Electronic element injection mold convenient to demold

Abstract

The utility model discloses an electronic component injection mold convenient for demolding, which comprises a movable mold and a fixed mold, a cavity is arranged in the fixed mold, a plurality of through holes are arranged at the bottom of the cavity, a mounting cavity is arranged at the lower part of the fixed mold, the through holes extend to the mounting cavity, ejector pins are arranged in the through holes, and the lower ends of the ejector pins extend out of the through holes. A mounting cavity is formed in the base and provided with the same lifting plate, a bearing plate is arranged in the mounting cavity, a servo motor is arranged on the bearing plate, a lead screw is arranged on an output shaft of the servo motor, and the lead screw is in threaded connection with the lifting plate; the fixed mold is transversely provided with air channels, the air channels are communicated with the through holes respectively, one end of each air channel is provided with a connector, and the connectors are externally connected with a cold air source. The injection mold is provided with the liftable ejector pin, so that the injection mold forms an injection molding state, a cooling state and a demolding state, in the cooling state, the electronic element is cooled, the cooling efficiency is improved, and after cooling is completed, the ejector pin ascends, the electronic element is ejected out, and demolding is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to a mould technical field, concretely relates to an electronic component injection mould convenient to demould. BACKGROUND

[0002] Injection molding is a common manufacturing process, which is widely used in electronic component processing. With the continuous development of industrial technology and the improvement of market demand for product precision and quality, the design and manufacture of injection mold become more and more complex and precise. The existing mold needs to wait for a certain strength of the electronic component after solidification before demolding, which takes too long to wait and greatly affects the production speed of the product. UTILITY MODEL CONTENT

[0003] The utility model discloses to the defects and insufficient of prior art, provide a kind of electronic component injection mould convenient to demould.

[0004] To achieve the above object, the utility model adopts the technical scheme: a kind of electronic component injection mould convenient to demould, including movable die and fixed die, the fixed die is internally provided with cavity, its innovation point is: the bottom of the cavity is provided with multiple through holes, the lower part of the fixed die is provided with installation cavity, the through hole extends to installation cavity, the through hole is internally provided with ejector pin, the lower end of the ejector pin extends out of the through hole, and is provided with same lifting plate, the installation cavity is provided with support plate, the support plate is provided with servo motor, the output shaft of the servo motor is provided with screw rod, the screw rod is connected with lifting plate by screw thread, the top of the installation cavity is provided with installation slot, the installation slot is provided with bearing seat, the top of the screw rod is connected with bearing seat;The fixed die is laterally provided with air channel, and the air channel is respectively communicated with the through hole, one end of the air channel is provided with connector, and the connector is connected with cold gas source;The ejector pin is lifted under the action of screw rod, so that injection mold forms injection state, cooling state and demolding state.

[0005] Further, when the top of the ejector pin is in the same plane with the bottom of the cavity, it is in the injection state.

[0006] Further, when the ejector pin is lowered below the air channel, it is in the cooling state.

[0007] Further, when the ejector pin is raised above the bottom of the cavity, it is in the demolding state.

[0008] Further, the left and right sides of the installation cavity are provided with limiting grooves, the left and right sides of the lifting plate extend into the limiting grooves, the top of the limiting groove limits the demolding state, and the bottom of the limiting groove limits the cooling state; the middle of the limiting groove is provided with an infrared sensor emitting end, and the left and right sides of the lifting plate are provided with infrared sensor receiving ends; when the infrared sensor emitting end and the infrared sensor receiving end are in mutual induction, the injection molding state is limited.

[0009] After the above structure is adopted, the beneficial effects of the present application are as follows:

[0010] The present application has the beneficial effects that: the ejector pin can be lifted and lowered, the injection mold forms an injection molding state, a cooling state and a demolding state, after the injection molding state is completed, the ejector pin is lowered, the air channel is communicated with the through hole, cold air is delivered into the through hole through the air channel to cool the electronic component, the cooling efficiency is improved, after the cooling is completed, the ejector pin is lifted to eject the electronic component, which is beneficial to demolding. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 It is a structural schematic view of the present application;

[0012] Figure 2 It is a schematic view of the present application in a cooling state;

[0013] Figure 3 It is a schematic view of the present application in a demolding state.

[0014] BRIEF DESCRIPTION OF DRAWINGS

[0015] 1 moving die, 2 fixed die, 3 cavity, 4 through hole, 5 installation cavity, 6 ejector pin, 7 lifting plate, 8 supporting plate, 9 servo motor, 10 screw rod, 11 installation groove, 12 bearing seat, 13 air channel, 14 joint, 15 limiting groove, 16 infrared sensor emitting end, 17 infrared sensor receiving end. DETAILED DESCRIPTION

[0016] The present application will be further described below with reference to the drawings.

