Universal clamping tool in BGA (Ball Grid Array) packaging device detinning process
By designing a universal clamping fixture, the problem of unstable tape fixation during the desoldering process of BGA packaged devices was solved, achieving efficient and stable clamping and desoldering operations, improving desoldering efficiency and reducing the risk of chip damage, and adapting to various shape structures.
Patent Information
- Application Number
- CN202423267431.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-29
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2034-12-29
AI Technical Summary
In the existing technology, the desoldering process of BGA packaged devices has problems such as unstable tape fixation, high risk of chip movement, high risk of contamination, and unstable operation. These problems are particularly prominent when the top is uneven or there is conformal adhesive, resulting in low desoldering efficiency and increased cost.
A universal clamping fixture for desoldering BGA packaged devices is adopted, including an anti-static carrier board, a fixed clamping plate and a movable clamping plate. Stable clamping is achieved by adjusting the slider movement through a lead screw. The clamping surface is provided with steps and V-grooves to adapt to different structures. It is made of synthetic stone anti-static material and has multiple clamping grooves to adapt to different sizes.
It improves the desoldering efficiency of BGA packaged devices from 10 min/piece to 4 min/piece, enhances compatibility with chips of different sizes, reduces the risk of chip damage and surface contamination, and meets the clamping requirements of various shapes.
Smart Images
Figure CN223899417U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of airborne electronic equipment repair, and provides a universal clamping tool in a BGA packaging device desmearing process. BACKGROUND
[0002] In the electronic industry, the repair of BGA packaging devices has always been a difficult problem. At present, the desmearing process of BGA ball mounting is to paste high-temperature adhesive tape on the substrate, fix the BGA packaging device by using the adhesion of the adhesive tape, and then use an electric soldering iron for desmearing. However, the adhesive tape fixing desmearing generally has the following problems:
[0003] 1. As the adhesion of the adhesive tape decreases after the chip is heated, the chip is easy to move, which causes difficulty in desmearing, and at the same time, the heating time of the chip is lengthened, which increases the risk of damage;
[0004] 2. For the chip with uneven top, since the adhesive tape has small adhesion area, the chip shakes back and forth during the desmearing process, which is unstable in operation, and there is a risk of BGA packaging device falling off the pad;
[0005] 3. The adhesive tape after heating will pollute the surface and characters of the BGA packaging device, which brings inconvenience to the subsequent operation;
[0006] 4. For the BGA packaging device with three-proofing glue on the top, the problem of insufficient adhesion of the adhesive tape is more prominent. SUMMARY
[0007] The purpose of the present application is to improve the repair efficiency of BGA packaging devices and save production costs under the premise of meeting the compatibility of different structures and different sizes.
[0008] In order to achieve the above purpose, the present application adopts the following technical scheme: a universal clamping tool in a BGA packaging device desmearing process, the tool comprising: an internally hollow clamping body, a sliding block arranged in the hollow cavity of the clamping body, a stop block fixed at one end of the clamping body, a lead screw penetrating into the hollow cavity of the clamping body for driving the sliding block to move in the hollow cavity, an anti-static carrier plate fixed at the upper end of the clamping body, and a clamping mechanism arranged on the anti-static carrier plate for clamping the BGA packaging device,
[0009] The clamping mechanism comprises an anti-static left fixed clamping plate and an anti-static right fixed clamping plate fixed on the anti-static carrier plate, and an anti-static movable clamping plate connected between the anti-static left fixed clamping plate and the anti-static right fixed clamping plate and sliding with the sliding block.
[0010] The universal clamping tool in the BGA packaging device desmearing process provided by the present application also has the following technical features: the anti-static carrier plate is provided with a guide groove for connecting the sliding block and the anti-static movable clamping plate.
[0011] The universal clamping tool for BGA packaging device in the process of tin removal provided by the application also has the technical features that the anti-static left fixed clamping plate, the anti-static movable clamping plate, the anti-static right fixed clamping plate and the anti-static carrier plate are all made of synthetic stone material.
[0012] The universal clamping tool for BGA packaging device in the process of tin removal provided by the application also has the technical features that the anti-static left fixed clamping plate, the anti-static movable clamping plate, the anti-static right fixed clamping plate and the anti-static carrier plate are all made of synthetic stone material.
