Electric control drive board heat dissipation fixing support for pump, heat dissipation system and motor pump

Abstract

The utility model discloses a heat dissipation fixing support of an electric control drive board for a pump, a heat dissipation system and a motor pump, and belongs to the field of heat dissipation of pump drive boards. The fixing support comprises a support body, the support body is sequentially divided into a plurality of installation areas, and each installation area is internally provided with a supporting plane used for supporting different power devices in a matched mode. And the heights of the supporting planes of the plurality of mounting areas are not completely consistent, so that the heat dissipation planes on the sides, deviating from the direction of the bracket main body, of the power devices with different thicknesses can be maintained at the same plane height. According to the utility model, the power device can form a unified heat dissipation plane, the heat dissipation effect of the power device is effectively improved, poor heat dissipation and safety risk caused by the reasons such as pin deformation and displacement of the power device are avoided, and the long-term stable use of the power device is ensured.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for pump drive boards, and more specifically, to a heat dissipation fixing bracket and heat dissipation system for an electronically controlled drive board for pumps, as well as a motor pump. Background Technology

[0002] A motor driver board is a circuit component used in conjunction with a motor to ensure its normal operation. It is typically housed in a control box located on the motor's casing, which also contains electrical connectors and electronic components. The motor driver board contains multiple power devices, such as through-hole diodes, MOSFETs, and rectifier bridges. These power devices generate significant heat during operation, necessitating adequate heat dissipation to ensure stable operation.

[0003] Currently, common heat dissipation methods in practical applications include attaching thermal pads to the surface of power devices to press against the inside of the control box, and setting corresponding heat dissipation holes or fins on the surface of the control box. However, in practice, the heat dissipation effect still needs improvement. Furthermore, power devices are mounted on the driver board via lead soldering. Due to the brittle nature of their leads, displacement can easily occur during assembly with the control box, potentially leading to contact with other components on the driver board. This could cause the driver board to malfunction or pose a high safety risk, further limiting the heat dissipation effect of the power devices. Therefore, effectively improving the safe, stable, and efficient heat dissipation of power devices on the driver board is clearly essential. Utility Model Content

[0004] 1. Technical problem to be solved by the utility model

[0005] In view of the fact that the heat dissipation performance of power devices on motor drive boards in the prior art still needs to be improved, this utility model intends to provide a heat dissipation fixing bracket and heat dissipation system for pump electronic control drive boards and a motor pump. The heat dissipation system of this utility model can effectively improve the heat dissipation effect on power devices and ensure their long-term stable use.

[0006] 2. Technical Solution

[0007] To achieve the above objectives, the technical solution provided by this utility model is as follows:

[0008] This utility model provides a heat dissipation mounting bracket for a pump's electrical control drive board. The bracket is configured to be mounted on the drive board of the pump motor and supported between the drive board and the power device.

[0009] The fixed bracket includes a bracket body, which is divided into multiple mounting areas. Each mounting area has a support plane for supporting different power devices. The support planes of the multiple mounting areas are not completely consistent in height, so that the heat dissipation planes of power devices with different thicknesses on the side away from the bracket body can be kept at the same plane height.

[0010] This utility model also provides a heat dissipation system for a pump's electronically controlled drive board, including a control box. The control box base includes a base plate and a receiving cavity formed by at least three side plates surrounding the base plate. The drive board is installed in the receiving cavity, and a fixing bracket as described above is installed on the drive board, with the fixing bracket supporting between the power device and the drive board. A heat dissipation boss with a heat dissipation plane is provided in the receiving cavity. The heat dissipation planes of multiple power devices on the side away from the main body of the bracket are kept at the same height and are in contact with the heat dissipation planes of the heat dissipation boss.

[0011] Furthermore, the heat dissipation protrusion inside the control box contacts the inner wall of the side plate of the box seat cavity, and the inner wall of the side plate of each box seat cavity contacts at most one heat dissipation protrusion.

