Adjustable sensor heat dissipation mechanism

Abstract

In order to overcome the defects in the prior art, the utility model provides an adjustable sensor heat dissipation mechanism which comprises a heat dissipation mechanism, a connecting base is arranged at the bottom of the heat dissipation mechanism, and screws penetrate through mounting holes in the connecting base to be fixed with a sensor shell. Heat dissipation silica gel is detachably installed at the end, back to the connecting base, of the heat dissipation mechanism, and the top end of the heat dissipation silica gel extends out of the heat dissipation mechanism and makes contact with the heat dissipation face of the single-chip microcomputer. And the heat dissipation mechanism is prepared from a heat transfer substance or is filled with the heat transfer substance in contact with the heat dissipation silica gel. According to the utility model, the heat dissipation mechanism which is independently designed and detachable is adopted, so that the heat dissipation mechanism and the single-chip microcomputer can always form good contact by replacing heat dissipation silica gel or the heat dissipation mechanism according to design requirements after internal hardware is upgraded, and the heat dissipation efficiency of the single-chip microcomputer is improved. Therefore, effective heat dissipation of the upgraded single-chip microcomputer is realized on the basis of not changing a main heat dissipation structure or a shell main body structure.

Description

TECHNICAL FIELD

[0001] The utility model relates to sensor technical field, concretely is adjustable sensor heat radiation mechanism. BACKGROUND

[0002] In the small laser radar, the single-chip microcomputer of high frequency operation has great heat, and the heat needs to be conducted to the shell. In the prior art, the single-chip microcomputer is generally connected to the shell by using heat-conducting silica gel, and a suitable structure design is adopted, so that the single-chip microcomputer and the shell can be filled with a piece of heat-conducting silica gel to dissipate heat.

[0003] Although this design helps the heat dissipation of the laser radar, because the laser radar is miniaturized, the internal space is generally tight, and great changes need to be made to adapt to the miniaturization of the product during product upgrading. If the internal product changes, such as the circuit board changes from two boards to one board or vice versa, or the height of the circuit board changes due to the use of other chips, the previous shell may need to be redesigned and the mold changed due to the heat dissipation problem of the single-chip microcomputer, so the heat dissipation mechanism needs to be redesigned, which results in that the original heat dissipation mechanism cannot be used again, and therefore serious component waste is caused. SUMMARY

[0004] To solve the problems in the prior art, the utility model provides a kind of adjustable sensor heat radiation mechanism, comprising: heat radiation mechanism, the bottom of heat radiation mechanism is equipped with connecting base, installation hole is equipped on connecting base, and screw is fixed with sensor shell by passing through installation hole.The end of heat radiation mechanism opposite to connecting base is detachably installed with heat dissipation silica gel, and the top end of heat dissipation silica gel extends to the outside of heat radiation mechanism and contacts with the heat dissipation surface of single-chip microcomputer. Heat radiation mechanism is prepared by heat transfer substance, or filled with heat transfer substance in contact with heat dissipation silica gel.

[0005] Optionally, the heat transfer substance is aluminum, iron, copper, lead, activated carbon or other existing substances with good heat conductivity.

[0006] Further, the heat radiation mechanism is provided with a mounting column on the side wall close to the bottom, and the connecting base is provided with a mounting hole corresponding to the mounting column on the side wall along the axis of the mounting hole.

[0007] Further, the heat radiation mechanism is provided with a connecting table at a position opposite to the connecting base, and buckles corresponding in number to the connecting table. The buckle is connected to the connecting table by a torsion spring, and the buckle is provided with a clamping head extending towards the connecting base at the top end. The connecting base is provided with a clamping groove corresponding to the clamping head at the position corresponding to the clamping head.

[0008] Further, the heat dissipation mechanism side facing the single-chip microcomputer is provided with a heat dissipation silica gel slot, and the heat dissipation silica gel is matched with the heat dissipation silica gel slot and is connected in a plug-in mode.

[0009] Further, the heat dissipation silica gel comprises a hollow fixed mounting frame, and a heat dissipation silica gel body is fixed in the fixed mounting frame; one end of the heat dissipation silica gel body is in contact with the heat transfer substance of the heat dissipation mechanism, and the other end extends to the outside of the fixed mounting frame and the heat dissipation mechanism.

