Electronic device

Abstract

The embodiment of the utility model provides electronic equipment, and relates to the technical field of heat dissipation. The electronic device includes: a first housing; the first heat dissipation mechanism is arranged in the first shell; the second shell is rotationally connected with the first shell; the second heat dissipation mechanism is arranged in the shell; and the second heat dissipation mechanism is rotationally connected with the first heat dissipation mechanism through the rotating mechanism, and the second heat dissipation mechanism communicates with the first heat dissipation mechanism through the rotating mechanism, so that the heat dissipation working medium can circulate between the first heat dissipation mechanism and the second heat dissipation mechanism. According to the electronic equipment provided by the embodiment of the invention, the noise generated when the first heat dissipation mechanism and the second heat dissipation mechanism dissipate heat of the electronic device is relatively low.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, and in particular to an electronic device. BACKGROUND

[0002] Electronic devices such as notebook computers generate heat when the electronic components are running. If the heat cannot be dissipated in time, the performance of the electronic device will decrease, the service life will be shortened, and even the electronic device will be damaged. Therefore, efficient heat dissipation is a key requirement for maintaining stable operation of the electronic device.

[0003] According to the related technology, a fan blade is driven to rotate to form a forced air flow, and a heat dissipation fin or a heat pipe is used to accelerate the heat transfer from the electronic component to the external environment.

[0004] However, the fan generates obvious noise when it is running, which affects the user experience. CONTENT OF THE INVENTION

[0005] The embodiments of the present application provide an electronic device to achieve the effect of generating less noise when dissipating heat from the electronic component.

[0006] The embodiments of the present application provide an electronic device, which comprises:

[0007] a first housing;

[0008] a first heat dissipation mechanism, which is arranged in the first housing;

[0009] a second housing, which is rotationally connected with the first housing;

[0010] a second heat dissipation mechanism, which is arranged in the second housing;

[0011] a rotating mechanism, the second heat dissipation mechanism is rotationally connected with the first heat dissipation mechanism through the rotating mechanism, and the second heat dissipation mechanism is in communication with the first heat dissipation mechanism through the rotating mechanism, so that the heat dissipation working medium can circulate between the first heat dissipation mechanism and the second heat dissipation mechanism.

[0012] In a possible implementation, the rotating mechanism comprises:

[0013] a first pipe body, which is in communication with the first heat dissipation mechanism;

[0014] a second pipe body, which is in communication with the first pipe body, the second pipe body is rotationally and sealingly connected with the first pipe body, and the second pipe body is in communication with the second heat dissipation mechanism.

[0015] In a possible implementation, the rotating mechanism further comprises a dynamic sealing ring, the second pipe body is rotationally and sealingly connected with the first pipe body through the dynamic sealing ring.

[0016] In a possible implementation, the number of rotating mechanisms is two; the first pipe body has a first pipe opening, and the first pipe opening is in communication with the first heat dissipation mechanism; the second pipe body has a second pipe opening, and the second pipe opening is in communication with the second heat dissipation mechanism.

[0017] In a possible implementation, the electronic device further includes a rotating shaft mechanism, the second shell is rotationally connected with the first shell through the rotating shaft mechanism, and the rotating mechanism is connected with the rotating shaft mechanism.

[0018] In a possible implementation, the rotating shaft mechanism includes:

[0019] a first shaft body;

[0020] a first hinge, the first hinge connecting the first shaft body and the first shell;

[0021] a second shaft body, the second shaft body being rotationally connected with the first shaft body;

[0022] a second hinge, the second hinge connecting the second shaft body and the second shell.

[0023] In a possible implementation, the second heat dissipation mechanism includes:

[0024] an etching groove, the etching groove being arranged on an inner wall of the second shell;

[0025] a cover plate, the cover plate sealing the etching groove.

[0026] In a possible implementation, the first heat dissipation mechanism is a liquid cooling radiator.

[0027] In a possible implementation, the electronic device further includes a piezoelectric pump, the piezoelectric pump being arranged in the first shell, the rotating mechanism or the second shell, and the piezoelectric pump being configured to drive a heat dissipation working medium to circulate between the first heat dissipation mechanism and the second heat dissipation mechanism.

