Frequency converter

Abstract

The embodiment of the utility model relates to the field of frequency converters, and provides a frequency converter, which comprises a shell in which electronic components are arranged; the liquid cooling plate is fixed on the outer surface of the shell; and the rectification and inversion assembly is fixed between the liquid cooling plate and the shell. The reliability of the frequency converter can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of frequency converters, and particularly to a frequency converter. Background Technology

[0002] A variable-frequency drive (VFD) is a power control device that uses frequency conversion technology and microelectronics to control an AC motor by changing the frequency of the motor's power supply.

[0003] A frequency converter mainly consists of rectification (AC to DC), filtering, inversion (DC to AC), braking unit, drive unit, detection unit, and microprocessor unit. The frequency converter adjusts the output voltage and frequency by switching its internal IGBTs, providing the required power voltage according to the actual needs of the motor, thereby achieving energy saving and speed regulation. In addition, the frequency converter has many protection functions, such as overcurrent, overvoltage, and overload protection. With the continuous improvement of industrial automation, frequency converters have been widely used.

[0004] It is currently necessary to improve the reliability of frequency converters. Utility Model Content

[0005] This disclosure provides an inverter that can at least improve the reliability of the inverter.

[0006] According to some embodiments of this disclosure, one aspect of this disclosure provides a frequency converter, including: a housing, wherein electronic components are disposed within the housing; a liquid cooling plate, wherein the liquid cooling plate is fixed to the outer surface of the housing; and a rectifier-inverter assembly, wherein the rectifier-inverter assembly is fixed between the liquid cooling plate and the housing.

[0007] In some embodiments, the liquid cooling plate includes a first liquid cooling plate and a second liquid cooling plate spaced apart along a first direction, and the rectifier-inverter assembly includes a rectifier unit and an inverter unit. The rectifier unit is fixed on the surface of the first liquid cooling plate facing the housing, and the inverter unit is fixed on the surface of the second liquid cooling plate facing the housing.

[0008] In some embodiments, the distance between the first liquid cooling plate and the housing is smaller than the distance between the second liquid cooling plate and the housing.

[0009] In some embodiments, the inverter further includes a water guide bracket located between the first liquid cooling plate and the second liquid cooling plate. The water guide bracket is fixed to the outer surface of the housing, and the distance between the side of the water guide bracket away from the housing and the housing is greater than the distance between the side of the rectifier-inverter assembly away from the housing and the housing, but less than the distance between the side of the first liquid cooling plate away from the housing and the housing.

[0010] In some embodiments, the inverter further includes: a first bracket, the first bracket being fixed to the outer surface of the housing and located between the first liquid cooling plate and the second liquid cooling plate, wherein the distance between the side of the first bracket away from the housing and the housing is greater than the distance between the side of the second liquid cooling plate away from the housing and the housing.

[0011] In some embodiments, the inverter further includes at least two second supports located on opposite sides of the liquid cooling plate along a first direction, wherein the distance between the side of the second support away from the housing and the housing is greater than the distance between the side of the liquid cooling plate away from the housing and the housing.

[0012] In some embodiments, the inverter further includes: a first insulation cotton covering the side of the liquid cooling plate facing the housing, and the first insulation cotton having a plurality of grooves facing the rectifier-inverter assembly.

[0013] In some embodiments, the inverter further includes a second insulation material covering the side surface of the liquid cooling plate away from the housing.

[0014] In some embodiments, the frequency converter further includes: an air-cooling device located inside the housing, the housing having an air inlet facing the air-cooling device and an air outlet located at the top of the housing.

[0015] In some embodiments, the gap between the liquid cooling plate and the housing is 5 to 10 mm.

