High-speed cable switching laser welding fixing structure and optical module

Abstract

The utility model relates to a high-speed cable transfer laser welding fixing structure, which is characterized in that at least one grounded base is fixed on a PCB (Printed Circuit Board), an upper cover is arranged on each base, a plurality of compartments which are distributed in rows and are independent from one another are arranged on the base in a cover sealing area of the upper cover, two signal bonding pads are arranged in an area enclosed by each compartment on the PCB, and the signal bonding pads are arranged on the PCB. Two wire clamps which are respectively welded with the two signal bonding pads are arranged in each compartment, and two signal wires of each high-speed cable are respectively and horizontally welded with the two wire clamps in one compartment on the base after the protective layer is stripped; the upper cover, the base, the ground wire exposed in the high-speed cable and the copper / aluminum foil exposed in the high-speed cable are welded in a laser welding mode. The fixing structure has the beneficial effects that the fixing structure does not need dispensing, so that the problem of impedance increase caused by excessive dispensing does not need to be considered, the performance of the high-speed optical module is not influenced, the signal line does not need to be bent, and stress is prevented from being generated.

Description

Technical Field

[0001] This utility model relates to the field of optical module technology, specifically to a high-speed cable adapter laser welding fixing structure and an optical module. Background Technology

[0002] In traditional optical modules, the signal and ground lines of high-speed cables are called dual-core coaxial cables with ground wires. These cables have two signal lines and two ground wires (with the ground wires located outside the two signal lines), all directly soldered to the PCB board. The disadvantage of this method is that after soldering, UV adhesive must be applied and cured with an ultraviolet lamp to prevent the signal lines from detaching and affecting performance. If too much adhesive is applied during the adhesive application process, it will affect the impedance, thus impacting the optical module's performance. This problem has a smaller impact on low-speed optical modules such as 10G, 25G, 40G, 100G, and 200G, but a significant impact on high-speed optical modules such as 800G and 1600G. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a high-speed cable adapter laser welding fixing structure and optical module to overcome the shortcomings of the prior art.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:

[0005] A high-speed cable adapter laser welding fixing structure includes: a PCB board, at least one grounded base fixed along its length on the PCB board, a top cover arranged on each base, and multiple rows of independent compartments arranged on the base within the sealing area of ​​the top cover. Two signal pads are arranged on the PCB board within the area enclosed by each compartment, and two wire clips are arranged in each compartment and soldered to the two signal pads respectively. After the protective layer of each high-speed cable is peeled off, the two signal lines are horizontally soldered to the two wire clips in one compartment of the base. The top cover, the base, the exposed ground wire in the high-speed cable, and the exposed copper / aluminum foil in the high-speed cable are welded together by laser welding.

[0006] The beneficial effects of this utility model are:

[0007] 1) This fixing structure does not require glue application, so there is no need to consider the impedance increase caused by excessive glue application, thus ensuring that it does not affect the performance of the high-speed optical module.

[0008] 2) A specially designed base, with each high-speed cable in its own independent compartment, combined with a cover, effectively prevents interference between signal lines in the high-speed cable;

[0009] 3) After the protective layer of the high-speed cable is stripped, the two signal lines are horizontally soldered to two line clips in one of the compartments on the base. By introducing the line clips, the signal lines do not need to be bent, which prevents stress from causing the signal pads to be scrapped. At the same time, the signal lines can be cut relatively short to reduce impedance, which is better for the signal and ensures performance.

[0010] Based on the above technical solution, the present invention can be further improved as follows.

[0011] Furthermore, the rear end of the line card has a U-shaped slot, and after the signal line is stripped of its protective layer, it enters the U-shaped slot horizontally and is soldered to the line card.

[0012] The further beneficial effect of adopting the above is that it allows the signal line to make effective contact with the line card, avoiding signal distortion.

[0013] Furthermore, the line card has a Z-shaped structure, and the length of the horizontally distributed pin segments at the front end of the line card is greater than the length of the signal pads.

[0014] The further beneficial effects of adopting the above are: the line card is designed with a Z-shaped structure, and the length of the horizontally distributed pins at the front end of the line card is greater than the length of the signal pads, so that the pins can act as an elastic buffer area to prevent excessive stress after being soldered to the signal pads on the PCB board.

[0015] Furthermore, a limiting hole is provided between the base and the top cover at each corresponding compartment. The end of the high-speed cable enters the limiting hole and, after the protective layer of the two signal lines is stripped, is horizontally soldered to the two line clips in the compartment corresponding to the limiting hole.

