Semiconductor wafer warping degree measuring instrument capable of simultaneously detecting multiple products

Abstract

The utility model discloses a semiconductor wafer warping degree measuring instrument capable of simultaneously detecting a plurality of products, and belongs to the technical field of warping degree measuring instruments. Comprising a conveyor and a supporting frame, the supporting frame is arranged outside the conveyor, a transverse moving support is arranged outside the supporting frame, a longitudinal moving support is arranged outside the transverse moving support, and four sets of suction cups are arranged above the supporting frame at equal intervals. According to the utility model, center positioning, clamping and straightening of semiconductor wafers can be conveniently carried out by the warping degree measuring instrument, multiple groups of semiconductor wafers can be conveniently measured, the measurement time of the multiple groups of the warping degree measuring instrument is shortened, the measurement efficiency of the warping degree measuring instrument is improved, and the measurement efficiency of the warping degree measuring instrument is improved. And the convenience of classifying and conveying the semiconductor wafers by the warping degree measuring instrument is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to warping degree measuring instrument technical field, concretely to a kind of semiconductor wafer warping degree measuring instrument of simultaneously detecting multiple products. BACKGROUND

[0002] Semiconductor wafer warping degree measuring instrument can detect multiple products simultaneously, significantly improve the detection efficiency, in traditional detection mode, it may be necessary to detect wafer one by one, not only time-consuming and laborious, but also may introduce error because of multiple operations, and this kind of measuring instrument that can detect multiple products simultaneously avoids these problems, so that detection process is more rapid and accurate.

[0003] As disclosed in the authorized announcement No.CN118578315B, a kind of semiconductor wafer warping degree measuring instrument of simultaneously detecting multiple products, including: drive part;The drive part includes support bottom shell, support block and drive block;The support bottom shell is set as cylindrical structure, rectangular protrusion is equipped on the outer wall of support bottom shell, the top of support bottom shell is equipped with annular groove, the annular groove of support bottom shell is connected with rectangular groove, the bottom of support bottom shell is equipped with cylindrical groove, the bottom of support bottom shell is equipped with synchronous motor;The inside of drive part is equipped with transposition part, and transposition part includes transposition ring;The transposition ring is rotatably connected in the inside of support bottom shell, and fixed point plug is inserted on the outer wall of transposition ring.

[0004] Although it is convenient to be clamped in the transposition ring at the same time, the relative position of the transposition ring is positioned, the transposition ring is rotatably connected in the inside of support bottom shell, the relative position of the corresponding wafer is adjusted in the process of rotation, different measurement structures are fixed on the transposition T frame, and the wafer is measured when moving to the measurement structure below.

[0005] But it does not solve the existing such warping degree measuring instrument when using generally not conducive to the center positioning clamping to arrange, it is inconvenient to measure multiple groups of semiconductor wafers, the time of measuring multiple groups of semiconductor wafers is affected, the efficiency of warping degree measuring instrument is affected, and the convenience of warping degree measuring instrument for semiconductor wafer classification conveying is affected. UTILITY MODEL CONTENTS

[0006] The utility model aims at providing a kind of semiconductor wafer warping degree measuring instrument of simultaneously detecting multiple products to solve the problem of warping degree measuring instrument in the above background that is not convenient for center positioning clamping to arrange, it is inconvenient to measure multiple groups of semiconductor wafers, the time of measuring multiple groups of semiconductor wafers is affected, the efficiency of warping degree measuring instrument is affected, and the convenience of warping degree measuring instrument for semiconductor wafer classification conveying is affected.