[0016] The technical solution provided in this disclosure has at least the following advantages: In a frequency converter, the rectifier-inverter assembly is usually the component that generates the most heat. For a frequency converter with a liquid cooling plate, the part of the liquid cooling plate that contacts the rectifier-inverter assembly usually forms water vapor due to the excessive heat generated by the rectifier-inverter assembly. The water vapor will have a significant impact on the electronic components inside the frequency converter. Therefore, this application places the liquid cooling plate outside the frequency converter housing and places the rectifier-inverter assembly between the liquid cooling plate and the housing. This ensures the cooling effect of the rectifier-inverter assembly and avoids the generation of condensate inside the housing, thereby improving the reliability of the frequency converter. Attached Figure Description

[0017] One or more embodiments are illustrated by way of example with corresponding pictures in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Unless otherwise stated, the pictures in the accompanying drawings do not constitute a limitation on scale. In order to more clearly illustrate the technical solutions in the embodiments of this disclosure or the conventional technology, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a frequency converter provided in an embodiment of the present disclosure;

[0019] Figure 2 A partial exploded view of a frequency converter provided in one embodiment of this disclosure;

[0020] Figure 3 A partial structural schematic diagram of a frequency converter provided in an embodiment of this disclosure;

[0021] Figure 4 This is a schematic diagram of the inverter provided in one embodiment of the present disclosure from another perspective. Detailed Implementation

[0022] As the background technology shows, currently commonly used frequency converter units are generally air-cooled. During operation, the rectifier module, capacitors, inverter module, copper busbars, etc., inside the unit generate a lot of heat. This heat is difficult to dissipate in large quantities by fans, thus affecting the stability and lifespan of the internal components. Therefore, liquid cooling can solve the heat dissipation problem of high-power frequency converters and is a new technological direction. However, installing the liquid cooling plate inside the housing can cause condensation to form inside the housing, which can affect the internal electronic components and cause short circuits.

[0023] This disclosure provides a frequency converter that, by placing a liquid cooling plate outside the inverter housing and placing the rectifier-inverter assembly between the liquid cooling plate and the housing, ensures the cooling effect of the rectifier-inverter assembly while preventing condensation from forming inside the housing, thereby improving the reliability of the frequency converter.

[0024] In the description of the embodiments of this disclosure, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary or secondary relationship of the indicated technical features. In the description of the embodiments of this disclosure, "a plurality of" means two or more, unless otherwise explicitly defined.

[0025] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this disclosure. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0026] In the description of the embodiments of this disclosure, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0027] In the description of the embodiments of this disclosure, the term "multiple" refers to two or more (including two), similarly, "multiple groups" refers to two or more (including two groups), and "multiple pieces" refers to two or more (including two pieces).

[0028] In the description of the embodiments of this disclosure, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this disclosure.

[0029] In the description of the embodiments of this disclosure, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0030] In the accompanying drawings corresponding to the embodiments of this disclosure, the thickness and area of ​​the layers are enlarged for better understanding and ease of description. When describing a component (such as a layer, film, region, or substrate) on or on the surface of another component, the component may be "directly" located on the surface of the other component, or there may be a third component between the two components. Conversely, when describing a component on the surface of another component, or when another component is formed or disposed on the surface of a component, it indicates that there is no third component between the two components. Furthermore, when describing a component as being "generally" formed on another component, it means that the component is not formed on the entire surface (or front surface) of the other component, nor is it formed on a portion of the edge of the entire surface.

[0031] In the description of embodiments of this disclosure, when a component "includes" another component, other components are not excluded unless otherwise stated, and may be further included. Furthermore, when a component such as a layer, film, region, or plate is referred to as being "on / located" on another component, it can be "directly" on the other component (i.e., located on the surface of the other component with no other components between them), or another component may be present therein. Additionally, when a component such as a layer, film, region, or plate is "directly located" on another component, or when a component such as a layer, film, region, or plate is located on the surface of another component, it indicates that no other components are located therein.

[0032] The terminology used in the description of the various embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the description of the various embodiments and the appended claims, the term "component" is also intended to include the plural form unless the context clearly indicates otherwise. Components include layers, films, regions, or plates, etc.