[0016] The further beneficial effect of adopting the above is that the high-speed cable is limited by the limiting hole, which effectively reduces the risk of the high-speed cable becoming loose.

[0017] Furthermore, the base has a limiting surface in each limiting hole to limit the end face of the high-speed cable protective sleeve. The exposed ground wire end face of the high-speed cable abuts against the limiting surface. The copper / aluminum foil of the high-speed cable in the protective sleeve within the limiting hole is exposed. The top cover has a soldering hole between two adjacent high-speed cables, corresponding to the exposed ground wire and copper / aluminum foil of each high-speed cable. Solder paste is added to the soldering hole, and the solder paste is used to weld the top cover, the base, the exposed ground wire and the exposed copper / aluminum foil of the high-speed cable into one piece by laser welding.

[0018] The further beneficial effects of adopting the above are as follows: solder paste can be added through the solder filling hole, and the solder paste can be melted into a liquid state by laser welding. Then it flows through the top cover, base, exposed ground wire in the high-speed cable, and exposed copper / aluminum foil in the high-speed cable, and then solidifies, thereby making the top cover, base, exposed ground wire in the high-speed cable, and exposed copper / aluminum foil in the high-speed cable welded together as one, resulting in higher assembly efficiency and better reliability.

[0019] Furthermore, the base has a groove below each solder hole, corresponding to the exposed ground wire and copper / aluminum foil, that communicates with two adjacent limiting holes.

[0020] The further beneficial effects of the above are as follows: when solder paste is added to the soldering hole and melts into a liquid state, the liquid solder paste can flow into the limiting hole through the groove, and first flow through the exposed ground wire of the high-speed cable below the soldering hole to the exposed copper / aluminum foil of the high-speed cable, and then flow to the exposed ground wire on the other side of the high-speed cable, and then solidify, thereby making the top cover, base, exposed ground wire in the high-speed cable and exposed copper / aluminum foil in the high-speed cable fused together, making the fusion process more convenient.

[0021] Furthermore, on the surface of the PCB board on the back of the base, there is a first limiting groove at each corresponding compartment, with one end communicating with the compartment and the other end penetrating through the side of the base. On the surface of the top cover near the PCB board, there is a second limiting groove at each corresponding first limiting groove. The first limiting groove on the base and the second limiting groove on the top cover together form a limiting hole.

[0022] The further beneficial effect of adopting the above method is that the limiting hole can be formed by assembly, which reduces the processing difficulty.

[0023] Furthermore, the base has a through groove on the surface near the PCB board that connects all the compartments. An insulating component that passes through all the compartments is arranged in the through groove. The insulating component is pressed onto the PCB board by the base, and the middle section of the wire clip is fixed to the insulating component.

[0024] The further beneficial effects of adopting the above are as follows: by introducing insulating components, the line card is prevented from being pulled off after being soldered to the signal pads on the PCB board, allowing the base and line card to be directly completed at the surface mount factory, which can better ensure quality, and the line card's pads can be made smaller, which is more conducive to reducing impedance.

[0025] Furthermore, the insulating component is made of plastic, and the wire clip and the insulating component are integrally molded using injection molding.

[0026] The further beneficial effects of adopting the above are: reducing the processing difficulty, while ensuring the firmness of the assembly between the wire clip and the insulation component.

[0027] Furthermore, the PCB board has multiple grounding pads at different locations, and each base is soldered to one of the grounding pads on the PCB board. The top cover is made of tin-plated copper, and the base is made of tin-plated copper.

[0028] The further beneficial effect of adopting the above is that it facilitates grounding of the base.

[0029] Based on the above technical solution, this utility model also provides an optical module, including the above-mentioned high-speed cable adapter laser welding fixing structure.

[0030] The further beneficial effect of adopting the above is that it ensures that the performance of the high-speed optical module is not affected. Attached Figure Description

[0031] Figure 1 This is a structural diagram of the laser welding and fixing structure for medium and high speed cable adapters of this utility model;

[0032] Figure 2 This is a partial exploded view of the laser welding and fixing structure for medium and high speed cable adapters of this utility model;

[0033] Figure 3 for Figure 2 Exploded view of part of the structure;

[0034] Figure 4 for Figure 2 Partial structural diagram;

[0035] Figure 5 Structural diagram of the base, top cover, insulating components, and wire clips;

[0036] Figure 6 for Figure 1 Structural diagram after removing one of the top covers;

[0037] Figure 7 for Figure 1 A structural diagram showing the removal of a base, top cover, insulation components, and wire clips.

