Drilling machining mechanism of board-level TGV laser drilling equipment and drilling equipment

Abstract

The utility model discloses a drilling machining mechanism of board level TGV laser drilling equipment and the drilling equipment, the drilling machining mechanism of the board level TGV laser drilling equipment comprises a cross beam device, the cross beam device is provided with an X-axis moving module, the X-axis moving module comprises an X-axis moving mounting seat, the X-axis moving mounting seat is provided with a Z-axis moving module, and the Z-axis moving module is connected with the X-axis moving mounting seat. The Z-axis moving module comprises a Z-axis light path box assembly, a camera positioning assembly, a displacement sensor and a Bessel cutting head which are arranged on the X-axis moving mounting base. The Z-axis light path box assembly is used for reflecting laser beams fed from the outside into the Bessel cutting head and completing laser drilling work through the Bessel cutting head. The drilling machining mechanism of the board-level TGV laser drilling equipment and the drilling equipment have the advantages of being accurate in control, small in heat effect, high in environment adaptability and the like, efficient machining of high-depth-diameter-ratio micropores with the hole diameter and the hole pattern being controllable in height can be achieved, the machining efficiency is high, and the production benefit is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the laser application field of three -dimensional integrated package especially a kind of drilling processing mechanism and drilling equipment of board level TGV laser drilling equipment. BACKGROUND

[0002] The board level TGV laser drilling technology is the key enabling technology of supporting next-generation advanced electronic packaging (especially based on glass substrate). Its background originates from the urgent demand for high frequency, high speed, high density, high reliable interconnection and the unique advantages of glass substrate. Ultrafast laser (picosecond / femtosecond) becomes the only feasible scheme for realizing high-quality, high-precision TGV manufacturing due to its "cold processing" characteristics. Modern TGV laser drilling equipment is a highly complex system engineering, which integrates top-notch ultrafast laser technology, precision optics, high-precision motion control, advanced sensing, intelligent software and automation technology to solve the core challenges of high aspect ratio, high quality, high efficiency, large size, high yield and other core challenges in glass material processing.

[0003] The existing glass micro-hole processing technology includes mechanical drilling, sand blasting drilling, electrochemical discharge hole forming, plasma dry etching hole forming, photosensitive glass etching hole forming and the like. The above-mentioned technologies can only make micro-holes with a hole diameter of more than 30 μm, and the processing efficiency is low, and the micro-hole morphology is not good. By using ultrafast laser single-pulse perforation, multi-pulse percussion, top-down or bottom-up ring cutting or spiral processing, micro-channel structure can be directly prepared by micro-explosion and ablation, and micro-holes with a minimum diameter of about 20 um can be processed, but it is almost impossible to obtain micro-holes with a diameter of less than 10 um without taper. The technical requirement of laser direct ablation to obtain micro-holes is to reach the ablation threshold of the material, which leads to the fact that the surface of the glass via hole formed by laser direct ablation is still very rough. Therefore, the quality and depth-diameter ratio of the micro-holes formed on the glass material by the laser direct ablation method are not ideal.

[0004] In summary, the existing glass micro-hole processing technology has the technical problems of large hole diameter, low processing efficiency, poor micro-hole morphology, large taper of micro-hole, rough via hole surface and poor hole forming quality, and the like. The above-mentioned problems seriously limit the further development and popularization and application in the field.

[0005] Therefore, the utility model aims at providing a new technical scheme to solve the existing technical problems. UTILITY MODEL CONTENT

[0006] In order to overcome the deficiencies of the prior art, the utility model provides a kind of drilling processing mechanism and drilling equipment of board level TGV laser drilling equipment, effectively solve the technical problems of large hole diameter, poor micro-hole morphology, rough via hole surface, taper of hole forming, poor hole forming quality and low drilling efficiency in the prior art.

[0007] The utility model discloses a technical scheme that solves its technical problem is:

[0008] A kind of drilling processing mechanism of board-level TGV laser drilling equipment, including beam device, X-axis movement module is provided on the beam device, the X-axis movement module includes X-axis movement mounting seat, Z-axis movement module is provided on the X-axis movement mounting seat, the Z-axis movement module includes Z-axis optical path box assembly, camera positioning assembly, displacement sensor and Bezier cutting head being set on the X-axis movement mounting seat, the Z-axis optical path box assembly is used to reflect the laser beam sent from outside into the Bezier cutting head and complete laser drilling work by the Bezier cutting head.

[0009] As a further improvement of the above technical solution, the Z-axis movement module further includes a Z-axis movement guide rail, a Z-axis screw nut pair, a Z-axis drive motor, and a Z-axis movement mounting seat disposed on the Z-axis movement guide rail. The output shaft of the Z-axis drive motor is connected to one end of the screw rod of the Z-axis screw nut pair. The nut of the Z-axis screw nut pair is connected to the Z-axis movement mounting seat through a connecting block. The camera positioning assembly, the displacement sensor, and the Bezier cutting head are all disposed on the Z-axis movement mounting seat. The Z-axis drive motor can drive the Z-axis movement mounting seat, the camera positioning assembly, the displacement sensor, and the Bezier cutting head to move up and down in the guiding direction of the Z-axis movement guide rail through the Z-axis screw nut pair. The Z-axis optical path box assembly is disposed on the X-axis movement mounting seat.