[0010] Further, the sensor shell is provided with an auxiliary fixing plate on the side opposite to the heat dissipation mechanism; the auxiliary fixing plate is provided with auxiliary fixing screw holes at positions corresponding to the mounting holes; and the screws are screwed and fastened through the mounting holes, the sensor shell and the auxiliary fixing screw holes.

[0011] The utility model discloses the beneficial effect lies in:

[0012] The utility model discloses the independent design detachable heat dissipation mechanism can be replaced with the heat dissipation silica gel or the mode of replacing the heat dissipation mechanism according to the design requirement after carrying out internal hardware upgrade, and the heat dissipation mechanism and single-chip microcomputer can form good contact all the time, and then effectively cool the upgraded single-chip microcomputer on the basis of not changing the main heat dissipation structure or shell main body structure. DRAWINGS

[0013] Figure 1 It is the structure schematic diagram of the adjustable sensor heat dissipation mechanism of the utility model;

[0014] Figure 2 It is the installation structure schematic diagram of the connecting base and the heat dissipation mechanism of the utility model;

[0015] Figure 3 It is the structure schematic diagram of the heat dissipation silica gel of the utility model;

[0016] Figure 4 It is the main body structure schematic diagram of the adjustable heat dissipation mechanism of the utility model;

[0017] Figure 5 It is the main body structure schematic diagram of another adjustable heat dissipation mechanism of the utility model;

[0018] Figure 6 It is the main body structure schematic diagram of the third adjustable heat dissipation mechanism of the utility model;

[0019] In the drawing:

[0020] 1, heat dissipation mechanism; 101, connecting table; 102, buckle; 103, torsional spring; 104, heat dissipation silica gel slot; 105, mounting column; 2, connecting base; 201, mounting hole; 202, mounting jack; 203, clamping groove; 3 mounting screw; 4, heat dissipation glue; 401, heat dissipation silica gel glue; 402, fixed mounting frame; 5, base plate; 6, single-chip microcomputer; 7, auxiliary fixing piece; 701, auxiliary fixing screw hole. DETAILED DESCRIPTION

[0021] The utility model will be explained in further detail in combination with the drawings. These drawings are all simplified schematic diagrams, and only schematically show the basic structure of the utility model, so they only show the structure related to the utility model.

[0022] Please note that the "upper", "lower", "left", "right", "top end", "top", "bottom end", "bottom" and the like used by the utility model to describe the positional relationship do not represent the absolute positional relationship between each module / component / assembly / part / element, but the relative positional relationship between each module / component / assembly / part / element.

[0023] Example 1

[0024] An adjustable sensor heat dissipation mechanism, as shown in Figure 1 The heat dissipation mechanism 1 is detachably mounted with heat dissipation silica gel 4 at the end opposite to the connecting base 2, the top end of the heat dissipation silica gel 4 extends to the outside of the heat dissipation mechanism 1 and is in contact with the heat dissipation surface of the single-chip microcomputer 6. The heat dissipation mechanism 1 is made of lead material, or made of PVC plastic and filled with lead blocks inside. When the heat dissipation mechanism 1 is made of lead material, a contact surface is provided between the heat dissipation mechanism 1 and the heat dissipation silica gel 4. When the heat dissipation mechanism 1 is made of PVC plastic and filled with lead blocks inside, a contact surface is provided between the lead blocks and the heat dissipation silica gel 4.

[0025] When the device is used, first, the corresponding connecting base 2 and heat dissipation mechanism 1 are fixed according to the mounting screw hole position of the sensor shell 5. Then the mounting screw 3 is screwed through the mounting hole 201 and the corresponding mounting screw hole on the sensor shell 5, so that the heat dissipation mechanism 1 is fixed with the sensor shell 5, so that the heat transfer substance of the heat dissipation silica gel 4 and the heat dissipation mechanism 1 forms a heat transfer channel connecting the single-chip microcomputer 6 and the heat dissipation port on the sensor shell 5, so as to realize the heat dissipation of the single-chip microcomputer 6. The contact of the heat dissipation silica gel 4 with the single-chip microcomputer 6 can realize the soft contact of the single-chip microcomputer 6, avoiding scratching or scratching the single-chip microcomputer 6.