[0038] The attached diagram lists the components represented by each number as follows:

[0039] 1. PCB board, 110. Signal pad, 120. Ground pad, 2. Base, 210. Compartment, 220. First limiting groove, 221. Limiting surface, 230. Groove, 240. Through groove, 3. Top cover, 310. Soldering hole, 320. Second limiting groove, 330. Ramp, 4. Wire clip, 410. U-shaped slot, 5. High-speed cable, 510. Signal line, 520. Ground line, 530. Copper / aluminum foil, 6. Insulating component. Detailed Implementation

[0040] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0041] Example 1

[0042] like Figures 1 to 7 As shown, a high-speed cable adapter laser welding fixing structure includes:

[0043] PCB board 1, at least one grounding base 2 is fixed on PCB board 1, that is, the base 2 is made of metal. The bases 2 on PCB board 1 are arranged in rows along the length direction of PCB board 1. Since the high-speed cable group composed of multiple high-speed cables is arranged in rows along the width direction of PCB board 1, the number of high-speed cables in each high-speed cable group can be four or six, or other numbers. Therefore, the length direction of the base 2 is preferably distributed along the width direction of PCB board 1.

[0044] Each base 2 is provided with a top cover 3. The base 2 has multiple rows of independent compartments 210 in the covered area of ​​the top cover 3. The compartments 210 penetrate the upper and lower surfaces of the base 2. Since the top cover 3 covers the compartments 210, the fit between the base 2 and the top cover 3 forms a shielding cavity at the compartments 210. The multiple compartments 210 on the base 2 are preferably arranged in rows along the width direction of the PCB board 1. The number of compartments 210 on the base 2 is determined according to the number of high-speed cables 5 in the high-speed cable group. For example, if each high-speed cable group has four or six high-speed cables 5, then the base 2 adapted to the high-speed cable group will have four or six compartments 210.

[0045] Two signal pads 110 are provided on the PCB board 1 within the area enclosed by each compartment 210. Two wire clips 4 are arranged in each compartment 210 and are respectively soldered to the two signal pads 110. The wire clips 4 are made of metal. After the protective layer (insulating medium) of the two signal lines 510 of each high-speed cable 5 is stripped, they are horizontally soldered to the two wire clips 4 in one compartment 210 of the base 2. The high-speed cable 5 is located between the upper cover 3 and the base 2. The upper cover 3, the base 2, the exposed ground wire 520 in the high-speed cable 5, and the exposed copper / aluminum foil 530 in the high-speed cable 5 are soldered together by laser welding. Since the base 2 is grounded, when the ground wire 520 is soldered to the base 2, the ground wire 520 in the high-speed cable 5 is also grounded.

[0046] Example 2

[0047] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6As shown, this embodiment is a further improvement on embodiment 1, as detailed below:

[0048] The rear end of the line card 4 has a U-shaped slot 410. After the protective layer of the signal line 510 is peeled off, it enters the U-shaped slot 410 horizontally and is soldered to the line card 4. The soldering method can be resistance welding. Since the cross-section of the signal line 510 is circular, the U-shaped slot 410 can better fit the outer circumference of the signal line 510, so that the signal line 510 can make effective contact with the line card 4 and avoid signal distortion.

[0049] Furthermore: Line card 4 is preferably a Z-shaped structure, and the length of the horizontally distributed pin segment at the front end of line card 4 is greater than the length of the signal pad 110. In this embodiment, line card 4 is designed as a Z-shaped structure, and the length of the horizontally distributed pin segment at the front end of line card 4 is greater than the length of the signal pad 110, so that the pin segment can act as an elastic buffer area to prevent excessive stress after soldering to the signal pad 110 on PCB board 1. It can be understood that the longer the pin segment, the more flexible line card 4 is, and the soldering can be slightly deformed. The shorter the pin segment, the less flexible it is. If there are tolerance reasons, the gap between line card 4 and signal pad 110 will be too large, which may lead to the risk of forming a cold solder joint. Under normal circumstances, the length of the horizontally distributed pin segment at the front end of line card 4 is preferably about twice the length of the signal pad 110.

[0050] Example 3

[0051] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below:

[0052] A limiting hole is provided between the base 2 and the top cover 3 at each corresponding compartment 210. The end of the high-speed cable 5 enters the limiting hole and after the protective layer of the two signal lines 510 is stripped, it is horizontally welded to the two wire clips 4 in the compartment 210 corresponding to the limiting hole. The limiting hole limits the high-speed cable 5, effectively reducing the risk of the high-speed cable 5 loosening (usually referring to rotation). The cross-sectional size of the limiting hole is determined according to the cross-sectional size of the high-speed cable 5 with the protective sleeve, and the two are usually consistent.

