Circuit board heat dissipation structure of range hood

Abstract

According to the circuit board heat dissipation structure of the smoke exhaust ventilator, electronic components on the circuit board generate heat in the working process, the heat generated by the electronic components is transmitted to the insulating layer through the mounting side of the circuit board, and the insulating layer allows the heat to be transmitted to the heat dissipation piece while ensuring the electrical safety. The heat dissipation piece evenly distributes heat and further transmits the heat to the surface of the shell by being attached to one side of the shell of the range hood. The range hood shell serves as a large-area heat dissipation medium, and heat is dissipated to the outside in an air convection or radiation mode. The heat is quickly transferred to the shell of the range hood through the heat dissipation piece, so that the working temperature of the circuit board and the electronic components is greatly reduced, and the stability and the reliability of equipment are improved. The arrangement of the insulating layer effectively prevents the electrical interference or short circuit risk between the circuit board and the heat dissipation piece, and guarantees the safety and durability of the heat dissipation structure.

Description

Technical Field

[0001] This application relates to the field of range hoods, and more particularly to a heat dissipation structure for a circuit board of a range hood. Background Technology

[0002] A range hood is a device installed above a kitchen stove to absorb and remove fumes, steam, odors, and heat generated during cooking. Its main function is to improve air quality in the kitchen, keeping it fresh and clean, and reducing grease buildup and air pollution.

[0003] A range hood mainly consists of a circuit board, a fan, a housing, and a control panel. The control panel is electrically connected to the circuit board to send instructions to the circuit board, which controls the fan to turn on or off to exhaust cooking fumes outdoors.

[0004] Electronic components on a circuit board generate heat during operation. If these components become too hot, the high temperature will accelerate their aging and damage, shortening their lifespan. In particular, components such as capacitors and transistors on the circuit board are temperature-sensitive; excessively high temperatures may cause them to fail or malfunction. Utility Model Content

[0005] In view of this, it is necessary to provide a heat dissipation structure for the circuit board of a range hood to solve the above problems.

[0006] Embodiments of this application provide a heat dissipation structure for a circuit board of a range hood, comprising:

[0007] The circuit board has electronic components on one side and is mounted on the other side.

[0008] An insulating layer is provided on the mounting side;

[0009] A heat dissipation component is provided on one side of the insulating layer away from the circuit board, and the other side is attached to the housing of the range hood to conduct heat from the circuit board to the housing of the range hood.

[0010] In at least one embodiment of this application, the heat sink includes:

[0011] Mounting plate, which is attached to the insulating layer;

[0012] Y-shaped heat-conducting fins are disposed on the mounting plate;

[0013] The bonding plate is fixedly connected to the Y-shaped heat-conducting fins on one side and bonded to the housing of the range hood on the other side.

[0014] In at least one embodiment of this application, the Y-shaped heat-conducting fins include:

[0015] The first heat dissipation section is located in the middle region of the mounting plate;

[0016] The second heat dissipation section is located in the edge region of the mounting plate;

[0017] The third heat dissipation section is located in the edge region of the mounting plate;

[0018] One end of the first heat dissipation part is connected to the second heat dissipation part and the third heat dissipation part.

[0019] In at least one embodiment of this application, the second heat dissipation part and the third heat dissipation part are located on both sides of the first heat dissipation part;

[0020] The heat from the first heat dissipation part is conducted to the second heat dissipation part and the third heat dissipation part to form a heat conduction.

[0021] In at least one embodiment of this application, the Y-shaped heat-conducting fins are located between the mounting plate and the bonding plate.

[0022] In at least one embodiment of this application, there are multiple Y-shaped heat-conducting fins, which are divided into two groups. One group of Y-shaped heat-conducting fins is arranged along a first direction, and the other group of Y-shaped heat-conducting fins is arranged along a second direction. The first direction and the second direction are opposite.

[0023] In at least one embodiment of this application, the edge region of the mounting plate is disposed around the central region of the mounting plate.

[0024] In at least one embodiment of this application, the heat dissipation structure of the circuit board of the range hood further includes:

[0025] An adhesive layer is provided on the side of the heat sink away from the circuit board, for fixing it to the housing of the range hood.

[0026] In at least one embodiment of this application, the heat sink further includes solder feet, one end of which is soldered to the circuit board.

[0027] In at least one embodiment of this application, the area of ​​the heat sink is denoted as a, and the area of ​​the circuit board is denoted as b, where a:b = 1:3.

