General grabbing device for large and medium-sized silicon wafer boxes
By designing a universal gripping device for large and medium-sized silicon wafer boxes, and utilizing the angle adjustment components and suspension rods for flexible adjustment, the problem of cumbersome disassembly and damage when replacing silicon wafers of different sizes in existing devices is solved, thus achieving efficient transfer of silicon wafers of different sizes.
Patent Information
- Application Number
- CN202520557403.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-03-27
AI Technical Summary
Existing silicon wafer cassette gripping devices require cumbersome disassembly and damage to screw holes when changing silicon wafers of different sizes, making the devices prone to damage and difficult to flexibly adapt to the transfer needs of silicon wafers of different sizes.
A universal gripping device for large and medium-sized silicon wafer cassettes was designed. By flexibly adjusting the angle adjustment component and the suspension rod, it can be applied to silicon wafer cassettes of different sizes, avoiding repeated disassembly of the suspension rod. The structure of movable groove and spring is used to ensure stability and flexibility.
It enables flexible adjustment of the gripping device without disassembling the suspension rod, is suitable for silicon wafer cassettes of different sizes, improves ease of operation, and reduces the risk of device damage.
Smart Images
Figure CN223906037U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of silicon wafer production, and concretely relates to a general grabbing device for large and medium size silicon wafer boxes. BACKGROUND
[0002] In the production process of silicon wafers, polishing is a very important link, which directly affects the final quality of the silicon wafers. In the whole polishing process, the silicon wafers need to be transferred between multiple devices, and a silicon wafer box needs to be used in the transfer process. A plurality of silicon wafers can be accommodated in one silicon wafer box, thereby improving the transfer efficiency of the silicon wafers. In the prior art, the grabbing device of the silicon wafer box mainly comprises a mounting rod capable of moving up and down, a plurality of grabbing mechanisms are fixedly arranged on the mounting rod, the grabbing mechanism comprises a suspension rod, a hook capable of hooking the upper edge of the silicon wafer box is fixedly connected to the lower end of the suspension rod. When silicon wafers of different sizes need to be processed, the grabbing mechanisms need to be adjusted, and the whole grabbing mechanism that is not used or the suspension rod in the grabbing mechanism that is not used is removed. The grabbing mechanism and the suspension rod are fastened by bolts, and the mounting and dismounting process is relatively cumbersome, and the screw hole is prone to damage after a long time, resulting in the scrapping of the grabbing mechanism. SUMMARY
[0003] In order to solve the problems in the prior art, the utility model provides a general grabbing device for large and medium size silicon wafer boxes, which can be flexibly adjusted to be suitable for grabbing silicon wafer boxes for large size silicon wafers or silicon wafer boxes for small size silicon wafers, and does not need to be repeatedly disassembled, is more convenient, and is not prone to damage.
[0004] In order to achieve the above-mentioned purpose, the utility model adopts the specific scheme that a general grabbing device for large and medium size silicon wafer boxes comprises a mounting rod and a plurality of grabbing mechanisms arranged on the mounting rod, wherein the grabbing mechanism comprises parallel pressing plates and a base plate, the pressing plate is fixedly connected with parallel first and second baffles, the pressing plate, the base plate, the first baffle and the second baffle enclose a clamping space for accommodating the mounting rod, the base plate is further rotatably connected with a suspension rod, the suspension rod is fixedly connected with a hook for grabbing the silicon wafer box, the base plate is provided with an angle adjusting assembly for adjusting the angle of the suspension rod, the angle adjusting assembly comprises a fixed plate arranged parallel to the base plate, an adjusting bolt is arranged on the fixed plate, the adjusting bolt can push the suspension rod to rotate during axial movement, and the suspension rod can drive the hook to rotate during rotation.
[0005] As a further optimization of the above-mentioned general grabbing device for large and medium size silicon wafer boxes, a movable groove is formed in the outer side wall of the base plate, and the movable groove penetrates to the lower edge of the base plate, a central shaft is fixedly arranged in the movable groove, a through hole is formed in the middle of the suspension rod, the central shaft passes through the through hole so that the suspension rod can rotate around the central shaft, and one end of the suspension rod is located in the movable groove, and the hook is fixedly arranged at the other end of the suspension rod.