[0026] When the internal substrate structure of the sensor changes, often involves the change of the position or height of the single-chip microcomputer 6, for example, the initial structure as shown in Figure 4 When the internal substrate structure of the sensor changes, often involves the change of the position or height of the single-chip microcomputer 6, for example, the initial structure as shown in Figure 6 When the internal substrate structure of the sensor changes, often involves the change of the position or height of the single-chip microcomputer 6, for example, the initial structure as shown in

[0027] When the internal substrate structure of the sensor changes, often involves the change of the position or height of the single-chip microcomputer 6, for example, the initial structure as shown in

[0028] Embodiment 2

[0029] The adjustable sensor cooling mechanism based on embodiment 1, as shown in Figure 2 The cooling mechanism 1 is provided with a mounting column 105 on the side wall near the bottom, and the connecting base 2 is provided with a mounting insertion hole 202 corresponding to the mounting column 105 on the side wall along the mounting hole 201.

[0030] At this time, the detachable connection between the connecting base 2 and the cooling mechanism 1 can be achieved by the plug-in detachable connection of the mounting insertion hole 202 and the mounting column 105.

[0031] For example, the initial structure as shown in Figure 4 At this time, the mounting hole of the sensor shell 5 is one on the left and one on the right, and after upgrading the shell, the mounting hole is changed to three on the left and one on the right. If the traditional way is adopted, the overall structure of the cooling mechanism 1 and the connecting base 2 needs to be redesigned to adapt to the change of the mounting hole. While using the detachable structure of the utility model, only the connecting base 2 corresponding to the mounting hole needs to be redesigned, which significantly reduces the upgrading cost.

[0032] Embodiment 3

[0033] Adjustable sensor heat dissipation mechanism based on example 2, as shown in Figure 2 The heat dissipation mechanism 1 is provided with connecting platforms 101 at both sides of the connecting base 2, and buckles 102 corresponding to the number of connecting platforms 101. The buckles 102 are connected to the connecting platforms 101 by torsion springs 103, and the top ends of the buckles 102 are provided with clamping heads extending towards the connecting base 2. The connecting base 2 is provided with clamping grooves 203 corresponding to the clamping heads.

[0034] At this time, when the connecting base 2 is fixed with the heat dissipation mechanism 1, the clamping heads of the buckles 102 are clamped into the clamping grooves 203 by the torsion of the torsion springs 103, thereby achieving auxiliary fixation between the connecting base 2 and the heat dissipation mechanism 1 by applying a counteracting force between the supporting force of the heat dissipation mechanism 1. When the connecting base 2 needs to be replaced, the buckles 102 are pried to make the clamping heads of the buckles 102 come out of the clamping grooves 203, so that the connecting base 2 can be pulled out of the heat dissipation mechanism 1 and inserted into a suitable connecting base 2. When the mounting column 105 is completely inserted into the mounting hole 202, the buckles 102 are rotated under the torsion of the torsion springs 103, so that the clamping heads of the buckles 102 are clamped into the clamping grooves 203, and the effective fixation is completed.

[0035] Example 4

[0036] Adjustable sensor heat dissipation mechanism based on example 1, as shown in Figure 1 The side of the heat dissipation mechanism 1 facing the single-chip microcomputer 6 is provided with a heat dissipation silica gel slot 104, and the heat dissipation silica gel 4 is matched with the heat dissipation silica gel slot 104 and connected in a plug-in manner.

[0037] As shown in Figure 3 The heat dissipation silica gel 4 includes a hollow fixed mounting frame 402, and the fixed mounting frame 402 is internally fixed with a heat dissipation silica gel body 401. One end of the heat dissipation silica gel body 401 is in contact with a heat transfer substance filled in the heat dissipation mechanism 1, and the other end extends to the outside of the fixed mounting frame 402 and the heat dissipation mechanism 1.