[0028] In a possible implementation, the electronic device further includes a voltage booster, the voltage booster being electrically connected with the piezoelectric pump.

[0029] The electronic device provided by the embodiments has the following advantages. The first heat dissipation mechanism is arranged in the first shell, and the first heat dissipation mechanism can be used to absorb heat generated by electronic devices in the first shell and dissipate the heat. The second shell is rotationally connected with the first shell, and the folding of the first shell and the second shell can be realized to facilitate the storage of the electronic device. The second heat dissipation mechanism is arranged in the second shell, and the second heat dissipation mechanism can be used to absorb heat generated by electronic devices in the second shell and dissipate the heat.

[0030] By setting the rotating mechanism, the second heat dissipation mechanism is rotatably connected with the first heat dissipation mechanism through the rotating mechanism, and the second heat dissipation mechanism is communicated with the first heat dissipation mechanism through the rotating mechanism, so that the heat dissipation working medium can circulate between the first heat dissipation mechanism and the second heat dissipation mechanism, so that the rotating mechanism can keep the communication between the first heat dissipation mechanism and the second heat dissipation mechanism during the opening and closing process of the electronic device, and ensure that the circulation of the heat dissipation working medium is not affected. And the heat dissipation working medium circulates between the first heat dissipation mechanism and the second heat dissipation mechanism, so that the heat generated by the electronic device in the first shell can be transmitted from the first shell to the second shell for dissipation, and is no longer limited to the limited space in the first shell, but uses the additional area of the second shell for heat dissipation, thereby improving the overall heat dissipation efficiency of the electronic device. In addition, since the heat dissipation working medium circulates for heat dissipation, compared with the traditional fan heat dissipation, the noise generated by the electronic device during heat dissipation is smaller, which significantly improves the user experience. BRIEF DESCRIPTION OF DRAWINGS

[0031] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application.

[0032] Figure 1 The structure schematic diagram of the electronic device provided by the embodiment of the present application is shown in the following figure;

[0033] Figure 2 The structure schematic diagram of the rotating mechanism and the rotating shaft mechanism in the embodiment is shown in the following figure; Figure 1 The structure schematic diagram of the rotating mechanism and the rotating shaft mechanism in the embodiment is shown in the following figure;

[0034] Figure 3 The structure schematic diagram of the etching groove of the second heat dissipation mechanism in the embodiment is shown in the following figure; Figure 1 The structure schematic diagram of the etching groove of the second heat dissipation mechanism in the embodiment is shown in the following figure;

[0035] Figure 4 The structure schematic diagram of the cover plate of the second heat dissipation mechanism in the embodiment is shown in the following figure. Figure 1 The structure schematic diagram of the cover plate of the second heat dissipation mechanism in the embodiment is shown in the following figure.

[0036] Explanation of reference signs:

[0037] 100-First shell;

[0038] 200-First heat dissipation mechanism;

[0039] 300-Second shell;

[0040] 400-Second heat dissipation mechanism; 410-etching groove; 420-cover plate; 430-connector;

[0041] 500-rotating mechanism; 510-first pipe body; 520-first pipe opening; 530-second pipe body; 540-second pipe opening; 550-moving sealing ring; 560-assistant shaft;

[0042] 600 - rotation mechanism; 610 - first shaft body; 620 - first hinge; 630 - second shaft body; 640 - second hinge;

[0043] 700 - piezoelectric pump;

[0044] 800 - voltage booster.

[0045] For the purpose of understanding the scheme of the embodiments of the present application, the spline curves and arrows used in the labels of the drawings are described as follows: the components indicated by the spline curves without arrows can be solid components, i.e. components with solid structures; the components indicated by the spline curves with arrows can be virtual components, i.e. components without solid structures; in some cases, the components indicated by the spline curves with arrows can also be assembly bodies with solid structures or virtual structures.

[0046] The specific embodiments of the present application have been shown by the above drawings, and will be described in more detail hereinafter. The drawings and the written description are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application for the person skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0047] For the purpose of making the objects, technical schemes and advantages of the embodiments of the present application more clear, the technical schemes of the embodiments of the present application will be described clearly and completely by combining the drawings in the embodiments of the present application.