[0033] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this disclosure to facilitate a better understanding of the disclosure. However, the technical solutions claimed in this disclosure can be implemented even without these technical details and various variations and modifications based on the following embodiments.

[0034] refer to Figures 1 to 4 , Figure 1 This is a schematic diagram of a frequency converter provided in one embodiment of the present disclosure. Figure 2 A partial exploded view of a frequency converter provided in one embodiment of this disclosure; Figure 3 A partial structural schematic diagram of a frequency converter provided in an embodiment of this disclosure; Figure 4 This is a schematic diagram of the inverter provided in one embodiment of the present disclosure from another perspective.

[0035] In some embodiments, the frequency converter may include a housing 100, within which electronic components are disposed.

[0036] The frequency converter may also include a liquid cooling plate 101, which is fixed to the outer surface of the housing 100.

[0037] The frequency converter may also include: a rectifier-inverter assembly 102, which is fixed between the liquid cooling plate 101 and the housing 100.

[0038] This disclosure provides a frequency converter. By placing a liquid cooling plate 101 outside the inverter housing 100 and placing a rectifier-inverter assembly 102 between the liquid cooling plate 101 and the housing 100, the cooling effect of the rectifier-inverter assembly 102 is ensured, and the generation of condensate inside the housing 100 is avoided, thereby improving the reliability of the frequency converter.

[0039] refer to Figure 2 In some embodiments, the liquid cooling plate 101 includes a first liquid cooling plate 111 and a second liquid cooling plate 121 arranged at intervals along a first direction. The rectifier-inverter assembly 102 includes a rectifier unit 112 and an inverter unit 122. The rectifier unit 112 is fixed to the surface of the first liquid cooling plate 111 facing the housing 100, and the inverter unit 122 is fixed to the surface of the second liquid cooling plate 121 facing the housing 100. For inverters with higher power, the rectifier-inverter assembly 102 is divided into a rectifier unit 112 and an inverter unit 122. Correspondingly, by setting the first liquid cooling plate 111 and the second liquid cooling plate 121, the first liquid cooling plate 111 is used to cool the rectifier unit 112, and the second liquid cooling plate 121 is used to cool the inverter unit 122, thereby satisfying the cooling requirements of the rectifier-inverter assembly 102.

[0040] In other embodiments, the liquid cooling plate 101 may also be a single piece, and the entire rectifier-inverter assembly 102 may be fixed on the surface of the liquid cooling plate 101 facing the housing 100, thereby completing the cooling of the rectifier-inverter assembly 102.

[0041] In some embodiments, the distance between the first liquid cooling plate 111 and the housing 100 is smaller than the distance between the second liquid cooling plate 121 and the housing 100. It is understood that, due to gravity, condensate generated on the first liquid cooling plate 111 will drip towards the second liquid cooling plate 121. Therefore, setting the distance between the first liquid cooling plate 111 and the housing 100 to be smaller than the distance between the second liquid cooling plate 121 and the housing 100 prevents condensate from dripping directly onto the inverter unit 122, thereby preventing condensate from affecting the reliability of the inverter unit 122.

[0042] In some embodiments, the inverter further includes a water guide bracket 103, which is located between the first liquid cooling plate 111 and the second liquid cooling plate 121. The water guide bracket 103 is fixed to the outer surface of the housing 100, and the distance between the side of the water guide bracket 103 away from the housing 100 and the housing 100 is greater than the distance between the side of the rectifier-inverter assembly 102 away from the housing 100 and the housing 100, but less than the distance between the side of the first liquid cooling plate 111 away from the housing 100 and the housing 100. In other words, the length of the water guide bracket 103 protruding from the housing 100 is greater than the distance between the side of the rectifier-inverter assembly 102 away from the housing 100 and the housing 100. This allows the water guide bracket 103 to collect all the condensate generated on the first liquid cooling plate 111 and then discharge the condensate outside the inverter, thus preventing the condensate from dripping directly onto the inverter unit 122 and affecting its reliability. At the same time, the distance between the side of the water guide bracket 103 away from the housing 100 and the housing 100 is also less than the distance between the side of the first liquid cooling plate 111 away from the housing 100 and the housing 100, which also prevents the water guide bracket 103 from affecting the installation and transportation of the inverter.

