Rapid packaging structure of integrated circuit

Abstract

The utility model relates to the field of integrated circuits, and discloses an integrated circuit rapid packaging structure which comprises an integrated circuit board and a mounting frame, adjusting devices are arranged on the front side and the rear side of the integrated circuit board, contraction devices are arranged at the two ends of the integrated circuit board, a packaging device is arranged on the outer side of the mounting frame, and the integrated circuit board is arranged on the mounting frame. The top end of the mounting rack is provided with a sliding packaging structure, the bottom end of the mounting rack is provided with a heat dissipation device, the sliding packaging structure is arranged, the operation steps and time in the packaging process can be reduced, and compared with traditional manual operation, the chip mounting and connecting speed is greatly increased; according to the utility model, the structure is simple, the period from chip manufacturing to finished product packaging is effectively shortened, the heat dissipation device can pay attention to optimization of a heat dissipation path on a rapid packaging structure, metal or heat dissipation ceramic and the like are installed as a packaging substrate or a heat dissipation fin, the structure design is compact and reasonable, the rapid packaging efficiency of an integrated circuit is improved by using a more efficient technology, and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of integrated circuit, concretely is a kind of integrated circuit quick packaging structure. BACKGROUND

[0002] With the rapid progress of information technology, integrated circuits (IC) are continuously expanding and deepening in various fields of modern society. From smart phones, computers and other consumer electronics to automobiles, industrial control, aerospace and other high-end manufacturing, integrated circuits as core components, their performance and functionality continue to improve, driving the rapid development of the entire electronics industry, and packaging as one of the key steps in integrated circuit manufacturing, plays a crucial role in protecting chips, achieving electrical connections and heat dissipation, etc. With the continued expansion of the integrated circuit market, the demand for efficient and fast packaging structures is increasingly urgent to meet the growing demand for chip production and application.

[0003] Modern consumers have increasingly high requirements for the appearance and portability of electronic products, such as smart phones, wearable devices and other products that continue to pursue thinner designs, which requires integrated circuit packaging structures to continuously reduce size while maintaining or improving performance. In order to achieve more powerful functions such as 5G communication, artificial intelligence computing, high-definition video processing, integrated circuits need to have higher computing speed, lower power consumption and better signal processing capability, and traditional packaging technology cannot meet these high-performance requirements while miniaturizing, so research and development of fast packaging structures have become the key to meeting the development needs of electronic products.

[0004] However, most of the current integrated circuit fast packaging structures are fixedly installed, which is relatively cumbersome and time-consuming during the packaging process, greatly reducing the speed of chip installation and connection, prolonging the cycle from chip manufacturing to finished product packaging, and most of them do not have a heat dissipation device, which cannot focus on optimizing the heat dissipation path on the fast packaging structure, therefore we propose an integrated circuit fast packaging structure. UTILITY MODEL CONTENT

[0005] (I) Technical problem solved

[0006] To address the shortcomings of the prior art, the utility model provides an integrated circuit fast packaging structure that solves the above problems.

[0007] (II) Technical solution

[0008] To achieve the above purposes, the utility model provides the following technical solutions:

[0009] The utility model provides an integrated circuit fast packaging structure, including integrated circuit board and mounting frame, the front and back sides of integrated circuit board are provided with adjusting device, both ends of integrated circuit board are provided with shrink device, the outside of mounting frame is provided with packaging device, the top of mounting frame is provided with sliding packaging structure, the bottom of mounting frame is provided with heat dissipation device.

[0010] Preferably, the adjusting device comprises a sliding plate, a limiting rod, a shock-absorbing sponge, and the mounting frame is internally slidably mounted with two symmetrical sliding plates, fixed limiting rods are penetratingly installed at both ends of the two sliding plates, and the inner sides of the two sliding plates are fixedly connected with symmetrical shock-absorbing sponges.

[0011] Preferably, the shrink device comprises a shrink spring, a connecting rod, an adjusting hole, and a pressing plate, two symmetrical square adjusting holes are formed in the two sides of the mounting frame away from the integrated circuit board, a pressing plate is slidably installed in the interior of the two symmetrical adjusting holes, the connecting rod is fixedly connected to the pressing plate at the other end of the connecting rod, a plurality of shrink springs are fixedly connected to the interior of the mounting frame at the other side of the plurality of shrink springs, and the sliding plate is fixedly connected with the connecting rod at the center of the side end away from the integrated circuit board.

