Cold forging radiator capable of finely adjusting mounting angle

Abstract

The utility model discloses a cold forging radiator capable of finely adjusting the mounting angle, relates to the technical field of radiating devices, and aims to solve the technical problems that the mounting angle of the conventional cold forging radiator is inconvenient to adjust, so that the fitting degree of a heat absorbing surface is low, and the heat absorbing efficiency is influenced. The assembling mechanism is composed of an assembling frame, a rotating ring and an assembling ring, supporting legs are distributed on the outer side of the assembling frame in an annular array mode and installed on the upper side of a main board, a processor chip is arranged on the upper side of the main board, an adapting opening is formed in the inner side of the assembling frame, and connecting ends are arranged on the front side and the rear side of the assembling ring correspondingly. Fins are arranged in the middle of the upper end face of the radiator body, positioning columns and connecting bolts are arranged on the front side and the rear side of the upper end face of the radiator body, and the positioning columns are located on the inner sides of the connecting bolts. The utility model has the advantages of fine-tuning the installation angle of the radiator and ensuring the fitting degree of the heat absorption surface.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and more specifically, to a cold-forged heat sink with adjustable installation angle. Background Technology

[0002] Cold-forged heat sinks primarily operate based on the principles of heat conduction and convection. Cold forging technology allows metal materials to be shaped at room temperature, creating structures such as heat dissipation fins and increasing the contact area with heat dissipation media like air. When a heat source generates heat, the heat is transferred to the base plate and fins of the cold-forged heat sink through heat conduction. Then, through natural convection or forced convection created by external forces such as fans, the heat is dissipated into the surrounding environment, thereby reducing the temperature of the heat source.

[0003] Cold-forged heatsinks are commonly used for chip cooling on circuit boards, absorbing the heat generated by the chips to ensure their continuous operation. The surface of a chip consists of pins or solder balls, and depending on the model, its texture varies. Existing cold-forged heatsinks are not easily fitted to the outer texture of the chip during installation, resulting in low heat absorption efficiency. Therefore, we propose a cold-forged heatsink with a finely adjustable mounting angle. Utility Model Content

[0004] The purpose of this utility model is to overcome the shortcomings of the existing technology, adapt to the needs of reality, and provide a cold-forged radiator with an adjustable installation angle, so as to solve the technical problem that the installation angle of the current cold-forged radiator is inconvenient to adjust, resulting in low heat absorption surface fit and affecting heat absorption efficiency.

[0005] To solve the above technical problems, this utility model provides the following technical solution: a cold-forged heat sink with adjustable installation angle, including an assembly mechanism and a heat sink body. The assembly mechanism consists of an assembly frame, a rotating ring, and an assembly ring. The outer side of the assembly frame has legs arranged in a circular array, and the legs are mounted on the upper side of the motherboard. The upper side of the motherboard has a processor chip. The inner side of the assembly frame has an adapter port. The front and rear sides of the assembly ring have connecting ends, and the connecting ends are fixed to the upper side of the assembly frame by screws. The upper end face of the heat sink body has fins in the middle. The front and rear sides of the upper end face of the heat sink body have positioning posts and connecting bolts, and the positioning posts are located inside the connecting bolts.

[0006] In use, the support legs of this device are fixed to the motherboard with screws. At this time, the heat-absorbing surface at the lower end of the heat sink body is in contact with the surface of the processor chip. When in contact, the heat sink body can be tilted to the left and right sides according to the undulating surface of the processor chip. At this time, the screw part of the connecting bolt that fixes the heat sink body tilts at the fine adjustment port. The tilt angle is buffered by the upper and lower springs of the connecting bolt, so that the installation angle of the heat sink body can be finely adjusted to ensure the fit with the processor chip. Through the above-mentioned fine adjustment structure design, it is easy to ensure the fit of the heat-absorbing surface of the heat sink body and ensure the heat absorption efficiency. The height of the support legs is limited, so the distance between the heat-absorbing surface at the lower end of the heat sink body and the processor chip is constant. By manually rotating the rotating ring, the gradient groove on its lower side presses the positioning post of the heat sink body, so that the height of the heat sink body can be finely adjusted according to the undulation of the gradient groove. This makes it easy for the height of the heat sink body to adapt to the undulating surface of different models of processor chips, thus enhancing the applicability of this device. At the same time, the height adjustment design allows the spring pressure on the connecting bolt to be adjusted, avoiding damage caused by high pressure.

[0007] Preferably, the adapter port has inner grooves on both sides, and the assembly frame has fine-tuning ports on the front and rear sides and the connection ends with the assembly ring.

[0008] Preferably, a bayonet is provided on the inner side of the connecting end of the assembly ring, the rotating ring is rotatably installed in the bayonet, and gradient grooves are provided on both the front and rear sides of the lower end face of the rotating ring.

[0009] Preferably, the fin passes through the inner side of the assembly ring and the adapter port, and the inclined surface of the upper end of the positioning post passes through the inner side of the inner groove and then docks with the gradient groove.

