Cooling mechanism, spray cooling device and battery piece separating equipment

Abstract

The utility model provides a cooling mechanism, a spray cooling device and battery piece separating equipment, and the cooling mechanism comprises a refrigeration assembly which comprises a seat body and a refrigeration piece, the seat body is internally provided with a flow channel for a cooling medium to flow, the side wall of the seat body is provided with a flow inlet and a flow outlet which are communicated with the two ends of the flow channel respectively, and the flow inlet and the flow outlet are communicated with the two ends of the flow channel respectively; a cooling medium enters the flow channel from the flow inlet and flows out from the flow outlet after flowing through the flow channel, the cooling face of the refrigeration piece is attached to the base body, and the refrigeration piece is configured to cool the cooling medium in the flow channel. According to the cooling mechanism provided by the utility model, the cooling medium can be rapidly cooled. After the cooling mechanism provided by the invention is connected between the cooling medium supply mechanism and the spray head, the temperature of the cooling medium sprayed by the spray head is lower than the normal temperature, and the temperature difference between the battery piece and the cooling medium can be increased when the cooling medium acts on the battery piece to be split, so that relatively large thermal stress is generated; and therefore, the straightness and the section flatness of the splinters can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of photovoltaic production equipment, in particular to a cooling mechanism, a spraying cooling device and a cell slicing device. BACKGROUND

[0002] In the process of solar cell production, before the processes such as lamination and series welding, it is often necessary to first cut large-size cell slices into small-size cell slices.

[0003] In the process of implementing the slicing of the cell slice by laser, the cell slice needs to be heated first and then cooled to generate a stress difference through rapid temperature change so as to realize the slicing of the cell slice. At present, after laser heating, a spraying mechanism is used to spray and cool the slicing area of the cell slice. The temperature of the cooling medium provided by the existing spraying device cannot be adjusted. In the process of slicing the cell slice, when the temperature of the cooling medium is too high, the temperature difference between the cell slice and the cooling medium is reduced, thereby affecting the thermal stress, and further affecting the straightness and cross-sectional flatness of the slicing position, and finally affecting the slicing quality. CONTENT OF THE UTILITY MODEL

[0004] In view of the above technical problems, the present application provides a cooling mechanism, and the detailed technical solutions are as follows:

[0005] A cooling mechanism for a cell slicing device, the cooling mechanism comprising:

[0006] A refrigeration assembly, the refrigeration assembly comprising a seat body and a refrigeration sheet, the seat body being provided with a flow channel for the flow of a cooling medium, a flow inlet and a flow outlet being arranged on the side wall of the seat body and being respectively in communication with the two ends of the flow channel, the cooling medium entering the flow channel from the flow inlet and flowing out of the flow outlet after flowing through the flow channel, and the cooling surface of the refrigeration sheet being attached to the seat body, the refrigeration sheet being configured to cool the cooling medium in the flow channel.

[0007] The cooling mechanism provided by the present application can rapidly cool the cooling medium. The cooling mechanism provided by the present application is connected between the cooling medium supply mechanism and the spray head, the cooling medium supplied by the cooling medium supply mechanism first passes through the cooling mechanism for cooling and then flows into the spray head, and is finally sprayed out of the spray head.

[0008] The temperature of the cooling medium sprayed out of the spray head is lower than the normal temperature, and when the cooling medium acts on the cell slice to be sliced, the temperature difference between the cell slice and the cooling medium is increased, thereby generating a larger thermal stress, and further improving the straightness and cross-sectional flatness of the slicing position.

[0009] In some embodiments, the refrigeration assembly further comprises a cover body, the flow channel is arranged on the first side of the seat body, and the cover body is attached to the first side of the seat body to close the flow channel; and the cooling surface of the refrigeration sheet is attached to the second side of the seat body.

[0010] The flow channel is arranged on the first side of the seat body and is closed by the cover body, which facilitates the processing and forming of the flow channel and facilitates the maintenance and cleaning of the flow channel.

[0011] In some embodiments, the refrigeration assembly further comprises a first temperature sensor and a second temperature sensor, wherein: the first temperature sensor is arranged in the flow channel and close to the flow inlet, and is used for measuring the temperature of the cooling medium flowing into the flow channel through the flow inlet; and the second temperature sensor is arranged in the flow channel and close to the flow outlet, and is used for measuring the temperature of the cooling medium flowing out of the flow channel through the flow outlet.