[0012] Preferably, the packaging device comprises a limiting rod, a sealing layer, a packaging frame, a sealing layer, and a lower packaging plate, the outer side of the mounting frame is fixedly installed with a packaging frame, the upper end of the packaging frame is tightly attached with a sealing layer, a plurality of limiting rods are fixedly installed at the four corner positions of the mounting frame, the bottom end of the packaging frame is tightly attached with a sealing layer, and the bottom end of the sealing layer is fixedly installed with a lower packaging plate.

[0013] Preferably, the sliding packaging structure comprises an upper packaging plate and a fastening bolt, the upper packaging plate is slidably installed above the shrink spring, and a plurality of fastening bolts are threadedly connected to the top end of the upper packaging plate above the limiting rod.

[0014] Preferably, the heat dissipation device comprises a heat dissipation hole, a heat dissipation fan, and a heat dissipation strip-shaped hole, a plurality of heat dissipation strip-shaped holes are linearly and equidistantly distributed on the lower packaging plate, a plurality of heat dissipation holes are linearly and equidistantly distributed on the side end of the packaging frame, and the top end of the upper packaging plate is fixedly installed with a heat dissipation fan.

[0015] (Three) beneficial effects

[0016] Compared with the prior art, the utility model has the advantages that:

[0017] The utility model provides an integrated circuit fast packaging structure has the following beneficial effects: the utility model discloses a sliding packaging structure can reduce the operation step and time in the packaging process, compared with traditional manual operation, greatly improves the speed of chip installation and connection, effectively shortens the period from chip manufacturing to finished product packaging, and the heat dissipation device can focus on the optimization of the heat dissipation path on the fast packaging structure, is installed metal or heat dissipation ceramic etc. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the utility model structural schematic diagram;

[0019] Figure 2 It is the utility model adjusting device schematic diagram;

[0020] Figure 3 It is the utility model sliding packaging structure cross section schematic diagram;

[0021] Figure 4 It is the utility model heat dissipation device schematic diagram.

[0022] In the drawing: 1, integrated circuit board;2, sliding plate;3, limit rod spare one;4, contraction spring;5, connecting rod spare;6, shock absorbing sponge;7, adjusting hole;8, pressing plate;9, limit rod spare two;10, sealing layer one;11, packaging frame;12, heat dissipation hole;13, heat dissipation fan;14, sealing layer two;15, lower packaging plate;16, heat dissipation strip hole;17, mounting frame;18, upper packaging plate;19, fastening bolt. DETAILED DESCRIPTION

[0023] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0024] Please refer to Figures 1-4 The utility model provides a technical scheme;

[0025] The utility model provides a kind of integrated circuit fast packaging structure, including integrated circuit board 1 and mounting frame 17, the front and rear sides of integrated circuit board 1 are provided with adjusting device, the both ends of integrated circuit board 1 are provided with shrink device, the outside of mounting frame 17 is provided with packaging device, the top of mounting frame 17 is provided with sliding packaging structure, the bottom of mounting frame 17 is provided with heat dissipation device, the utility model is provided with sliding packaging structure, can reduce the operation step and time in packaging process, compared with traditional manual operation, greatly improve the speed of chip installation and connection, effectively shorten the period from chip manufacturing to finished product packaging, heat dissipation device can focus on the optimization of heat dissipation path on fast packaging structure, install metal or heat dissipation ceramic etc.

[0026] Further, the adjusting device includes sliding plate 2, limit rod piece one 3, shock-absorbing sponge 6, the inside of mounting frame 17 is slidably installed with two symmetrical sliding plates 2, the both ends of two sliding plates 2 are penetrated and installed with fixed limit rod piece one 3, the inner side of two sliding plates 2 is fixedly connected with symmetrical shock-absorbing sponge 6, in initial state, two sliding plates 2 are in the inside of mounting frame 17, because the both ends are penetrated and installed with limit rod piece one 3, it can only slide along limit rod piece one 3 horizontally. At this time, the symmetrical shock-absorbing sponge 6 of sliding plate 2 inner side is in natural state, when integrated circuit board 1 is placed into mounting frame 17, if there is certain placing impact force, integrated circuit board 1 first contacts shock-absorbing sponge 6, shock-absorbing sponge 6 can effectively absorb this part of impact force by its good elasticity and buffering performance, prevent integrated circuit board 1 from being damaged due to collision, provide preliminary protection for chip.

