Heat dissipation device and data acquisition equipment
By designing a heat dissipation device in electronic devices and utilizing a heat dissipation channel composed of a heat dissipation substrate and fins, the problem of low heat dissipation efficiency in existing technologies is solved, achieving a more efficient heat dissipation effect.
Patent Information
- Application Number
- CN202423219010.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2034-12-24
AI Technical Summary
Existing electronic device heat sinks have low heat dissipation efficiency and cannot effectively solve the operational problems caused by high temperatures of internal chips.
Design a heat dissipation device, including a housing and a heat dissipation component. The heat dissipation component consists of a heat dissipation substrate and heat dissipation fins. A heat dissipation channel runs through the component to be dissipated and the heat dissipation substrate, ensuring that the component to be dissipated is in full contact with the heat dissipation substrate and forming a heat dissipation channel, avoiding the heat dissipation substrate from blocking the heat flow and enhancing the smoothness of heat flow.
It improves heat dissipation efficiency, ensures smooth heat flow, enhances heat dissipation effect, reduces the impact of the heat dissipation substrate on heat flow, and achieves more efficient heat dissipation.
Smart Images
Figure CN223899512U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology for electronic devices, and more specifically, to a heat dissipation device and a data acquisition device. Background Technology
[0002] During operation, some electronic devices generate high temperatures from the chips on their internal motherboards. Once the temperature reaches a critical value, the device will malfunction. Currently, many electronic devices use heat sinks with low heat dissipation efficiency. Therefore, improving heat dissipation efficiency has become a pressing technical problem for those skilled in the art. Utility Model Content
[0003] In view of this, the purpose of this application is to provide a heat dissipation device to improve heat dissipation efficiency.
[0004] Another objective of this application is to provide a data acquisition device including the aforementioned heat dissipation device.
[0005] To achieve the above objectives, this application provides the following technical solution:
[0006] A heat dissipation device includes a housing and a heat dissipation assembly;
[0007] The housing contains components that need to dissipate heat.
[0008] The heat dissipation assembly includes a heat dissipation substrate and heat dissipation fins. The heat dissipation substrate is disposed inside the housing and connected to the component to be cooled. The heat dissipation fins are connected to the heat dissipation substrate and form a heat dissipation channel. The heat dissipation channel extends along the component to be cooled toward the heat dissipation substrate.
[0009] Along the direction from the component to be cooled to the heat dissipation substrate, the projection of the heat dissipation substrate completely covers the projection of the component to be cooled.
[0010] Optionally, in the above-described heat dissipation device, the heat dissipation fins are arranged in a staggered manner with respect to the heat dissipation substrate along the direction from the component to be dissipated to the heat dissipation substrate.
[0011] Optionally, in the above-described heat dissipation device, the heat dissipation substrate includes a first substrate, the heat dissipation fins include a plurality of first fins, and the heat dissipation flow channel is formed between two adjacent first fins;
[0012] The first substrate is disposed inside the housing and connected to the component to be cooled. The projection of the first substrate completely covers the projection of the component to be cooled along the direction from the component to the first substrate. The first fin is connected to at least one sidewall of the first substrate in the circumferential direction.
[0013] Optionally, in the above-described heat dissipation device, the heat flow generated by the heat emitted by the component to be dissipated flows along the through direction of the heat dissipation channel.
[0014] The first fin extends away from the first substrate, and the direction of extension is perpendicular to the direction of penetration of the heat dissipation channel.
[0015] Optionally, in the above-mentioned heat dissipation device, the housing is provided with a clearance hole, and part or all of the first fins pass through the clearance hole and are exposed outside the housing.
[0016] Optionally, in the above-described heat dissipation device, the first substrate and the first fin are an integral structure.
[0017] Optionally, in the above-mentioned heat dissipation device, the heat dissipation substrate includes a second substrate, the heat dissipation fins include a plurality of second fins, the heat dissipation channel is formed between two adjacent second fins, and the second substrate and the second fins are connected by a heat pipe.
[0018] The second substrate is disposed inside the housing and connected to the component to be cooled, and the projection of the second substrate completely covers the projection of the component to be cooled along the direction from the component to the second substrate.
[0019] Optionally, in the above-described heat dissipation device, a mounting groove is provided on the side of the second substrate facing the component to be dissipated, and one end of the heat pipe is embedded in the mounting groove.