[0012] The inflow temperature and outflow temperature of the cooling medium are detected, and based on this, the refrigeration power of the refrigeration fin can be adjusted to ensure that the cooled cooling medium reaches the predetermined temperature.

[0013] In some embodiments, the flow inlet and the flow outlet are arranged on two opposite side walls of the seat body, and the flow channel is arranged in a meandering manner between the flow inlet and the flow outlet.

[0014] The length of the flow channel is extended, thereby correspondingly extending the flow time of the cooling medium in the flow channel, improving the cooling effect, and ultimately ensuring that the cooling medium is cooled to a predetermined temperature.

[0015] In some embodiments, the cooling mechanism further comprises a heat dissipation assembly, which is attached to the heat dissipation surface of the refrigeration fin and is configured to blow air to cool the heat dissipation surface of the refrigeration fin.

[0016] By arranging the heat dissipation assembly, heat dissipation of the heat dissipation surface of the refrigeration fin is achieved, thereby ensuring that the refrigeration effect of the refrigeration fin remains stable.

[0017] In some embodiments, the heat dissipation assembly comprises a heat dissipation component and a fan, wherein: the heat dissipation component is attached to the heat dissipation surface of the refrigeration fin; and the fan is arranged towards the heat dissipation component and is used for blowing air towards the heat dissipation component.

[0018] The heat dissipation component exchanges heat with the heat dissipation surface of the refrigeration fin, carrying away the heat of the heat dissipation surface of the refrigeration fin, thereby ensuring that the refrigeration effect of the refrigeration fin remains stable. The fan blows air to cool the heat dissipation component, so that the heat dissipation component remains at a low temperature, ensuring the heat dissipation effect of the heat dissipation component on the refrigeration fin.

[0019] In some embodiments, the heat dissipation component comprises a fin plate, a first side surface of the fin plate is attached to the heat dissipation surface of the refrigeration fin; a second side surface of the fin plate opposite to the first side surface is arranged with a plurality of rows of heat dissipation pieces in a first direction, each row of heat dissipation pieces comprises a plurality of heat dissipation fins arranged in a second direction, and the second direction is perpendicular to the first direction; and the fan is located on the second side of the fin plate and is used for blowing air to the fin plate.

[0020] The finned plate is used to dissipate heat of the refrigeration sheet, and a plurality of rows of heat dissipation fins arranged at intervals are arranged on the second side surface of the finned plate to form longitudinal and transverse intersecting heat dissipation channels in the finned plate, so that the air blown by the fan carries away the heat on the finned plate when flowing in the heat dissipation channels. In this way, the heat dissipation area of the finned plate can be increased, the cooling effect of the fan on the finned plate can be improved, and finally the heat dissipation effect of the finned plate on the refrigeration sheet can be improved.

[0021] In some embodiments, the cooling mechanism further comprises a pressing member and a protective cover plate, the pressing member is used to press the refrigeration assembly onto the heat dissipation assembly, and the protective cover plate is installed on the heat dissipation assembly and the refrigeration assembly is located in the protective cover plate.

[0022] The refrigeration assembly is pressed onto the heat dissipation assembly by the pressing member, which can ensure that the heat dissipation assembly and the refrigeration assembly are in close contact, thereby improving the heat dissipation effect of the heat dissipation assembly on the refrigeration assembly. The protective cover plate can protect the heat dissipation assembly and the pressing member.

[0023] The application also provides a spray cooling device, which comprises a cooling medium supply mechanism, a spray head and the cooling mechanism described above, wherein: the cooling medium supply mechanism is connected with the inflow port of the cooling mechanism through a first connecting pipe, and the spray head is connected with the outflow port of the cooling mechanism through a second connecting pipe; the cooling medium supply mechanism is used to supply cooling medium and drive the cooling medium to flow into the cooling mechanism along the first connecting pipe, and the cooling mechanism is used to cool the cooling medium; the cooled cooling medium flows into the spray head through the second connecting pipe and is sprayed out through the spray head.