[0013] The universal clamping tool for BGA packaging device in the process of tin removal provided by the application also has the technical features that the anti-static right fixed clamping plate and the anti-static movable clamping plate are provided with a plurality of clamping grooves with different sizes for cooperating with the BGA packaging device.
[0014] The universal clamping tool for BGA packaging device in the process of tin removal provided by the application also has the technical features that the anti-static movable clamping plate is provided with a guide block at the lower end for cooperating with the guide groove, and the guide block is connected with the sliding block.
[0015] The universal clamping tool for BGA packaging device in the process of tin removal provided by the application also has the technical features that the thickness of the guide block is greater than the thickness of the anti-static carrier plate, and the difference in thickness is 0.3-0.6mm.
[0016] The universal clamping tool for BGA packaging device in the process of tin removal provided by the application also has the technical features that the end of the lead screw exposed from the stop block is provided with a knob for adjusting the position of the sliding block.
[0017] Beneficial effects
[0018] The universal clamping tool for BGA packaging device in the process of tin removal provided by the application can improve the operation efficiency of the BGA packaging device in the process of tin removal from 10min / piece to 4min / piece, and the efficiency is improved by 60%. The clamping tool has strong compatibility and can stably clamp BGA packaging chips with different sizes. The clamping surface is provided with a stepped V-shaped groove, which meets the clamping scene of various BGA shapes such as BGA with resistance-capacitance on the top, glass body on the top and laminated packaging. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor.
[0020] Figure 1 Structure diagram of the clamping tool provided by the present application;
[0021] Figure 2 Exploded view of the clamping tool provided by the embodiment of the present application;
[0022] Figure 3 Clamping diagram of a small-size BGA device clamped between a small-size clamping groove of an anti-static movable clamping plate and an anti-static right fixed clamping plate;
[0023] Figure 4 Clamping diagram of a large-size BGA device clamped between a large-size clamping groove of an anti-static movable clamping plate and an anti-static right fixed clamping plate;
[0024] Figure 5 Clamping diagram of a large-size BGA device clamped between a large-size clamping groove of an anti-static movable clamping plate and an anti-static right fixed clamping plate in another clamping mode;
[0025] Figure 6 Clamping diagram of a BGA device clamped between an anti-static left fixed clamping plate and an anti-static movable clamping plate;
[0026] Figure 7 Clamping diagram of a BGA device clamped between an anti-static left fixed clamping plate and an anti-static movable clamping plate in another clamping mode,
[0027] Wherein, 1: anti-static left fixed clamping plate; 2: anti-static movable clamping plate; 3: anti-static right fixed clamping plate; 4: anti-static carrier plate; 5: sliding block; 6: clamping body; 7: stop block; 8: lead screw; 9: knob; 10: BGA packaging device. DETAILED DESCRIPTION
[0028] The present application will be further described below in conjunction with the drawings and embodiments, but it should be noted that these embodiments are not a limitation on the present application, and equivalent transformations or substitutions of function, method, or structure made by those of ordinary skill in the art based on these embodiments are within the protection scope of the present application.
[0029] In the description of the embodiments of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0030] In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.
[0031] The terms "mounting", "connecting", "connection" should be broadly understood, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0032] As shown in Figures 1-7 The present application provides a universal clamping tool in the process of BGA packaging device tin removal, the tool comprises: an internal hollow clamping body 6, a sliding block 5 arranged in the hollow cavity of the clamping body 6, a stop block 7 fixed at one end of the clamping body 6, a lead screw 8 passing through the stop block 7 and extending into the hollow cavity of the clamping body 6 for driving the sliding block 5 to move in the hollow cavity, an anti-static carrier plate 4 fixed at the upper end of the clamping body 6, and a clamping mechanism arranged on the anti-static carrier plate 4 for clamping the BGA packaging device 10, the clamping mechanism comprises an anti-static left fixed clamping plate 1 and an anti-static right fixed clamping plate 3 fixed on the anti-static carrier plate 4, and an anti-static movable clamping plate 2 connected between the anti-static left fixed clamping plate 1 and the anti-static right fixed clamping plate 3 and sliding with the sliding block 5.