[0006] As a further optimization of the above-mentioned universal grabbing device for large and medium-sized silicon wafer boxes, the angle adjusting assembly comprises two connecting plates fixedly connected with the outer side wall of the base plate and parallel to each other, and the two connecting plates are located on both sides of the movable slot, and the fixed plate is fixedly connected between the two connecting plates.
[0007] As a further optimization of the above-mentioned universal grabbing device for large and medium-sized silicon wafer boxes, a spring is arranged between the bottom of the movable slot and one end of the suspension rod located in the movable slot.
[0008] As a further optimization of the above-mentioned universal grabbing device for large and medium-sized silicon wafer boxes, one end of the suspension rod located in the movable slot is fixedly connected with a follower plate, and a limiting plate is fixedly arranged on the inner wall of the movable slot, and the follower plate can be in contact with the limiting plate during the rotation of the suspension rod.
[0009] As a further optimization of the above-mentioned universal grabbing device for large and medium-sized silicon wafer boxes, a notch is formed in the suspension rod, and the notch is located on the side of the hook.
[0010] As a further optimization of the above-mentioned universal grabbing device for large and medium-sized silicon wafer boxes, the base plate is fixedly connected with the first baffle and the second baffle through fastening bolts.
[0011] As a further optimization of the above-mentioned universal grabbing device for large and medium-sized silicon wafer boxes, a distance is left between or the two grabbing mechanisms are attached to each other on the mounting rod.
[0012] Beneficial effects: the present application can flexibly adjust the initial angle of the suspension rod in the grabbing mechanism, thereby changing the state of the grabbing mechanism, when all the grabbing mechanisms are adjusted to the working state, the grabbing device is suitable for grabbing the silicon wafer box of large-sized silicon wafer, when part of the grabbing mechanisms are adjusted to the standby state, the grabbing device is suitable for grabbing the silicon wafer box of small-sized silicon wafer, through this adjustment mode, the working condition of the grabbing device can be adjusted without repeatedly disassembling the suspension rod, which is more convenient and less likely to be damaged. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 is a schematic view of the overall structure of the grabbing device;
[0014] Figure 2 is a schematic view of the structure of the grabbing mechanism;
[0015] Figure 3 is a schematic view of the grabbing mechanism adjusted to the working state;
[0016] Figure 4 is a schematic view of the grabbing mechanism adjusted to the standby state.
[0017] Figure descriptions: 1-Mounting rod, 2-Gripping mechanism, 3-First baffle, 4-Pressure plate, 5-Second baffle, 6-Base plate, 7-Clamping space, 8-Fasting bolt, 9-Moving groove, 10-Central shaft, 11-Suspension rod, 12-Notch, 13-Hook, 14-Connecting plate, 15-Fixing plate, 16-Adjusting bolt, 17-Limiting plate, 18-Follower plate, 19-Spring. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] like Figures 1 to 2 As shown, a universal gripping device for large and medium-sized silicon wafer cassettes includes a mounting rod 1 and multiple gripping mechanisms 2 mounted on the mounting rod 1. Each gripping mechanism 2 includes a parallel pressure plate 4 and a base plate 6. The pressure plate 4 is fixedly connected to a parallel first baffle 3 and a second baffle 5. The pressure plate 4, base plate 6, first baffle 3, and second baffle 5 enclose a clamping space 7 for accommodating the mounting rod 1. The base plate 6 is fixedly connected to both the first baffle 3 and the second baffle 5 by fastening bolts 8. The base plate 6 is also rotatably connected to a suspension rod 11, which is fixedly connected to a hook 13 for gripping the silicon wafer cassette. The base plate 6 is provided with an angle adjustment assembly for adjusting the angle of the suspension rod 11. The angle adjustment assembly includes a fixing plate 15 parallel to the base plate 6, and an adjusting bolt 16 passes through the fixing plate 15. The adjusting bolt 16, during axial movement, can push the suspension rod 11 to rotate, and the rotation of the suspension rod 11 can drive the hook 13 to rotate.