[0043] In some embodiments, one end of the water guide bracket 103 is fixed to the outer surface of the housing 100, and the other end extends toward the first liquid cooling plate 111. This makes the angle between the water guide bracket 103 and the outer surface of the housing 100 acute, thereby playing the role of water storage and backflow, thus preventing condensate from sliding directly from the water guide bracket 103 onto the surface of the inverter unit 122.

[0044] In some embodiments, the inverter further includes a first bracket (not shown), which is fixed to the outer surface of the housing 100 and located between the first liquid cooling plate 111 and the second liquid cooling plate 121. The distance between the side of the first bracket away from the housing 100 and the housing 100 is greater than the distance between the side of the second liquid cooling plate 121 away from the housing 100 and the housing 100. The first bracket also serves to prevent condensate from sliding onto the surface of the inverter unit 122. When condensate drips from the surface of the first liquid cooling plate 111, it will drip down the first bracket. Since the distance between the side of the first bracket away from the housing 100 and the housing 100 is greater than the distance between the side of the first bracket away from the housing 100 and the housing 100, the condensate can bypass the second liquid cooling plate 121, thereby preventing condensate from affecting the reliability of the inverter unit 122 and improving the reliability of the inverter.

[0045] In some embodiments, the frequency converter further includes at least two second supports 104, which are located on opposite sides of the liquid cooling plate 101 along a first direction, and the distance between the side of the second support 104 away from the housing 100 and the housing 100 is greater than the distance between the side of the liquid cooling plate 101 away from the housing 100 and the housing 100. By providing the second supports 104, the liquid cooling plate 101 can be isolated from other objects during transportation or installation of the frequency converter, thereby avoiding damage to the liquid cooling plate 101 caused by contact and friction with other objects, and thus further improving the reliability of the frequency converter.

[0046] refer to Figure 3 In some embodiments, the inverter further includes a first insulation cotton 105, which covers the side of the liquid cooling plate 101 facing the housing 100, and has multiple grooves 115 that face the rectifier-inverter assembly 102. By providing the first insulation cotton 105, the liquid cooling plate 101 and the rectifier-inverter assembly 102 can be insulated, thereby reducing the formation of condensate on the liquid cooling plate 101. Moreover, the multiple grooves 115 on the first insulation cotton 105 can prevent the first insulation cotton 105 from affecting the installation of the rectifier-inverter assembly 102, thereby improving the reliability of the inverter while avoiding affecting the assembly of the inverter.

[0047] refer to Figure 2 In some embodiments, the inverter further includes a second insulation cotton 106, which covers the surface of the liquid cooling plate 101 away from the housing 100. That is, the surface of the liquid cooling plate 101 away from the housing 100 is also covered with a second insulation cotton 106. On the one hand, this can also prevent the generation of condensate; on the other hand, when the liquid cooling plate 101 is subjected to external impact, the second insulation cotton 106 can also act as a buffer.

[0048] In some embodiments, the second insulation cotton 106 also covers the periphery of the liquid cooling plate 101 and the water inlet pipe and water blowing pipe communicating with the liquid cooling plate 101.

[0049] refer to Figure 4In some embodiments, the frequency converter further includes an air-cooling device 107, which is located inside the housing 100. The housing 100 has an air inlet facing the air-cooling device 107 and an air outlet located at the top of the housing 100. Although the rectifier-inverter assembly 102 generates the most heat in the frequency converter, other electronic components also generate a certain amount of heat. Therefore, the air-cooling device 107 is also provided inside the housing 100 to provide air cooling for other electronic components, thereby further improving the reliability of the frequency converter. Moreover, since hot air rises and cold air sinks, placing the air outlet at the top of the housing 100 also helps to dissipate heat inside the frequency converter.