[0007] To solve the above technical problems, the utility model provides the following technical scheme:

[0008] A semiconductor wafer warping degree measuring instrument for simultaneously detecting multiple products, comprising a conveyor and a support frame, wherein the conveyor is externally provided with the support frame, the support frame is externally provided with a transverse moving support, the transverse moving support is externally provided with a longitudinal moving support, the support frame is provided with four groups of suction cups at equal intervals on the top, the suction cups are externally provided with a rotating disc, the rotating disc is externally provided with two groups of support columns, the support columns are all installed with a warping degree measuring instrument body on the side wall, the warping degree measuring instrument body is externally provided with a top plate, the support columns are externally provided with a first output machine, the first output machine is installed with a control panel on the side wall, the first output machine is externally provided with a second output machine, the conveyor is symmetrically installed with a first air cylinder on the side wall, and the first air cylinder is all installed with an elastic clamp plate on the output end.

[0009] Optionally, a support shaft is installed at the bottom center of the rotating disc, the support shaft extends to the top end of the support frame and is movably connected thereto, a worm gear is sleeved on the surface of the support shaft, and a servo motor is installed at the top end of the support frame outside the support shaft.

[0010] Optionally, a worm gear is installed on the output end of the servo motor, the worm gear is engaged with the worm gear, a power motor is installed on the side wall of the transverse moving support, a second threaded rod is installed on the output end of the power motor, and the second threaded rod extends to the inside of the transverse moving support and is movably connected thereto.

[0011] Optionally, a second threaded block is sleeved on the surface of the second threaded rod, the second threaded block is connected with the longitudinal moving support, and a variable frequency motor is installed at the top end of the longitudinal moving support.

[0012] Optionally, a third threaded rod is installed on the output end of the variable frequency motor, and the third threaded rod extends to the inside of the longitudinal moving support and is movably connected thereto.

[0013] Optionally, a third threaded block is sleeved on the surface of the third threaded rod, and the side wall of the third threaded block is connected with the top plate.

[0014] Optionally, a support plate is installed at the top end of each of the suction cups, and a first threaded block is installed on the two sides of the support plate.

[0015] Optionally, a stepping motor is installed at the top end of the rotating disc above the first threaded block, a first threaded rod is installed on the output end of the stepping motor, and the first threaded rod extends to the outside of the rotating disc through the rotating disc.

[0016] Optionally, the first threaded rod is movably connected with the rotating disc, and the first threaded rod is threadedly connected with the first threaded block.

[0017] Optionally, the first output machine is installed with a second air cylinder away from one side of the control panel, the output end of the second air cylinder is installed with a top plate, and the output end of the control panel is electrically connected with the input end of the conveyor, the first output machine, the second output machine, the warping degree measuring instrument body, the first air cylinder, the servo motor, the stepping motor, the suction cup, the power motor, the variable frequency motor and the second air cylinder.

[0018] Compared with the prior art, the warping degree measuring instrument not only realizes the center positioning, clamping and alignment of the semiconductor wafer, but also facilitates the measurement of multiple groups of semiconductor wafers, shortens the measurement time between multiple groups of the warping degree measuring instrument, improves the measurement efficiency of the warping degree measuring instrument, and improves the convenience of the warping degree measuring instrument for classifying and conveying semiconductor wafers.

[0019] When the semiconductor wafer warping degree measuring instrument is used, the semiconductor wafers are placed on the surface of the conveyor in sequence, so that the conveyor drives the semiconductor wafers to move and convey, when the semiconductor wafers move to between the two groups of first air cylinders, the first air cylinders drive the elastic clamping plates to move oppositely, and the elastic clamping plates center position, clamp and align the semiconductor wafers, which facilitates the center positioning, clamping and alignment of the semiconductor wafers, realizes the center positioning, clamping and alignment of the semiconductor wafers by the warping degree measuring instrument, and improves the convenience of the warping degree measuring instrument for center positioning, clamping and alignment of the semiconductor wafers.