[0028] The circuit board heat dissipation structure of the range hood implementing this embodiment will have at least the following beneficial effects:

[0029] The circuit board heat dissipation structure of the range hood described above utilizes the electronic components on the circuit board to generate heat during operation. This heat is transferred through the mounting side of the circuit board to the insulating layer. The insulating layer ensures electrical safety while allowing heat transfer to the heat sink. The heat sink evenly distributes the heat and, by attaching to one side of the range hood housing, further transfers the heat to the housing surface. The range hood housing, acting as a large-area heat dissipation medium, dissipates heat to the outside through air convection or radiation. The rapid heat transfer to the range hood housing via the heat sink significantly reduces the operating temperature of the circuit board and electronic components, thereby improving the stability and reliability of the equipment. The insulating layer effectively prevents electrical interference or short-circuit risks between the circuit board and the heat sink, ensuring the safety and durability of the heat dissipation structure. Attached Figure Description

[0030] Figure 1 This is a structural diagram of the heat dissipation structure of the circuit board of a range hood in one embodiment;

[0031] Figure 2 for Figure 1 An exploded view of the heat dissipation structure of the circuit board in a Chinese-style range hood;

[0032] Figure 3 This is a structural diagram of the heat dissipation structure of the circuit board of a range hood in another embodiment;

[0033] Figure 4 for Figure 3 A cross-sectional view of the heat dissipation structure of the circuit board in a range hood;

[0034] Figure 5 for Figure 3 An exploded view of the heat dissipation structure of the circuit board of a range hood.

[0035] Explanation of main component symbols

[0036] 100. Heat dissipation structure of the circuit board of a range hood;

[0037] 110. Circuit board; 110a. Mounting side;

[0038] 120. Insulation layer;

[0039] 130. Heat sink; 131. Mounting plate; 131a. Central region; 131b. Edge region; 132. Y-shaped heat-conducting fins; 1321. First heat sink; 1322. Second heat sink; 1323. Third heat sink; 133. Adhesive plate;

[0040] A. First direction; B. Second direction;

[0041] 140. Paste layer. Detailed Implementation

[0042] The embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0043] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also have an intervening component. When a component is considered to be "placed" on another component, it can be directly placed on the other component or may also have an intervening component. The terms "top," "bottom," "upper," "lower," "left," "right," "front," "back," and similar expressions used in this article are for illustrative purposes only.

[0044] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0045] Embodiments of this application provide a heat dissipation structure 100 for a circuit board 110 of a range hood, comprising:

[0046] The circuit board 110 has electronic components on one side and a mounting side 110a on the other side;

[0047] Insulating layer 120 is provided on the mounting side 110a;

[0048] The heat sink 130 is located on one side of the insulating layer 120 away from the circuit board 110, and the other side is attached to the housing of the range hood, so as to conduct the heat on the circuit board 110 to the housing of the range hood.

[0049] Please refer to Figures 1-2 In this embodiment, the electronic components on the circuit board 110 generate heat during operation. The heat generated by the electronic components is transferred to the insulating layer 120 through the mounting side 110a of the circuit board 110. The insulating layer 120 ensures electrical safety while allowing heat to be transferred to the heat sink 130.

[0050] The heat dissipation component 130 distributes heat evenly and further transfers heat to the surface of the range hood by attaching it to one side of the range hood housing.

[0051] The range hood casing serves as a large-area heat dissipation medium, releasing heat to the outside through air convection or radiation.

[0052] Heat is quickly transferred to the range hood housing by the heat sink 130, which greatly reduces the operating temperature of the circuit board 110 and electronic components, thereby improving the stability and reliability of the equipment.

[0053] The insulating layer 120 effectively prevents electrical interference or short circuit risk between the circuit board 110 and the heat sink 130, ensuring the safety and durability of the heat dissipation structure.

[0054] It should be noted that the insulating layer 120 includes: thermally conductive silicone sheet, thermally conductive ceramic layer, thermally conductive plastic, etc. In this embodiment, a thermally conductive ceramic layer is used. The insulating layer 120 is roughly rectangular in shape and is fixed by adhesive.

[0055] Circuit board 110 is a roughly rectangular PCB board, and electronic components include resistors, capacitors, transistors, etc.

[0056] The heat sink 130 is mounted on the side of the insulating layer 120 away from the circuit board 110.

[0057] In at least one embodiment of this application, the heat sink 130 includes:

[0058] Mounting plate 131 is attached to the insulating layer 120;

[0059] Y-shaped heat-conducting fins 132 are disposed on the mounting plate 131;

[0060] The bonding plate 133 is fixedly connected to the Y-shaped heat-conducting fins 132 on one side and is attached to the housing of the range hood on the other side.