[0012] Furthermore, a fixing post is provided on the bottom surface of the bracket body close to the drive plate, and a corresponding mounting hole is provided on the drive plate. The fixing post is installed on the drive plate with an interference fit.

[0013] Furthermore, some of the power devices have their surfaces coated with thermally conductive metal; adjacent power devices with thermally conductive metal on their surfaces are separated by partition ribs between their corresponding mounting areas; power devices without thermally conductive metal on their surfaces have outwardly protruding support ribs on their mounting areas, with the top surface of the support ribs forming a support surface to support the power devices.

[0014] Furthermore, the end edge of the support body along the length direction is also provided with a partition rib, which separates the installation area from the outside of the support body; the top surface height of the partition rib is higher than the top surface height of the support rib.

[0015] Furthermore, the bottom surface of the support body has an inwardly recessed bottom groove, and bottom support ribs are formed around the bottom groove, which are used to contact and support the surface of the drive plate.

[0016] Or / and, the support rib has a groove inside, and the support rib surrounds the groove to form a top support surface.

[0017] Furthermore, the mounting bracket is made of anti-static material; and / or thermally conductive adhesive is provided between the heat dissipation planes of the power devices and the heat dissipation bosses inside the control box.

[0018] Furthermore, the receiving cavity is provided with a first heat dissipation protrusion and a second heat dissipation protrusion. The receiving cavity of the box base is a rectangular cavity. The first heat dissipation protrusion and the second heat dissipation protrusion are in contact with the two side plates on both sides of the box base along the length direction, and the first heat dissipation protrusion and the second heat dissipation protrusion are staggered on both sides of the box base along the length direction. The heat dissipation planes of multiple power devices are in contact with the heat dissipation plane of the second heat dissipation protrusion.

[0019] This utility model also provides an electric motor pump, including a control box and a pump body as described above. The bottom surface of the control box has a pump body mounting area in the middle, and the pump body is installed in the pump body mounting area.

[0020] 3. Beneficial effects

[0021] Compared with the prior art, the technical solution provided by this utility model has the following advantages:

[0022] The heat dissipation fixing bracket for the pump's electronic control drive board of this utility model can effectively limit and support the power device. Even if the power device is squeezed, it will not easily move due to the support and limitation of the fixing bracket below. Moreover, the surface heat dissipation plane of the power device can be kept at basically the same plane height, thus forming a uniform heat dissipation plane. Since there will be no easy displacement, it can ensure stable contact with the heat dissipation component within the effective range of limitation. It is convenient to cooperate with the heat dissipation component in the control box to achieve uniform and rapid heat dissipation, and will not cause poor heat dissipation or safety risks due to pin deformation or displacement. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the heat dissipation fixing bracket in the embodiment;

[0024] Figure 2 for Figure 1 A bottom view of the structure of the heat dissipation fixing bracket;

[0025] Figure 3 for Figure 1 Front view schematic diagram of the heat dissipation fixing bracket;

[0026] Figure 4 This is a schematic diagram showing the assembly and application state of the heat dissipation fixing bracket in the embodiment;

[0027] Figure 5 This is a schematic diagram of the structure of the motor pump in the embodiment;

[0028] Figure 6 This is an exploded view of the control box structure in the embodiment;

[0029] Figure 7 This is a schematic diagram of the structure of the electronic control drive board in the embodiment;

[0030] Figure 8 This is a schematic diagram of the control box body in the embodiment.

[0031] Explanation of the labels in the diagram:

[0032] 300. Fixed bracket; 310. Bracket body; 311. First installation area; 312. Second installation area; 313. Third installation area; 314. First partition rib; 315. Second partition rib; 316. Third support rib; 317. Bottom support rib; 318. Bottom groove; 319. Fixed column;

[0033] 100. Control box; 200. Pump body;

[0034] 110. Box base; 111. First heat dissipation boss; 112. Second heat dissipation boss; 113. Positioning post; 114. Connecting plate; 115. Heat dissipation fins; 116. Heat dissipation ribs;

[0035] 120. Driver board; 121. Power device; 121a. Diode; 121b. MOSFET; 121c. Rectifier bridge. Detailed Implementation

[0036] To further understand the content of this utility model, a detailed description of this utility model will be provided in conjunction with the accompanying drawings.