[0048] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. In the description of the embodiments of this application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships (if present), are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this application. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Where there is no conflict, embodiments of this application and the various features thereof can be combined with each other, all of which are within the scope of protection of this application.

[0049] Electronic components in laptops and other electronic devices generate heat during operation. If this heat cannot be dissipated in time, it will lead to a decline in the performance of the electronic devices, a shortened lifespan, or even damage. Therefore, efficient heat dissipation has become a key requirement for maintaining the stable operation of electronic devices.

[0050] The relevant technology creates forced airflow by driving the fan blades to rotate, and then uses heat sinks or heat pipes to accelerate the transfer of heat from electronic devices to the external environment.

[0051] However, the fan produces noticeable noise when it is running, which affects the user experience.

[0052] To address the aforementioned technical problems, embodiments of this application provide an electronic device. Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0053] Please see Figure 1The electronic device includes: a first housing 100; a first heat dissipation mechanism 200 disposed within the first housing 100; a second housing 300 rotatably connected to the first housing 100; a second heat dissipation mechanism 400 disposed within the second housing 300; and a rotating mechanism 500, wherein the second heat dissipation mechanism 400 is rotatably connected to the first heat dissipation mechanism 200 and communicates with the first heat dissipation mechanism 200 through the rotating mechanism 500, so that the heat dissipation working fluid can circulate between the first heat dissipation mechanism 200 and the second heat dissipation mechanism 400.

[0054] The electronic device provided in this application embodiment has a first housing 100 as the main body of the electronic device, which is used to house some electronic devices and related components. For example, when the electronic device is a laptop computer, the first housing 100 is the device bottom shell (D shell), which is used to house electronic devices such as the keyboard and motherboard.

[0055] By providing a first heat dissipation mechanism 200 within the first housing 100, the first heat dissipation mechanism 200 can be used to absorb and dissipate the heat generated by the electronic devices within the first housing 100.

[0056] The first housing 100 can also be used to house some electronic devices and related components. For example, when the electronic device is a laptop, the first housing 100 is the device shell (A-shell), which is used to house electronic devices such as a display screen. By rotating the second housing 300 to the first housing 100, the first housing 100 and the second housing 300 can be folded to facilitate the storage of the electronic device.

[0057] By providing a second heat dissipation mechanism 400 within the second housing 300, the second heat dissipation mechanism 400 can be used to absorb and dissipate the heat generated by the electronic devices within the second housing 300.

[0058] By setting a rotating mechanism 500, the second heat dissipation mechanism 400 is rotatably connected to the first heat dissipation mechanism 200 through the rotating mechanism 500, and the second heat dissipation mechanism 400 is connected to the first heat dissipation mechanism 200 through the rotating mechanism 500. This allows the heat dissipation medium to circulate between the first heat dissipation mechanism 200 and the second heat dissipation mechanism 400, ensuring that the circulation of the heat dissipation medium is not affected during the opening and closing of the electronic device. Furthermore, the circulation of the heat dissipation medium between the first heat dissipation mechanism 200 and the second heat dissipation mechanism 400 allows the heat generated by the electronic components within the first housing 100 to be transferred from the first housing 100 to the second housing 300 for dissipation, no longer confined to the limited space within the first housing 100, but utilizing the additional area of ​​the second housing 300 for heat dissipation, thereby improving the overall heat dissipation efficiency of the electronic device. In addition, due to the use of a circulating heat dissipation medium, compared to traditional fan cooling, the embodiments of this application generate less noise when cooling electronic components, significantly improving the user experience. This low-noise heat dissipation method is particularly suitable for scenarios where a high level of quietness is required, such as libraries, conference rooms, or nighttime use.

[0059] It should be noted that the embodiments of this application do not limit the specific type of electronic device, and can be selected according to specific needs. For example, electronic devices include laptops, foldable phones, wearable devices, home appliances, office equipment, gaming and entertainment devices, health and medical devices, industrial equipment, or network equipment, etc.

[0060] It should also be noted that the embodiments of this application do not limit the specific type of heat dissipation medium. For example, the heat dissipation medium is a coolant.