[0061] Please refer to Figures 1-5 In this embodiment, the heat on the circuit board 110 is transferred to the mounting plate 131 through the insulating layer 120. The mounting plate 131 distributes the heat evenly to the Y-shaped heat-conducting fins 132. The Y-shaped heat-conducting fins 132 rapidly diffuse the heat through their expanded surface area and further transfer it to the bonding plate 133.

[0062] The bonding plate 133 transfers the heat absorbed by the fins to the range hood housing, and the range hood housing releases the heat into the environment through radiation or air convection.

[0063] The Y-shaped heat-conducting fins 132, through their special shape design, ensure that heat is evenly distributed inside the heat-conducting component and quickly conducted to the housing, avoiding heat accumulation.

[0064] The casing acts as a heat dissipation terminal, releasing heat through its large surface area.

[0065] The Y-shaped heat-conducting fins 132 significantly increase the heat dissipation surface area, enhancing the ability to conduct heat from the mounting plate 131 to the environment.

[0066] The bonding plate 133 combines the heat sink 130 with the housing, making full use of the heat dissipation performance of the housing to form a multi-layer heat dissipation structure.

[0067] Y-shaped heat-conducting fins 132 are horizontally arranged on the mounting plate 131, and the heat sink 130 is made of aluminum-based material.

[0068] The overall heat dissipation path (circuit board 110 to mounting plate 131 to Y-shaped heat-conducting fins 132 to bonding plate 133 to housing) ensures smooth heat flow and avoids heat accumulation or uneven heat dissipation.

[0069] The use of a housing for heat dissipation also reduces the need for external cooling devices (such as fans), thereby improving the reliability and stability of the system.

[0070] In at least one embodiment of this application, the Y-shaped heat-conducting fin 132 includes:

[0071] A first heat dissipation part 1321 is provided in the middle region 131a of the mounting plate 131;

[0072] The second heat dissipation part 1322 is provided in the edge region 131b of the mounting plate 131;

[0073] The third heat dissipation part 1323 is provided in the edge region 131b of the mounting plate 131;

[0074] One end of the first heat dissipation part 1321 is connected to the second heat dissipation part 1322 and the third heat dissipation part 1323.

[0075] In this embodiment, the heat generated by the circuit board 110 is transferred to the mounting plate 131 through the insulating layer 120.

[0076] The heat in the central region 131a of the mounting plate 131 is concentrated and transferred to the first heat dissipation part 1321.

[0077] The first heat dissipation section 1321 serves as the main heat receiving area, quickly absorbing the heat from the middle of the mounting plate 131.

[0078] Heat is transferred from the first heat dissipation unit 1321 to the connected second and third heat dissipation units 1323.

[0079] The second heat dissipation section 1322 and the third heat dissipation section 1323 disperse the heat from the first heat dissipation section 1321 to the edge region 131b of the mounting plate 131.

[0080] The symmetrical heat dissipation layout on both sides ensures that heat is evenly distributed and quickly conducted.

[0081] The second and third heat dissipation sections 1323 transfer heat to the bonding plate 133 through their larger heat dissipation surface area, and then further release it into the environment through the range hood housing.

[0082] After the first heat dissipation part 1321 absorbs heat, it distributes the heat to the second and third heat dissipation parts 1323 through the connecting structure, forming a Y-shaped heat flow path.

[0083] Heat diffuses from the center to the edge region 131b, resulting in a more even distribution and preventing localized overheating.

[0084] The second and third heat dissipation sections 1323 expand the heat dissipation area, covering the edge area 131b of the mounting plate 131, thereby improving the overall heat conduction and release efficiency.

[0085] The shape of the Y-shaped heat-conducting fin 132 makes full use of space and reduces heat accumulation.

[0086] The first heat dissipation part 1321 and the second and third heat dissipation parts 1323 form an integrated Y-shaped structure, which has higher mechanical strength and can resist thermal expansion or external impact.

[0087] In at least one embodiment of this application, the second heat dissipation part 1322 and the third heat dissipation part 1323 are located on both sides of the first heat dissipation part 1321;

[0088] The heat from the first heat dissipation part 1321 is conducted to the second heat dissipation part 1322 and the third heat dissipation part 1323 to form a heat conduction.

[0089] In this embodiment, the heat generated by the circuit board 110 is transferred to the mounting plate 131 through the insulating layer 120, and the heat in the central region 131a of the mounting plate 131 is concentrated and transferred to the first heat dissipation part 1321.

[0090] The first heat dissipation section 1321 serves as the main heat receiving area, quickly absorbing the heat from the middle of the mounting plate 131.

[0091] Heat is transferred from the first heat dissipation unit 1321 to the connected second and third heat dissipation units 1323.