[0020] When the semiconductor wafer needs to be measured, the semiconductor wafer is moved to the lower side of the rotating disc through the conveyor, the first threaded rod is driven to rotate by the stepping motor, the first threaded rod drives the first threaded block to move up and down, the first threaded block drives the support plate and the suction cup to move up and down, so that the suction cup moves to the surface of the semiconductor wafer, the suction cup is opened, so that the suction cup sucks the semiconductor wafer, the stepping motor is reversely opened, so that the stepping motor moves upward, the worm is driven to rotate by the servo motor, the worm drives the worm gear to rotate, the worm gear drives the support shaft, the suction cup and the semiconductor wafer to rotate by a certain angle, so that the suction cup drives the semiconductor wafer to move to the surface of a group of top plates, the semiconductor wafer is placed on the surface of the top plate, the second threaded rod is driven to rotate by the power motor, the second threaded rod drives the second threaded block to move, the second threaded block drives the longitudinal moving support to move, the third threaded rod is driven to rotate by the frequency conversion motor, the third threaded rod drives the third threaded block, the top plate and the semiconductor wafer to move, so that the semiconductor wafer moves to the surface of the warpage measuring instrument body for measurement, during the measurement process, the suction cup continues to suck the semiconductor wafer to be measured and is placed on the surface of another group of top plates, and another group of top plates is moved to the lower side of another group of warpage measuring instrument bodies for measurement, so that a plurality of semiconductor wafers can be measured at the same time, the warpage measuring instrument can measure a plurality of semiconductor wafers at the same time, the measurement time of the plurality of groups of the warpage measuring instrument is shortened, and the measurement efficiency of the warpage measuring instrument is improved.

[0021] After the measurement is completed, the warpage measuring instrument body feeds back the measurement result to the control panel, the control panel makes analysis and judgment, if it is a good product, the measurement is transported through the first output machine, if it is a defective product, when the semiconductor wafer is conveyed to the side of the second air cylinder, the second air cylinder drives the top plate to move, the top plate pushes the semiconductor wafer to the surface of the second output machine for transportation, so that convenient judgment and classification transportation are realized, the warpage measuring instrument is convenient to make judgment and classification transportation, and the convenience of classification transportation of the semiconductor wafer by the warpage measuring instrument is improved. BRIEF DESCRIPTION OF DRAWINGS

[0022] The drawings incorporated herein and forming a part of the specification, illustrate embodiments of the present application and, together with the description, further serve to explain the principles of the application and to enable one skilled in the pertinent art to make and use the application.

[0023] Figure 1 It is a three-dimensional structure schematic view of the utility model;

[0024] Figure 2 It is a front view structure schematic view of the utility model;

[0025] Figure 3 It is a conveyor three-dimensional structure schematic view of the utility model;

[0026] Figure 4 It is the three-dimensional structure schematic view of the rotating disc of the utility model;

[0027] Figure 5 It is the three-dimensional structure schematic view of the sucking disc of the utility model;

[0028] Figure 6 It is the three-dimensional structure schematic view of the supporting column of the utility model;

[0029] Figure 7 It is the three-dimensional structure schematic view of the control panel of the utility model.

[0030] Reference signs:

[0031] 1, conveyor; 2, first output machine; 3, second output machine; 4, rotating disc; 5, supporting frame; 6, supporting column; 7, warping degree measuring instrument body; 8, transverse moving support; 9, longitudinal moving support; 10, first air cylinder; 11, elastic clamping plate; 12, servo motor; 13, worm; 14, supporting shaft; 15, worm wheel; 16, stepping motor; 17, first threaded rod; 18, first threaded block; 19, supporting plate; 20, sucking disc; 21, power motor; 22, second threaded block; 23, second threaded rod; 24, frequency conversion motor; 25, third threaded block; 26, third threaded rod; 27, second air cylinder; 28, control panel; 29, top plate.