[0037] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0038] Furthermore, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection of two components. The terms "first," "second," "third," and "fourth" should also be interpreted broadly, merely distinguishing feature names and not indicating a specific sequential relationship. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0039] The present invention will be further described below with reference to the embodiments.

[0040] Example

[0041] Combination Figures 1-8 As shown in this embodiment, a heat dissipation mounting bracket for a pump's electronic control drive board is provided. The mounting bracket 300 is configured to be mounted on the drive board 120 of the pump motor and supported between the drive board 120 and the power device 121. The mounting bracket 300 includes a bracket body 310, which is divided into multiple mounting areas. Each mounting area has a supporting plane for supporting different power devices 121. The supporting planes of the multiple mounting areas are not completely consistent in height, so that the heat dissipation planes of the power devices 121 with different thicknesses on the side away from the bracket body 310 can be kept at the same plane height.

[0042] Preferably, in practice, combined with Figure 4 As shown, the power device 121 may include a diode 121a, a MOSFET 121b, and a rectifier bridge 121c. In this embodiment, these three sets of standby power devices 121 are centrally installed to achieve centralized heat dissipation. The corresponding installation areas are set as a first installation area 311, a second installation area 312, and a third installation area 313. The support plane heights of the first installation area 311, the second installation area 312, and the third installation area 313 are not completely consistent and are adjusted according to the thickness of the corresponding power device 121. In practice, the type and number of power devices 121 can be adjusted according to application requirements, and the design of the installation area can be adjusted accordingly.

[0043] The traditional installation method for power devices 121 in the industry involves soldering the pins of each power device 121 onto the driver board 120, and then installing the driver board 120 into the control box 100 of the motor pump. However, due to the easily bendable nature of the pins, displacement is highly likely to occur during the assembly process. This can even lead to the power device 121 contacting other components of the driver board 120 or reducing the safety distance, causing the driver board 121 to malfunction or be at high safety risk. Furthermore, any change in the position of the power device 121 will also alter its positional relationship with the heat dissipation structure originally installed within the control box 100, further affecting the heat dissipation effect of the power device 121 and resulting in poor overall heat dissipation. To overcome the pin bending and displacement problem, the industry has considered fixed installation of the power device 121, currently using bolt mounting, i.e., positioning holes are made on both the driver board 120 and the power device 121, and bolts or screws are used for fastening. However, this method is not only complex but also keeps the power device 121 under constant stress, which is not conducive to long-term use.

[0044] This embodiment designs a fixed bracket 300, which is fixedly installed on the drive board 120 and positioned between the power device 121 and the drive board 120 during use. The fixed bracket 300 effectively limits and supports the power device 121. The pins of the power device 121 are still soldered to the drive board 120, and the height gap between the pins and the drive board 120 is filled and supported by the fixed bracket 300. When the drive board 120 is installed in the control box 100, even if the power device 121 is subjected to pressure, it will not easily shift due to the support and limitation of the fixed bracket 300 below. This maintains a relatively stable heat dissipation state with the heat dissipation components inside the control box 100. Furthermore, in practice, each power device... The structural thickness of power devices 121 often varies. This design specifically differentiates the support plane heights of multiple mounting areas, ensuring they are not entirely identical. Thinner power devices 121 are installed in higher mounting areas, while thicker ones are installed in lower areas. This ensures that after multiple power devices 121 are installed, the surface heights of their heat dissipation planes remain essentially at the same level, forming a unified heat dissipation plane. Because easy displacement is prevented, stable contact with the heat dissipation components is guaranteed within the effective limiting range, facilitating uniform and rapid heat dissipation in conjunction with the heat dissipation components within the control box 100. This design effectively limits and supports the power devices 121, avoiding bolt fixing and optimizing the process flow. It also prevents them from being under long-term high-stress installation and helps ensure stable heat dissipation, preventing poor heat dissipation and safety risks caused by pin deformation or displacement.