[0020] Optionally, in the above-described heat dissipation device, the second fin is disposed inside or outside the housing; and / or,
[0021] The second fin is directly attached to the shell or indirectly attached through a heat-conducting medium.
[0022] Optionally, in the above-described heat dissipation device, the side of the heat dissipation substrate facing away from the component to be dissipated is directly attached to the housing or indirectly attached through a thermally conductive medium.
[0023] Optionally, in the above-described heat dissipation device, the component to be dissipated is disposed on the mounting member, and along the extending direction of the heat dissipation fins, the ends of the heat dissipation fins extend beyond the mounting member.
[0024] Optionally, in the above-described heat dissipation device, the component to be dissipated includes a chip, and the mounting component includes a PCBA board.
[0025] A data acquisition device includes the aforementioned heat dissipation device.
[0026] The heat dissipation device provided in this application includes a housing and a heat dissipation assembly. A component to be cooled is disposed within the housing. The heat dissipation assembly includes a heat dissipation substrate and heat dissipation fins. The heat dissipation substrate is disposed within the housing and connected to the component to be cooled. The heat dissipation fins are connected to the heat dissipation substrate and form a heat dissipation channel. This heat dissipation channel extends along the direction from the component to the heat dissipation substrate and is unaffected by the heat dissipation substrate. Along the direction from the component to the heat dissipation substrate, the projection of the heat dissipation substrate completely covers the projection of the component to be cooled, allowing the heat dissipation surface of the component facing the heat dissipation substrate to fully contact the substrate for heat dissipation. Simultaneously, since the heat dissipation surface of the component, besides contacting the heat dissipation substrate, also contacts the air for heat dissipation, the heat dissipation fins can contact this portion of the air for heat exchange. Furthermore, the formed heat dissipation channel allows heat flow to proceed along the direction from the component to the heat dissipation substrate, thereby avoiding obstruction by the heat dissipation substrate, ensuring smooth heat flow, and improving heat dissipation efficiency. Compared with the prior art, the heat dissipation channel of the heat dissipation device provided in this application allows heat flow to be conducted along the direction of the component to be dissipated to the first substrate until it is conducted to the shell and exchanged with the external environment, reducing the influence of the heat dissipation substrate on the smoothness of heat flow, resulting in better heat dissipation effect and higher heat dissipation efficiency.
[0027] The data acquisition device provided in this application includes the aforementioned heat dissipation device, and therefore also possesses the aforementioned structure and beneficial effects. Other structures can be referred to in the prior art, and will not be described in detail here. Attached Figure Description
[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. The dashed arrows in the figures indicate the through direction of the heat dissipation channel.
[0029] Figure 1 This is a schematic diagram of the overall structure of the first heat dissipation device disclosed in the embodiments of this application;
[0030] Figure 2 This is an exploded view of the first heat dissipation device disclosed in the embodiments of this application;
[0031] Figure 3 This is a schematic diagram of the internal structure of the first heat dissipation device disclosed in the embodiments of this application;
[0032] Figure 4 This is a schematic diagram of the installation of the first type of heat sink and the component to be cooled, as disclosed in the embodiments of this application;
[0033] Figure 5This is a schematic diagram of the internal structure of the second heat dissipation device disclosed in the embodiments of this application;
[0034] Figure 6 This is an exploded view of the second heat dissipation device disclosed in the embodiments of this application;
[0035] Figure 7 This is a schematic diagram of the installation of the second type of heat sink and the component to be cooled, as disclosed in the embodiments of this application. Figure 1 ;
[0036] Figure 8 This is a schematic diagram of the installation of the second type of heat sink and the component to be cooled, as disclosed in the embodiments of this application. Figure 2 .
[0037] Wherein, 100 is the shell, 110 is the cover, 120 is the body, 200 is the heat dissipation component, 210 is the first substrate, 211 is the first fin, 220 is the second substrate, 221 is the heat pipe, 222 is the second fin, 300 is the heat transfer medium, 400 is the connector, 500 is the component to be dissipated, and 510 is the mounting component. Detailed Implementation
[0038] The core of this application is to disclose a heat dissipation device to improve heat dissipation efficiency.
[0039] Another key aspect of this application is the disclosure of a data acquisition device that includes the aforementioned heat dissipation device.