[0032] As shown in the drawings, in order to clearly realize the structure of the embodiments of the utility model, specific structures and devices are marked in the drawings, but this is only for the need of illustration, and is not intended to limit the utility model in the specific structure, device and environment, and the devices and environment can be adjusted or modified by the ordinary skilled in the art according to the specific needs. DETAILED DESCRIPTION

[0033] The semiconductor wafer warping degree measuring instrument for simultaneously detecting multiple products provided by the utility model is described in detail below in combination with the drawings and specific embodiments. It is explained here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and other alternative ways can also be adopted by the skilled in the art to implement some known technologies; and the drawings are only used to more specifically describe the embodiments, and are not intended to specifically limit the utility model.

[0034] It is to be appreciated that the use of any of the following terms "one embodiment," "an embodiment," "some embodiments," "one example," "an example," "some examples," and the like, are not intended to limit the scope of the application to a specific embodiment or embodiment, nor imply that all embodiments include the discussed feature, advantage or mode of operation. Rather, these terms are intended to encompass the subject matter recited in the claims, and those come within the scope of the application as expressed in the claims.

[0035] Generally, the nomenclature is chosen to be illustrative of the features that one of ordinary skill in the art would appreciate is of significance. For example, the term "one or more" as used herein, depending at least in part upon the context, can be used to describe any feature, structure, or characteristic in a singular sense or can be used in a plural sense to describe a combination of features, structures or characteristics. Additionally, the term "based on" can be understood as not necessarily being constrained to a set of exclusive factors, but rather, can instead be interpreted as allowing for existence of other factors not necessarily explicitly described.

[0036] It is to be understood that the terms "on," "over," and "above" in the present application should be interpreted in the broadest possible way consistent with the context. Consequently, "on," "over," and "above" should be interpreted not only to mean "directly on" something, but also to mean "on," "over," or "above" something with intervening features or layers also present.

[0037] In addition, spatially relative terms, such as "beneath", "below", "lower", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0038] As Figures 1 to 7The utility model discloses an embodiment provides a kind of semiconductor wafer warping degree measuring instrument for simultaneously detecting multiple products, including conveyer 1 and support frame 5, the outside of conveyer 1 is provided with support frame 5, the outside of support frame 5 is provided with transverse moving bracket 8, the outside of transverse moving bracket 8 is provided with longitudinal moving bracket 9, the top of support frame 5 is provided with four groups of suction cups 20 of equal interval, the outside of suction cup 20 is provided with rotary disc 4, the outside of rotary disc 4 is provided with two groups of support column 6, all be installed on the lateral wall of support column 6 with warping degree measuring instrument body 7, the outside of warping degree measuring instrument body 7 is provided with top plate 29, the outside of support column 6 is provided with first output machine 2, control panel 28 is installed on the lateral wall of first output machine 2, the outside of first output machine 2 is provided with second output machine 3, first cylinder 10 is symmetrically installed on the lateral wall of conveyer 1, the output end of first cylinder 10 is all installed with elastic clamp plate 11.

[0039] When using semiconductor wafer warping degree measuring instrument, operation control panel 28 opens conveyer 1, and semiconductor wafer is placed on the surface of conveyer 1 in sequence, so that conveyer 1 drives semiconductor wafer to move, when semiconductor wafer moves to between two groups of first cylinder 10, opens two groups of first cylinder 10, under the support of conveyer 1, first cylinder 10 drives elastic clamp plate 11 to move oppositely, and elastic clamp plate 11 is centered to position and clamps semiconductor wafer and is adjusted, which is convenient for the centering of semiconductor wafer to position and clamp and adjust, realizes that the warping degree measuring instrument is conveniently centered to position and clamp semiconductor wafer and adjust, and the convenience of the centering of semiconductor wafer to position and clamp and adjust of warping degree measuring instrument is improved.

[0040] Rotary disc 4 is installed with support shaft 14 at the bottom center, support shaft 14 extends to the top of support frame 5 and is movably connected therewith, the surface of support shaft 14 is sleeved with worm gear 15, and the top of support frame 5 outside support shaft 14 is installed with servo motor 12.