[0010] As a further improvement of the above technical solution, the camera positioning assembly includes a coarse positioning camera assembly and a fine positioning camera assembly disposed on the Z-axis movement mounting seat. The coarse positioning camera assembly and the fine positioning camera assembly are fixedly installed on the Z-axis movement mounting seat through a camera assembly mounting seat. The coarse positioning camera assembly includes a coarse positioning camera, a coarse positioning camera lens, and a coarse positioning camera point light source used in conjunction. The fine positioning camera assembly includes a fine positioning camera, a fine positioning camera lens, and a fine positioning camera point light source used in conjunction.

[0011] As a further improvement of the above technical solution, the displacement sensor is a point spectrum displacement sensor. The displacement sensor is fixedly installed on the Z-axis movement mounting seat through a sensor mounting seat.

[0012] As a further improvement of the above technical solution, the Bezier cutting head is fixedly installed on the Z-axis movement mounting seat through a cutting head mounting seat. The cutting head mounting seat is provided with a cutting head temperature sensor.

[0013] As a further improvement of the above technical solution, a light path protection sleeve is arranged between the light path outlet of the Z-axis light path box assembly and the light path inlet of the Bezier cutting head.

[0014] As a further improvement of the above technical solution, a dust collection head is arranged at the bottom of the Bezier cutting head, and a through slot matched with the light beam outlet of the Bezier cutting head is arranged at the middle position of the dust collection head. The dust collection head is fixed on the Z-axis moving mounting seat through a dust collection head mounting seat and a dust collection head mounting plate. A dust collection pipeline is arranged at the side of the X-axis moving mounting seat. An internal dust collection channel is arranged in the dust collection head mounting seat, and the internal dust collection channel is communicated with the dust collection cavity of the dust collection head. The outlet of the internal dust collection channel is communicated with the lower end inlet of the dust collection pipeline through a dust collection connecting pipe.

[0015] As a further improvement of the above technical solution, the Z-axis moving mounting seat is arranged on the Z-axis moving guide rail through a Z-axis moving guide rail seat. A Z-axis cooling channel is arranged in the Z-axis moving mounting seat from the position corresponding to the Z-axis moving guide rail seat at the side of the Z-axis moving mounting seat. A Z-axis cooling pipeline joint is arranged at the inlet of the Z-axis cooling channel at the side of the Z-axis moving mounting seat. The other end of the Z-axis cooling channel extends to the back of the Z-axis moving mounting seat and forms an air outlet structure with multiple air outlets.

[0016] As a further improvement of the above technical solution, the X-axis moving module comprises an X-axis linear motor arranged on the cross beam device, an X-axis moving guide rail, and an X-axis moving mounting seat arranged on the X-axis moving guide rail. The stator of the X-axis linear motor is fixedly arranged on the cross beam device. The rotor of the X-axis linear motor is fixedly connected with the X-axis moving mounting seat. The X-axis linear motor is used to drive the X-axis moving mounting seat to move on the X-axis moving guide rail.

[0017] As a further improvement of the above technical solution, the X-axis moving module further comprises an X-axis moving grating arranged on the cross beam device and an X-axis temperature sensor arranged at the side of the rotor of the X-axis linear motor.

[0018] As a further improvement of the above technical solution, the X-axis moving module further comprises an X-axis limit switch and an X-axis limit buffer arranged on the cross beam device.

[0019] As a further improvement of the above technical solution, the X-axis moving mounting seat is arranged on the X-axis moving guide rail through an X-axis moving guide rail seat. An X-axis cooling channel is arranged in the X-axis moving mounting seat from the position corresponding to the X-axis moving guide rail seat at the side of the X-axis moving mounting seat. An X-axis cooling pipeline joint is arranged at the inlet of the X-axis cooling channel at the side of the X-axis moving mounting seat. The other end of the X-axis cooling channel extends to the back of the X-axis moving mounting seat and forms an air outlet structure with multiple air outlets.

[0020] As a further improvement of the above technical solution, the cross beam device includes a cross beam body, a first lateral thickening part and a second lateral thickening part are arranged on one side of the cross beam body on which the X-axis moving guide rail is installed, a first lateral groove is arranged between the first lateral thickening part and the second lateral thickening part, the X-axis moving guide rail includes a first X-axis moving guide rail and a second X-axis moving guide rail which are parallel to each other, the first X-axis moving guide rail is arranged on the first lateral thickening part, the second X-axis moving guide rail is arranged on the second lateral thickening part, and the X-axis linear motor is arranged in the first lateral groove.

[0021] As a further improvement of the above technical solution, the cross beam device is installed on the support platform of the drilling equipment through a first cross beam base and a second cross beam base, and the cross beam device and the first cross beam base and the second cross beam base are all marble components.

[0022] As a further improvement of the above technical solution, a laser and a light path shaping box assembly are further included, the light path shaping box assembly includes a sealed shaping box with a shaping box light path entrance and a shaping box light path exit, and along a light path path of a laser beam, a first mirror, a second mirror, a beam expander, a glass sheet and a third mirror are sequentially arranged in the sealed shaping box, the shaping box light path entrance is used for allowing the laser beam emitted by the laser to be emitted to the inside of the light path shaping box assembly, the shaping box light path exit is used for allowing the laser beam to be emitted from the light path shaping box assembly, and the laser beam emitted from the shaping box light path exit of the light path shaping box assembly is used for corresponding entering into the light path entrance of the Z-axis light path box assembly, the Z-axis light path box assembly has a fourth mirror inside and is used for reflecting the laser beam entering into the inside of the Z-axis light path box assembly to the Bessel cutting head through the fourth mirror.

