Multimode laser assembly mounted based on COB technology

Abstract

The utility model discloses a multimode laser assembly mounted based on a COB technology, and the assembly comprises an electronic module assembly which is used for processing a first electric signal; the laser chip is connected to the electronic module assembly, receives the first electric signal and converts the first electric signal into an optical signal; the beam splitter is used for receiving the optical signal and splitting the optical signal into a first optical signal and a second optical signal; the adapter is used for receiving the first optical signal so as to transmit the first optical signal to the outside; the backlight detector chip is connected to the electronic module assembly and used for receiving the second optical signal and converting the second optical signal into a second electric signal so as to detect the power of the laser chip; according to the utility model, the required parts are fewer, the installation is convenient, and the cost is lower.

Description

Technical Field

[0001] This utility model belongs to the field of optoelectronic communication technology, specifically a multimode laser component based on COB process mounting. Background Technology

[0002] In the field of optoelectronic communication, multimode laser assemblies, also known as multimode TOSAs, mainly consist of the following components: a TO base, a spacer, a laser chip (currently usually a VECSEL chip), a backlight detector chip, a TO cap (usually a slanted window TO cap, but some are flat window TO caps), an adapter, and a flexible strip. The TO base, spacer, laser chip, backlight detector chip, and TO cap are typically first packaged into a single unit called a TO-Can. The TO-Can is then assembled with the adapter using adhesive or soldering processes to form a detector assembly, and a flexible strip is usually soldered on afterward. The optical transmission function is achieved through the following steps: the electrical signal to be transmitted is first converted into an optical signal by the laser chip, then passes through the TO cap, and partially reflects onto the backlight detector chip for intensity feedback. The remaining signal light is focused by a lens on the adapter onto the multimode optical fiber in its optical port for signal transmission.

[0003] The relevant documents also disclose a surface-emitting coaxial laser assembly, including a TO base, a laser chip, a backlight detector chip, a TO cap, and a through-hole adapter. The TO cap includes a cap body, a glass ball is processed in the middle of the front end of the cap body, and a beam splitter is fixed inside the cap body.

[0004] Both of the aforementioned multimode laser components have complex structures and high production costs. Utility Model Content

[0005] The purpose of this invention is to provide a multimode laser assembly based on COB process mounting to solve at least one of the above-mentioned technical problems.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] A multimode laser assembly based on COB (Chip-on-Board) mounting technology includes:

[0008] Electronic module assembly for first electrical signal processing;

[0009] The laser chip connected to the electronic module assembly receives the first electrical signal and converts the first electrical signal into an optical signal;

[0010] A beam splitter receives the optical signal and splits the optical signal into a first optical signal and a second optical signal.

[0011] The adapter receives the first optical signal and transmits it to the outside.

[0012] A backlight detector chip connected to the electronic module assembly receives the second optical signal and converts the second optical signal into a second electrical signal to detect the power of the laser chip.

[0013] This invention uses an electronic module component to transmit a first electrical signal to a laser chip, which then converts the first electrical signal into an optical signal and emits it onto a beam splitter. The beam splitter divides the optical signal into a first optical signal and a second optical signal. The first optical signal is transmitted to the outside via an adapter, and the second optical signal is received by a backlight detector chip to detect the power of the optical signal emitted by the laser chip, i.e., to detect the intensity of the optical signal emitted by the laser chip. Compared with the prior art, this invention requires fewer components, is easier to install, and has a lower cost.

[0014] Furthermore, the electronic module assembly includes a circuit board and a processing circuit disposed on the circuit board. The processing circuit is electrically connected to both the laser chip and the backlight detector chip to process the first electrical signal and the second electrical signal. The circuit board is used to house the processing circuit, which is used to transmit the first electrical signal to the laser chip and to receive and process the second electrical signal generated by the backlight detector chip.

[0015] Furthermore, both the laser chip and the backlight detector chip are mounted on the surface of the circuit board. The circuit board is used to install the laser chip and the backlight detector chip. The laser chip and the backlight detector chip are fixed to the circuit board by mounting. This fixing method is simple and low in cost.