[0041] The output end of servo motor 12 is installed with worm 13, worm 13 is engaged with worm gear 15, power motor 21 is installed on the lateral wall of transverse moving bracket 8, the output end of power motor 21 is installed with second threaded rod 23, and second threaded rod 23 extends to the inside of transverse moving bracket 8 and is movably connected therewith.

[0042] Second threaded rod 23 surface is sleeved with second threaded block 22, and second threaded block 22 is connected with longitudinal moving bracket 9, and variable frequency motor 24 is installed on the top of longitudinal moving bracket 9, the output end of variable frequency motor 24 is installed with third threaded rod 26, and third threaded rod 26 extends to the inside of longitudinal moving bracket 9 and is movably connected therewith.

[0043] The third threaded rod 26 is sleeved with a third threaded block 25, the side wall of the third threaded block 25 is connected with a top plate 29, the top end of the suction cup 20 is provided with a supporting plate 19, and the two sides of the supporting plate 19 are provided with a first threaded block 18.

[0044] The top end of the rotating disc 4 above the first threaded block 18 is provided with a stepping motor 16, and the output end of the stepping motor 16 is provided with a first threaded rod 17.

[0045] The first threaded rod 17 is movably connected with the rotating disc 4, and the first threaded rod 17 is screw-connected with the first threaded block 18.

[0046] When it is necessary to measure the semiconductor wafer, the semiconductor wafer is moved to the lower side of the rotating disc 4 through the conveyor 1, the stepping motor 16 is opened, and the first threaded rod 17 is driven to rotate under the support of the rotating disc 4, the first threaded rod 17 drives the first threaded block 18 to move up and down under the threaded connection between the first threaded rod 17 and the first threaded block 18, the first threaded block 18 drives the support plate 19 and the suction cup 20 to move up and down, so that the suction cup 20 moves to the surface of the semiconductor wafer, the suction cup 20 is opened, so that the suction cup 20 sucks the semiconductor wafer, the stepping motor 16 is opened in the opposite direction, so that the stepping motor 16 moves upward, the servo motor 12 is opened, and the worm 13 is driven to rotate under the support of the support frame 5, the worm 13 drives the worm wheel 15 to rotate under the engagement between the worm 13 and the worm wheel 15, the worm wheel 15 drives the support shaft 14, the suction cup 20 and the semiconductor wafer to rotate by a certain angle, so that the suction cup 20 drives the semiconductor wafer to move to the surface of a group of top plates 29, and the semiconductor wafer is placed on the surface of the top plate 29, the power motor 21 is opened, the second threaded rod 23 is driven to rotate under the support of the transverse moving bracket 8, the second threaded rod 23 drives the second threaded block 22 to move under the threaded connection between the second threaded rod 23 and the second threaded block 22, the second threaded block 22 drives the longitudinal moving bracket 9 to move, the variable frequency motor 24 is opened, and the third threaded rod 26 is driven to rotate under the support of the longitudinal moving bracket 9, the third threaded rod 26 drives the third threaded block 25, the top plate 29 and the semiconductor wafer to move under the threaded connection between the third threaded rod 26 and the third threaded block 25, so that the semiconductor wafer moves to the surface of the warpage measuring instrument body 7 for measurement, the warpage measuring instrument body 7 adopts the same type of equipment as SemDex M1, and in the measurement process, the suction cup 20 continues to suck the semiconductor wafer to be measured and is placed on the surface of another group of top plates 29, and another group of top plates 29 is moved to the lower side of another group of warpage measuring instrument bodies 7 for measurement, so that a plurality of semiconductor wafers can be measured at the same time, the warpage measuring instrument can measure a plurality of semiconductor wafers at the same time, the measurement time of the warpage measuring instrument is shortened, and the measurement efficiency of the warpage measuring instrument is improved.