[0023] As a further improvement of the above technical solution, the first mirror, the second mirror and the third mirror are all installed in the sealed shaping box through a three-dimensional adjusting frame, the beam expander is installed in the sealed shaping box through a two-dimensional adjusting frame, and the glass sheet is installed in the sealed shaping box through a six-dimensional adjusting frame.

[0024] The utility model also provides:

[0025] A board-level TGV laser drilling equipment, the board-level TGV laser drilling equipment includes the drilling processing mechanism of the board-level TGV laser drilling equipment.

[0026] The utility model discloses a beneficial effect is: the utility model provides a kind of drilling processing mechanism and drilling equipment of plate level TGV laser drilling equipment, this kind of drilling processing mechanism of plate level TGV laser drilling equipment is driven by X axis movement module and Z axis movement module and makes the Bezier cutting head move in X axis and Z axis, laser beam is reflected to the Bezier cutting head by Z axis optical path box subassembly, drilling processing is carried out to glass plate by the Bezier cutting head, Bezier light beam is generated by the Bezier cutting head, the Bezier cutting head can be modulated as non-diffraction light beam with long focal depth by beam shaping technology, and its axial energy distribution is controllable, in combination with the control of high-speed high-precision X axis and Z axis, energy controllable deposition in glass plate and the accurate control of modification processing area can be realized, the efficient processing of high depth-diameter ratio micro-hole with highly controllable aperture and hole type can be realized. Compared with prior art other processing techniques, the processing process does not produce any mechanical force, thermal effect is small, hole type is adjustable, and can be processed in atmospheric environment, can fully meet the feasibility of adapter plate industrial batch preparation, compared with traditional process has obvious technical advancement, greatly improves production efficiency.

[0027] In conclusion, the drilling processing mechanism and drilling equipment of plate level TGV laser drilling equipment effectively solve the technical problems of large aperture, poor micro-hole appearance characteristics, rough through-hole surface, taper in hole forming, poor hole forming quality and low drilling efficiency in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0028] The utility model is further described below in connection with the drawings and examples.

[0029] Figure 1 is the assembly schematic diagram of the drilling processing mechanism of plate level TGV laser drilling equipment in the utility model embodiment;

[0030] Figure 2 is the assembly schematic diagram of Z axis movement module in the utility model embodiment;

[0031] Figure 3 is another assembly schematic diagram of Z axis movement module in the utility model embodiment;

[0032] Figure 4 is the assembly schematic diagram of X axis movement module in the utility model embodiment;

[0033] Figure 5 is the local structure schematic diagram of X axis movement mounting seat back in the utility model embodiment;

[0034] Figure 6 is the structure schematic diagram of crossbeam device in the utility model embodiment;

[0035] Figure 7It is the internal structure schematic view of the light path shaping box assembly in the embodiment of the utility model.

[0036] In the drawing:

[0037] 1, beam device, 11, beam main body, 111, first transverse thickening, 112, second transverse thickening, 113, first transverse groove, 12, first beam base, 13, second beam base, 2, X-axis movement module, 21, X-axis movement mounting seat, 211, X-axis cooling pipeline joint, 212, X-axis cooling air outlet, 213, X-axis cooling groove, 22, X-axis linear motor, 23, X-axis movement guide rail, 24, X-axis movement grating, 25, X-axis temperature sensor, 26, X-axis limit switch, 27, X-axis limit buffer, 3, Z-axis movement module, 301, Z-axis movement guide rail, 302, Z-axis screw nut pair, 303, Z-axis drive motor, 31, Z-axis movement mounting seat, 311, Z-axis cooling pipeline joint, 32, Z-axis light path box assembly, 33, camera positioning assembly, 331, coarse positioning camera, 332, coarse positioning camera lens, 333, coarse positioning camera point light source, 334, fine positioning camera, 335, fine positioning camera lens, 336, fine positioning camera point light source, 337, camera assembly mounting seat, 34, displacement sensor, 341, sensor mounting seat, 35, Bezier cutting head, 351, cutting head mounting seat, 352, cutting head temperature sensor, 36, light path protection sleeve, 37, dust absorption head, 371, dust absorption head mounting seat, 372, dust absorption head mounting plate, 373, dust absorption pipeline, 38, Z-axis limit switch, 39, Z-axis buffer block, 4, laser, 5, light path shaping box assembly, 51, sealing shaping box, 511, shaping box light path entrance, 512, shaping box light path exit, 52, first reflector, 53, second reflector, 54, beam expander, 55, glass sheet, 56, third reflector, 57, three-dimensional adjusting frame, 58, two-dimensional adjusting frame, 59, six-dimensional adjusting frame. DETAILED DESCRIPTION

[0038] The concept, specific structure and generated technical effects of the utility model will be described clearly and completely in combination with the embodiments and drawings, so that the purpose, features and effects of the utility model can be fully understood. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments, and other embodiments obtained by the skilled in the art without creative labor based on the embodiments of the utility model all belong to the protection scope of the utility model. In addition, all the coupling / connection relations involved in the patent are not single direct connection of components, but can form a better coupling structure by adding or reducing coupling auxiliary components according to the specific implementation situation. Figures 1-7 .