[0092] The second heat dissipation section 1322 and the third heat dissipation section 1323 disperse the heat from the first heat dissipation section 1321 to the edge region 131b of the mounting plate 131.

[0093] The symmetrical heat dissipation layout on both sides ensures that heat is evenly distributed and quickly conducted.

[0094] The second and third heat dissipation sections 1323 transfer heat to the bonding plate 133 through their larger heat dissipation surface area, and then further release it into the environment through the range hood housing.

[0095] After the first heat dissipation part 1321 absorbs heat, it distributes the heat to the second and third heat dissipation parts 1323 through the connecting structure, forming a Y-shaped heat flow path.

[0096] Heat diffuses from the center to the edge region 131b, resulting in a more even distribution and preventing localized overheating.

[0097] The second and third heat dissipation sections 1323 expand the heat dissipation area, covering the edge area 131b of the mounting plate 131, thereby improving the overall heat conduction and release efficiency.

[0098] The shape of the Y-shaped heat-conducting fin 132 makes full use of space and reduces heat accumulation.

[0099] Uniform heat distribution reduces the overall operating temperature of circuit board 110, reduces the risk of component damage due to overheating, and extends product life.

[0100] Efficient heat dissipation also improves the stability of equipment operation, preventing shutdowns or malfunctions due to overheating.

[0101] In one embodiment, the heat sink 130 is integrally formed, while in another embodiment, the heat sink 130 is manufactured by welding.

[0102] In at least one embodiment of this application, the Y-shaped heat-conducting fin 132 is located between the mounting plate 131 and the bonding plate 133.

[0103] In this embodiment, the Y-shaped heat-conducting fin 132 is located between the mounting plate 131 and the bonding plate 133.

[0104] Mounting plate 131 is located near the heat source (circuit board 110) and mainly collects heat; bonding plate 133 is connected to the housing of the range hood and releases heat to the external environment.

[0105] The Y-shaped heat-conducting fins 132 act as a bridge, optimizing the heat transfer path from the mounting plate 131 to the bonding plate 133, while also expanding the heat dissipation area by utilizing the heat dissipation function of the fins.

[0106] The mounting plate 131 and the bonding plate 133 have the same area and are both rectangular in shape.

[0107] Y-shaped heat-conducting fins 132 are arranged between the mounting plate 131 and the bonding plate 133, thereby creating a temperature difference between the mounting plate 131 and the bonding plate 133, which facilitates the heat transfer of the Y-shaped heat-conducting fins 132.

[0108] In at least one embodiment of this application, there are multiple Y-shaped heat-conducting fins 132, which are divided into two groups. One group of Y-shaped heat-conducting fins 132 is arranged along a first direction A, and the other group of Y-shaped heat-conducting fins 132 is arranged along a second direction B. The first direction A and the second direction B are opposite.

[0109] In this embodiment, the first set of Y-shaped heat-conducting fins 132 conducts heat along the first direction A, guiding the heat flow to one side of the heat dissipation system.

[0110] The second set of Y-shaped heat-conducting fins 132 conducts heat along the second direction B, guiding the heat flow to the other side.

[0111] Two sets of Y-shaped heat-conducting fins 132 disperse heat to different areas of the mounting plate 131 or the bonding plate 133.

[0112] The bonding plate 133 further transfers the evenly distributed heat to the range hood housing, and finally releases it into the external environment through the housing.

[0113] In at least one embodiment of this application, the edge region 131b of the mounting plate 131 is disposed around the central region 131a of the mounting plate 131.

[0114] In this embodiment, the central region 131a is directly connected to the heat source (circuit board 110) and conducts heat through the insulating layer 120, thus it is a key area for heat concentration and conduction.

[0115] The edge region 131b is distributed around the central region 131a, serving to expand the heat dissipation area and further dissipate heat.

[0116] The heat generated when the circuit board 110 is in operation is conducted through the insulating layer 120 to the central region 131a of the mounting plate 131.

[0117] The central region 131a disperses and transfers concentrated heat to the edge region 131b.

[0118] The Y-shaped heat-conducting fins 132 enable the heat concentrated in the central region 131a to be quickly transferred to the edge region 131b, thus preventing the problem of heat concentration.

[0119] In at least one embodiment of this application, the heat dissipation structure 100 of the circuit board 110 of the range hood further includes:

[0120] An adhesive layer is provided on the side of the heat sink 130 away from the circuit board 110, for fixing it to the housing of the range hood.

[0121] In this embodiment, the adhesive layer is a functional layer attached to the outside of the heat sink 130 and is in direct contact with the range hood housing.

[0122] Secure the heat sink 130 firmly to the housing while ensuring that heat can be smoothly transferred to the housing.