[0024] By arranging the cooling mechanism between the spray head and the cooling medium supply mechanism of the spray cooling device, the cooling medium supplied from the cooling medium supply mechanism to the spray head can be cooled, so that the temperature of the cooling medium sprayed out of the spray head is lower than the normal temperature. By spraying the cooled cooling medium onto the battery sheet to be split through the spray head, spray cooling is implemented, which can increase the temperature difference between the battery sheet and the cooling medium, thereby generating greater thermal stress, and further improving the straightness and cross-sectional flatness of the split part of the battery sheet.

[0025] The application also provides a battery sheet splitting device, which comprises a slotting laser, a splitting laser and the spray cooling device described above, wherein: the slotting laser is used to form at least one slot on the battery sheet along the direction of the part to be split; the splitting laser is used to heat the battery sheet along the extension direction of the formed slot; and the spray cooling device is used to spray cooling medium towards the splitting laser at the heated position of the battery sheet, so as to split the battery sheet along the direction of the part to be split.

[0026] By cooperation of the slotting laser, the splitting laser and the spraying cooling device, the battery piece splitting equipment provided by the application realizes automatic splitting of the battery piece. In particular, after the splitting laser heats the battery piece along the extension direction of the slot body opened by the slotting laser, the spraying cooling device sprays the cooling medium lower than normal temperature to the heating position of the battery piece, so as to increase the temperature difference between the battery piece and the cooling medium, to generate greater thermal stress, and to further improve the straightness and cross-section flatness of the splitting position. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a structure schematic view of the cooling mechanism in the embodiment of the application in one perspective view;

[0028] Figure 2 It is a structure schematic view of the cooling mechanism in the embodiment of the application in another perspective view;

[0029] Figure 3 It is a structure schematic view of the seat body in the embodiment of the application in a first perspective view;

[0030] Figure 4 It is a structure schematic view of the seat body in the embodiment of the application in a second perspective view;

[0031] Figure 5 It is a structure schematic view of the seat body in the embodiment of the application in a third perspective view;

[0032] Figure 6 It is a structure schematic view of the seat body in the embodiment of the application in a fourth perspective view;

[0033] Figure 7 It is a structure schematic view of the fin plate in the embodiment of the application in one perspective view;

[0034] Figure 8 It is a structure schematic view of the fin plate in the embodiment of the application in another perspective view.

[0035] Figures 1 to 8 It comprises:

[0036] The refrigeration assembly 1: the seat body 11, the refrigeration piece 12, the flow channel 13, the flow inlet 14, the flow outlet 15, the cover body 16, the first temperature sensor 17, the second temperature sensor 18;

[0037] The heat dissipation assembly 2: the heat dissipation component 21, the fan 22, the fin plate 23, the heat dissipation fin 24;

[0038] The pressing piece 3. DETAILED DESCRIPTION

[0039] In order to make the above objectives, characteristics and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0040] As described in the background section, the existing spray device for battery piece slicing cooling cannot adjust the temperature of the cooling medium provided. During the battery piece slicing process, when the temperature of the cooling medium is too high, the temperature difference between the battery piece and the cooling medium is reduced, thereby affecting the thermal stress, and further affecting the straightness and cross-sectional flatness at the slicing position, and finally affecting the slicing quality. In order to solve this problem, the present application provides a cooling mechanism for a battery piece slicing device.

[0041] As shown in Figures 1 to 6 , the cooling mechanism of the present application embodiment includes a refrigeration assembly 1, which includes a seat body 11 and a refrigeration sheet 12. The seat body 11 is provided with a flow channel 13 for the flow of cooling medium. The side wall of the seat body 11 is provided with a flow inlet 14 and a flow outlet 15 respectively communicating with the two ends of the flow channel 13. The cooling medium enters the flow channel 13 from the flow inlet 14 and flows out from the flow outlet 15 after flowing through the flow channel 13. The cooling surface of the refrigeration sheet 12 is attached to the seat body 11, and the refrigeration sheet 12 is configured to cool the cooling medium in the flow channel 13.

[0042] The cooling mechanism provided by the present application embodiment can implement rapid cooling of the cooling medium. The cooling mechanism provided by the present application embodiment is connected between the cooling medium supply mechanism of the spray device and the spray head. The cooling medium supplied by the cooling medium supply mechanism first passes through the cooling mechanism for cooling and then flows into the spray head and is finally sprayed out through the spray head. In this way, the temperature of the cooling medium sprayed out through the spray head is lower than room temperature. The sprayed cooling medium acts on the battery piece to be sliced, which increases the temperature difference between the battery piece and the cooling medium, thereby generating a larger thermal stress, and further improving the straightness and cross-sectional flatness at the slicing position.