[0050] In some embodiments, the gap between the liquid cooling plate 101 and the housing 100 is 5 to 10 mm, such as 6 mm, 7 mm, 8 mm, or 9 mm. If the gap between the liquid cooling plate 101 and the housing 100 is too small, it will cause difficulties in installing the rectifier inverter assembly 102 or cause installation interference. If the gap is too large, it will increase the overall size of the inverter, which is not conducive to the installation of the inverter. Therefore, setting the gap between the liquid cooling plate 101 and the housing 100 to 5 to 10 mm can improve the reliability of the inverter while avoiding negative impressions of the inverter, thereby improving the reliability of the inverter.

[0051] This disclosure provides a frequency converter. By placing a liquid cooling plate 101 outside the inverter housing 100 and placing a rectifier-inverter assembly 102 between the liquid cooling plate 101 and the housing 100, the cooling effect of the rectifier-inverter assembly 102 is ensured, and the generation of condensate inside the housing 100 is avoided, thereby improving the reliability of the frequency converter.

[0052] Those skilled in the art will understand that the above embodiments are specific examples of implementing this disclosure, and in practical applications, various changes in form and detail may be made without departing from the spirit and scope of the embodiments of this disclosure. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the embodiments of this disclosure; therefore, the scope of protection of the embodiments of this disclosure should be determined by the scope defined in the claims.

Claims

1. A frequency converter, characterized in that, include: A housing, wherein electronic components are disposed within the housing; A liquid cooling plate, which is fixed to the outer surface of the housing; A rectifier-inverter assembly, wherein the rectifier-inverter assembly is fixed between the liquid cooling plate and the housing.

2. The frequency converter according to claim 1, characterized in that, The liquid cooling plate includes a first liquid cooling plate and a second liquid cooling plate arranged at intervals along a first direction. The rectifier-inverter assembly includes a rectifier unit and an inverter unit. The rectifier unit is fixed on the surface of the first liquid cooling plate facing the housing, and the inverter unit is fixed on the surface of the second liquid cooling plate facing the housing.

3. The frequency converter according to claim 2, characterized in that, The distance between the first liquid cooling plate and the housing is smaller than the distance between the second liquid cooling plate and the housing.

4. The frequency converter according to claim 2, characterized in that, The inverter further includes a water guide bracket, which is located between the first liquid cooling plate and the second liquid cooling plate. The water guide bracket is fixed to the outer surface of the housing, and the distance between the side of the water guide bracket away from the housing and the housing is greater than the distance between the side of the rectifier-inverter assembly away from the housing and the housing, but less than the distance between the side of the first liquid cooling plate away from the housing and the housing.

5. The frequency converter according to claim 2, characterized in that, The inverter further includes: a first bracket, which is fixed to the outer surface of the housing and located between the first liquid cooling plate and the second liquid cooling plate, wherein the distance between the side of the first bracket away from the housing and the housing is greater than the distance between the side of the second liquid cooling plate away from the housing and the housing.

6. The frequency converter according to claim 1, characterized in that, The inverter further includes at least two second brackets, the second brackets being located on opposite sides of the liquid cooling plate along the first direction, and the distance between the side of the second bracket away from the housing and the housing is greater than the distance between the side of the liquid cooling plate away from the housing and the housing.

7. The frequency converter according to claim 1, characterized in that, The inverter further includes: a first insulation cotton covering the side of the liquid cooling plate facing the housing, and the first insulation cotton having multiple grooves facing the rectifier-inverter assembly.

8. The frequency converter according to claim 1 or 7, characterized in that, The inverter further includes a second insulation material, which covers the side of the liquid cooling plate away from the housing.

9. The frequency converter according to claim 1, characterized in that, The inverter further includes an air-cooling device located inside the housing. The housing has an air inlet facing the air-cooling device and an air outlet located at the top of the housing.

10. The frequency converter according to claim 1, characterized in that, The gap between the liquid cooling plate and the housing is 5-10 mm.

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