[0016] Furthermore, the circuit board is provided with a plurality of pads, which are electrically connected to the processing circuit. The laser chip and the backlight detector chip are both electrically connected to their corresponding pads. The pads are used to realize the electrical connection between the laser chip and the backlight detector chip and the processing circuit.

[0017] Furthermore, the laser chip, the backlight detector chip, and the plurality of pads are all disposed on the same side of the circuit board, facilitating the electrical connection between the laser chip and the backlight detector chip and the pads.

[0018] Furthermore, the adapter is mounted on the surface of the circuit board and forms a sealed cavity between the adapter and the circuit board. The laser chip and the backlight detector chip are both located in the cavity. The adapter is fixed to the circuit board by mounting, which is simple and low-cost. The cavity forms a sealed space to install the laser chip and the backlight detector chip, avoiding interference from external stray light.

[0019] Specifically, the adapter includes a square top cover and an adapter head disposed on one side of the square top cover. The square top cover is attached to the surface of the circuit board to form the receiving cavity. A reflective surface is formed on the square top cover to reflect the first optical signal to the adapter head. An optical fiber interface is disposed on the side of the adapter head away from the square top cover to transmit the first optical signal received by the adapter head to the outside. The receiving cavity is formed by the square top cover.

[0020] Furthermore, the beam splitter is disposed on the inner surface of the square top cover, which facilitates receiving the light signal emitted by the laser chip, facilitating the transmission of the first light signal to the reflective surface, and facilitating the transmission of the second light signal to the backlight detector chip.

[0021] Specifically, the laser chip is a VECSEL chip. When the VECSEL chip is mounted on the circuit board, it can emit light signals perpendicular to the circuit board and directly direct them to the beam splitter, resulting in a simple light signal transmission path.

[0022] Specifically, the laser chip can also be an FP chip. The electronic module assembly is provided with a 45-degree full-reflection filter to guide the optical signal emitted by the FP chip to the beam splitter. When the FP chip is mounted on the circuit board, the optical signal emitted by the FP chip is parallel to the circuit board. By providing a 45-degree full-reflection filter on the circuit board of the electronic module assembly, the transmission path of the optical signal is changed, so that the path of the optical signal changes from parallel to the circuit board to perpendicular to the circuit board, thereby guiding the optical signal to the beam splitter.

[0023] Compared with the prior art, the beneficial effects of this utility model are:

[0024] (1) The present invention uses an electronic module component to transmit a first electrical signal to a laser chip, which then converts the first electrical signal into an optical signal and emits it onto a beam splitter. The beam splitter divides the optical signal into a first optical signal and a second optical signal. The first optical signal is transmitted to the outside through an adapter, and the second optical signal is received by a backlight detector chip to detect the power of the optical signal emitted by the laser chip, that is, to detect the intensity of the optical signal emitted by the laser chip. Compared with the prior art, the present invention requires fewer parts, is easier to install, and has a lower cost.

[0025] (2) This utility model can be designed according to different laser chips and is applicable to multimode laser components of various rates. Attached Figure Description

[0026] Figure 1 This is a cross-sectional view of a multimode laser assembly based on COB process mounting in this embodiment.

[0027] Figure 2 This is a top view of a multimode laser assembly based on COB process mounting in this embodiment.

[0028] Figure 3 This is a diagram showing the positional relationship between the VECSEL chip and the backlight detector chip in this embodiment;

[0029] Figure 4 This is a schematic diagram of the solder pads on the flexible section of the rigid-flex PCB in this embodiment;

[0030] Figure 5 This is a diagram showing the positional relationship between the FP chip and the backlight detector chip in this embodiment;

[0031] In the diagram: 1. Electronic module assembly; 101. Circuit board; 102. Processing circuit; 103. Solder pad; 2. Laser chip; 3. Beam splitter; 4. Adapter; 401. Square top cover; 402. Adapter head; 403. Reflective surface; 404. Fiber optic interface; 5. Backlight detector chip; 6. Receiving cavity; 7. 45-degree full-reflection filter. Detailed Implementation

[0032] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0033] like Figure 1 and Figure 2 As shown, this embodiment provides a multimode laser assembly based on COB process mounting, including: electronic module assembly 1, laser chip 2, beam splitter 3, adapter 4, and backlight detector chip 5.