[0043] The cooling medium that can be cooled by the cooling mechanism of the present application embodiment can be a liquid or gaseous cooling fluid such as water, oil, air, etc. The refrigeration sheet 12 may, for example, use a thermoelectric semiconductor refrigeration sheet (also known as a Peltier element). After being powered on, the temperature of the cooling surface of the refrigeration sheet 12 rapidly decreases, thereby cooling the seat body 11. The other surface of the refrigeration sheet 12 opposite to the cooling surface is a heat dissipation surface.

[0044] As shown in Figure 6 , in order to improve the cooling effect and cooling uniformity of the seat body 11, a plurality of refrigeration sheets 12 can be attached to the seat body 11, for example, four refrigeration sheets 12 in Figure 6 .

[0045] In order to facilitate the processing and forming of the flow channel 13 and facilitate the maintenance and cleaning of the flow channel 13. As shown in Figure 1 , Figures 2 to 3As shown, optionally, the cooling assembly 1 also includes a cover 16, with a flow channel 13 formed on the first side of the base 11 (as shown above), and the cover 16 covering the first side of the base 11 to close the flow channel 13. The cooling surface of the cooling plate 12 is in contact with the second side of the base 11 (as shown below).

[0046] Of course, the flow channel 13 can also be directly formed in the base 11 by drilling, buried hole or other hole forming processes. In this case, there is no need to set up the base 11.

[0047] Optionally, the cooling assembly 1 further includes a first temperature sensor 17 and a second temperature sensor 18, wherein: the first temperature sensor 17 is disposed within the flow channel 13 and near the inlet 14, and is used to measure the temperature of the cooling medium flowing into the flow channel 13 through the inlet 14; the second temperature sensor 18 is disposed within the flow channel 13 and near the outlet 15, and is used to measure the temperature of the cooling medium about to flow out of the flow channel 13 from the outlet 15.

[0048] By setting up a first temperature sensor 17 and a second temperature sensor 18, the inflow and outflow temperatures of the cooling medium are detected. Based on this, the cooling power of the thermostat 12 can be adjusted to ensure that the temperature of the cooled medium reaches a predetermined temperature below room temperature after cooling. Room temperature is, for example, room temperature (25°C), and the predetermined temperature is, for example, a specific temperature value such as 5°C, 8°C, or 10°C. The predetermined temperature can also be a temperature range, such as 5°C to 8°C, 6°C to 10°C, etc.

[0049] The first temperature sensor 17 and the second temperature sensor 18 can be any suitable type of existing temperature sensor, such as a thermocouple.

[0050] like Figures 3 to 4 As shown, optionally, the inlet 14 and outlet 15 are located on two opposite side walls of the base, and the flow channel 13 is arranged in a tortuous manner between the inlet 14 and outlet 15. The flow channel 13 is, for example, a serpentine channel or an S-shaped channel. This arrangement can extend the length of the flow channel 13, thereby correspondingly extending the flow time of the cooling medium in the flow channel 13, improving the cooling effect, and ultimately ensuring that the temperature of the cooling medium can be cooled to the predetermined temperature.

[0051] like Figures 1 to 2 As shown, optionally, the cooling mechanism in this embodiment further includes a heat dissipation component 2, which is attached to the heat dissipation surface of the cooling chip 12 and configured to cool the heat dissipation surface of the cooling chip 12 by blowing air. By dissipating heat from the heat dissipation surface of the cooling chip 12 through the heat dissipation component 2, the cooling effect of the cooling chip 12 can be kept stable, preventing the cooling chip 12 from overheating and being damaged.

[0052] Optionally, the heat dissipation assembly 2 includes a heat dissipation component 21 and a fan 22, wherein: the heat dissipation component 21 is in contact with the heat dissipation surface of the cooling chip 12. The fan 22 is positioned towards the heat dissipation component 21 and is used to blow air onto the heat dissipation component 21. The heat dissipation component 21 and the heat dissipation surface of the cooling chip 12 exchange heat, removing heat from the heat dissipation surface of the cooling chip 12, thereby ensuring that the cooling effect of the cooling chip 12 remains stable and preventing the cooling chip 12 from overheating and being damaged. The fan 22 blows air onto the heat dissipation component 21 to keep the heat dissipation component 21 within a lower temperature range, ensuring the heat dissipation effect of the heat dissipation component 21 on the cooling chip 12.