[0061] The preferred technical solutions of the electronic devices according to embodiments of this application are described below with reference to the accompanying drawings. Figure 2 for Figure 1 A schematic diagram showing the connection between the rotating mechanism 500 and the rotating shaft mechanism 600; Figure 3 for Figure 1 A schematic diagram of the etching groove 410 of the second heat dissipation mechanism 400; Figure 4 for Figure 1 A schematic diagram of the cover plate 420 of the second heat dissipation mechanism 400.

[0062] In some embodiments, please refer to Figure 2 The rotating mechanism 500 includes: a first tube 510, which is connected to the first heat dissipation mechanism 200; a second tube 530, which is connected to the first tube 510, and is rotatably sealed to the first tube 510, and is connected to the second heat dissipation mechanism 400.

[0063] Based on the above embodiments, this embodiment further designs the structure of the rotating mechanism 500 so that it can more efficiently realize the connection between the first heat dissipation mechanism 200 and the second heat dissipation mechanism 400 and the circulation of the heat dissipation working fluid.

[0064] In this embodiment, the first tube 510 is connected to the first heat dissipation mechanism 200, the second tube 530 is connected to the first tube 510, and the second tube 530 is connected to the second heat dissipation mechanism 400. The heat dissipation medium from the first heat dissipation mechanism 200 can flow into the second heat dissipation mechanism 400 in sequence through the first tube 510 and the second tube 530. The heat dissipation medium in the second heat dissipation mechanism 400 can also flow back to the first heat dissipation mechanism 200 in sequence through the second tube 530 and the first tube 510, so that the heat dissipation medium can circulate between the first heat dissipation mechanism 200 and the second heat dissipation mechanism 400 to improve the overall heat dissipation effect of the electronic device.

[0065] Furthermore, the second tube 530 is rotatably sealed to the first tube 510. When the second housing 300 rotates relative to the first housing 100, the second tube 530 can rotate with the second housing 300, so that the second tube 530 rotates relative to the first tube 510, ensuring the continuity and sealing of the heat dissipation working fluid circulation channel during the opening and closing of the electronic device.

[0066] In specific implementation, the first tube 510 can be connected to the first heat dissipation mechanism 200 through a pipe, and the second tube 530 can be connected to the second heat dissipation mechanism 400 through a pipe.

[0067] For some specific implementation methods, please refer to [link / reference]. Figure 2 The rotating mechanism 500 also includes a dynamic sealing ring 550, and the second tube 530 is rotatably sealed to the first tube 510 through the dynamic sealing ring 550.

[0068] In this embodiment, by providing a dynamic sealing ring 550, the second tube 530 is rotary sealed to the first tube 510 through the dynamic sealing ring 550. When the first tube 510 and the second tube 530 rotate relative to each other, the dynamic sealing ring 550 can allow relative movement while maintaining a seal.

[0069] It should be noted that the dynamic sealing ring 550 is an existing structural design method in the field of pipe connection, and will not be described in detail here.

[0070] For other specific implementations, please refer to [link / reference]. Figure 2There are two rotating mechanisms 500; the first tube body 510 has a first tube opening 520, which is connected to the first heat dissipation mechanism 200; the second tube body 530 has a second tube opening 540, which is connected to the second heat dissipation mechanism 400.

[0071] In this embodiment, the number of rotating mechanisms 500 is set to two, which can form a closed-loop circulation system, so that the heat dissipation working fluid can form a continuous and stable flow between the first heat dissipation mechanism 200 and the second heat dissipation mechanism 400.

[0072] Specifically, the first tube body 510 has a first port 520, which communicates with the first heat dissipation mechanism 200, and the second tube body 530 has a second port 540, which communicates with the second heat dissipation mechanism 400, so as to realize the flow between the first heat dissipation mechanism 200 and the second heat dissipation mechanism 400. In this case, one of the two rotating mechanisms 500 is used to allow the heat dissipation working medium in the first heat dissipation mechanism 200 to flow to the second heat dissipation mechanism 400, and the other is used to allow the heat dissipation working medium in the second heat dissipation mechanism 400 to flow back to the first heat dissipation mechanism 200.

[0073] This dual-pipeline design forms an inlet and outlet channel for the heat dissipation medium, constructing a complete unidirectional circulation system. This allows the heat dissipation medium to form a stable unidirectional flow between the first heat dissipation mechanism 200 and the second heat dissipation mechanism 400, ensuring the integrity of the heat dissipation medium circulation.