[0039] With reference to the drawings Figure 1 、 Figure 2 、 Figure 3 The utility model provides:

[0040] A kind of drilling processing mechanism of board-level TGV laser drilling equipment, including beam device 1, X-axis movement module 2 is provided on the beam device 1, the X-axis movement module 2 includes X-axis movement mounting seat 21, Z-axis movement module 3 is provided on the X-axis movement mounting seat 21, the Z-axis movement module 3 includes Z-axis optical path box assembly 32 being arranged on the X-axis movement mounting seat 21, camera positioning assembly 33, displacement sensor 34 and Bezier cutting head 35, the Z-axis optical path box assembly 32 is used to reflect the laser beam sent from outside into the Bezier cutting head 35 and complete laser drilling work by the Bezier cutting head 35.Driven by X-axis movement module 2 and Z-axis movement module 3, the Bezier cutting head 35 moves in X-axis direction and Z-axis direction, so that the Bezier cutting head 35 reaches preset processing position and carries out drilling processing work when the utility model is implemented.Specifically, the laser 4 laser beam is shot into the optical path shaping box assembly 5, the optical path shaping box assembly 5 is shaped to laser beam and the shaped laser beam is shot to the Z-axis optical path box assembly 32, and the Z-axis optical path box assembly 32 is reflected to the Bezier cutting head 35, and the Bezier cutting head 35 is drilled to glass plate material by the Bezier cutting head 35, and the Bezier cutting head 35 can be modulated into non-diffractive beam with long focal depth by beam shaping technology, and its axial energy distribution is controllable, in combination with high-speed high-precision X-axis direction and Z-axis direction control, energy controllable deposition in glass plate material and accurate control of modified processing area can be realized, and high-depth-ratio micro-hole with highly controllable aperture and hole type can be efficiently processed.Compared with other existing processing techniques, the processing process does not generate any mechanical force, thermal effect is small, hole type is controllable, and can be processed in atmospheric environment, can fully meet the feasibility of industrial batch preparation of adapter plate, has obvious technical advancement compared with traditional process, and greatly improves production efficiency.

[0041] With reference to the drawings Figure 2 、 Figure 3In some specific embodiments, the Z-axis moving module 3 further comprises a Z-axis moving guide rail 301 arranged on the X-axis moving mounting base 21, a Z-axis screw-nut pair 302, a Z-axis driving motor 303, and a Z-axis moving mounting base 31 arranged on the Z-axis moving guide rail 301. The output shaft of the Z-axis driving motor 303 is connected with one end of the screw rod of the Z-axis screw-nut pair 302. The nut of the Z-axis screw-nut pair 302 is connected with the Z-axis moving mounting base 31 through a connecting block. The camera positioning assembly 33, the displacement sensor 34, and the Bezier cutting head 35 are arranged on the Z-axis moving mounting base 31. The Z-axis driving motor 303 can drive the Z-axis moving mounting base 31, the camera positioning assembly 33, the displacement sensor 34, and the Bezier cutting head 35 to move up and down in the guiding direction of the Z-axis moving guide rail 301. The Z-axis light path box assembly 32 is arranged on the X-axis moving mounting base 21. In this embodiment, the Z-axis moving guide rail 301 is a linear guide rail and has two. The two Z-axis moving guide rails 301 are symmetrically arranged on the X-axis moving mounting base 21. The Z-axis driving motor 303 is a servo motor. The Z-axis driving motor 303 is installed on the X-axis moving mounting base 21 through a motor base. The screw rod of the Z-axis screw-nut pair 302 is installed on the X-axis moving mounting base 21 through a screw rod base and a screw rod bearing. The output shaft of the Z-axis driving motor 303 is connected with one end of the screw rod of the Z-axis screw-nut pair 302 through a shaft coupling. The camera positioning assembly 33 is used for positioning the plate. The displacement sensor 34 is used for collecting the height displacement data of the Bezier cutting head 35 to realize high-precision drilling.

[0042] Referring to Figure 2 , Figure 3 In some specific embodiments, the side of the Z-axis moving mounting base 31 is provided with a Z-axis limit switch 38. The X-axis moving mounting base 21 is provided with a Z-axis buffer block 39. The Z-axis limit switch 38 and the Z-axis buffer block 39 are used for limiting the movement of the Z-axis moving mounting base 31 in the Z-axis direction.

[0043] Referring to Figure 2 , Figure 3In some specific embodiments, the camera positioning assembly 33 comprises a coarse positioning camera assembly and a fine positioning camera assembly arranged on the Z-axis moving mount 31, the coarse positioning camera assembly and the fine positioning camera assembly are fixedly installed on the Z-axis moving mount 31 through a camera assembly mount 337, the coarse positioning camera assembly comprises a coarse positioning camera 331, a coarse positioning camera lens 332 and a coarse positioning camera point light source 333 used in cooperation, and the fine positioning camera assembly comprises a fine positioning camera 334, a fine positioning camera lens 335 and a fine positioning camera point light source 336 used in cooperation. In the implementation of the present application, the coarse positioning camera assembly and the fine positioning camera assembly are respectively used to provide coarse positioning and fine positioning functions for the plate, the positioning accuracy can be improved through double positioning operation, and thus a basis is provided for high-quality drilling work.

