PCH chip heat dissipation structure of all-in-one computer

Abstract

The utility model discloses a PCH chip heat dissipation structure of an all-in-one computer, which comprises a mainboard and a shield plate, a CPU and a PCH chip are arranged on the mainboard, vertical fins and a heat dissipation part are arranged on the shield plate, a heat dissipation fan is arranged on the vertical fins, the shield plate covers the mainboard so that the vertical fins are aligned with the CPU, the heat dissipation part is aligned with the PCH chip, and the heat dissipation fan is arranged on the shield plate. A slope part facing the vertical fins is arranged at the first end of the heat dissipation part, and through grooves back to the slope part are formed in the heat dissipation part in a vertical array to form a plurality of horizontal fin parts. According to the PCH chip heat dissipation structure of the all-in-one computer provided by the utility model, the slope part is used for receiving high-temperature airflow flowing out of the vertical fins, and the high-temperature airflow is lifted to be far away from the heat dissipation part along the surface of the slope part, so that the problem of high-temperature damage of the PCH chip caused by continuous heating of the horizontal fin part by the high-temperature airflow is avoided; and the protectiveness of the PCH chip is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to computer all -in -one technical field, specifically related to a computer all -in -one's PCH chip heat radiation structure. BACKGROUND

[0002] PCH is the south bridge chip, and the south bridge chip is the most important component part in the motherboard chipset except the north bridge chip. Generally, it is located below the CPU socket far away from the mainboard, near the PCI slot. Its working principle is to manufacture the circuit on the surface of the semiconductor chip to perform operation and processing. With the wide use of all-in-one products, there is an increasing demand for high-performance all-in-one products. As an important component of the computer motherboard, the PCH chip has higher performance and greater heat power. Therefore, the PCH chip needs to be cooled.

[0003] According to the announcement number CN218675962U, the announcement date is March 21, 2023, and the disclosed PCH chip heat radiation structure, motherboard structure and computer all-in-one machine relate to the technical field of computer heat dissipation structure, which solves the technical problem of high research and development cost in the existing PCH chip heat dissipation process. The PCH chip heat radiation structure includes a PCH chip, a heat-conducting sheet and a motherboard shield cover. The heat-conducting sheet is attached to the surface of the PCH chip, and the motherboard shield cover is arranged above the PCH chip and the heat-conducting sheet, and a heat transfer part is formed on the motherboard shield cover and contacts the upper surface of the heat-conducting sheet. The PCH chip heat radiation structure of the utility model can conduct the heat generated by the PCH chip to the motherboard shield cover through the heat-conducting sheet and the heat transfer part of the motherboard shield cover, and finally dissipate the heat through natural heat dissipation, which can achieve the effect of installing a radiator alone. At the same time, the PCH chip heat radiation structure of the present application has simple structure, low product cost and simple installation operation, and can be widely applied to all-in-one machines.

[0004] In the prior art including the above-mentioned patent, in the highly integrated computer all-in-one machine, the CPU is directly integrated on the motherboard, and a small-sized down-draft fan is used to cool the CPU. In the actual working process, the heat generated by the CPU is dissipated through the fan and the fins, and the high-temperature airflow dissipated is easy to pass through the heat transfer part of the shield cover of the motherboard, which in turn heats and warms the heat transfer part and the PCH chip, resulting in the problem of high-temperature delamination of the PCH south bridge chip. Utility model content

[0005] The utility model aims to provide a PCH chip heat radiation structure of computer all-in-one machine, which solves the above-mentioned problems.

[0006] In order to achieve the above object, the utility model provides the following technical scheme: A PCH chip heat dissipation structure of computer all -in -one, including mainboard and shielding plate, be provided with CPU and PCH chip on the mainboard, be provided with vertical fin and heat dissipation portion on the shielding plate, be provided with heat dissipation fan on the vertical fin, the shielding plate is covered on the mainboard to make vertical fin and CPU align, heat dissipation portion and PCH chip align, the first end on the heat dissipation portion is provided with the inclined portion towards vertical fin, the heat dissipation portion is opened to the through groove of the inclined portion in the vertical array to form several horizontal fin portions.