[0074] Furthermore, one of the two rotating mechanisms 500 can transport the heat-absorbing working medium from the first heat dissipation mechanism 200 to the second heat dissipation mechanism 400 for heat dissipation, while the other can transport the cooled working medium from the second heat dissipation mechanism 400 back to the first heat dissipation mechanism 200 to continue absorbing heat. This unidirectional circulation not only improves the efficiency of the working medium flow but also enhances the heat transfer capacity of the entire heat dissipation system.

[0075] In specific implementation, pipes are provided on both the first pipe opening 520 and the second pipe opening 540. The first heat dissipation mechanism 200 is connected to the first pipe body 510 in sequence through the pipe and the first pipe opening 520. The second heat dissipation mechanism 400 is connected to the second pipe body 530 in sequence through the pipe and the second pipe opening 540.

[0076] For further information, please refer to [link / reference]. Figure 2 The rotating mechanism 500 also includes an auxiliary shaft 560, which is disposed between the two rotating mechanisms 500, and both rotating mechanisms 500 are rotatably connected to the auxiliary shaft 560.

[0077] By setting the auxiliary shaft 560, a structural connection is established between the two rotating mechanisms 500, forming a more stable rotating system. The auxiliary shaft 560, acting as an intermediate connector 430, integrates the two originally independent rotating mechanisms 500 into a cooperating whole, making the entire rotating system more robust.

[0078] It should be noted that this embodiment does not limit the rotational connection method between the rotating mechanism 500 and the auxiliary shaft 560, and can be adjusted according to specific needs. For example, the rotating mechanism 500 and the auxiliary shaft 560 are connected by bearings.

[0079] In other embodiments (not shown in this embodiment), the number of rotating mechanisms 500 is set to one. The rotating mechanism 500 has at least two first ports 520 and at least two second ports 540. The first ports 520 and the second ports 540 are connected to each other to form working fluid channels. At least one working fluid channel is used to allow the heat dissipation working fluid in the first heat dissipation mechanism 200 to flow to the second heat dissipation mechanism 400. At least one working fluid channel is used to allow the heat dissipation working fluid in the second heat dissipation mechanism 400 to flow back to the first heat dissipation mechanism 200, so that the heat dissipation working fluid can circulate between the first heat dissipation mechanism 200 and the second heat dissipation mechanism 400.

[0080] In some examples, the various working fluid channels are isolated from each other to achieve unidirectional circulation of the heat dissipation working fluid.

[0081] In some embodiments, please continue reading Figure 2 The electronic device also includes a rotating shaft mechanism 600, the second housing 300 is rotatably connected to the first housing 100 through the rotating shaft mechanism 600, and the rotating mechanism 500 is connected to the rotating shaft mechanism 600.

[0082] In this embodiment, by setting a rotating shaft mechanism 600, the second housing 300 is rotatably connected to the first housing 100 through the rotating shaft mechanism 600. At the same time, the rotating mechanism 500 is connected to the rotating shaft mechanism 600, so that the rotation function of the heat dissipation system is organically combined with the opening and closing function of the electronic device. The circulation channel of the heat dissipation working fluid can be naturally formed with the opening and closing action of the electronic device without the need for additional connection structure.

[0083] This embodiment achieves functional integration by connecting the rotating mechanism 500 and the pivot mechanism 600. When the electronic device is opened or closed, the pivot mechanism 600 drives the rotating mechanism 500 to rotate synchronously, allowing the heat dissipation medium to circulate continuously at different opening and closing angles. This integrated design saves internal space in the electronic device, leaving more layout space for other functional components, which is beneficial for the thinner and lighter design of the electronic device.

[0084] Furthermore, the connection design between the hinge mechanism 600 and the rotation mechanism 500 allows the heat dissipation system to operate naturally with the opening and closing of the electronic device, requiring no additional user intervention. When the user turns on the electronic device, a heat dissipation channel is automatically formed; when the user turns off the electronic device, the heat dissipation channel remains open, ensuring basic heat dissipation function is maintained even when the device is closed. This seamless heat dissipation method enhances the user experience.