[0123] The adhesive layer provides a reliable fixation method, enabling the heat sink 130 to be firmly attached to the housing, and the heat sink 130 will not loosen or shift even in high temperature, high humidity or vibrating working environments.

[0124] It avoids the complex installation of mechanical fasteners (such as screws) and improves assembly efficiency.

[0125] In at least one embodiment of this application, the heat sink 130 further includes solder feet, one end of which is soldered to the circuit board 110.

[0126] In this embodiment, the solder pads are part of the heat sink 130 and are usually made of a metal material with good thermal conductivity (such as copper, aluminum, tin). Their shape and number can be adjusted according to the design requirements of the circuit board 110.

[0127] By soldering, the solder feet can be firmly connected to the circuit board 110, while also directly contacting the heat source to enhance heat conduction.

[0128] Soldering is a high-strength, reliable connection method that ensures tight contact between the solder pads and the circuit board 110.

[0129] The solder feet achieve rapid heat conduction by soldering directly to heat sources on the circuit board 110 (such as copper foil or heat sinks around heating elements).

[0130] The solder feet securely connect the heat sink 130 and the circuit board 110 by soldering, providing mechanical support and preventing the heat sink 130 from loosening or shifting due to vibration or thermal expansion in the working environment.

[0131] In at least one embodiment of this application, the area of ​​the heat sink 130 is denoted as a, and the area of ​​the circuit board 110 is denoted as b, where a:b = 1:3.

[0132] In this embodiment, the ratio of the area a of the heat sink 130 to the area b of the circuit board 110 is 1:3.

[0133] The area ratio a:b = 1:3 enables the heat sink 130 to efficiently meet the heat dissipation requirements of the circuit board 110 without taking up too much space.

[0134] The heat sink 130 has a moderate area, ensuring that it will not be damaged by excessive heat when absorbing heat, thereby improving the reliability of the heat dissipation system and the overall equipment.

[0135] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. A heat dissipation structure for a circuit board of a range hood, characterized in that, include: The circuit board has electronic components on one side and is mounted on the other side. An insulating layer is provided on the mounting side; A heat dissipation component is provided on one side of the insulating layer away from the circuit board, and the other side is attached to the housing of the range hood to conduct heat from the circuit board to the housing of the range hood.

2. The heat dissipation structure of the circuit board of the range hood according to claim 1, characterized in that, The heat sink includes: Mounting plate, which is attached to the insulating layer; Y-shaped heat-conducting fins are disposed on the mounting plate; The bonding plate is fixedly connected to the Y-shaped heat-conducting fins on one side and bonded to the housing of the range hood on the other side.

3. The circuit board heat dissipation structure of the range hood according to claim 2, characterized in that, The Y-shaped heat-conducting fins include: The first heat dissipation section is located in the middle region of the mounting plate; The second heat dissipation section is located in the edge region of the mounting plate; The third heat dissipation section is located in the edge region of the mounting plate; One end of the first heat dissipation part is connected to the second heat dissipation part and the third heat dissipation part.

4. The heat dissipation structure of the circuit board of the range hood according to claim 3, characterized in that, The second heat dissipation part and the third heat dissipation part are located on both sides of the first heat dissipation part; The heat from the first heat dissipation part is conducted to the second heat dissipation part and the third heat dissipation part to form a heat conduction.

5. The circuit board heat dissipation structure of the range hood according to claim 2, characterized in that, The Y-shaped heat-conducting fins are located between the mounting plate and the bonding plate.

6. The heat dissipation structure of the circuit board of the range hood according to claim 2, characterized in that, The Y-shaped heat-conducting fins are multiple, and the multiple Y-shaped heat-conducting fins are divided into two groups. One group of Y-shaped heat-conducting fins is arranged along a first direction, and the other group of Y-shaped heat-conducting fins is arranged along a second direction. The first direction and the second direction are opposite.

7. The heat dissipation structure of the circuit board of the range hood according to claim 3, characterized in that, The edge region of the mounting plate is arranged around the central region of the mounting plate.

8. The circuit board heat dissipation structure of the range hood according to claim 1, characterized in that, The heat dissipation structure of the circuit board of the range hood also includes: An adhesive layer is provided on the side of the heat sink away from the circuit board, for fixing it to the housing of the range hood.

9. The heat dissipation structure of the circuit board of the range hood according to claim 1, characterized in that, The heat sink also includes solder feet, one end of which is soldered to the circuit board.

10. The heat dissipation structure of the circuit board of the range hood according to claim 1, characterized in that, The area of ​​the heat sink is denoted as a, and the area of ​​the circuit board is denoted as b, where a:b = 1:3.

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