[0045] This embodiment also provides a heat dissipation system for a pump's electronic control drive board, combined with... Figures 5-8 As shown, the control box 100 includes a base 110 of the control box 100, which includes a base plate and a receiving cavity formed by at least three side plates surrounding the base plate. A drive plate 120 is installed in the receiving cavity, and a fixing bracket 300 as described above is installed on the drive plate 120. The fixing bracket 300 is supported between the power device 121 and the drive plate 120. A heat dissipation boss with a heat dissipation plane is provided in the receiving cavity. The heat dissipation planes of multiple power devices 121 on the side away from the bracket body 310 are kept at the same height and are in contact with the heat dissipation planes of the heat dissipation boss.

[0046] like Figure 8As shown, in this embodiment, a metal heat dissipation protrusion is provided inside the housing 110 as a heat dissipation plane. During use, the heat dissipation plane of the power device 121 to be dissipated comes into contact with the heat dissipation plane of the heat dissipation protrusion. Heat is transferred through the heat dissipation protrusion to dissipate heat from the power device 121. Furthermore, the overall heat dissipation planes of multiple power devices 121 are at the same height, ensuring contact between the entire device and the heat dissipation plane of the protrusion. The heat dissipation plane of the protrusion can cover the overall heat dissipation plane of multiple power devices 121. Due to the stable support of the fixing bracket 300, it is also ensured that the overall heat dissipation plane of the power device 121 can fully contact the heat dissipation protrusion for heat dissipation during installation. In practice, it is preferable to use thermally conductive adhesive, such as thermally conductive silicone or thermal grease, between the power device 121 and the heat dissipation plane of the heat dissipation protrusion inside the control box 100. After installation, the heat dissipation protrusion can tightly compress the thermally conductive adhesive to shrink it, ensuring both heat dissipation effect and avoiding damage to the surface of the power device 121.

[0047] More preferably, some of the power devices 121 have their surfaces coated with a thermally conductive metal; for two adjacent power devices 121 with their surfaces coated with thermally conductive metal, their corresponding mounting areas are separated by a partition rib to avoid metal contact between adjacent devices; for power devices 121 whose surfaces are not coated with thermally conductive metal, their mounting areas are provided with outwardly protruding support ribs, the top surface of which forms a support surface for supporting the power devices 121. More preferably, partition ribs are provided at the end edges along the length direction of the bracket body 310, and these partition ribs separate the mounting area from the outside of the bracket body 310; the top surface height of the partition ribs is higher than the top surface height of the support ribs.

[0048] In practice, the PFC circuit of the motor pump drive board 120 usually has three basic power devices: diode 121a, MOSFET 121b, and rectifier bridge 121c. In this embodiment, the three power devices are mounted on the fixed bracket 300 as an example. The fixed bracket 300 is used to place them in a concentrated manner to achieve compact installation and centralized heat dissipation. Specifically, diode 121a and MOSFET 121b can be placed in the inner cavity of the first mounting area 311 and the second mounting area 312 respectively. The order of their placement can be adjusted according to requirements. The first mounting area 311 and the second mounting area 312 are separated by the second partition rib 315. In practice, the surfaces of diode 121a and MOSFET 121b are coated with thermally conductive metal. The second separating rib 315 effectively prevents the metal surfaces of diode 121a and MOSFET 121b from contacting after being squeezed, ensuring safety. Similarly, a first separating rib 314 is provided on the front edge of the support body 310 along its length. The first separating rib 314 separates the first mounting area 311 from the outside of the support body 310, also preventing contact with other electronic components on the drive board 120, ensuring safety. Furthermore, the fixing bracket 300 is preferably made of anti-static material, such as PC+10%GF material in practice. This material has less surface fiber and uniform fiber distribution; good spraying performance and low paint defect rate; and excellent toughness and impact resistance. More importantly, it has good heat resistance and is not prone to thermal deformation.