[0085] It should be noted that in some other embodiments, the rotating mechanism 500 can be set independently of the rotating shaft mechanism 600, and the specific setting position of the rotating mechanism 500 is not limited, as long as it can achieve the following: when the second housing 300 rotates relative to the first housing 100, the second heat dissipation mechanism 400 can also rotate relative to the first heat dissipation mechanism 200. For example, the rotating mechanism 500 can be set between the first housing 100 and the second housing 300, or it can be set on both sides of the first housing 100 and / or the second housing 300.

[0086] For some specific implementation methods, please refer to [link / reference]. Figure 2 The rotating shaft mechanism 600 includes: a first shaft 610, which is connected to the first housing 100; and a second shaft 630, which is rotatably connected to the first shaft 610 and connected to the second housing 300.

[0087] In this embodiment, by setting a first shaft 610 and a second shaft 630, the first shaft 610 is connected to the first housing 100, and the second shaft 630 is connected to the second housing 300, and a rotatable connection is formed between the second shaft 630 and the first shaft 610, thereby realizing the rotation function of the second housing 300 relative to the first housing 100.

[0088] It should be noted that the rotational connection between the second shaft 630 and the first shaft 610 is a structural design method already existing in the field, and will not be described in detail here.

[0089] For further information, please refer to [link / reference]. Figure 2 The pivot mechanism 600 further includes: a first hinge 620, which connects the first shaft 610 and the first housing 100; and a second hinge 640, which connects the second shaft 630 and the second housing 300.

[0090] In this embodiment, by providing a first hinge 620 and a second hinge 640, the first hinge 620 serves as a connector 430 between the first shaft 610 and the first housing 100, and the second hinge 640 serves as a connector 430 between the second shaft 630 and the second housing 300, together forming a complete pivot support system.

[0091] The advantage of this design is that the hinge structure provides a larger connection area and more fixing points, making the connection between the first shaft 610 and the first housing 100, and between the second shaft 630 and the second housing 300, more secure. Compared to direct connection, hinge connections can better distribute stress and reduce loosening or deformation problems that may occur during long-term use.

[0092] In some embodiments, please refer to Figure 1 and Figure 3 The second heat dissipation mechanism 400 includes: an etching groove 410 disposed on the inner wall of the second housing 300; and a cover plate 420 that seals the etching groove 410.

[0093] In this embodiment, the second heat dissipation mechanism 400 adopts a structural design combining an etched groove 410 and a cover plate 420. Specifically, an etched groove 410 is formed on the inner wall of the second housing 300 through an etching process. The etched groove 410 has a specific flow channel shape for the flow of heat dissipation fluid. The cover plate 420 is tightly fitted and sealed with the etched groove 410 to form a closed flow channel.

[0094] By etching the etching grooves 410 onto the second housing 300, the etching grooves 410 can maximize coverage of the areas within the second housing 300 that require heat dissipation. Furthermore, by rationally designing the shape and distribution of the etching grooves 410, the heat dissipation medium can fully contact the inner wall of the second housing 300 during flow, improving heat exchange efficiency. When the electronic device generates heat during operation, the heat flows with the heat dissipation medium into the etching grooves 410, then transfers to the second housing 300, and is finally dissipated to the external environment. It should be noted that when the second housing 300 is in the open / closed state, the airflow outside the second housing 300 can carry away the heat transferred by the heat dissipation medium within the etching grooves 410, thereby improving the overall heat dissipation efficiency of the electronic device.

[0095] The etching groove 410 is formed directly on the inner wall of the second housing 300, eliminating the need for additional heat dissipation components and saving valuable internal space. This is especially important for modern electronic devices that prioritize a slim and lightweight design. Compared to traditional standalone heat sinks, this integrated design reduces thermal resistance in the heat dissipation path and improves heat conduction efficiency. Furthermore, since the etching groove 410 is integrally formed with the second housing 300, the contact thermal resistance between the traditional heat sink and the housing is eliminated, further enhancing heat dissipation performance.

[0096] In practice, the cover plate 420 is connected to the inner wall of the second housing 300 by sealant, or the cover plate 420 is welded to the inner wall of the second housing 300 to achieve the sealing of the etching groove 410.