[0040] Hereinafter, embodiments will be described with reference to the accompanying drawings. Furthermore, the embodiments shown below do not limit the scope of the utility model as described in the claims. Additionally, the complete contents of the structures represented in the embodiments below are not limited to those necessary for the solution of the utility model as described in the claims. It should be noted that, for ease of description, only the parts relevant to the utility model are shown in the drawings. Unless otherwise specified, the embodiments and features described in this application can be combined with each other.
[0041] Combination Figures 1-8The heat dissipation device disclosed in this application includes a housing 100 and a heat dissipation assembly 200. A component 500 to be cooled is disposed within the housing 100. The heat dissipation assembly 200 includes a heat dissipation substrate and heat dissipation fins. The heat dissipation substrate is disposed within the housing 100 and connected to the component 500. The heat dissipation fins are connected to the heat dissipation substrate and form a heat dissipation channel. The heat dissipation channel extends along the direction from the component 500 to the heat dissipation substrate and is unaffected by the heat dissipation substrate. Along the direction from the component 500 to the heat dissipation substrate, the projection of the heat dissipation substrate completely covers the projection of the component 500, allowing the heat dissipation surface of the component 500 facing the heat dissipation substrate to fully contact the heat dissipation substrate for heat dissipation. Simultaneously, since the heat dissipation surface of the component 500, in addition to contacting the heat dissipation substrate, also contacts the air for heat dissipation, the heat dissipation fins can contact this portion of the air for heat exchange. Furthermore, the formed heat dissipation channel allows heat flow to occur along the direction from the component 500 to the heat dissipation substrate, thereby avoiding obstruction by the heat dissipation substrate, ensuring smooth heat flow, and improving heat dissipation efficiency.
[0042] Compared with the prior art, the heat dissipation channel of the heat dissipation device disclosed in this application allows heat flow to be conducted along the direction from the component to be dissipated 500 to the first substrate 210 until it reaches the housing 100 to exchange heat with the external environment. This reduces the influence of the heat dissipation substrate on the smoothness of heat flow, resulting in better heat dissipation effect and higher heat dissipation efficiency.
[0043] The component to be cooled 500 includes various electronic and mechanical components capable of generating heat, such as chips, power devices, and power supplies. In some embodiments, along the direction from the component to be cooled 500 to the heat dissipation assembly 200, the projection of the component to be cooled 500 completely coincides with the projection of the heat dissipation assembly 200, and is positioned at the middle of the projection of the heat dissipation assembly 200, so as to ensure a balanced heat dissipation effect of the heat dissipation assembly 200 on the component to be cooled 500.
[0044] Combination Figure 2 and Figure 3 Along the direction from the component to be cooled 500 to the heat dissipation substrate, the heat dissipation fins are staggered with the heat dissipation substrate to avoid the heat dissipation substrate affecting the flow of heat, thereby improving the smoothness of heat flow and ensuring the heat dissipation effect.
[0045] In a specific embodiment disclosed in this application, the heat dissipation substrate includes a first substrate 210, and the heat dissipation fins include a plurality of first fins 211, with a heat dissipation channel formed between two adjacent first fins 211. The first substrate 210 is disposed within the housing 100 and connected to the component 500 to be cooled. Along the direction from the component 500 to the first substrate 210, the projection of the first substrate 210 completely covers the projection of the component 500 to be cooled, ensuring sufficient contact and heat exchange with the heat dissipation surface of the component 500 facing the heat dissipation assembly 200. Furthermore, along the direction from the component 500 to the first substrate 210, the projection of the component 500 is positioned at the center of the projection of the first substrate 210, ensuring a balanced heat dissipation effect from the first substrate 210 on the component 500. The first fins 211 are connected to the first substrate 210, which can conduct heat from the first substrate 210 and contact the air for heat dissipation, increasing the heat dissipation area and improving heat dissipation efficiency. In order to ensure sufficient contact with the component 500 to be cooled, the first substrate 210 may be in the form of a plate. For example, the first substrate 210 may include, but is not limited to, a solid metal plate, a heat spreader, a heat pipe, etc.
[0046] Specifically, along the direction from the heat-dissipating component 500 to the first substrate 210, the first fin 211 can be connected to at least one sidewall of the first substrate 210 in the circumferential direction. This solution can reduce the space occupied along the direction from the heat-dissipating component 500 to the first substrate 210 and is suitable for housings 100 with a relatively narrow height.