[0038] At this time, according to the height and size of the single-chip microcomputer 6, the corresponding heat dissipation silica gel body 401 can be selected, and the heat dissipation silica gel body 401 is fixed in a plug-in manner by using the corresponding fixed mounting frame 402, and then the whole is connected in a plug-in manner with the heat dissipation silica gel slot 104. This way, by replacing the heat dissipation silica gel body 401 and the corresponding fixed mounting frame 402, the adaptability adjustment of the single-chip microcomputer 6 in a certain height range can be realized, and the upgrade cost is significantly reduced.

[0039] Example 5

[0040] Based on the adjustable sensor heat dissipation mechanism of embodiment 1, as Figure 1 The sensor shell 5 is provided with an auxiliary fixing sheet 7 on the opposite side of the heat dissipation mechanism 1. The auxiliary fixing sheet 7 is provided with an auxiliary fixing screw hole 701 at the corresponding position of the mounting hole 201, and the screw 3 is screwed and fastened through the mounting hole 201, the sensor shell 5 and the auxiliary fixing screw hole 701.

[0041] Since the sensor shell 5 is generally thin, directly fixing the connecting base 2 and the sensor shell 5 may cause unstable fixation or insufficient bearing of the mounting hole of the sensor shell 5. The auxiliary fixing sheet 7 can realize stable fixation of the mounting and disperse the stress bearing of the sensor shell 5, thereby avoiding the above problems.

[0042] Based on the above ideal embodiments according to the present application, through the above description, relevant personnel can make various changes and modifications without deviating from the technical idea of the present application. The technical scope of the present application is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims

1. An adjustable sensor heat dissipation mechanism, characterized in that, include: A heat dissipation mechanism (1) is provided at the bottom of the heat dissipation mechanism (1), and a connecting base (2) is provided on the connecting base (2), and a mounting hole (201) is provided on the connecting base (2), and a screw (3) passes through the mounting hole (201) and is fixed to the sensor housing (5); a heat dissipation silicone (4) is detachably installed on one end of the heat dissipation mechanism (1) facing away from the connecting base (2), and the top end of the heat dissipation silicone (4) extends to the outside of the heat dissipation mechanism (1) and contacts the heat dissipation surface of the microcontroller (6); the heat dissipation mechanism (1) is made of heat transfer material, or is filled with heat transfer material that contacts the heat dissipation silicone (4).

2. The adjustable sensor heat dissipation mechanism according to claim 1, characterized in that, The heat dissipation mechanism (1) has a mounting post (105) on the side wall near the bottom, and the connecting base (2) has a mounting hole (202) corresponding to the mounting post (105) on the side wall along the axial direction of the mounting hole (201).

3. The adjustable sensor heat dissipation mechanism according to claim 2, characterized in that, The heat dissipation mechanism (1) is provided with a connecting platform (101) on the opposite side of the connecting base (2) and a buckle (102) corresponding to the number of connecting platforms (101); the end of the buckle (102) is connected to the connecting platform (101) by a torsion spring (103), and the top of the buckle (102) is provided with a buckle head extending toward the connecting base (2); the connecting base (2) is provided with a buckle groove (203) corresponding to the buckle head at the corresponding position of the buckle head.

4. The adjustable sensor heat dissipation mechanism according to claim 1, characterized in that, The heat dissipation mechanism (1) has a heat dissipation silicone slot (104) on the side facing the microcontroller (6), and the heat dissipation silicone (4) matches the heat dissipation silicone slot (104) and is plugged in.

5. The adjustable sensor heat dissipation mechanism according to claim 4, characterized in that, The heat-dissipating silicone (4) includes: a hollow fixed mounting frame (402), in which a heat-dissipating silicone gel (401) is fixed, one end of which is in contact with the heat transfer material of the heat dissipation mechanism (1), and the other end extends to the outside of the fixed mounting frame (402) and the heat dissipation mechanism (1).

6. The adjustable sensor heat dissipation mechanism according to claim 1, characterized in that, The sensor housing (5) has an auxiliary fixing plate (7) on the side opposite to the heat dissipation mechanism (1); the auxiliary fixing plate (7) has an auxiliary fixing screw hole (701) at the position corresponding to the mounting hole (201), and the screw (3) passes through the mounting hole (201), the sensor housing (5) and the auxiliary fixing screw hole (701) are screwed together and fastened.

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