[0020] In use, a plurality of grabbing mechanisms 2 are installed on the mounting rod 1 in advance, and the distance between two adjacent grabbing mechanisms 2 on the mounting rod 1 is left or they are attached to each other, and the two grabbing devices are a group and are cooperated to grab the wafer box, and the hooks 13 in the two grabbing devices in the same group are oppositely arranged one by one. In the production process of the silicon wafer, after the size of the silicon wafer is determined, each grabbing mechanism 2 in the grabbing device is adjusted, and specifically, the angle of the suspension rod 11 is adjusted through the angle adjusting assembly, and when the suspension rod 11 is parallel to the plate surface of the base plate 1, the suspension rod 11 and the hook 13 connected thereto enter the working state. When the wafer box needs to be grabbed, the mounting rod 1 is first driven to rotate around the axis thereof at a small amplitude, so that the distance between the hooks 13 of the two grabbing devices in the same group is increased, and then the mounting rod 1 is moved to drive the grabbing device to move towards the wafer box until the hooks 13 move to the vicinity of the upper edge of the wafer box, and then the mounting rod 1 is reset and drives the distance between the hooks 13 of the two grabbing devices in the same group to be reduced until the hooks 13 of the two grabbing devices are respectively hooked on the upper edge of the wafer box from the two sides of the wafer box, and finally the mounting rod 1 is moved to drive the grabbing device and the wafer box to move synchronously to realize the transfer of the wafer box. For large-size silicon wafers of eight inches and twelve inches, and medium-size silicon wafers of six inches and five inches, the sizes of the wafer boxes used are different, and if the size of the silicon wafer to be processed changes, the grabbing mechanism 2 can be adjusted again, and when adjusting, the angle of the suspension rod 11 is adjusted by using the angle adjusting assembly to make the suspension rod 11 form an obtuse angle with the base plate 6, as shown in Figure 4 FIG. 5, and at this time, the distance between the hooks 13 of the two grabbing devices in the same group is increased. After adjustment, even if the mounting rod 1 rotates, the adjusted hooks 13 cannot grab the upper edge of the wafer box, and at this time, the grabbing mechanisms 2 where the hooks 13 are located are in a standby state, and accordingly, the number of grabbing mechanisms 2 in the working state is small, and thus the grabbing device is suitable for grabbing the wafer box of the silicon wafer of a smaller size.
[0021] The utility model can flexibly adjust the initial angle of the suspension rod 11 in the grabbing mechanism 2, so as to change the state of the grabbing mechanism 2, when all the grabbing mechanisms 2 are adjusted to the working state, the grabbing device is suitable for grabbing the wafer box of the silicon wafer of a larger size, when part of the grabbing mechanisms 2 are adjusted to the standby state, the grabbing device is suitable for grabbing the wafer box of the silicon wafer of a smaller size, and through this adjustment mode, the working condition of the grabbing device can be adjusted without repeatedly disassembling the suspension rod 11, which is more convenient and is not easy to damage.
[0022] The suspension rod 11 is specifically arranged as follows: an active slot 9 is formed in the outer side wall of the base plate 6 and extends to the lower edge of the base plate 6, a central shaft 10 is fixedly arranged in the active slot 9, a through hole is formed in the middle of the suspension rod 11, the central shaft 10 passes through the through hole to enable the suspension rod 11 to rotate around the central shaft 10 and to enable one end of the suspension rod 11 to be located in the active slot 9, and a hook 13 is fixedly arranged at the other end of the suspension rod 11.