[0007] As preferred, the shielding plate is respectively provided with a heat-conducting member, and the shielding plate is covered on the mainboard so that the heat-conducting members are in contact with the CPU and the PCH chip, respectively.

[0008] As preferred, the heat pipes are linearly arranged in the heat dissipation portion and sequentially contact the horizontal fin portions and the heat-conducting members.

[0009] As preferred, the inclined portion is linearly provided with a wind guide groove, and two ends of the wind guide groove are located at high and low ends of the inclined portion, respectively.

[0010] As preferred, the second end of the shielding plate is symmetrically provided with a reinforced column portion connected to the horizontal fin portions.

[0011] As preferred, the reinforced column portion is linearly provided with a plurality of annular grooves, and the annular grooves are aligned with the through grooves between the horizontal fin portions.

[0012] As preferred, the shielding plate is made of aluminum.

[0013] As preferred, the heat-conducting member is a high-thermal-conductivity silicone sheet.

[0014] As preferred, the heat pipes are made of copper.

[0015] As preferred, the shielding plate is provided with a conductive coating.

[0016] In the above technical scheme, the PCH chip heat dissipation structure of the computer all-in-one provided by the utility model has the following beneficial effects: the inclined portion receives the high-temperature airflow flowing out of the vertical fin and lifts the high-temperature airflow along the surface of the inclined portion to be away from the heat dissipation portion, thereby avoiding the problem of high-temperature damage of the PCH chip caused by the continuous heating of the horizontal fin portion by the high-temperature airflow, and improving the protection of the PCH chip. BRIEF DESCRIPTION OF DRAWINGS

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0018] Figure 1 A schematic diagram of the overall structure provided for an embodiment of this utility model;

[0019] Figure 2 This is a schematic cross-sectional view of the overall structure of an embodiment of the present utility model;

[0020] Figure 3 An overall exploded structural diagram provided for an embodiment of this utility model;

[0021] Figure 4 A schematic diagram illustrating the overall working principle of this utility model embodiment.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Motherboard; 11. CPU; 12. PCH chip; 2. Shielding plate; 21. Vertical fins; 22. Heat sink; 221. Sloping section; 2211. Air guide channel; 222. Horizontal fin section; 23. Reinforcing column; 231. Annular groove; 3. Cooling fan; 4. Heat-conducting component; 5. Heat pipe. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0025] like Figures 1-4 As shown, a PCH chip heat dissipation structure for an all-in-one computer includes a motherboard 1 and a shielding plate 2. The motherboard 1 is equipped with a CPU 11 and a PCH chip 12. The shielding plate 2 is equipped with vertical fins 21 and a heat dissipation section 22. A cooling fan 3 is provided on the vertical fins 21. The shielding plate 2 is covered onto the motherboard 1 so that the vertical fins 21 are aligned with the CPU 11 and the heat dissipation section 22 is aligned with the PCH chip 12. The first end of the heat dissipation section 22 is provided with a ramp 221 facing the vertical fins 21. The heat dissipation section 22 is provided with through slots along the vertical array facing away from the ramp 221 to form a plurality of horizontal fin sections 222.

[0026] Specifically, such asFigure 3 As shown, the end of the heat sink 22 facing the vertical fins 21 is the first end. When the shielding plate 2 is covered on the motherboard 1, the cooling fan 3 can be activated to drive the cold airflow into the space between the vertical fins 21 to dissipate heat from the CPU 11. The ramp 221 is provided at the first end of the heat sink 22 to receive the high-temperature airflow flowing out from the vertical fins 21 and lift the high-temperature airflow along the surface of the ramp 221 away from the heat sink 22. The other end of the heat sink 22 is provided with a through groove to form a number of horizontal fins 222. The horizontal fins 222 are used to conduct heat to the PCH chip 12 in contact. The presence of the ramp 221 avoids the problem of high-temperature damage to the PCH chip 12 caused by the continuous heating of the horizontal fins 222 by the high-temperature airflow, thus improving the protection of the PCH chip 12.