[0049] Furthermore, a rectifier bridge 121c is preferably placed in the third mounting area 313 at the tail end of the drive board 120 along its length. The surface of the rectifier bridge 121c typically does not require thermally conductive metal plating, thus avoiding the risk of metal contact with other electronic components. The third mounting area 313 is provided with an outwardly protruding third support rib 316. The top surface of the third support rib 316 forms a support surface to stably support the rectifier bridge 121c. The top surface heights of the first separating rib 314 and the second separating rib 315 are both higher than the top surface height of the third support rib 316, ensuring stable support for the rectifier bridge 121c and effectively isolating the diode 121a and the MOSFET 121b. A further preferred design is as follows: Figure 1 As shown, a groove is formed inside the third support rib 316, and the third support rib 316 surrounds the groove to form a top support surface. This not only makes the injection molding process of the third support rib 316 easier and improves the molding quality, but also forms a certain ventilation gap under the rectifier bridge 121c, further promoting the auxiliary heat dissipation effect.

[0050] In practice, the implementation location can be further selected, combined with... Figure 2The bottom surface of the bracket body 310 has an inwardly recessed bottom groove 318, and bottom support ribs 317 are formed around the bottom groove 318. The bottom support ribs 317 are used to contact and support the surface of the drive plate 120. In this way, the contact between the bottom support ribs 317 and the drive plate 120 can ensure the stability of the contact support. A certain ventilation gap can also be formed between the bracket body 310 and the drive plate 120 to facilitate heat dissipation. It also facilitates the structural forming and demolding quality during injection molding, ensuring the overall forming quality of the bottom surface of the bracket body 310. The bottom surface is smooth and flat, which also avoids the instability of support that may be caused by the whole surface contact due to the bottom surface forming quality problem, thereby affecting the overall heat dissipation and flatness of the power device 121.

[0051] To facilitate rapid installation of the mounting bracket 300, in practice, it is preferable that the bottom surface of the bracket body 310, which is close to the drive plate 120, is provided with fixing posts 319. For example, two sets of fixing posts 319 are provided in the bottom groove 318, and corresponding mounting holes are provided on the drive plate 120. The fixing posts 319 are interference-fitted onto the drive plate 120; during installation, they can be directly inserted. In practice, at least some power devices 121 are provided with positioning holes, which are adapted to the positions of the mounting holes on the drive plate 120. This design helps to improve the versatility of the mounting bracket 300. As mentioned above, the traditional fixing method involves drilling holes in the power device 121 and the drive board 120 and fastening them with screws. In this embodiment, the original hole positions on the drive board 120 and the power device 121 are retained, and corresponding fixing posts 319 are set on the bracket body 310. This allows for the selection of different installation methods for the power device 121 according to different application scenarios and requirements, such as still using screw fastening or interference fit of fixing posts 319, without having to repeatedly drill holes in other positions, simplifying the operation process and making it more versatile.

[0052] Further explanation is needed; in practice, the design can be further optimized to enhance the heat dissipation effect of the heat dissipation protrusions within the control box 100 on the power device 121. Furthermore, in combination with… Figure 8The heat dissipation protrusions inside the control box 100 contact the inner wall of the side plate of the receiving cavity of the box base 110, and the inner wall of the side plate of each receiving cavity of the box base 110 contacts at most one heat dissipation protrusion. By setting the heat dissipation protrusions to contact the inner wall of the side plate of the box base 110, and since both the heat dissipation protrusions and the box base 110 are made of metal, heat can be transferred quickly. The heat from the power device 121 can be transferred to the side plate of the box base 110 through the heat dissipation protrusions, thereby effectively increasing the heat dissipation area and utilizing the entire box base 110 for rapid heat dissipation. When multiple heat dissipation protrusions are distributed, the inner wall of the side plate of the receiving cavity of the box base 110 contacts at most one heat dissipation protrusion, and multiple heat dissipation protrusions do not contact the same inner wall of the side plate. In this way, the heat received by multiple heat dissipation protrusions is transferred to different side plates, achieving uniform and rapid heat dissipation from all sides, and avoiding uneven heat dissipation. To further improve the heat dissipation efficiency of the heat dissipation boss, it is preferable that the bottom of the heat dissipation boss extends to contact the inner wall of the bottom plate of the box base 110, and at least one edge of the heat dissipation boss extends to contact the inner wall of the side plate of the box base 110.