[0097] It should be noted that this embodiment does not limit the specific shape of the etching groove 410, and it can be adjusted according to specific needs. For example, the shape of the etching groove 410 can be curved, S-shaped, wavy, sawtooth, etc.

[0098] It should also be noted that this embodiment does not limit the specific shape of the cover plate 420, as long as it can seal the etching groove 410. For example, the cover plate 420 is square, rectangular, circular, etc.

[0099] It is understandable that the larger the space occupied by the etching groove 410 on the inner surface of the second housing 300, the larger the heat dissipation area of ​​the etching groove 410 and the better the heat dissipation effect of the etching groove 410.

[0100] For some specific implementation methods, please refer to [link / reference]. Figure 3 The etching groove 410 includes multiple parallel and spaced channels, which are connected end to end to make full use of the internal space of the second housing 300, increase the heat dissipation area, and thus improve the overall heat dissipation effect of the electronic device.

[0101] For other specific implementations, please refer to [link / reference]. Figure 3 The second heat dissipation mechanism 400 also includes a connector 430, which has a connection channel that connects the rotating mechanism 500 and the etching tank 410.

[0102] In this embodiment, the connector 430 can be a connector with a certain rigidity, such as a metal connector 430, so that the rotating mechanism 500 can rotate along with the rotation of the second housing 300.

[0103] In some other embodiments, the second housing 300 has a receiving groove (not shown) that connects the outside of the second housing 300 to the etching groove 410, and the receiving groove is used to receive the connector 430.

[0104] In this embodiment, by providing a receiving groove, the connector 430 is accommodated in the receiving groove, so that the connector 430 is embedded in the inner wall of the second housing 300. The heat dissipation device can be arranged in full use of the structure of the second housing 300 itself without occupying more external space, thereby realizing the miniaturization and thinning of electronic devices.

[0105] In some embodiments, the first heat dissipation mechanism 200 is a liquid-cooled heat sink.

[0106] In this embodiment, the first heat dissipation mechanism 200 is disposed within the first housing 100 in the form of a liquid-cooled heat sink and is rotatably connected to the second heat dissipation mechanism 400 via a rotating mechanism 500. As a highly efficient heat dissipation solution, the liquid-cooled heat sink utilizes the flow of a liquid heat dissipation medium to transfer and disperse heat, thereby achieving effective cooling of the electronic components inside the electronic device.

[0107] The working principle of a liquid-cooled heat sink is based on the circulating flow of a liquid heat dissipation medium. When the electronic components inside the first housing 100 generate heat, the heat is first transferred to the liquid-cooled heat sink. The heat dissipation medium, after absorbing the heat, flows through the rotating mechanism 500 to the second heat dissipation mechanism 400, then releases the heat and cools through the second housing 300, and then returns to the liquid-cooled heat sink, forming a complete heat dissipation cycle.

[0108] In other embodiments, the first heat dissipation mechanism 200 is a phase change heat sink.

[0109] The phase change heat sink transfers heat through a phase change cycle of the heat dissipation medium within a sealed cavity. When the phase change heat sink absorbs heat from the electronic components inside the first housing 100, the liquid heat dissipation medium inside the phase change heat sink evaporates into a gaseous state, carrying heat and diffusing to the second heat dissipation mechanism 400 via the rotating mechanism 500; after the gaseous heat dissipation medium cools down, it liquefies again and flows back to the phase change heat sink via the rotating mechanism 500, forming a continuous heat dissipation cycle.

[0110] In some embodiments, please refer to Figure 1 The electronic device also includes a piezoelectric pump 700, which is disposed in the first housing 100, the rotating mechanism 500 or the second housing 300. The piezoelectric pump 700 is used to drive the heat dissipation medium to circulate between the first heat dissipation mechanism 200 and the second heat dissipation mechanism 400.

[0111] In this embodiment, in order to achieve effective circulation of the heat dissipation medium between the first heat dissipation mechanism 200 and the second heat dissipation mechanism 400, the electronic device is equipped with a piezoelectric pump 700 as a power source. The piezoelectric pump 700 can be flexibly set at any appropriate position within the first housing 100, the rotating mechanism 500, or the second housing 300 to meet different design requirements and spatial layouts.