[0027] In the above technical solution, the slope portion 221 is used to receive the high-temperature airflow from the vertical fin 21 and raise the high-temperature airflow along the surface of the slope portion 221 to a distance away from the heat dissipation portion 22, thereby avoiding the problem of high-temperature damage to the PCH chip 12 caused by the continuous heating of the horizontal fin portion 222 by the high-temperature airflow and improving the protection of the PCH chip 12.

[0028] As a further embodiment of this utility model, heat-conducting components 4 are respectively provided on the shielding plate 2, and the shielding plate 2 is covered on the motherboard 1 so that the heat-conducting components 4 respectively contact the CPU 11 and the PCH chip 12.

[0029] Specifically, such as Figure 2 As shown, when the shielding plate 2 is placed on the motherboard 1, the heat-conducting component 4 directly contacts the CPU 11 and PCH chip 12 to improve the heat conduction efficiency between the shielding plate 2 and the CPU 11 and PCH chip 12, thereby further improving the heat dissipation efficiency of the CPU 11 and PCH chip 12 and preventing the CPU 11 and PCH chip 12 from being damaged due to overheating.

[0030] As a further embodiment of this utility model, heat pipes 5 are arranged in a linear array within the heat dissipation section 22, and the heat pipes 5 sequentially contact a plurality of horizontal fin sections 222 and heat-conducting elements 4.

[0031] Specifically, such as Figure 2 As shown, the heat dissipation section 22 is equipped with several heat pipes 5, which simultaneously contact several horizontal fin sections 222 and the heat-conducting element 4. This utilizes the heat pipes 5 to further improve the heat conduction efficiency between the PCH chip 12 and the horizontal fin sections 222, preventing overheating damage to the PCH chip 12. Furthermore, the heat pipes 5 penetrate the horizontal fin sections 222 to enhance their support, thus preventing deformation of the horizontal fin sections 222 that could lead to a decrease in heat dissipation efficiency.

[0032] As a further embodiment provided by this utility model, the slope portion 221 is provided with a linear array of air guide grooves 2211, with the two ends of the air guide grooves 2211 located at the high and low ends of the slope portion 221, respectively.

[0033] Specifically, such as Figure 1 As shown, an air guide groove 2211 is provided on the slope portion 221. One end of the air guide groove 2211 is located at the lower end of the slope portion 221 and faces the vertical fin 21. The other end of the air guide groove 2211 is located at the higher end of the slope portion 221 and faces away from the vertical fin 21. When the high-temperature airflow blown out of the vertical fin 21 blows onto the slope portion 221, the high-temperature airflow will be squeezed into the air guide groove 2211 to increase the flow rate. This causes the high-temperature airflow to rise along the surface of the slope portion 221 to a region away from the horizontal fin portion 222, further reducing the heating problem of the high-temperature airflow on the horizontal fin portion 222 and the PCH chip 12.

[0034] As a further embodiment provided in this utility model, the second end of the shielding plate 2 is symmetrically provided with reinforcing column portions 23 connected to a plurality of horizontal fin portions 222.

[0035] Specifically, such as Figure 1 As shown, the end of the shielding plate 2 facing away from the vertical fins 21 is the second end. The reinforcing column 23 provided on the second end of the shielding plate 2 is connected to several horizontal fins 222, thereby further improving the deformation resistance of the horizontal fins 222 and avoiding the decrease in heat dissipation capacity due to the deformation of the horizontal fins 222.

[0036] As a further embodiment provided by this utility model, the reinforcing column 23 is provided with a plurality of annular grooves 231 arranged in a linear array, and the annular grooves 231 are aligned with the through grooves between the plurality of horizontal fin portions 222.