[0053] Furthermore, the receiving cavity is provided with a first heat dissipation protrusion 111 and a second heat dissipation protrusion 112. The receiving cavity of the housing 110 is a rectangular cavity. The first heat dissipation protrusion 111 and the second heat dissipation protrusion 112 are in contact with the side plates on both sides of the length direction of the housing 110, utilizing the side plates with a larger heat dissipation area for rapid heat dissipation. The first heat dissipation protrusion 111 and the second heat dissipation protrusion 112 are staggered on both sides of the length direction of the housing 110. The heat dissipation planes of multiple power devices 121 are in contact with the heat dissipation planes of the second heat dissipation protrusion 112. Correspondingly, the drive board 120 is also provided with other electronic components that require heat dissipation, and these other electronic components are in contact with the heat dissipation planes of the first heat dissipation protrusion 111 for heat dissipation. Within the limited space of the receiving cavity inside the housing 110, the two sets of heat dissipation protrusions are staggered as much as possible to avoid the situation where the two sets of heat dissipation protrusions are too close together, resulting in heat concentration and inability to dissipate quickly. This arrangement not only improves heat dissipation efficiency but also helps to ensure heat dissipation uniformity.

[0054] In practice, the control box 100 can be further optimized. For example, to facilitate the stable installation of the drive board 120 within the housing 110, the cavity can be further equipped with multiple positioning posts 113 for connecting to the drive board 120. The drive board 120 and the positioning posts 113 each have corresponding mounting holes. After the drive board 120 is placed into the cavity, the positioning posts 113 are used to position, support, and fix the drive board 120. To further improve the heat dissipation performance of the drive board 120 using the positioning posts 113, at least one edge of the positioning post 113 is connected to the inner wall of the side plate of the housing 110 via a connecting plate 114. To accelerate the rapid dissipation of heat from the housing 110, such as... Figure 6As shown, multiple metal heat dissipation fins 115 are provided on the outer wall of the base plate of the box seat 110 around the installation area of ​​the pump body 200. Multiple heat dissipation ribs 116 extending along the height direction are provided on one side plate of the box seat 110 in the width direction. A heat dissipation channel is formed between adjacent heat dissipation ribs 116, thus supplementing heat dissipation in the width direction of the box seat 110. This, together with the heat dissipation fins 115 provided on the other side of the width direction of the box seat 110, achieves uniform heat dissipation.

[0055] This embodiment also provides a motor pump, including a control box 100 and a pump body 200 as described above. The bottom surface of the box base 110 of the control box 100 has a pump body mounting area in the middle, and the pump body 200 is installed in the pump body mounting area.

[0056] The scope of protection of this utility model is defined only by the claims. Thanks to the teachings of this utility model, those skilled in the art will readily recognize that alternative structures to the disclosed structure can be used as feasible alternative implementations, and that the disclosed implementations can be combined to produce new implementations, which also fall within the scope of the appended claims.

Claims

1. A heat dissipation mounting bracket for a pump's electronic control drive board, characterized in that: The mounting bracket (300) is configured to be mounted on the drive plate (120) of the pump motor and supported between the drive plate (120) and the power device (121); The fixed bracket (300) includes a bracket body (310), which is divided into multiple mounting areas. Each mounting area has a support plane for supporting different power devices (121). The support planes of the multiple mounting areas are not completely consistent in height, so that the heat dissipation planes of the power devices (121) with different thicknesses on the side away from the bracket body (310) can be maintained at the same plane height.