[0053] Example 4

[0054] like Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, this embodiment is a further improvement on embodiment 3, as detailed below:

[0055] The base 2 has a limiting surface 221 in each limiting hole to limit the end face of the protective sleeve of the high-speed cable 5. The exposed ground wire 520 end face of the high-speed cable 5 abuts against the limiting surface 221. The copper / aluminum foil 530 of the protective sleeve of the high-speed cable 5 in the limiting hole is exposed. The top cover 3 has a soldering hole 310 between two adjacent high-speed cables 5 at the corresponding exposed ground wire 520 and copper / aluminum foil 530 of each high-speed cable 5. Solder paste can be added through the soldering hole 310. The solder paste can be melted into liquid by laser welding and then flows through the top cover 3, the base 2, the exposed ground wire 520 and the exposed copper / aluminum foil 530 of the high-speed cable 5, and then solidifies, thereby making the top cover 3, the base 2, the exposed ground wire 520 and the exposed copper / aluminum foil 530 of the high-speed cable 5 fuse together as one.

[0056] Furthermore, the base 2 has a groove 230 below each soldering hole 310, corresponding to the exposed ground wire 520 and copper / aluminum foil 530, which communicates with two adjacent limiting holes. When solder paste is added to the soldering hole 310 and melts into a liquid state, the liquid solder paste can flow into the limiting hole through the groove 230, and first flow through the exposed ground wire 520 of the high-speed cable 5 below the soldering hole 310 to the exposed copper / aluminum foil 530 of the high-speed cable 5, and then flow to the exposed ground wire 520 on the other side of the high-speed cable 5, and then solidify, thereby making the top cover 3, the base 2, the exposed ground wire 520 in the high-speed cable 5 and the exposed copper / aluminum foil 530 in the high-speed cable 5 fused together as one.

[0057] Example 5

[0058] like Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, this embodiment is a further improvement on embodiment 2, 3, or 4, as detailed below:

[0059] On the surface of the PCB board 1 on the back of the base 2, there is a first limiting groove 220 on each corresponding compartment 210, with one end communicating with the compartment 210 and the other end passing through the side of the base 2. On the surface of the top cover 3 adjacent to the PCB board 1, there is a second limiting groove 320 on each corresponding first limiting groove 220. The first limiting groove 220 on the base 2 and the second limiting groove 320 on the top cover 3 together form a limiting hole, which can be formed by assembly, reducing the processing difficulty.

[0060] Example 6

[0061] like Figure 2 , Figure 3 , Figure 4 , Figure 5As shown, this embodiment is a further improvement on any one of embodiments 1 to 5, as detailed below:

[0062] The base 2 has a through groove 240 on the surface adjacent to the PCB board 1 that connects all the compartments 210. An insulating component 6 that passes through all the compartments 210 is arranged in the through groove 240. The insulating component 6 is pressed onto the PCB board 1 by the base 2. The middle section of the wire clip 4 is fixed to the insulating component 6. During assembly, the insulating component 6 with the wire clip 4 fixed is first placed on the PCB board 1, and then the base 2 is used to press the insulating component 6. By introducing the insulating component 6, the wire clip 4 is soldered to the signal pad 110 on the PCB board 1 to prevent the wire clip 4 from being pulled off.

[0063] Furthermore, the insulating component 6 is made of plastic, while the wire clip 4 and the insulating component 6 are integrally molded by injection molding, which reduces the processing difficulty and ensures the firmness of the assembly between the wire clip 4 and the insulating component 6.

[0064] Example 7

[0065] like Figure 1 , Figure 5 , Figure 6 , Figure 7 As shown, this embodiment is a further improvement on any one of embodiments 1 to 6, as detailed below:

[0066] The PCB board 1 has multiple grounding pads 120 at different locations. Each base 2 is soldered to one of the grounding pads 120 on the PCB board 1 to facilitate grounding of the base 2. Since the base 2 is made of metal, the top cover 3 is also made of metal. The top cover 3 is preferably made of copper-plated tin, and the base 2 is preferably made of copper-plated tin. Of course, in actual application, the use of other materials is not excluded.