[0033] In the above embodiment, the sliding block 5 and the anti-static movable clamping plate 2 are driven to move left and right as a whole by adjusting the lead screw 8, so that the anti-static left fixed clamping plate 1 and the anti-static movable clamping plate 2, and the anti-static right fixed clamping plate 3 and the anti-static movable clamping plate 2 can be clamped and meet different clamping requirements.
[0034] In some embodiments, the anti-static carrier plate 4 is provided with a guide groove for connecting the sliding block 5 and the anti-static movable clamping plate 2.
[0035] In some embodiments, the anti-static left fixed clamping plate 1, the anti-static movable clamping plate 2, the anti-static right fixed clamping plate 3 and the anti-static carrier plate 4 are all made of synthetic stone material. The synthetic stone material not only has anti-static, high temperature resistance and is not easy to deform, but also will not pollute the surface and characters of the BGA packaging device 10.
[0036] In some embodiments, the clamping surface between the anti-static left fixed clamping plate 1 and the anti-static movable clamping plate 2 is provided with a step and a V-shaped groove for cooperating with the BGA packaged device 10.
[0037] In some embodiments, the clamping surface between the anti-static right fixed clamping plate 3 and the anti-static movable clamping plate 2 is provided with a plurality of clamping grooves of different sizes for cooperating with the BGA packaged device 10. As shown in Figures 3-7 , there are different clamping modes.
[0038] In some embodiments, the anti-static movable clamping plate 2 is provided at the lower end with a guide block for cooperating with the guide groove, and the guide block is connected with the sliding block 5.
[0039] In some embodiments, the thickness of the guide block is greater than the thickness of the anti-static carrier plate 4, and the difference in thickness is 0.3-0.6mm.
[0040] In some embodiments, the exposed end of the lead screw 8 from the stop block 7 is provided with a knob 9 for adjusting the position of the sliding block.
[0041] The above is only the preferred embodiment of the present application, and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application. The above is only the preferred embodiment of the present application, and it should be pointed out that, for ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and modifications can be made, and these improvements and modifications should be considered as the protection scope of the present application.
Claims
1. A universal clamping fixture for desoldering BGA packaged devices, characterized in that, The fixture includes: a hollow clamping body, a slider disposed in the hollow cavity of the clamping body, a stop fixed at one end of the clamping body, a lead screw extending through the stop into the hollow cavity of the clamping body to drive the slider to move in the hollow cavity, an anti-static carrier plate fixed at the upper end of the clamping body, and a clamping mechanism disposed on the anti-static carrier plate for clamping BGA packaged devices. The clamping mechanism includes an antistatic left fixed clamp and an antistatic right fixed clamp fixed on the antistatic carrier plate, and an antistatic movable clamp connected to the slider and sliding between the antistatic left fixed clamp and the antistatic right fixed clamp.
2. The universal clamping fixture for desoldering BGA packaged devices according to claim 1, characterized in that, The antistatic carrier plate is provided with a guide groove for connecting the slider and the antistatic movable clamp.
3. The universal clamping fixture for desoldering BGA packaged devices according to claim 1, characterized in that, The antistatic left fixed clamp, antistatic movable clamp, antistatic right fixed clamp, and antistatic carrier plate are all made of synthetic stone.
4. The universal clamping fixture for desoldering BGA packaged devices according to claim 1, characterized in that, The clamping surfaces between the antistatic left fixed clamp and the antistatic movable clamp are provided with steps and V-grooves, which are used to cooperate with BGA packaged devices.
5. The universal clamping fixture for desoldering BGA packaged devices according to claim 1, characterized in that, The clamping surfaces between the antistatic right fixed clamping plate and the antistatic movable clamping plate are provided with multiple clamping slots of different sizes for mating with BGA packaged devices.
6. The universal clamping fixture for desoldering BGA packaged devices according to claim 2, characterized in that, The lower end of the antistatic movable clamp is provided with a guide block that cooperates with the guide groove, and the guide block is connected to the slider.
7. The universal clamping fixture for desoldering BGA packaged devices according to claim 6, characterized in that, The thickness of the guide block is greater than the thickness of the antistatic carrier plate, with a thickness difference of 0.3-0.6 mm.
8. The universal clamping fixture for desoldering BGA packaged devices according to claim 1, characterized in that, The end of the lead screw that protrudes from the stop block is provided with a knob for adjusting the position of the slider.