[0010] Preferably, the connecting bolt consists of a screw, a nut, and a spring. The lower end of the screw is fixed to the heat-absorbing surface of the radiator body, and a nut is threaded onto the top of the screw. Springs are sleeved on both the upper and lower sides of the screw, with the two springs located on the lower side of the assembly frame and the upper side of the assembly ring, respectively.

[0011] Preferably, the opening of the fine-tuning port is laterally distributed, and the thread of the connecting bolt is adapted to the lateral direction of the fine-tuning port.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. This utility model uses an assembly ring to fix the support legs of the device to the motherboard with screws. At this time, the heat-absorbing surface at the lower end of the heat sink body is in contact with the surface of the processor chip. When in contact, the heat sink body can be tilted to the left and right sides according to the undulating surface of the processor chip. At this time, the screw part of the connecting bolt that fixes the heat sink body tilts at the fine adjustment port. The tilt angle is buffered by the upper and lower springs of the connecting bolt, so that the installation angle of the heat sink body can be finely adjusted to ensure the fit with the processor chip. Through the above-mentioned fine adjustment structure design, it is convenient to ensure the fit of the heat-absorbing surface of the heat sink body and ensure the heat absorption efficiency.

[0014] 2. This utility model also features a rotating ring design. The height of the support legs is limited, so the distance between the heat-absorbing surface at the lower end of the heat sink body and the processor chip remains constant. By manually rotating the rotating ring, the gradient groove on its lower side presses against the positioning post of the heat sink body, allowing the heat sink body to make fine adjustments to its height according to the undulation of the gradient groove. This makes it easier for the height of the heat sink body to adapt to the undulating surface of different models of processor chips, thus enhancing the applicability of this device. At the same time, the height adjustment design allows the spring pressure on the connecting bolts to be adjusted, avoiding damage caused by high pressure. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the unfolded structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the assembly mechanism of this utility model;

[0018] Figure 4 This is a bottom view of the assembly frame of this utility model;

[0019] Figure 5 This is a schematic diagram of the rotating ring structure of this utility model;

[0020] Figure 6 This is a schematic diagram of the assembly ring structure of this utility model.

[0021] The following are the labels in the diagram: 1. Motherboard; 101. Processor chip; 2. Assembly mechanism; 201. Assembly frame; 202. Support leg; 203. Rotary ring; 204. Assembly ring; 205. Inner slot; 206. Fine adjustment port; 207. Gradient slot; 208. Bayonet; 209. Adapter port; 210. Connection end; 3. Heatsink body; 301. Positioning post; 302. Connecting bolt; 303. Fin. Detailed Implementation

[0022] like Figures 1 to 5As shown, the cold-forged heat sink with adjustable installation angle according to this utility model includes an assembly mechanism 2 and a heat sink body 3. The assembly mechanism 2 consists of an assembly frame 201, a rotating ring 203, and an assembly ring 204. Support legs 202 are arranged in a circular array on the outer side of the assembly frame 201 and are mounted on the upper side of the motherboard 1. A processor chip 101 is located on the upper side of the motherboard 1. An adapter port 209 is provided on the inner side of the assembly frame 201, and inner grooves 205 are provided on both sides of the adapter port 209. Fine-tuning ports 206 are provided on the front and rear sides of the assembly frame 201 and the connection ends 210 of the assembly ring 204. Connection ends 210 are provided on the front and rear sides of the assembly ring 204, and the connection ends 210 are fixed to the upper side of the assembly frame 201 by screws. A bayonet 208 is provided on the inner side of the connection ends 210 of the assembly ring 204. The rotating ring 203 is rotatably installed in the bayonet 208. Gradient grooves 207 are provided on the front and rear sides of the lower end face of the rotating ring 203. The support leg 202 of this device is fixed to the motherboard 1 with screws. At this time, the heat-absorbing surface of the lower end of the heat sink body 3 is in contact with the surface of the processor chip 101. When in contact, according to the undulating surface of the outer side of the processor chip 101, the heat sink body 3 can be tilted to the left and right sides laterally. At this time, the screw part of the connecting bolt 302 that fixes the heat sink body 3 tilts at the fine adjustment port 206. The tilt angle is buffered by the upper and lower springs of the connecting bolt 302, so that the installation angle of the heat sink body 3 can be finely adjusted to ensure the fit with the processor chip 101. Through the above-mentioned fine adjustment structure design, it is convenient to ensure the fit of the heat-absorbing surface of the heat sink body 3 and ensure the heat absorption efficiency.