[0027] Further, the retracting device comprises retracting springs 4, connecting rods 5, adjusting holes 7, pressing plates 8, two symmetrical square adjusting holes 7 are arranged on the two sides of the mounting frame 17 away from the integrated circuit board 1, the pressing plates 8 are slidably arranged in the two symmetrical adjusting holes 7, the connecting rods 5 are fixedly connected to the center of the side end of the sliding plate 2 away from the integrated circuit board 1, the other end of the connecting rods 5 is fixedly connected to the pressing plates 8, a plurality of retracting springs 4 are fixedly connected to the inside of the mounting frame 17 on the side of the sliding plate 2 away from the integrated circuit board 1, the other side of the plurality of retracting springs 4 is fixedly connected to the inside of the mounting frame 17, when the position of the integrated circuit board 1 needs to be finely adjusted, the operator presses the pressing plates 8 in the adjusting holes 7 on the two sides of the mounting frame 17 to realize. The pressing plates 8 slide in the adjusting holes 7, since the pressing plates 8 are fixedly connected to the sliding plate 2 through the connecting rods 5, when the pressing plates 8 are pressed, the connecting rods 5 will be moved, and then the sliding plate 2 is pushed to slide on the limiting rods 3, the plurality of retracting springs 4 on the side of the sliding plate 2 away from the integrated circuit board 1 are compressed in this process, by controlling the pressing degree of the pressing plates 8, that is, controlling the compression amount of the retracting springs 4, the position of the sliding plate 2 can be accurately adjusted, since the integrated circuit board 1 and the sliding plate 2 have a mutual interaction relationship, the fine adjustment of the position of the integrated circuit board 1 is realized, so that the integrated circuit board 1 can be accurately aligned with the related components such as the packaging device, and the accuracy and effectiveness of the packaging are ensured, when the pressing plates 8 are released after being adjusted to the appropriate position, the retracting springs 4 which are compressed will push the sliding plate 2 to return to the original position due to the elastic restoring force of the retracting springs 4, the characteristics of the retracting springs 4 make the sliding plate 2 be able to keep fixed after adjustment, and then the position of the integrated circuit board 1 is ensured to be stable and unchanged, which provides a stable basis for subsequent packaging operation, and avoids affecting the packaging quality due to the position change of the integrated circuit board 1 in the packaging process.

[0028] Further, the packaging device comprises the limiting rod piece two 9, the sealing layer one 10, the packaging frame 11, the sealing layer two 14, the lower packaging plate 15, the outer side of the mounting frame 17 is fixedly installed with the packaging frame 11, the upper end of the packaging frame 11 is tightly combined with the sealing layer one 10, the four corner positions of the mounting frame 17 are fixedly installed with a plurality of limiting rod piece two 9, the bottom end of the packaging frame 11 is tightly combined with the sealing layer two 14, the bottom end of the sealing layer two 14 is fixedly installed with the lower packaging plate 15, the packaging frame 11 outside the mounting frame 17 surrounds the integrated circuit board 1 to form a relatively closed space. The sealing layer one 10 tightly combined with the upper end of the packaging frame 11 and the sealing layer two 14 tightly combined with the bottom end of the packaging frame 11 play a key sealing role, the sealing layer one 10 and the sealing layer two 14 can effectively prevent the impurities such as dust and moisture from the outside into the packaging area, avoid the adverse effects of these impurities on the performance of the integrated circuit board 1, such as short circuit, corrosion and the like, provide the integrated circuit board 1 with preliminary packaging protection, the plurality of limiting rod piece two 9 fixedly installed at the four corner positions of the mounting frame 17 provide the packaging frame 11 with positioning and supporting role, the limiting rod piece two 9 ensures that the packaging frame 11 can be accurately installed in place during the installation process, and after the packaging is completed, the entire packaging structure can be kept stable, the lower packaging plate 15 fixedly installed at the bottom end of the sealing layer two 14 further enhances the bottom support and sealing performance of the packaging structure, so that the entire packaging structure is more firm and complete, and provides the integrated circuit board 1 with all-round protection.