[0067] The top cover 3 has a ramp 330 on the side away from the high-speed cable 5. When a PCB board 1 has multiple adjacent bases 2 along its length on the same side, the ramp 330 on the top cover 3 facilitates the high-speed cable 5 in another base 2 in front of it to pass over it, reducing the bending angle of the high-speed cable 5.

[0068] Example 8

[0069] An optical module includes a high-speed cable adapter laser welding fixing structure as described in any one of embodiments 1 to 7.

[0070] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A high-speed cable adapter laser welding fixing structure, characterized in that, include: A PCB board (1) is provided with at least one grounded base (2) fixed along its length. Each base (2) is provided with a top cover (3). The base (2) has multiple rows of independent compartments (210) in the covered area of ​​the top cover (3). The PCB board (1) has two signal pads (110) in the area enclosed by each compartment (210). Each compartment (210) has two wire clips (4) that are respectively soldered to the two signal pads (110). After the protective layer is peeled off, the two signal lines (510) of each high-speed cable (5) are horizontally soldered to the two wire clips (4) in one of the compartments (210) on the base (2). The top cover (3), the base (2), the exposed ground wire (520) in the high-speed cable (5) and the exposed copper / aluminum foil (530) in the high-speed cable (5) are soldered together by laser welding.

2. The high-speed cable adapter laser welding fixing structure according to claim 1, characterized in that, The line card (4) has a U-shaped slot (410) at its rear end. After the protective layer is peeled off, the signal line (510) enters the U-shaped slot (410) horizontally and is welded to the line card (4).

3. A high-speed cable adapter laser welding fixing structure according to claim 1 or 2, characterized in that, The line card (4) has a Z-shaped structure, and the length of the horizontally distributed pin segment at the front end of the line card (4) is greater than the length of the signal pad (110).

4. The high-speed cable adapter laser welding fixing structure according to claim 1, characterized in that, The base (2) and the top cover (3) are provided with a limiting hole at each corresponding compartment (210). The end of the high-speed cable (5) enters the limiting hole and after the protective layer of the two signal lines (510) is peeled off, it is horizontally welded to the two wire clips (4) in the compartment (210) corresponding to the limiting hole.

5. The high-speed cable adapter laser welding fixing structure according to claim 4, characterized in that, The base (2) has a limiting surface (221) in each limiting hole to limit the end face of the protective sleeve of the high-speed cable (5). The exposed end face of the ground wire (520) in the high-speed cable (5) abuts against the limiting surface (221). The copper / aluminum foil (530) in the protective sleeve of the high-speed cable (5) in the limiting hole is exposed. The upper cover (3) has a soldering hole (310) between two adjacent high-speed cables (5) at the exposed ground wire (520) and copper / aluminum foil (530) of each high-speed cable (5). Solder paste is added into the soldering hole (310) and the solder paste is used to weld the upper cover (3), the base (2), the exposed ground wire (520) in the high-speed cable (5) and the exposed copper / aluminum foil (530) in the high-speed cable (5) into one piece by laser welding.

6. The high-speed cable adapter laser welding fixing structure according to claim 5, characterized in that, The base (2) has a groove (230) below each solder hole (310) at the corresponding exposed ground wire (520) and copper / aluminum foil (530) that communicates with two adjacent limiting holes.

7. A high-speed cable adapter laser welding fixing structure according to any one of claims 3 to 6, characterized in that, On the surface of the PCB board (1) on the back of the base (2), there is a first limiting groove (220) at each corresponding compartment (210), one end of which is connected to the compartment (210) and the other end of which passes through the side of the base (2). On the surface of the upper cover (3) near the PCB board (1), there is a second limiting groove (320) at each corresponding first limiting groove (220). The first limiting groove (220) on the base (2) and the second limiting groove (320) on the upper cover (3) together form a limiting hole.

8. The high-speed cable adapter laser welding fixing structure according to claim 1, characterized in that, The base (2) has a through groove (240) on the surface near the PCB board (1) that connects all the compartments (210). An insulating member (6) that passes through all the compartments (210) is arranged in the through groove (240). The insulating member (6) is pressed onto the PCB board (1) by the base (2). The middle section of the wire clip (4) is fixed to the insulating member (6).

9. The high-speed cable adapter laser welding fixing structure according to claim 1, characterized in that, The PCB board (1) has multiple grounding pads (120) at different locations. Each base (2) is welded to one of the grounding pads (120) on the PCB board (1). The top cover (3) is made of tin-plated copper, and the base (2) is made of tin-plated copper.

10. An optical module, characterized in that, Including the high-speed cable adapter laser welding fixing structure as described in any one of claims 1 to 9.

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