[0053] like Figures 7 to 8 As shown, optionally, the heat dissipation component 21 includes a finned plate 23, the first side surface of which (as shown above) is in contact with the heat dissipation surface of the cooling fin 12. The second side surface of the finned plate 23, opposite to the first side surface (as shown below), is provided with several rows of heat dissipation elements spaced along a first direction (e.g., the X direction). Each row of heat dissipation elements includes several heat dissipation fins 24 spaced along a second direction (e.g., the Y direction), the second direction being perpendicular to the first direction. A fan 22 is located on the second side of the finned plate 23 (as shown below), and the fan is used to blow air onto the finned plate 23.

[0054] A finned plate 23 is used to dissipate heat from the cooling element 12. Several rows of spaced-apart heat dissipation fins 24 are arranged on the second side surface of the finned plate 23, forming a crisscrossing heat dissipation channel within the finned plate 23. Air blown out by the fan 22 flows through this channel, carrying away heat from the finned plate 23. This increases the heat dissipation area of ​​the finned plate 23, improves the cooling effect of the fan on the finned plate 23, and ultimately enhances the heat dissipation effect of the finned plate 23 on the cooling element 12.

[0055] like Figure 1 As shown, optionally, the cooling mechanism in this embodiment of the application further includes a clamping member 3 and a protective cover plate (not shown in the figure). The clamping member 3 is used to press the cooling component 1 onto the heat dissipation component 2, and the protective cover plate is installed on the heat dissipation component 2, with the cooling component 2 located inside the protective cover plate.

[0056] The cooling component 1 is pressed onto the heat dissipation component 2 by the clamping member 3. This not only secures the cooling component 1 but also ensures that the heat dissipation component 2 and the cooling component 1 are in close contact, thereby improving the heat dissipation effect of the heat dissipation component 2 on the cooling component 1. The protective cover plate provides protection for the heat dissipation component 2 and the clamping member 3.

[0057] Based on the same concept, this application also provides a spray cooling device, which includes a cooling medium supply mechanism, a nozzle, and a cooling mechanism as described in any of the above embodiments. The cooling medium supply mechanism is connected to the inlet 14 of the cooling mechanism via a first connecting pipe, and the nozzle is connected to the outlet 15 of the cooling mechanism via a second connecting pipe. The cooling medium supply mechanism supplies the cooling medium and drives it to flow along the first connecting pipe into the flow channel 13 of the cooling mechanism. The cooling mechanism cools the cooling medium. The cooled cooling medium flows into the nozzle via the second connecting pipe and is then sprayed out through the nozzle.

[0058] By installing a cooling mechanism between the nozzle of the spray cooling device and the cooling medium supply mechanism, the cooling medium supplied from the cooling medium supply mechanism to the nozzle can be cooled, thereby making the temperature of the cooling medium sprayed from the nozzle lower than the ambient temperature.

[0059] The cooling medium, cooled by the cooling mechanism in this embodiment, is sprayed onto the cell to be cracked through a nozzle to perform spray cooling. This increases the temperature difference between the cell and the cooling medium, thereby generating greater thermal stress and improving the straightness and cross-sectional flatness at the crack.

[0060] Based on the same concept, this application also provides a solar cell slicing device, which includes a grooving laser, a cleaving laser, and the aforementioned spray cooling device, wherein: the grooving laser is used to create at least one groove on the solar cell along the direction to be cleaved. For example, a groove is created at each end of the solar cell along the direction to be cleaved. The cleaving laser is used to heat the solar cell along the extension direction of the groove. The spray cooling device is used to spray a cooling medium toward the heating position of the solar cell by the cleaving laser, so that the solar cell cleaves along the direction to be cleaved.

[0061] By combining a grooving laser, a cleaving laser, and a spray cooling device, the cell slicing equipment in this embodiment of the application achieves automatic slicing of cell wafers. Specifically, after the cleaving laser heats the cell wafer along the extension direction of the groove opened by the grooving laser, the spray cooling device sprays a cooling medium at a temperature lower than room temperature onto the heated position of the cell wafer, thereby increasing the temperature difference between the cell wafer and the cooling medium, generating greater thermal stress, and thus improving the straightness and cross-sectional flatness at the cleaving point.

