction.

[0043] Specifically, an overlapping plate 141 is installed on the inner side wall of the first end of the base plate 14, which overlaps the replacement port 13. The overlapping plate 141 has an L-shaped structure, and a lock body 142 is provided at the other end. The second end of the base plate 14 is connected to the replacement port 13 through the lock body 142. The first end and the second end are distributed along the second direction. Specifically, by opening the lock body 142, the connection between the second end and the replacement port 13 is unlocked. Then, the first end of the base plate 14 is pulled out from the replacement port 13, and the base plate 14 can be removed, exposing the replacement port 13. After replacing the semiconductor chip board 22, the first end of the base plate 14 is first inserted into the replacement port 13, and the overlapping plate 141 is overlapped on the bottom side wall of the box 11 at the replacement port 13. Then, the first end of the base plate 14 is placed at the replacement port 13, and the second end of the base plate 14 is connected to the replacement port 13 through the lock body 142, thus closing the replacement port 13. Specifically, in this embodiment, the lock body 142 adopts the Shengji MS717-1.

[0044] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A test chamber for testing semiconductor devices, used in conjunction with external testing equipment to test semiconductors, characterized in that, Includes a mounting box, wherein the test equipment is mounted on the upper end face of the top plate of the mounting box; The mounting box contains a chipset and an interface assembly. The chipset includes multiple semiconductor chip boards on which semiconductor devices are mounted. The interface assembly is located on the upper surface of the chipset and is connected to the semiconductor chip boards. The interface assembly is connected to the test equipment. The bottom of the installation box is provided with a replacement port, and the replacement port is provided with an openable bottom plate; The outer sides of both side walls of the mounting box distributed along the first direction are provided with flipping components for connecting with external flipping brackets, so that the entire test box is suspended in the air and can be flipped so that the bottom plate faces upward.

2. The test chamber according to claim 1, characterized in that, The mounting box includes a box body and an inner fixing frame. The box body is connected to the outside of the inner fixing frame and encloses the inner fixing frame. The chipset is connected to the inside of the inner fixing frame. The two side walls of the box body distributed along the first direction are provided with positioning holes, and the two flipping components are respectively connected to the two end faces of the inner fixing frame through the two positioning holes.

3. The test chamber according to claim 2, characterized in that, The flipping assembly includes positioning connecting blocks. The two positioning connecting blocks are respectively connected to the two end faces of the inner fixing frame distributed along the first direction through the two positioning ports. The positioning connecting blocks are detachably connected to the outer flipping bracket.

4. The test chamber according to claim 2, characterized in that, The flipping component includes a positioning connecting block and a connecting block; The two positioning connecting blocks are respectively connected to the two end faces of the inner fixing frame through the two positioning ports. The positioning connecting blocks and the connecting blocks are detachably connected. The positioning connecting blocks and the connecting blocks form a whole and are detachably connected to the external flipping assembly.

5. The test chamber according to claim 3 or 4, characterized in that, The positioning connecting block is connected to the inner fixing frame by bolts, and the positioning connecting block is also provided with multiple threaded connecting holes.

6. The test chamber according to claim 2, characterized in that, The housing is detachably mounted on the outside of the inner fixing frame.

7. The test chamber according to claim 2, characterized in that, The inner fixing frame is provided with heat dissipation components at both ends along the second direction, and the two side walls of the box body distributed along the second direction are provided with heat dissipation holes. The first direction is perpendicular to the second direction.

8. The test chamber according to claim 2, characterized in that, The inner sidewall of the first end of the base plate is equipped with an overlapping plate that overlaps the replacement port. The overlapping plate is configured as an L-shaped structure, and a lock body is provided at the other end. The second end of the base plate is connected to the replacement port through the lock body. The first end and the second end are distributed along the second direction.

9. The test chamber according to claim 2, characterized in that, A level is installed on the top of the box.

Images