[0029] Further, the sliding packaging structure comprises the upper packaging plate 18 and the fastening bolt 19, the upper packaging plate 18 is slidably installed above the contraction spring 4, a plurality of fastening bolts 19 are threadedly connected to the top end of the upper packaging plate 18 above the limiting rod piece two 9, the upper packaging plate 18 cooperates with the limiting rod piece two 9 through the fastening bolt 19 threadedly connected at the top end, when it is necessary to fix the upper packaging plate 18, the fastening bolt 19 moves downward along the limiting rod piece two 9 by tightening, so that the upper packaging plate 18 is tightly pressed on the integrated circuit board 1, this fastening mode can provide stable pressure, ensure the sealing property between the upper packaging plate 18 and the integrated circuit board 1 and the entire packaging structure, and good sealing property is crucial for preventing internal components from being damp and oxidized and ensuring the stability of electrical connection, thereby improving the quality and reliability of the packaging.

[0030] Further, the heat dissipation device comprises heat dissipation holes 12, a heat dissipation fan 13 and heat dissipation strip holes 16. The lower packaging plate 15 is provided with a plurality of heat dissipation strip holes 16 which are linearly and equidistantly distributed. The side end of the packaging frame 11 is provided with a plurality of heat dissipation holes 12 which are linearly and equidistantly distributed. The top end of the upper packaging plate 18 is fixedly provided with the heat dissipation fan 13. The heat dissipation fan 13 fixedly provided at the top end of the upper packaging plate 18 is started when the integrated circuit board 1 works. The heat dissipation fan 13 rotates to generate airflow, which accelerates the flow speed of the air inside the packaging. Under the action of the heat dissipation fan 13, the hot air inside the packaging is quickly extracted and discharged to the outside environment through the heat dissipation strip holes 16 and the heat dissipation holes 12. At the same time, the cold air from the outside is sucked into the packaging, forming forced convection heat dissipation. This forced convection heat dissipation mode greatly improves the heat dissipation efficiency, can effectively dissipate the heat generated by the integrated circuit board 1 in time, further reduces the working temperature of the integrated circuit board 1, ensures stable operation of the integrated circuit board 1 in a high-performance state, and prolongs the service life of the integrated circuit.

[0031] Working principle: when the device needs to be used, the integrated circuit board 1 is placed in the mounting frame 17, and in the process of placing, the integrated circuit board 1 will contact with the sliding plate 2 installed on both sides of the mounting frame 17, the sliding plate 2 penetrates through the limiting rod one 3 at both ends, so that it can only slide horizontally along the limiting rod one 3, and the shock absorbing sponge 6 on the inner side of the sliding plate 2 can play a buffering role, preventing the integrated circuit board 1 from being damaged by collision during installation, and also helping to fix the position of the integrated circuit board 1 to a certain extent, so that it remains relatively stable, when the integrated circuit board 1 is placed in position, if further adjustment is needed to ensure accurate packaging, the pressing plate 8 in the adjusting hole 7 on both sides of the mounting frame 17 can be pressed to achieve this, the pressing plate 8 is connected with the sliding plate 2 through the connecting rod 5, when the pressing plate 8 is pressed, the connecting rod 5 will push the sliding plate 2 to slide on the limiting rod one 3, the contraction spring 4 on the side of the sliding plate 2 away from the integrated circuit board 1 is compressed, by controlling the pressing degree of the pressing plate 8, the position of the sliding plate 2 can be accurately adjusted, so that the position of the integrated circuit board 1 is fine tuned, so that it is accurately aligned with the packaging device and other related components, facilitating subsequent packaging operation, after adjustment is completed, the pressing plate 8 is released, the contraction spring 4 returns to its original state, so that the sliding plate 2 remains in the adjusted position, the packaging device starts to work, the packaging frame 11 on the outside of the mounting frame 17 surrounds the integrated circuit board 1, the upper end of the packaging frame 11 is tightly attached to the sealing layer one 10, and the bottom end is tightly attached to the sealing layer two 14, forming a preliminary packaging protection structure, preventing foreign matter from entering the packaging area and affecting the packaging effect and the performance of the integrated circuit board, the sealing layer one 10 and the sealing layer two 14 play the role of sealing, moisture-proof, dust-proof and other functions, protecting the integrated circuit board from environmental factors, the upper packaging plate 18 is placed above the integrated circuit board 1 along the contraction spring 4, the top end of the upper packaging plate 18 is fixed in the appropriate position through the fastening bolt 19 screwed with the limiting rod two 9. By tightening the fastening bolt 19, the upper packaging plate 18 can be tightly pressed on the integrated circuit board 1, further enhancing the sealing and stability of the packaging, in this process, compared with the traditional complex packaging operation, the sliding installation and fastening bolt fixing method greatly simplifies the steps, improves the packaging speed and effectively shortens the packaging cycle.The heat dissipation path is optimized, and through the cooperation of the heat dissipation holes, the heat dissipation strip-shaped holes and the heat dissipation fan, the temperature of the integrated circuit board can be effectively reduced in time, the stable operation of the integrated circuit board in the normal working temperature range is ensured, and the reliability and performance of the integrated circuit are improved.