[0044] With reference to Figure 2 , Figure 3 In some specific embodiments, the displacement sensor 34 is a point spectrum displacement sensor, and the displacement sensor 34 is fixedly installed on the Z-axis moving mount 31 through a sensor mount 341. The point spectrum displacement sensor can maximally improve the monitoring and control accuracy of the Bezier cutting head 35 in the height direction and improve the drilling processing quality.

[0045] With reference to Figure 2 , Figure 3 In some specific embodiments, the Bezier cutting head 35 is fixedly installed on the Z-axis moving mount 31 through a cutting head mount 351, the cutting head mount 351 is provided with a cutting head temperature sensor 352, the cutting head mount 351 is a cylindrical mount, has a fixed through hole at the center position, and the Bezier cutting head 35 is fixedly arranged at the fixed through hole, the cutting head temperature sensor 352 is used to provide temperature data of the Bezier cutting head 35 in real time, when temperature abnormality is detected, data can be fed back to the control system, and the control system can control shutdown after receiving the temperature abnormality, so as to avoid equipment damage or abnormal processing.

[0046] With reference to Figure 2 , Figure 3In some specific embodiments, a light path protection sleeve 36 is arranged between the light path outlet of the Z-axis light path box assembly 32 and the light path inlet of the Bezier cutting head 35, which is used to protect the light path safety between the light path outlet of the Z-axis light path box assembly 32 and the light path inlet of the Bezier cutting head 35, avoiding the influence of external environment on the light path and affecting the processing quality. The upper end of the light path protection sleeve 36 is connected with the light path outlet of the Z-axis light path box assembly 32, and the lower end of the light path protection sleeve 36 is connected with the light path inlet of the Bezier cutting head 35. The light path protection sleeve 36 has a certain telescopic function to ensure that the light path protection sleeve 36 will not be deformed and damaged when the Bezier cutting head 35 is in lifting motion.

[0047] Referring to Figure 2 , Figure 3 In some specific embodiments, the bottom of the Bezier cutting head 35 is provided with a dust collection head 37, which has a through slot in the middle position matched with the light beam outlet of the Bezier cutting head 35. The dust collection head 37 is fixed on the Z-axis moving mounting seat 31 through a dust collection head mounting seat 371 and a dust collection head mounting plate 372. The X-axis moving mounting seat 21 is provided with a dust collection pipeline 373 on the side. An internal dust collection channel is formed in the inside of the dust collection head mounting seat 371, which is communicated with the dust collection inner cavity of the dust collection head 37. The outlet of the internal dust collection channel is communicated with the lower end inlet of the dust collection pipeline 373 through a dust collection connecting pipe. In specific application, the upper part of the dust collection pipeline 373 is connected with a dust collector module. When the equipment works, the dust collector module starts to work. The smoke and dust particles generated during the drilling work of the Bezier cutting head 35 are sucked away by the dust collection head 37. The smoke and dust particles in the dust collection inner cavity of the dust collection head 37 pass through the internal dust collection channel of the dust collection head mounting seat 371, the dust collection connecting pipe and the dust collection pipeline 373 in turn and are finally sucked away by the dust collector module, avoiding the influence of smoke and dust particles on the processing quality and the pollution of the environment.

[0048] Referring to Figure 2 , Figure 3In some specific embodiments, the Z-axis moving seat 31 is arranged on the Z-axis moving guide rail 301 through a Z-axis moving guide rail seat, and a Z-axis cooling channel is arranged in the Z-axis moving seat 31 from a side corresponding to a position of the Z-axis moving guide rail seat, and a Z-axis cooling pipe joint 311 is arranged at an entrance of the Z-axis cooling channel at the side of the Z-axis moving seat 31, and the other end of the Z-axis cooling channel extends to the back of the Z-axis moving seat 31 and forms an air outlet structure with multiple air outlets. Specifically, multiple Z-axis cooling air outlets are arranged at the back of the Z-axis moving seat 31, and multiple Z-axis cooling grooves are arranged in the back of the Z-axis moving seat 31 and are in communication with the Z-axis cooling air outlets. In actual application, an external cooling air source is connected to the Z-axis cooling pipe joint 311 through a pipe and sends cooling air into the Z-axis cooling channel, and the Z-axis cooling channel sends the cooling air into the Z-axis cooling grooves through the Z-axis cooling air outlets. Since the Z-axis moving guide rail seat is arranged at the position of the Z-axis cooling grooves, and the distal end of the Z-axis cooling grooves extends out of the projection range of the Z-axis moving guide rail seat on the Z-axis moving seat 31 and forms an air outlet, when the cooling air enters the Z-axis cooling grooves, the cooling air in the Z-axis cooling grooves cools the Z-axis moving guide rail seat on one hand, and on the other hand, the cooling air is sent out through the air outlets at the ends of the Z-axis cooling grooves and cools the Z-axis moving guide rail 301, so as to ensure the normal operation of the Z-axis moving guide rail 301 and the Z-axis moving guide rail seat.