[0047] The second cylinder 27 is installed on the side away from the control panel 28 of the first output machine 2, the output end of the second cylinder 27 is installed with the top plate 29, and the output end of the control panel 28 is electrically connected with the input end of the conveyor 1, the first output machine 2, the second output machine 3, the warpage measuring instrument body 7, the first cylinder 10, the servo motor 12, the stepping motor 16, the suction cup 20, the power motor 21, the variable frequency motor 24 and the second cylinder 27.

[0048] After the measurement is completed, the warpage measuring instrument body 7 feeds back the measurement result to the control panel 28, the control panel 28 makes an analysis and judgment, if it is a good product, the measurement is transported through the first output machine 2, if it is a defective product, when the semiconductor wafer is conveyed to the side of the second air cylinder 27, the second air cylinder 27 is opened through the control panel 28, under the support of the first output machine 2, the second air cylinder 27 drives the top plate 29 to move, the top plate 29 pushes the semiconductor wafer to the surface of the second output machine 3 for transportation, which facilitates convenient judgment and classification transportation, realizes that the warpage measuring instrument can conveniently make judgment and classification transportation, and improves the convenience of the warpage measuring instrument for classification transportation of the semiconductor wafer.

[0049] The utility model provides a technical scheme working principle as follows: when using semiconductor wafer warpage measuring instrument, place semiconductor wa wafer in the surface of conveyer 1 in turn, make conveyer 1 drive semiconductor wafer to move and convey, when semiconductor wafer moves to between two groups of first air cylinder 10, first air cylinder 10 drives elastic clamping plate 11 to move to the opposite direction, and elastic clamping plate 11 carries out center positioning clamping and straightening to semiconductor wafer, and the convenient center positioning clamping and straightening to semiconductor wafer is convenient, when needing to measure semiconductor wafer, semiconductor wafer moves to the below of rotary disc 4 through conveyer 1, and stepping motor 16 drives first screw rod 17 to rotate, and first screw rod 17 drives first screw block 18 to move up and down, and first screw block 18 drives support plate 19 and suction cup 20 to move up and down, so that suction cup 20 moves to the surface of semiconductor wafer, opens suction cup 20, so that suction cup 20 holds semiconductor wafer, reversely opens stepping motor 16, so that stepping motor 16 moves up, and servo motor 12 drives worm 13 to rotate, and worm 13 drives worm wheel 15 to rotate, and worm wheel 15 drives support shaft 14, suction cup 20 and semiconductor wafer to rotate a certain angle, so that suction cup 20 drives semiconductor wafer to move to the surface of a group of top plate 29, places semiconductor wafer on the surface of top plate 29, and power motor 21 drives second screw rod 23 to rotate, and second screw rod 23 drives second screw block 22 to move, and second screw block 22 drives longitudinal movement support 9 to move, and variable frequency motor 24 drives third screw rod 26 to rotate, and third screw rod 26 drives third screw block 25, top plate 29 and semiconductor wafer to move, in the measurement process, continues to make suction cup 20 suck semiconductor wafer to be measured and place on the surface of another group of top plate 29, moves another group of top plate 29 to another group of warpage measuring instrument body 7 below and measures, and the convenient measurement of multiple semiconductor wafers is carried out simultaneously, after measurement, warpage measuring instrument body 7 feeds back the measurement result to control panel 28, and control panel 28 makes analysis and judgement, if it is a good product, passes first output machine 2 and conveys, if it is a defective product, when semiconductor wafer is conveyed to the side of second air cylinder 27, second air cylinder 27 drives top plate 29 to move, and top plate 29 pushes semiconductor wafer to the surface of second output machine 3 and conveys, and the convenient judgement and classification conveying are carried out, to complete the use of warpage measuring instrument.

[0050] The utility model covers any alternative, modification, equivalent method and scheme which are made on the essence and range of the utility model. In order to make the public have the thorough understanding of the utility model, the specific details are explained in the following preferred embodiment of the utility model, and the utility model can also be completely understood without the description of these details for the person skilled in the art. In addition, in order to avoid unnecessary confusion to the essence of the utility model, the well-known method, process, flow, element and circuit are not explained in detail.