[0112] The piezoelectric pump 700 operates based on the piezoelectric effect, which states that a material generates an electric charge when subjected to mechanical stress, and conversely, deforms when an electric field is applied. In this embodiment, the piezoelectric pump 700 utilizes this principle to apply an alternating electric field to the piezoelectric material, causing it to undergo periodic deformation, thereby generating a pumping force to drive the heat dissipation medium to circulate between the first heat dissipation mechanism 200 and the second heat dissipation mechanism 400.

[0113] Traditional mechanical pumps typically rely on rotating components, such as impellers or gears, which generate vibration and noise when operating at high speeds. In contrast, the piezoelectric pump 700 operates based on the microscopic deformation of materials, with no large-scale moving mechanical parts, resulting in extremely quiet operation. This low-noise characteristic perfectly aligns with the original intent of this application: to improve heat dissipation efficiency without compromising the user experience.

[0114] For further information, please refer to [link / reference]. Figure 1 The electronic equipment also includes a booster 800, which is electrically connected to the piezoelectric pump 700.

[0115] In this embodiment, by setting up a booster 800, the voltage of the piezoelectric pump 700 can be increased, the current flowing through the piezoelectric pump 700 can be reduced, thereby reducing the heat generated by the piezoelectric pump 700 during operation, further controlling heat and reducing additional power consumption.

[0116] It should be understood that the embodiments of this application are not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. An electronic device, characterized in that, include: First housing (100); A first heat dissipation mechanism (200) is disposed inside the first housing (100); The second housing (300) is rotatably connected to the first housing (100); The second heat dissipation mechanism (400) is disposed inside the second housing (300); The rotating mechanism (500) and the second heat dissipation mechanism (400) are rotatably connected to the first heat dissipation mechanism (200) through the rotating mechanism (500). The second heat dissipation mechanism (400) is connected to the first heat dissipation mechanism (200) through the rotating mechanism (500) so that the heat dissipation working fluid can circulate between the first heat dissipation mechanism (200) and the second heat dissipation mechanism (400).

2. The electronic device according to claim 1, characterized in that, The rotating mechanism (500) includes: The first tube body (510) is connected to the first heat dissipation mechanism (200); The second tube (530) is connected to the first tube (510), the second tube (530) is rotatably sealed to the first tube (510), and the second tube (530) is connected to the second heat dissipation mechanism (400).

3. The electronic device according to claim 2, characterized in that, The rotating mechanism (500) further includes a dynamic sealing ring (550), and the second tube (530) is rotatably and sealingly connected to the first tube (510) through the dynamic sealing ring (550).

4. The electronic device according to claim 2, characterized in that, The number of rotating mechanisms (500) is two; the first tube body (510) has a first tube opening (520) which is connected to the first heat dissipation mechanism (200); the second tube body (530) has a second tube opening (540) which is connected to the second heat dissipation mechanism (400).

5. The electronic device according to claim 1, characterized in that, It also includes a rotating shaft mechanism (600), the second housing (300) is rotatably connected to the first housing (100) through the rotating shaft mechanism (600), and the rotating mechanism (500) is connected to the rotating shaft mechanism (600).

6. The electronic device according to claim 5, characterized in that, The rotating shaft mechanism (600) includes: First axis (610); The first hinge (620) connects the first shaft (610) and the first housing (100). The second shaft (630) is rotatably connected to the first shaft (610); The second hinge (640) connects the second shaft (630) to the second housing (300).

7. The electronic device according to any one of claims 1-6, characterized in that, The second heat dissipation mechanism (400) includes: An etching tank (410) is disposed on the inner wall of the second housing (300); A cover plate (420) seals the etching tank (410).

8. The electronic device according to any one of claims 1-6, characterized in that, The first heat dissipation mechanism (200) is a liquid-cooled heat sink.

9. The electronic device according to any one of claims 1-6, characterized in that, It also includes a piezoelectric pump (700), which is disposed in the first housing (100), the rotating mechanism (500) or the second housing (300), and the piezoelectric pump (700) is used to drive the heat dissipation working medium to circulate between the first heat dissipation mechanism (200) and the second heat dissipation mechanism (400).

10. The electronic device according to claim 9, characterized in that, It also includes a booster (800) which is electrically connected to the piezoelectric pump (700).

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