[0049] Referring to Figure 1 , Figure 4 In some specific embodiments, the X-axis moving module 2 comprises an X-axis linear motor 22 arranged on the beam device 1, an X-axis moving guide rail 23, and an X-axis moving seat 21 arranged on the X-axis moving guide rail 23. The stator of the X-axis linear motor 22 is fixedly arranged on the beam device 1, the mover of the X-axis linear motor 22 is fixedly connected with the X-axis moving seat 21, and the X-axis linear motor 22 is used to drive the X-axis moving seat 21 to move on the X-axis moving guide rail 23. In the implementation of the present application, since the Z-axis optical path box assembly 32, the camera positioning assembly 33, the displacement sensor 34, and the Bezier cutting head 35 are arranged on the X-axis moving seat 21, when the X-axis linear motor 22 drives the X-axis moving seat 21 to move on the X-axis moving guide rail 23, the Z-axis optical path box assembly 32, the camera positioning assembly 33, the displacement sensor 34, and the Bezier cutting head 35 will move synchronously with the X-axis moving seat 21, thereby achieving the control of the movement of the Z-axis optical path box assembly 32, the camera positioning assembly 33, the displacement sensor 34, and the Bezier cutting head 35 in the X-axis direction.

[0050] With reference to Figure 1 , Figure 4 , Figure 6 In this embodiment, the beam device 1 is installed on the support platform of the drilling equipment through the first beam base 12 and the second beam base 13, and the beam device 1 and the first beam base 12 and the second beam base 13 are all marble components, which have good anti-seismic performance and help to improve the machining precision. The beam device 1 comprises a beam body 11, one side of the beam body 11 on which the X-axis moving guide rail 23 is installed is provided with a first lateral thickening part 111 and a second lateral thickening part 112, and a first lateral groove 113 is arranged between the first lateral thickening part 111 and the second lateral thickening part 112. The X-axis moving guide rail 23 comprises a first X-axis moving guide rail and a second X-axis moving guide rail which are parallel to each other. The first X-axis moving guide rail is arranged on the first lateral thickening part 111, the second X-axis moving guide rail is arranged on the second lateral thickening part 112, and the X-axis linear motor 22 is arranged in the first lateral groove 113.

[0051] With reference to Figure 1 , Figure 4 In some specific embodiments, the X-axis moving module 2 further comprises an X-axis moving grating 24 arranged on the beam device 1 and an X-axis temperature sensor 25 arranged on the mover side of the X-axis linear motor 22. The movement distance of the Z-axis moving module 3 in the X-axis direction can be detected in real time through the X-axis moving grating 24, and the displacement of the X-axis linear motor 22 and the X-axis moving guide rail 23 in the X-axis direction can be detected through the X-axis temperature sensor 25, so as to facilitate precise control.

[0052] With reference to Figure 1 , Figure 4 In some specific embodiments, the X-axis moving module 2 further comprises an X-axis limit switch 26 and an X-axis limit buffer 27 arranged on the beam device 1. The X-axis limit switch 26 and the X-axis limit buffer 27 are used to limit the X-axis moving mounting seat 21 in the X-axis direction. Specifically, the X-axis limit switch 26 has two, which are arranged on the two sides of the beam device 1 in the X-axis direction, respectively. The X-axis limit buffer 27 has four, which are arranged on the two sides of the beam device 1 in the X-axis direction in pairs.

[0053] With reference to Figure 4 , Figure 5In some specific embodiments, the X-axis moving seat 21 is arranged on the X-axis moving guide rail 23 through an X-axis moving guide rail seat, and an X-axis cooling channel is formed in the side of the X-axis moving seat 21 corresponding to the position of the X-axis moving guide rail seat. An X-axis cooling pipe joint 211 is arranged at the entrance of the X-axis cooling channel in the side of the X-axis moving seat 21, and the other end of the X-axis cooling channel extends to the back of the X-axis moving seat 21 and forms an air outlet structure with multiple air outlets. Specifically, a plurality of X-axis cooling air outlets 212 are arranged at the back of the X-axis moving seat 21, and a plurality of X-axis cooling grooves 213 are formed in the back of the X-axis moving seat 21 and are in communication with the X-axis cooling air outlets 212. In actual application, an external cooling air source is connected to the X-axis cooling pipe joint 211 through a pipeline and sends cooling air into the X-axis cooling channel. The X-axis cooling channel sends the cooling air into the X-axis cooling grooves 213 through the X-axis cooling air outlets 212. Since the X-axis moving guide rail seat is arranged at the position of the X-axis cooling grooves 213, and the distal end of the X-axis cooling grooves 213 extends out of the projection range of the X-axis moving guide rail seat on the X-axis moving seat 21 and forms an air outlet, when the cooling air enters the X-axis cooling grooves 213, the cooling air in the X-axis cooling grooves 213 cools the X-axis moving guide rail seat on one hand, and on the other hand, the cooling air is sent outwards through the air outlet at the end of the X-axis cooling grooves 213 and cools the X-axis moving guide rail 23, thereby ensuring the normal operation of the X-axis moving guide rail 23 and the X-axis moving guide rail seat.