[0017] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0018] Referring to Figure 1The utility model provides an electronic component injection mold of easy demoulding, including movable mould 1 and fixed mould 2, and the fixed mould 2 is internally set up cavity 3, and the bottom of cavity 3 is provided with a plurality of through holes 4, and the lower part of fixed mould 2 is set up installation cavity 5, and through hole 4 extends to installation cavity 5, and the inside of through hole 5 is provided with ejector pin 6, and the lower end of ejector pin 6 extends out of through hole 4, and sets up same lift plate 7, and installation cavity 5 is provided with support plate 8, and support plate 8 is provided with servo motor 9, and the output shaft of servo motor 9 is provided with lead screw 10, and lead screw 10 is screw connected with lift plate 7, and the top of installation cavity 5 is set up installation groove 11, and installation groove 11 is provided with bearing seat 12, and the top of lead screw 10 is connected with bearing seat 12, and fixed mould 2 is set up air channel 13 transversely, and air channel 13 is communicated with through hole 4 respectively, and one end of air channel 13 is provided with connector 14, and connector 14 is connected with cold gas source, and ejector pin 6 is lifted under the action of lead screw 10, and makes the injection mold form injection state, cooling state and demoulding state. Specifically, servo motor 9 starts, drives lead screw 10 to rotate, and lift plate 7 is lifted along with the rotation of lead screw 10, that is, the lifting of ejector pin 6 is controlled, when the top surface of ejector pin 6 and the bottom of cavity 3 are in the same horizontal plane, movable mould 1 is lowered, and electronic component injection is carried out, after injection is completed, ejector pin 6 is lowered to below air channel 13, air channel 13 is communicated with through hole 4, and cold gas source sends cold gas into air channel 13 and through hole 4, and the electronic component is cooled, and the cooling efficiency is improved, after a period of cooling, ejector pin 6 is lifted, and the cooled electronic component is ejected, thereby facilitating demoulding.

[0019] In the embodiment, when the top of ejector pin 6 and the bottom of cavity 3 are in the same plane, it is the injection state (see Figure 1 ), so that the bottom of cavity 3 remains flat, thereby facilitating injection.

[0020] In the embodiment, when ejector pin 6 is lowered to below air channel 13, it is the cooling state (see Figure 2 ), air channel 13 is communicated with through hole 4, and cold gas is sent into through hole 4 through air channel 13, and the electronic component is cooled, and the cooling efficiency is improved, which assists demoulding.

[0021] In the embodiment, when ejector pin 6 is lifted above the bottom of cavity 3, it is the demoulding state (see Figure 3 ), and ejector pin 6 ejects the electronic component in cavity 3, thereby demoulding.

[0022] In the embodiment, the left and right sides of the installation cavity 5 are provided with limiting grooves 15, and the left and right sides of the lifting plate 7 extend into the limiting grooves 15; the top of the limiting groove 15 limits the demolding state, that is, limits the rising height of the ejector pin, so as to avoid damage to the electronic components caused by the rising height being too high; the bottom of the limiting groove limits the cooling state, that is, ensures that the ejector pin can be lowered below the air passage 13, while avoiding that the lowering depth is too large, which expands the stroke of the ejector pin; the middle of the limiting groove is provided with an infrared sensor transmitting end 16, and the left and right sides of the lifting plate 7 are provided with infrared sensor receiving ends 17; when the infrared sensor transmitting end 16 and the infrared sensor receiving end 17 are in mutual induction, the injection molding state is limited, the control system controls the servo motor 9 to stop working, and it is ensured that the top surface of the ejector pin is in the same plane as the bottom when the ejector pin is in the same plane.

[0023] The above is only used to illustrate the technical scheme of the utility model and is not limited, and other modifications or equivalent replacements of the technical scheme of the utility model made by those skilled in the art should be covered in the claim range of the utility model.

Claims

1. An electronic component injection mold facilitating demolding, comprising a movable mold and a fixed mold, a cavity being formed in the fixed mold, characterized in that: The bottom of the cavity is provided with a plurality of through holes, the lower part of the fixed mold is provided with a mounting cavity, the through holes extend to the mounting cavity, a ejector pin is arranged in the through hole, the lower end of the ejector pin extends out of the through hole, and a same lifting plate is arranged, a supporting plate is arranged in the mounting cavity, a servo motor is arranged on the supporting plate, a lead screw is arranged on the output shaft of the servo motor, the lead screw is in threaded connection with the lifting plate, a mounting groove is formed in the top of the mounting cavity, a bearing seat is arranged in the mounting groove, and the top of the lead screw is connected with the bearing seat; the fixed mold is transversely provided with air channels, the air channels are respectively communicated with the through holes, one end of the air channel is provided with a connector, and the connector is connected with a cold air source; the ejector pin is lifted and lowered under the action of the lead screw, so that the injection mold forms an injection state, a cooling state and a demolding state.

2. The electronic component injection mold facilitating demolding according to claim 1, characterized by: When the top of the ejector pin is in the same plane with the bottom of the cavity, the injection mold is in the injection state.

3. The electronic component injection mold facilitating demolding of claim 1, wherein: When the ejector pin is lowered below the air channel, the injection mold is in the cooling state.

4. The electronic component injection mold facilitating demolding of claim 1, wherein: When the ejector pin is raised above the bottom of the cavity, the injection mold is in the demolding state.

5. The electronic component injection mold facilitating demolding of claim 1, wherein: Limiting grooves are formed on the left and right sides of the mounting cavity, the left and right sides of the lifting plate extend into the limiting grooves, the top of the limiting groove limits the demolding state, and the bottom of the limiting groove limits the cooling state; an infrared sensor emitting end is arranged in the middle of the limiting groove, and infrared sensor receiving ends are arranged on the left and right sides of the lifting plate; when the infrared sensor emitting end and the infrared sensor receiving end are in mutual induction, the injection state is limited.

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