[0037] Specifically, such as Figure 3 As shown, several annular grooves 231 are provided on the reinforcing column 23, and the annular grooves 231 are aligned with the through grooves between several horizontal fin portions 222, as shown. Figure 4As shown, when the high-temperature airflow blown from the vertical fins 21 blows onto the ramp 221, the high-temperature airflow is squeezed into the air guide groove 2211 to increase the flow velocity. This causes the high-temperature airflow to rise along the surface of the ramp 221 to a region away from the horizontal fins 222. At the same time, while the high-temperature air flows towards the horizontal fins 222, due to the velocity difference, the cold air on both sides of the horizontal fins 222 flows into the through-groove between the horizontal fins 222. The cold air flowing into the space between the horizontal fins 222 carries away the heat from the horizontal fins 222 and continues to flow away from the vertical fins 21. This results in a symmetrical gas circulation formed on the heat dissipation section 22 with the reinforcing pillar 23 as the vortex center. This gas circulation can further dissipate heat from the horizontal fins 222, improving the heat dissipation efficiency of the PCH chip 12. Furthermore, the annular groove 231 on the reinforcing pillar 23 can increase the flow velocity of the symmetrical gas circulation formed with the reinforcing pillar 23 as the vortex center.

[0038] As a further embodiment provided in this utility model, the shielding plate 2 is made of aluminum.

[0039] Specifically, shielding plate 2 is made of aluminum to improve its service life and thermal conductivity.

[0040] As a further embodiment provided in this utility model, the thermal conductive element 4 is a high thermal conductivity silicone grease sheet.

[0041] As a further embodiment provided in this utility model, the heat pipe 5 is made of copper.

[0042] Specifically, heat pipe 5 is made of copper to further improve its thermal conductivity.

[0043] As a further embodiment provided in this utility model, the shielding plate 2 is provided with a conductive coating.

[0044] Specifically, a conductive coating is provided on the shielding plate 2 to increase the shielding effect of the shielding plate 2.

[0045] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation structure for the PCH chip of an all-in-one computer, characterized in that, The device includes a motherboard (1) and a shielding plate (2). The motherboard (1) is equipped with a CPU (11) and a PCH chip (12). The shielding plate (2) is equipped with vertical fins (21) and a heat sink (22). A heat sink fan (3) is provided on the vertical fins (21). The shielding plate (2) is covered on the motherboard (1) so that the vertical fins (21) are aligned with the CPU (11) and the heat sink (22) is aligned with the PCH chip (12). The first end of the heat sink (22) is provided with a ramp (221) facing the vertical fins (21). The heat sink (22) is provided with through slots along the vertical array facing away from the ramp (221) to form several horizontal fin portions (222).

2. The heat dissipation structure for the PCH chip of an all-in-one computer according to claim 1, characterized in that, The shielding plate (2) is provided with heat-conducting components (4), and the shielding plate (2) is covered on the motherboard (1) so that the heat-conducting components (4) contact the CPU (11) and the PCH chip (12).

3. The heat dissipation structure for the PCH chip of an all-in-one computer according to claim 2, characterized in that, The heat dissipation section (22) is arranged in a linear array with heat pipes (5) in sequence, and the heat pipes (5) contact a number of horizontal fin sections (222) and heat-conducting components (4) in sequence.

4. The heat dissipation structure for the PCH chip of an all-in-one computer according to claim 1, characterized in that, The slope (221) is provided with a linear array of air guide grooves (2211), with the two ends of the air guide grooves (2211) located at the high and low ends of the slope (221), respectively.

5. The heat dissipation structure for the PCH chip of an all-in-one computer according to claim 1, characterized in that, The shielding plate (2) is symmetrically provided with reinforcing column parts (23) that are connected to several horizontal fin parts (222) on the second end.

6. The heat dissipation structure for the PCH chip of an all-in-one computer according to claim 5, characterized in that, The reinforcing column (23) has a number of annular grooves (231) arranged in a linear array, and the annular grooves (231) are aligned with the through grooves between the number of horizontal fins (222).

7. The heat dissipation structure for the PCH chip of an all-in-one computer according to claim 1, characterized in that, The shielding plate (2) is made of aluminum.

8. The heat dissipation structure for the PCH chip of an all-in-one computer according to claim 2, characterized in that, The thermal conductive component (4) is a high thermal conductivity silicone grease sheet.

9. The heat dissipation structure for the PCH chip of an all-in-one computer according to claim 3, characterized in that, The heat pipe (5) is made of copper.

10. The heat dissipation structure for the PCH chip of an all-in-one computer according to claim 1, characterized in that, The shielding plate (2) is provided with a conductive coating.

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