[0034] Electronic module component 1 is used for the first electrical signal processing.

[0035] The laser chip 2 is connected to the electronic module component 1 and is used to receive the first electrical signal and convert the first electrical signal into an optical signal.

[0036] The beam splitter 3 is used to receive optical signals and split the optical signals into a first optical signal and a second optical signal.

[0037] Adapter 4 is used to receive the first optical signal so as to transmit the first optical signal to the outside.

[0038] The backlight detector chip 5 is connected to the electronic module assembly 1 to receive the second optical signal and convert it into a second electrical signal to detect the power of the laser chip 2.

[0039] Specifically, the electronic module assembly 1 includes a circuit board 101 and a processing circuit 102 disposed on the circuit board 101. The processing circuit 102 is electrically connected to both the laser chip 2 and the backlight detector chip 5 to process the first electrical signal and the second electrical signal.

[0040] In this embodiment, as Figure 1 , Figure 2 and Figure 4 As shown, circuit board 101 is a rigid-flex PCB.

[0041] In this embodiment, both the laser chip 2 and the backlight detector chip 5 are mounted on the surface of the circuit board 101.

[0042] Furthermore, the circuit board 101 is provided with several pads 103, which are electrically connected to the processing circuit 102. The laser chip 2 and the backlight detector chip 5 are both electrically connected to their corresponding pads 103.

[0043] In this embodiment, both the laser chip 2 and the backlight detector chip 5 are electrically connected to their corresponding pads 103 by wire bonding. That is, the laser chip 2 is bonded to its corresponding pads 103 by wire bonding, and the backlight detector chip 5 is bonded to its corresponding pads 103 by wire bonding. The wires can be gold wires, aluminum wires, or copper wires.

[0044] In this embodiment, the laser chip 2 and the backlight detector chip 5 can be mounted on the surface of the circuit board 101 using COB technology. COB technology is an existing technology and will not be described in detail in this embodiment.

[0045] Furthermore, the laser chip 2, the backlight detector chip 5, and several pads 103 are all located on the same side of the circuit board 101, which facilitates the electrical connection of the laser chip 2 and the backlight detector chip 5 with their corresponding pads 103.

[0046] Furthermore, the adapter 4 is attached to the surface of the circuit board 101 and forms a sealed receiving cavity 6 between the adapter 4 and the circuit board 101. The laser chip 2 and the backlight detector chip 5 are both located in the receiving cavity 6.

[0047] Specifically, the adapter 4 includes a square top cover 401 and an adapter head 402 disposed on one side of the square top cover 401. The square top cover 401 is attached to the surface of the circuit board 101 to form a receiving cavity 6. A reflective surface 403 is formed on the square top cover 401 to reflect the first optical signal to the adapter head 402. An optical fiber interface 404 is disposed on the side of the adapter head 402 away from the square top cover 401. An optical fiber can be connected to the optical fiber interface 404 to transmit the first optical signal received by the adapter head 402 to the outside.

[0048] In this embodiment, the adapter 4 can be mounted using active coupling, that is, powering on the laser chip 2 (giving the laser chip 2 a specified bias current), and judging whether the position of the adapter 4 is appropriate by monitoring the magnitude of the light received by the optical fiber in the optical fiber interface 404, and fixing the adapter 4 at the position with the greatest light intensity.

[0049] Furthermore, the beam splitter 3 is disposed on the inner surface of the square top cover 401.

[0050] Specifically, such as Figure 3 As shown, laser chip 2 is a VECSEL chip. The VECSEL chip can emit light perpendicular to the circuit board 101 and can directly hit the beam splitter 3.