[0062] The foregoing has provided a sufficiently detailed and specific description of this application. Those skilled in the art should understand that the descriptions in the embodiments are merely exemplary, and all changes made without departing from the true spirit and scope of this application should fall within the protection scope of this application. The scope of protection claimed in this application is defined by the claims, and not by the above descriptions in the embodiments.

Claims

1. A cooling mechanism, characterized in that, The cooling mechanism is used on a battery cell slitting device, and the cooling mechanism includes: A cooling assembly includes a base and a cooling plate. The base has a flow channel for the flow of a cooling medium. The side wall of the base has an inlet and an outlet that are respectively connected to the two ends of the flow channel. The cooling medium enters the flow channel from the inlet and flows out from the outlet after passing through the flow channel. The cooling surface of the cooling plate is in contact with the base. The cooling plate is configured to cool the cooling medium in the flow channel.

2. The cooling mechanism as described in claim 1, characterized in that, The cooling assembly also includes a cover, the flow channel is formed on the first side of the base, and the cover covers the first side of the base to close the flow channel; the cooling surface of the cooling chip is in contact with the second side of the base.

3. The cooling mechanism as described in claim 1, characterized in that, The cooling assembly further includes a first temperature sensor and a second temperature sensor, wherein: The first temperature sensor is disposed in the flow channel and near the inlet, and is used to measure the temperature of the cooling medium flowing into the flow channel through the inlet; The second temperature sensor is disposed inside the flow channel and near the outlet, for measuring the temperature of the cooling medium that will flow out of the flow channel from the outlet.

4. The cooling mechanism as described in claim 1, characterized in that, The inlet and the outlet are located on two opposite side walls of the seat body; The flow channel is arranged in a tortuous manner between the inlet and the outlet.

5. The cooling mechanism as described in claim 1, characterized in that, The cooling mechanism further includes a heat dissipation component, which is attached to the heat dissipation surface of the cooling chip and configured to blow air to cool the heat dissipation surface of the cooling chip.

6. The cooling mechanism as described in claim 5, characterized in that, The heat dissipation assembly includes a heat dissipation component and a fan, wherein: The heat dissipation component is in contact with the heat dissipation surface of the cooling chip; The fan is positioned toward the heat dissipation component and is used to blow air toward the heat dissipation component.

7. The cooling mechanism as described in claim 6, characterized in that, The heat dissipation section includes a finned plate, and the first side surface of the finned plate is in contact with the heat dissipation surface of the cooling chip; The second side surface of the finned plate, which is opposite to the first side surface, is provided with a plurality of rows of heat dissipation components at intervals along the first direction. Each row of heat dissipation components includes a plurality of heat dissipation fins at intervals along the second direction, which is perpendicular to the first direction. The fan is located on the second side of the finned plate and is used to blow air onto the finned plate.

8. The cooling mechanism as described in claim 5, characterized in that, The cooling mechanism also includes a clamping component and a protective cover plate, wherein the clamping component is used to press the cooling component onto the heat dissipation component; The protective cover is mounted on the heat dissipation assembly, and the cooling assembly is located inside the protective cover.

9. A spray cooling device, characterized in that, The spray cooling device includes a cooling medium supply mechanism, a spray nozzle, and a cooling mechanism as described in any one of claims 1 to 8, wherein: The cooling medium supply mechanism is connected to the inlet of the cooling mechanism via a first connecting pipe, and the nozzle is connected to the outlet of the cooling mechanism via a second connecting pipe. The cooling medium supply mechanism is used to supply cooling medium and drive the cooling medium to flow into the cooling mechanism along the first connecting pipe; the cooling mechanism is used to cool the cooling medium. The cooled medium flows into the nozzle through the second connecting pipe and is then sprayed out through the nozzle.

10. A solar cell slicing device, characterized in that, The cell slicing equipment includes a grooving laser, a slicing laser, and a spray cooling device as described in claim 9, wherein: The slotting laser is used to create at least one slot on the solar cell along the direction to be cleaved. The slit laser is used to heat the battery cells along the extension direction of the groove. The spray cooling device is used to spray cooling medium toward the heating position of the cell in the cleaving laser, so that the cell cracks along the direction to be cleaved.

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