[0054] Reference Figure 7In some specific embodiments, the laser 4 and the light path shaping box assembly 5 are further included, the light path shaping box assembly 5 comprises a sealed shaping box 51 with a shaping box light path entrance 511 and a shaping box light path exit 512, along the light path of the laser beam, the first mirror 52, the second mirror 53, the beam expander 54, the glass sheet 55 and the third mirror 56 are sequentially arranged in the sealed shaping box 51, the shaping box light path entrance 511 is used for the laser beam emitted by the laser 4 to exit to the inside of the light path shaping box assembly 5, the shaping box light path exit 512 is used for the laser beam to exit from the light path shaping box assembly 5, the laser beam exiting from the shaping box light path exit 512 of the light path shaping box assembly 5 is used to correspond to the light path entrance of the Z-axis light path box assembly 32, the Z-axis light path box assembly 32 has a fourth mirror inside and is used for reflecting the laser beam entering the inside of the Z-axis light path box assembly 32 to the Bessel cutting head 35 through the fourth mirror. Specifically, the first mirror 52, the second mirror 53 and the third mirror 56 are all installed in the sealed shaping box 51 through a three-dimensional adjusting frame 57, the beam expander 54 is installed in the sealed shaping box 51 through a two-dimensional adjusting frame 58, and the glass sheet 55 is installed in the sealed shaping box 51 through a six-dimensional adjusting frame 59. In the implementation of the present application, the first mirror 52, the second mirror 53 and the third mirror 56 are all used for reflecting the laser beam, the beam expander 54 is arranged opposite to the second mirror 53 and is used for expanding the diameter of the laser processing beam, the glass sheet 55 is used for receiving the laser beam after expansion by the beam expander 54 and modulating the beam into left-handed circularly polarized light, and the sealed shaping box 51 is used for sealing the internal components to avoid the adverse effects of the external environment.

[0055] Based on the drilling machining mechanism of the above-mentioned plate-level TGV laser drilling equipment, the utility model further provides:

[0056] A plate-level TGV laser drilling equipment, the plate-level TGV laser drilling equipment comprises the drilling machining mechanism of the plate-level TGV laser drilling equipment. In actual application, the plate-level TGV laser drilling equipment further comprises a Y-axis moving module and a plate lifting module, and the plate lifting module is arranged on the Y-axis moving module. During drilling machining, the glass substrate plate is placed on the plate lifting module, the Y-axis moving module drives the plate lifting module to move to the drilling position, the X-axis moving module 2 and the Z-axis moving module 3 cooperate to drive the Bessel cutting head 35 to reach the preset drilling position, and the Bessel cutting head 35 is used for drilling the plate.

[0057] The above is a specific description of the preferred embodiment of the present application, but the present application is not limited to the described embodiment, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the present application, and these equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. A drilling mechanism of a board-level TGV laser drilling apparatus, characterized by: Including crossbeam device (1), the crossbeam device (1) is provided with X-axis movement module (2), the X-axis movement module (2) includes X-axis movement mounting seat (21), the X-axis movement mounting seat (21) is provided with Z-axis movement module (3), the Z-axis movement module (3) includes the Z-axis optical path box assembly (32) being set on the X-axis movement mounting seat (21), camera positioning assembly (33), displacement sensor (34) and Bezier cutting head (35), the Z-axis optical path box assembly (32) is used to reflect the laser beam sent from outside into the Bezier cutting head (35) and completes laser drilling work through the Bezier cutting head (35).

2. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 1, wherein: The Z-axis movement module (3) further includes Z-axis movement guide rail (301) set on the X-axis movement mounting seat (21), Z-axis screw nut pair (302), Z-axis drive motor (303) and Z-axis movement mounting seat (31) set on the Z-axis movement guide rail (301), the output shaft of the Z-axis drive motor (303) is connected with the one end of the screw rod of the Z-axis screw nut pair (302), the nut of the Z-axis screw nut pair (302) is connected with the Z-axis movement mounting seat (31) through the connecting block, the camera positioning assembly (33), the displacement sensor (34) and the Bezier cutting head (35) are all arranged on the Z-axis movement mounting seat (31), the Z-axis drive motor (303) can drive the Z-axis movement mounting seat (31), the camera positioning assembly (33), the displacement sensor (34) and the Bezier cutting head (35) to move up and down in the guide direction of the Z-axis movement guide rail (301) through the Z-axis screw nut pair (302), and the Z-axis optical path box assembly (32) is arranged on the X-axis movement mounting seat (21).

3. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 2, wherein: The camera positioning assembly (33) includes a coarse positioning camera assembly and a fine positioning camera assembly arranged on the Z-axis movement mounting seat (31), and the coarse positioning camera assembly and the fine positioning camera assembly are fixedly installed on the Z-axis movement mounting seat (31) through a camera assembly mounting seat (337); the coarse positioning camera assembly comprises a coarse positioning camera (331), a coarse positioning camera lens (332) and a coarse positioning camera point light source (333) used in conjunction; and the fine positioning camera assembly comprises a fine positioning camera (334), a fine positioning camera lens (335) and a fine positioning camera point light source (336) used in conjunction.

4. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 2, wherein: The displacement sensor (34) is a point spectrum displacement sensor, and the displacement sensor (34) is fixedly installed on the Z-axis movement mounting seat (31) through a sensor mounting seat (341).

5. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 2, wherein: The Bezier cutting head (35) is fixedly installed on the Z-axis movement mounting seat (31) through a cutting head mounting seat (351), and a cutting head temperature sensor (352) is arranged on the cutting head mounting seat (351).

6. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 2, wherein: An optical path protection sleeve (36) is arranged between the optical path outlet of the Z-axis optical path box assembly (32) and the optical path inlet of the Bezier cutting head (35).

7. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 2, wherein: The bottom of the Bezier cutting head (35) is provided with a dust collection head (37) with a through slot matching the light beam outlet of the Bezier cutting head (35) in the middle position, the dust collection head (37) is fixed on the Z-axis moving mounting seat (31) through a dust collection head mounting seat (371) and a dust collection head mounting plate (372), the X-axis moving mounting seat (21) is provided with a dust collection pipeline (373) on the side, and the inside of the dust collection head mounting seat (371) is provided with an internal dust collection channel, which is communicated with the dust collection cavity of the dust collection head (37), and the outlet of the internal dust collection channel is communicated with the lower end inlet of the dust collection pipeline (373) through a dust collection connecting pipe.

8. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 2, wherein: The Z-axis moving mounting seat (31) is arranged on the Z-axis moving guide rail (301) through a Z-axis moving guide rail seat, and the Z-axis cooling channel is arranged in the position corresponding to the Z-axis moving guide rail seat on the side of the Z-axis moving mounting seat (31), the Z-axis cooling channel is provided with a Z-axis cooling pipeline joint (311) at the inlet on the side of the Z-axis moving mounting seat (31), and the other end of the Z-axis cooling channel extends to the back of the Z-axis moving mounting seat (31) and forms an air outlet structure with multiple air outlets.

9. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 1, wherein: The X-axis moving module (2) comprises an X-axis linear motor (22), an X-axis moving guide rail (23) and an X-axis moving mounting seat (21) arranged on the cross beam device (1), the stator of the X-axis linear motor (22) is fixedly arranged on the cross beam device (1), the rotor of the X-axis linear motor (22) is fixedly connected with the X-axis moving mounting seat (21), and the X-axis linear motor (22) is used for driving the X-axis moving mounting seat (21) to move on the X-axis moving guide rail (23).

10. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 9, wherein: The X-axis moving module (2) further comprises an X-axis moving grating (24) arranged on the cross beam device (1) and an X-axis temperature sensor (25) arranged on the side of the rotor of the X-axis linear motor (22).

11. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 9, wherein: The X-axis moving module (2) further comprises an X-axis limit switch (26) and an X-axis limit buffer (27) arranged on the cross beam device (1).

12. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 9, wherein: The X-axis moving mounting seat (21) is arranged on the X-axis moving guide rail (23) through an X-axis moving guide rail seat, and the X-axis cooling channel is arranged in the position corresponding to the X-axis moving guide rail seat on the side of the X-axis moving mounting seat (21), the X-axis cooling pipeline joint (211) is arranged at the inlet on the side of the X-axis moving mounting seat (21), and the other end of the X-axis cooling channel extends to the back of the X-axis moving mounting seat (21) and forms an air outlet structure with multiple air outlets.

13. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 9, wherein: The crossbeam device (1) comprises a crossbeam body (11), one side of the crossbeam body (11) on which the X-axis moving guide rail (23) is installed is provided with a first lateral thickening part (111) and a second lateral thickening part (112), and a first lateral groove (113) is arranged between the first lateral thickening part (111) and the second lateral thickening part (112), the X-axis moving guide rail (23) comprises a first X-axis moving guide rail and a second X-axis moving guide rail which are parallel to each other, the first X-axis moving guide rail is arranged on the first lateral thickening part (111), the second X-axis moving guide rail is arranged on the second lateral thickening part (112), and the X-axis linear motor (22) is arranged in the first lateral groove (113).

14. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 1, wherein: The crossbeam device (1) is installed on a support platform of a drilling device through a first crossbeam base (12) and a second crossbeam base (13), and the crossbeam device (1), the first crossbeam base (12) and the second crossbeam base (13) are all marble components.

15. The drilling mechanism of a board-level TGV laser drilling apparatus according to any one of claims 1-14, wherein: Further comprising a laser (4) and a light path shaping box assembly (5), the light path shaping box assembly (5) comprises a sealed shaping box (51) with a shaping box light path entrance (511) and a shaping box light path exit (512), and along the light path of the laser beam, a first mirror (52), a second mirror (53), a beam expander (54), a glass sheet (55) and a third mirror (56) are sequentially arranged in the sealed shaping box (51), the shaping box light path entrance (511) is used for the laser beam emitted by the laser (4) to be emitted to the inside of the light path shaping box assembly (5), the shaping box light path exit (512) is used for the laser beam to be emitted from the light path shaping box assembly (5), and the laser beam emitted from the shaping box light path exit (512) of the light path shaping box assembly (5) is used to correspond to the light path entrance of the Z-axis light path box assembly (32), the Z-axis light path box assembly (32) has a fourth mirror inside and is used for reflecting the laser beam entering the inside of the Z-axis light path box assembly (32) to the Bessel cutting head (35) through the fourth mirror.

16. The drilling mechanism of the board-level TGV laser drilling apparatus according to claim 15, wherein: The first mirror (52), the second mirror (53) and the third mirror (56) are all installed in the sealed shaping box (51) through a three-dimensional adjusting frame (57), the beam expander (54) is installed in the sealed shaping box (51) through a two-dimensional adjusting frame (58), and the glass sheet (55) is installed in the sealed shaping box (51) through a six-dimensional adjusting frame (59).

17. A board-level TGV laser drilling apparatus, characterized by: The board-level TGV laser drilling device comprises the drilling machining mechanism of the board-level TGV laser drilling device according to any one of claims 1-16.

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