[0047] Those skilled in the art will understand that the hot air formed by the heat dissipated from the heat-dissipating component 500 into the air has a lower density than cold air, thus creating an upward-flowing heat current. Combined with Figure 2 and Figure 3 In one specific embodiment, the first substrate 210 is disposed above the component 500 to be cooled, and the first fin 211 extends away from the first substrate 210, and the extension direction is perpendicular to the through direction of the heat dissipation channel, so that the main heat flow formed by the heat dissipation of the component 500 can automatically flow along the through direction of the heat dissipation channel, ensuring the smooth flow of heat flow and improving heat dissipation efficiency.
[0048] Among them, combined Figure 4The first substrate 210 and the first fin 211 can be an integral structure. The first fin 211 is formed by slotting on the heat dissipation assembly 200. The specific layout of the first fin 211 on the first substrate 210 can be adapted to the internal space of the housing 100. The shape and extension length of each first fin 211 can be the same or different. The heat conduction effect is better when the first substrate 210 and the first fin 211 are an integral structure. The first substrate 210 can be fixed to the heat dissipation component 500 or the housing 100 by means of screws or other connectors 400, adhesive bonding, etc., which is convenient for installation.
[0049] To further optimize the design, clearance holes are provided on the housing 100, through which some or all of the first fins 211 pass and are exposed outside the housing 100. This facilitates direct contact between the heat dissipation component 200 and the external environment for heat exchange, thereby improving heat dissipation efficiency. It should be noted that since some components 500 to be cooled need to operate outdoors, the housing 100 needs to provide a sealed environment to ensure their service life. Therefore, after the first fins 211 pass through the clearance holes, waterproof adhesive or similar materials can be used to seal and fill the gap between the clearance holes and the first fins 211, ensuring a sealed environment inside the housing 100.
[0050] In a specific embodiment disclosed in this application, the heat dissipation substrate includes a second substrate 220, and the heat dissipation fins include a plurality of second fins 222. A heat dissipation channel is formed between two adjacent second fins 222, and the second substrate 220 and the second fins 222 are connected by a heat pipe 221. The second substrate 220 is disposed in the housing 100 and connected to the component 500 to be cooled. Along the direction from the component 500 to the second substrate 220, the projection of the second substrate 220 completely covers the projection of the component 500 to be cooled, so that the component 500 to be cooled can have sufficient contact and heat exchange with the second substrate 220. In some embodiments, along the direction from the second substrate 220 to the component 500 to be cooled, the component 500 to be cooled is disposed at the middle position of the projection of the second substrate 220, so as to ensure the balanced heat dissipation effect of the second substrate 220 on the component 500 to be cooled. The two ends of the heat pipe 221 are connected to the second substrate 220 and the second fin 222 respectively. It can exchange heat with its environment and can conduct heat from the second substrate 220 to the second fin 222 for heat dissipation. Each component in the heat dissipation assembly 200 can exchange heat with its environment, with a large heat exchange area and higher heat dissipation efficiency.
[0051] The heat pipe 221 is at least one in number, and each heat pipe 221 corresponds to a second fin 222 for heat conduction. The types of heat pipe 221 include, but are not limited to, solid metal pipes, ordinary heat pipes, microfluidic heat pipes, etc. Among ordinary heat pipes, copper pipes have better heat conduction effect and can conduct heat from the component to be cooled 500 to the second fin 222 for heat dissipation more quickly. The second substrate 220 includes, but is not limited to, solid plate structure, heat spreader, heat pipe, etc. The solid plate structure of the second substrate 220 can be made of aluminum. The second fin 222 can be made of aluminum, which is low in cost and easy to produce.
[0052] To further optimize the heat conduction effect, combined with Figure 7 and Figure 8 The second substrate 220 has a mounting groove on the side facing the component 500 to be cooled. The mounting groove is adapted to the shape of the heat pipe 221. The first end of the heat pipe 221 is embedded in the mounting groove and positioned between the second substrate 220 and the component 500 to be cooled. The second end of the heat pipe 221 passes through the component 500 to be cooled and connects to it, so that the heat pipe 221 can be tightly fitted with the second substrate 220 and the component 500 to conduct heat, ensuring heat dissipation efficiency. To ensure the heat conduction effect, the second substrate 220 and the heat pipe 221 can be fixed together by interference fit, welding, adhesive bonding, or other methods. The heat pipe 221 and the second fin 222 can also be tightly fitted and fixed together by interference fit, welding, adhesive bonding, or other methods.