[0051] The above only is the preferred implementation of the utility model, should point out, for the ordinary skill in the art of the present technology, on the premise of not departing from the principle of the utility model, still can make a number of improvement and embellishment, these improvements and embellishment also should be regarded as the protection range of the utility model.

Claims

1. A semiconductor wafer bow measurement apparatus for simultaneously measuring a plurality of products, characterized by: The utility model provides a kind of warping degree measuring instrument, including conveyor and support frame, the outside of the conveyor is provided with support frame, the outside of the support frame is provided with transverse moving support, the outside of the transverse moving support is provided with longitudinal moving support, the top of the support frame is provided with four groups of suction cups of equal interval, the outside of the suction cup is provided with rotary disc, the outside of the rotary disc is provided with two groups of support column, the sidewall of the support column is all installed with warping degree measuring instrument body, the outside of the warping degree measuring instrument body is provided with top plate, the outside of the support column is provided with first output machine, the sidewall of the first output machine is installed with control panel, the outside of the first output machine is provided with second output machine, the sidewall of the conveyor is symmetrically installed with first air cylinder, the output end of the first air cylinder is all installed with elastic clamp plate.

2. The semiconductor wafer warpage measurement apparatus for simultaneously measuring a plurality of products according to claim 1, wherein: The bottom end center of the rotary disc is installed with support shaft, the support shaft extends to the top of support frame and is movably connected therewith, the surface of the support shaft is sleeved with worm gear, the top of the support frame outside the support shaft is installed with servo motor.

3. The semiconductor wafer bow measurement apparatus for simultaneously measuring a plurality of products according to claim 2, wherein: The output end of the servo motor is installed with worm, the worm is engaged with worm gear, the sidewall of the transverse moving support is installed with power motor, the output end of the power motor is installed with second threaded rod, the second threaded rod extends to the inside of transverse moving support and is movably connected therewith.

4. The semiconductor wafer bow measurement apparatus for simultaneously measuring a plurality of products according to claim 3, wherein: The surface of the second threaded rod is sleeved with second threaded block, the second threaded block is connected with longitudinal moving support, the top of the longitudinal moving support is installed with variable frequency motor.

5. The semiconductor wafer bow measurement apparatus for simultaneously measuring a plurality of products according to claim 4, wherein: The output end of the variable frequency motor is installed with third threaded rod, the third threaded rod extends to the inside of longitudinal moving support and is movably connected therewith.

6. The semiconductor wafer bow measurement apparatus for simultaneously measuring a plurality of products according to claim 5, wherein: The surface of the third threaded rod is sleeved with third threaded block, the sidewall of the third threaded block is connected with top plate.

7. The semiconductor wafer bow measurement apparatus for simultaneously measuring a plurality of products according to claim 1, wherein: The top of the suction cup is all installed with support plate, the two sides of the support plate are all installed with first threaded block.

8. The semiconductor wafer bow measurement apparatus for simultaneously measuring a plurality of products according to claim 7, wherein: The top of the first threaded block is all installed with stepping motor, the output end of the stepping motor is all installed with first threaded rod, the first threaded rod extends to the outside of rotary disc.

9. The semiconductor wafer bow measurement apparatus for simultaneously measuring a plurality of products according to claim 8, wherein: The first threaded rod is movably connected with rotary disc, and the first threaded rod is threadedly connected with the first threaded block.

10. The semiconductor wafer bow measurement apparatus for simultaneously measuring a plurality of products according to claim 1, wherein: The side, away from the control panel, of the first output machine is installed with second air cylinder, the output end of the second air cylinder is installed with top plate, and the output end of the control panel is electrically connected with the input end of the conveyor, the first output machine, the second output machine, the warping degree measuring instrument body, the first air cylinder, the servo motor, the stepping motor, the suction cup, the power motor, the variable frequency motor and the second air cylinder.

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