[0023] like Figures 2 to 6As shown, the cold-forged radiator with adjustable installation angle involved in this utility model includes an assembly mechanism 2 and a radiator body 3. A fin 303 is provided at the middle of the upper end face of the radiator body 3. The fin 303 passes through the inner side of the assembly ring 204 and the adapter port 209. The inclined surface of the upper end of the positioning post 301 passes through the inner side of the inner groove 205 and then connects with the gradient groove 207. Positioning posts 301 and connecting bolts 302 are provided on both the front and rear sides of the upper end face of the radiator body 3, with the positioning post 301 located inside the connecting bolt 302. The connecting bolt 302 consists of a screw, a nut, and a spring. The lower end of the screw is fixed to the heat-absorbing surface of the radiator body 3, and a nut is threaded onto the top of the screw. Springs are sleeved on both the upper and lower sides of the screw, and the two springs are respectively located at the assembly... On the lower side of the frame 201 and the upper side of the assembly ring 204, the openings of the fine-tuning ports 206 are horizontally distributed, and the screws of the connecting bolts 302 are adapted to the horizontal orientation of the fine-tuning ports 206. The height of the support legs 202 is limited, so the distance between the heat-absorbing surface at the lower end of the heat sink body 3 and the processor chip 101 is constant. By manually rotating the rotating ring 203, the gradient groove 207 on its lower side presses against the positioning post 301 of the heat sink body 3, so that the height of the heat sink body 3 can be finely adjusted according to the undulation of the gradient groove 207. This makes it easy for the height of the heat sink body 3 to adapt to the undulating surface of different models of processor chips 101, thus enhancing the applicability of the device. At the same time, the height adjustment design allows the spring pressure on the connecting bolts 302 to be adjusted, avoiding damage caused by high pressure.

[0024] Working Principle: This embodiment provides a cold-forged heat sink with adjustable installation angle. In use, the support leg 202 of this device is fixed to the motherboard 1 with screws. At this time, the heat-absorbing surface at the lower end of the heat sink body 3 is in contact with the surface of the processor chip 101. When in contact, the heat sink body 3 can be tilted to the left and right sides according to the undulating surface on the outer side of the processor chip 101. At this time, the screw part of the connecting bolt 302 that fixes the heat sink body 3 tilts at the fine-tuning port 206. The tilt angle is buffered by the upper and lower springs of the connecting bolt 302, so that the installation angle of the heat sink body 3 can be finely adjusted to ensure the fit with the processor chip 101. The height of the support leg 202 is limited, so the distance between the heat-absorbing surface at the lower end of the heat sink body 3 and the processor chip 101 is constant. By manually rotating the rotating ring 203, the gradient groove 207 on its lower side presses the positioning post 301 of the heat sink body 3, so that the height of the heat sink body 3 can be finely adjusted according to the undulation of the gradient groove 207, making it easy for the height of the heat sink body 3 to adapt to the undulating surface of different models of processor chips 101.

[0025] The embodiments disclosed herein are preferred embodiments, but are not limited thereto. Those skilled in the art can readily grasp the spirit of this utility model based on the above embodiments and make different extensions and variations. However, as long as they do not depart from the spirit of this utility model, they are all within the protection scope of this utility model.

Claims

1. A cold-forged radiator with adjustable installation angle, comprising an assembly mechanism (2) and a radiator body (3), characterized in that: The assembly mechanism (2) consists of an assembly frame (201), a rotating ring (203), and an assembly ring (204). The outer side of the assembly frame (201) is arranged with supporting legs (202) in a ring array, and the supporting legs (202) are installed on the upper side of the motherboard (1). The upper side of the motherboard (1) is provided with a processor chip (101). The inner side of the assembly frame (201) is provided with an adapter port (209). The front and rear sides of the assembly ring (204) are provided with connecting ends (210), and the connecting ends (210) are fixed to the upper side of the assembly frame (201) by screws. The upper end face of the heat sink body (3) is provided with fins (303) in the middle. The front and rear sides of the upper end face of the heat sink body (3) are provided with positioning posts (301) and connecting bolts (302), and the positioning posts (301) are located inside the connecting bolts (302).

2. The cold-forged radiator with adjustable installation angle according to claim 1, characterized in that: The adapter (209) has an inner groove (205) on both sides, and the assembly frame (201) has a fine adjustment port (206) at the connection end (210) with the assembly ring (204) on both the front and rear sides.

3. The cold-forged radiator with adjustable installation angle according to claim 2, characterized in that: The connecting end (210) of the assembly ring (204) has a bayonet (208) on its inner side, and the rotating ring (203) is rotatably installed in the bayonet (208). The front and rear sides of the lower end face of the rotating ring (203) are provided with gradient grooves (207).

4. The cold-forged radiator with adjustable installation angle according to claim 3, characterized in that: The fin (303) passes through the inner side of the assembly ring (204) and the adapter port (209), and the upper inclined surface of the positioning post (301) passes through the inner side of the inner groove (205) and then docks with the gradient groove (207).

5. The cold-forged radiator with adjustable installation angle according to claim 4, characterized in that: The connecting bolt (302) consists of a screw, a nut and a spring. The lower end of the screw is fixed to the heat-absorbing surface of the radiator body (3). The top of the screw is threaded with a nut. Springs are sleeved on both the upper and lower sides of the screw, and the two springs are located on the lower side of the assembly frame (201) and the upper side of the assembly ring (204) respectively.

6. The cold-forged radiator with adjustable installation angle according to claim 5, characterized in that: The opening of the fine-tuning port (206) is laterally distributed, and the screw of the connecting bolt (302) is adapted to the lateral direction of the fine-tuning port (206).

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