2. A heat dissipation system for an electronically controlled drive board of a pump, comprising a control box (100), wherein the base (110) of the control box (100) comprises a base plate and a receiving cavity formed by at least three side plates surrounding the base plate, characterized in that: The drive plate (120) is installed in the receiving cavity, and the drive plate (120) is equipped with the fixed bracket (300) as described in claim 1. The fixed bracket (300) is supported between the power device (121) and the drive plate (120). A heat dissipation boss with a heat dissipation plane is provided in the receiving cavity. The heat dissipation planes of multiple power devices (121) on the side away from the bracket body (310) are kept at the same height and are in contact with the heat dissipation plane of the heat dissipation boss.

3. The heat dissipation system for a pump's electronically controlled drive board according to claim 2, characterized in that: The heat dissipation protrusion inside the control box (100) contacts the inner wall of the side plate of the receiving cavity of the box seat (110), and the inner wall of the side plate of each receiving cavity of the box seat (110) contacts at most one heat dissipation protrusion.

4. The heat dissipation system for a pump's electronically controlled drive board according to claim 2, characterized in that: A fixing post (319) is provided on the bottom surface of the bracket body (310) close to the drive plate (120). The drive plate (120) is provided with a corresponding mounting hole, and the fixing post (319) is installed on the drive plate (120) with an interference fit.

5. A heat dissipation system for a pump's electronically controlled drive board according to claim 2, characterized in that: Among the multiple power devices (121), some power devices (121) have their surfaces plated with thermally conductive metal; the mounting areas of two adjacent power devices (121) with thermally conductive metal plated on their surfaces are separated by a partition rib; the mounting areas of the power devices (121) without thermally conductive metal plated on their surfaces are provided with outwardly protruding support ribs, and the top surface of the support ribs forms a support surface for supporting the power devices (121).

6. A heat dissipation system for an electronically controlled drive board for a pump according to claim 5, characterized in that: The end edge of the support body (310) along the length direction is also provided with a partition rib, which separates the installation area from the outside of the support body (310); the top surface height of the partition rib is higher than the top surface height of the support rib.

7. A heat dissipation system for a pump's electronically controlled drive board according to claim 5, characterized in that: The bottom surface of the support body (310) has an inwardly recessed bottom groove (318), and a bottom support rib (317) is formed around the bottom groove (318). The bottom support rib (317) is used to contact and support the surface of the drive plate (120). Or / and, the support rib has a groove inside, and the support rib surrounds the groove to form a top support surface.

8. A heat dissipation system for an electronically controlled drive board for a pump according to any one of claims 2-7, characterized in that: The mounting bracket (300) is made of anti-static material; and / or thermally conductive adhesive is provided between the heat dissipation plane of the heat dissipation protrusion inside the power device (121) and the control box (100).

9. A heat dissipation system for an electronically controlled drive board for a pump according to any one of claims 2-7, characterized in that: The cavity is provided with a first heat dissipation protrusion (111) and a second heat dissipation protrusion (112). The cavity of the housing (110) is a rectangular cavity. The first heat dissipation protrusion (111) and the second heat dissipation protrusion (112) are in contact with the two side plates of the housing (110) along the length direction, and the first heat dissipation protrusion (111) and the second heat dissipation protrusion (112) are staggered on both sides of the housing (110) along the length direction. The heat dissipation plane of multiple power devices (121) is in contact with the heat dissipation plane of the second heat dissipation protrusion (112).

10. An electric motor pump, characterized in that: Includes a control box (100) and a pump body (200) as described in any one of claims 2-9, wherein the bottom surface of the base (110) of the control box (100) has a pump body mounting area in the middle, and the pump body (200) is fitted and installed in the pump body mounting area.

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