[0053] Specifically, the second fin 222 can be disposed inside or outside the housing 100. Disposing the second fin 222 outside the housing 100 allows it to directly dissipate heat from the external environment, enhancing the heat dissipation effect. When the second fin 222 is disposed inside the housing 100, it can be arranged at a relatively far distance from the component 500 to be cooled, or it can be placed in a location within the housing 100 with good heat flow. When the second fin 222 and the component 500 to be cooled are arranged at a relatively far distance, the heat pipe 221 has a longer extension length to dissipate heat from its surroundings, reducing the impact of heat exchange between the second fin 222 and its surroundings on the component 500 to be cooled. When the second fin 222 is placed at the air inlet / outlet of the housing 100 or near the cooling system, or in a location with good heat flow, the heat dissipation efficiency can be effectively improved. Furthermore, when the second fin 222 is located at the air inlet or outlet of the housing 100, the fin gap of the second fin 222 can be adjusted to be arranged opposite to the air inlet or outlet to facilitate heat flow and heat dissipation.
[0054] The second fin 222 can be directly attached to the housing 100 or indirectly attached through the heat-conducting medium 300, so that the second fin 222 can conduct heat to the housing 100 and exchange heat with the external environment over a larger area through the housing 100, thereby enhancing the heat exchange effect. In some embodiments, the heat-conducting pipe 221 is arranged in a way that is attached to the housing 100, so that the heat-conducting pipe 221 can directly contact the housing 100 for heat exchange, thereby enhancing the heat exchange effect.
[0055] To enhance thermal conductivity, the heat dissipation substrate can be directly bonded to the component 500 to be cooled, or indirectly bonded through a thermally conductive medium 300. The side of the heat dissipation substrate facing away from the component 500 can also be directly bonded to the housing 100, or indirectly bonded through a thermally conductive medium 300, until the heat from the component 500 is conducted to the outside of the housing 100. The thermally conductive medium 300 can be one or more of the following: heat pipes, vapor chambers, and thermal interface materials. The order of these various thermally conductive media between the component 500 and the heat dissipation substrate, and between the heat dissipation substrate and the housing 100, is not limited. Both heat pipes and vapor chambers have good thermal conductivity. The thermal interface material can be filled between the first substrate 210 and the component 500 to be cooled, reducing heat transfer resistance and improving thermal conductivity.
[0056] Exemplary, in one embodiment, combined with Figure 2 The housing 100 includes a box body 120 and a box cover 110, which are connected to form an installation space. The component to be cooled 500 includes a chip, which is mounted in the installation space via a PCBA board. The two sides of the first substrate 210 are fully attached to the box cover 110 and the component to be cooled 500 via a thermally conductive medium 300. Along a direction perpendicular to the heat dissipation assembly 200 toward the component to be cooled 500, the first fins 211 extend beyond the PCBA board, and the first substrate 210 is connected to the PCBA board via a connector 400, which presses the chip. When the chip and PCBA board are in operation, part of the heat emitted is conducted to the box cover 110 via the thermally conductive medium 300 and the first substrate 210 and exchanges heat with the external environment, while the other part exchanges heat with the air inside the housing 100 to form a heat flow. The heat flow is guided along the heat dissipation channels between the first fins 211 to the box cover 110 for heat exchange with the external environment.
[0057] To further optimize heat dissipation, along the extension direction of the heat dissipation fins, the fins extend beyond the area of the component to be cooled 500 and beyond the area of other components that may affect heat flow. For example, in combination with… Figure 2 and Figure 3The heat-dissipating component 500 is disposed on the mounting member 510. Along the direction from the heat-dissipating component 500 to the first substrate 210, the projection of the first substrate 210 completely covers the projection of the heat-dissipating component 500, and along the extension direction of the first fin 211, the end of the first fin 211 extends beyond the mounting member 510. In some embodiments, the heat-dissipating component 500 includes a chip, and the mounting member 510 includes a PCBA (Printed Circuit Board Assembly) board.
[0058] Some current data acquisition devices also suffer from low heat dissipation efficiency. Therefore, this application also discloses a data acquisition device that includes the above-mentioned heat dissipation device. Since it includes the above-mentioned heat dissipation device, it also has the above-mentioned structure and beneficial effects. Other structures can be referred to the prior art, and will not be described in detail here.