[0051] As another preferred embodiment of this solution, such as Figure 5 As shown, the laser chip 2 can also be an FP chip. In this case, a 45-degree full-reflection filter 7 needs to be set on the electronic module assembly 1 to guide the light signal emitted by the FP chip to the beam splitter 3. Specifically, the 45-degree full-reflection filter 7 is set on the circuit board 101 so that the light emitted by the FP chip can be guided to the beam splitter 3.

[0052] Working principle: The first electrical signal is received by the laser chip 2 and converted into an optical signal. The optical signal is emitted onto the beam splitter 3 and split into a first optical signal and a second optical signal. The first optical signal is emitted onto the reflective surface 403 and is guided to the optical fiber interface 404 of the adapter head 402. After the optical fiber is inserted into the optical fiber interface 404, the first optical signal can enter the optical fiber through the optical fiber interface 404 and be transmitted to the outside. The second optical signal is received by the backlight detector chip 5 set on the circuit board 101. The backlight detector chip 5 converts the received second optical signal into a second electrical signal, thereby detecting the intensity of the optical signal emitted by the laser chip 2.

[0053] It should be noted that although the present invention has been disclosed above with specific embodiments, the above embodiments are not intended to limit the present invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the claims.

Claims

1. A multimode laser assembly based on COB (Chip-on-Board) mounting process, characterized in that, include: Electronic module assembly for first electrical signal processing; The laser chip connected to the electronic module assembly receives the first electrical signal and converts the first electrical signal into an optical signal; A beam splitter receives the optical signal and splits the optical signal into a first optical signal and a second optical signal. The adapter receives the first optical signal and transmits it to the outside. A backlight detector chip connected to the electronic module assembly receives the second optical signal and converts the second optical signal into a second electrical signal to detect the power of the laser chip.

2. A multimode laser assembly based on COB process mounting as described in claim 1, characterized in that, The electronic module assembly includes a circuit board and a processing circuit disposed on the circuit board. The processing circuit is electrically connected to both the laser chip and the backlight detector chip to process the first electrical signal and the second electrical signal. The circuit board is a rigid-flex PCB.

3. A multimode laser assembly based on COB process mounting as described in claim 2, characterized in that, Both the laser chip and the backlight detector chip are mounted on the surface of the circuit board.

4. A multimode laser assembly based on COB process mounting as described in claim 2, characterized in that, The circuit board has several pads, which are electrically connected to the processing circuit. The laser chip and the backlight detector chip are both electrically connected to their corresponding pads.

5. A multimode laser assembly based on COB process mounting as described in claim 4, characterized in that, The laser chip, the backlight detector chip, and the several pads are all located on the same side of the circuit board.

6. A multimode laser assembly based on COB process mounting as described in claim 2, characterized in that, The adapter is mounted on the surface of the circuit board and forms a sealed cavity between itself and the circuit board. The laser chip and the backlight detector chip are both located within the cavity.

7. A multimode laser assembly based on COB process mounting as described in claim 6, characterized in that, The adapter includes a square top cover and an adapter head disposed on one side of the square top cover. The square top cover is attached to the surface of the circuit board to form the receiving cavity. A reflective surface is formed on the square top cover to reflect the first optical signal to the adapter head. An optical fiber interface is provided on the side of the adapter head away from the square top cover to transmit the first optical signal received by the adapter head to the outside.

8. A multimode laser assembly based on COB process mounting as described in claim 7, characterized in that, The beam splitter is located on the inner surface of the square top cover.

9. A multimode laser assembly based on COB process mounting as described in claim 1, characterized in that, The laser chip is a VECSEL chip.

10. A multimode laser assembly based on COB process mounting as described in claim 1, characterized in that, The laser chip is an FP chip, and the electronic module assembly is provided with a 45-degree full-reflection filter to guide the optical signal emitted by the FP chip to the beam splitter.

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