[0032] Although the embodiments of the utility model have been shown and described, it can be understood by those of ordinary skill in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A rapid packaging structure for integrated circuits, comprising an integrated circuit board (1) and a mounting bracket (17), characterized in that: The integrated circuit board (1) is provided with adjustment devices on the front and rear sides, and with shrinking devices at both ends. The mounting bracket (17) is provided with a packaging device on the outside, with a sliding packaging structure at the top and a heat dissipation device at the bottom.

2. The integrated circuit rapid packaging structure according to claim 1, characterized in that: The adjustment device includes a sliding plate (2), a limiting rod (3), and a shock-absorbing sponge (6). Two symmetrical sliding plates (2) are slidably installed inside the mounting frame (17). The two sliding plates (2) are fixedly installed at both ends by a limiting rod (3). The two sliding plates (2) are fixedly connected to the inner sides by symmetrical shock-absorbing sponges (6).

3. The integrated circuit rapid packaging structure according to claim 2, characterized in that: The shrinking device includes a shrinking spring (4), a connecting rod (5), an adjustment hole (7), and a pressing plate (8). The mounting bracket (17) has two symmetrical square adjustment holes (7) on both sides away from the integrated circuit board (1). The pressing plate (8) is slidably installed inside the two symmetrical adjustment holes (7). The sliding plate (2) is fixedly connected to the connecting rod (5) at the center of the side end away from the integrated circuit board (1). The other end of the connecting rod (5) is fixedly connected to the pressing plate (8). The sliding plate (2) is fixedly connected to a plurality of shrinking springs (4) that are equidistantly distributed in a straight line on one side away from the integrated circuit board (1). The other side of the plurality of shrinking springs (4) is fixedly connected to the inside of the mounting bracket (17).

4. The integrated circuit rapid packaging structure according to claim 3, characterized in that: The packaging device includes a second limiting rod (9), a first sealing layer (10), a packaging frame (11), a second sealing layer (14), and a lower packaging plate (15). The packaging frame (11) is fixedly installed on the outside of the mounting frame (17). The first sealing layer (10) is tightly attached to the upper end of the packaging frame (11). Multiple second limiting rods (9) are fixedly installed at the four corners of the mounting frame (17). The second sealing layer (14) is tightly attached to the bottom end of the packaging frame (11). The lower packaging plate (15) is fixedly installed at the bottom end of the second sealing layer (14).

5. The integrated circuit rapid packaging structure according to claim 4, characterized in that: The sliding encapsulation structure includes an upper encapsulation plate (18) and fastening bolts (19). The upper encapsulation plate (18) is slidably installed above the retraction spring (4). Multiple fastening bolts (19) are threadedly connected to the top of the upper encapsulation plate (18) above the limiting rod (9).

6. The integrated circuit rapid packaging structure according to claim 5, characterized in that: The heat dissipation device includes heat dissipation holes (12), a heat dissipation fan (13), and heat dissipation strip holes (16). The lower encapsulation plate (15) has multiple heat dissipation strip holes (16) that are distributed in a straight line at equal intervals. The side end of the encapsulation frame (11) has multiple heat dissipation holes (12) that are distributed in a straight line at equal intervals. The top of the upper encapsulation plate (18) is fixedly installed with a heat dissipation fan (13).

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