[0059] It should be noted that the heat dissipation device disclosed in this application can be used in the field of data acquisition technology equipment or other fields. Other fields refer to any field other than the field of data acquisition equipment technology, such as signal conditioner technology, data storage device technology, communication equipment technology, power device technology, etc. The above are merely examples and do not limit the application field of the heat dissipation device disclosed in this application.
[0060] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Specific technical means in some embodiments may be incorporated, in whole or in part, into another embodiment unless explicitly excluded by another embodiment. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A heat dissipation device, characterized in that, Includes a housing (100) and a heat dissipation assembly (200); The housing (100) contains a heat dissipation component (500). The heat dissipation assembly (200) includes a heat dissipation substrate and heat dissipation fins. The heat dissipation substrate is disposed in the housing (100) and connected to the component to be cooled (500). The heat dissipation fins are connected to the heat dissipation substrate and form a heat dissipation channel. The heat dissipation channel extends along the component to be cooled (500) toward the heat dissipation substrate. Along the direction from the heat-dissipating component (500) to the heat-dissipating substrate, the projection of the heat-dissipating substrate completely covers the projection of the heat-dissipating component (500).
2. The heat dissipation device as described in claim 1, characterized in that, Along the direction from the heat-dissipating component (500) to the heat-dissipating substrate, the heat dissipation fins are arranged in a staggered manner with respect to the heat dissipation substrate.
3. The heat dissipation device as described in claim 2, characterized in that, The heat dissipation substrate includes a first substrate (210), and the heat dissipation fins include a plurality of first fins (211), with the heat dissipation channel formed between two adjacent first fins (211). The first substrate (210) is disposed inside the housing (100) and connected to the heat dissipation component (500). Along the direction from the heat dissipation component (500) to the first substrate (210), the projection of the first substrate (210) completely covers the projection of the heat dissipation component (500). The first fin (211) is connected to at least one sidewall of the first substrate (210) in the circumferential direction.
4. The heat dissipation device as described in claim 3, characterized in that, The heat generated by the heat dissipated by the component to be cooled (500) flows along the through direction of the heat dissipation channel. The first fin (211) extends away from the first substrate (210) and the extension direction is perpendicular to the through direction of the heat dissipation channel.
5. The heat dissipation device as described in claim 3, characterized in that, The housing (100) has a clearance hole, through which part or all of the first fin (211) passes and is exposed on the housing (100).
6. The heat dissipation device as described in claim 3, characterized in that, The first substrate (210) and the first fin (211) are an integral structure.
7. The heat dissipation device as described in claim 1, characterized in that, The heat dissipation substrate includes a second substrate (220), the heat dissipation fins include a plurality of second fins (222), the heat dissipation channel is formed between two adjacent second fins (222), and the second substrate (220) and the second fins (222) are connected by a heat pipe (221). The second substrate (220) is disposed inside the housing (100) and connected to the heat dissipation component (500). The projection of the second substrate (220) completely covers the projection of the heat dissipation component (500) along the direction from the heat dissipation component (500) to the second substrate (220).
8. The heat dissipation device as described in claim 7, characterized in that, The second substrate (220) has a mounting groove on the side facing the heat dissipation component (500), and one end of the heat pipe (221) is embedded in the mounting groove.
9. The heat dissipation device as described in claim 7, characterized in that, The second fin (222) is disposed inside or outside the housing (100); and / or, The second fin (222) is directly attached to the housing (100) or indirectly attached through a heat-conducting medium (300).
10. The heat dissipation device as claimed in claim 1, characterized in that, The side of the heat dissipation substrate facing away from the heat dissipation component (500) is directly attached to the housing (100) or indirectly attached through a thermally conductive medium (300).
11. The heat dissipation device as claimed in claim 1, characterized in that, The heat-dissipating component (500) is disposed on the mounting member (510), and the end of the heat dissipation fin extends beyond the mounting member (510) along the extending direction of the heat dissipation fin.
12. The heat dissipation device as described in claim 11, characterized in that, The heat-dissipating component (500) includes a chip, and the mounting component (510) includes a PCBA board.
13. A data acquisition device, characterized in that, Includes the heat dissipation device as described in any one of claims 1-12.