[0023] The fixing plate 15 is specifically arranged as follows: the angle adjusting assembly includes two connecting plates 14 which are fixedly connected with the outer side wall of the base plate 6 and are parallel to each other, the two connecting plates 14 are located at the two sides of the active slot 9, and the fixing plate 15 is fixedly connected between the two connecting plates 14. Based on the arrangement, the adjusting screw 16 only needs to be rotated to move along the axial direction of the adjusting screw 16, to push the upper end of the suspension rod 11, i.e., the end located in the active slot 9, to rotate, and to drive the lower end of the suspension rod 11, i.e., the end connected with the hook 13, to rotate, which is simple and convenient.
[0024] Although the adjusting screw 16 can push the suspension rod 11 to rotate, the suspension rod 11 cannot be pulled back to the original position, so that the grabbing mechanism 2 in the standby state cannot be adjusted to the working state. In order to avoid the problem, a spring 19 is arranged between the bottom of the active slot 9 and the end of the suspension rod 11 located in the active slot 9. When the grabbing mechanism 2 is adjusted from the working state to the standby state, the spring 19 is compressed. After the adjusting screw 16 is reversely rotated to release the upper end of the suspension rod 11, the spring 19 can rebound and push the suspension rod 11 back to the original position, so that the grabbing mechanism 2 in the standby state is adjusted to the working state again.
[0025] In order to ensure that the grabbing mechanism 2 can be stably in the working state and can stably grab the silicon wafer box, a follower plate 18 is fixedly connected to the end of the suspension rod 11 located in the active slot 9, and a limiting plate 17 is fixedly arranged on the inner wall of the active slot 9, and the follower plate 18 can be in contact with the limiting plate 17 during the rotation of the suspension rod 11. By the cooperation of the limiting plate 17 and the follower plate 18, the suspension rod 11 can be limited, so that the grabbing mechanism 2 can be stably in the working state. It should be noted that the spring 19 should also be in the compressed state at this time.
[0026] In order to facilitate the hook 13 to grab the silicon wafer box, a notch 12 is formed in the suspension rod 11 and located at the side of the hook 13, and a part of the silicon wafer box can enter the notch 12, so that the suspension rod 11 and the silicon wafer box do not interfere with each other.
[0027] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A universal grabbing device for large and medium-sized silicon wafer boxes, comprising a mounting rod (1) and a plurality of grabbing mechanisms (2) arranged on the mounting rod (1), wherein the grabbing mechanism (2) comprises a pressing plate (4) and a base plate (6) parallel to each other, the pressing plate (4) is fixedly connected with a first baffle (3) and a second baffle (5) parallel to each other, and the pressing plate (4), the base plate (6), the first baffle (3) and the second baffle (5) enclose a clamping space (7) for accommodating the mounting rod (1), characterized in that, The substrate (6) is also rotationally connected with a hanging rod (11), the hanging rod (11) is fixedly connected with a hook (13) for grabbing a silicon wafer box, an angle adjusting assembly for adjusting the angle of the hanging rod (11) is arranged on the substrate (6), the angle adjusting assembly comprises a fixed plate (15) arranged in parallel with the substrate (6), an adjusting bolt (16) is arranged on the fixed plate (15) in a penetrating mode, the adjusting bolt (16) can push the hanging rod (11) to rotate during axial movement, and the hanging rod (11) can drive the hook (13) to rotate during rotation.
2. A universal gripping device for large and medium size silicon wafer cassettes as claimed in claim 1, characterized in that, An active slot (9) is arranged on the outer side wall of the substrate (6) and penetrates to the lower edge of the substrate (6), a central shaft (10) is fixedly arranged in the active slot (9), a through hole is arranged in the middle of the hanging rod (11), the central shaft (10) passes through the through hole so that the hanging rod (11) can rotate around the central shaft (10), and one end of the hanging rod (11) is located in the active slot (9), and the hook (13) is fixedly arranged at the other end of the hanging rod (11).
3. A universal gripping device for large and medium size silicon wafer cassettes as defined in claim 2, wherein, The angle adjusting assembly comprises two connecting plates (14) fixedly connected with the outer side wall of the substrate (6) and parallel with each other, the two connecting plates (14) are located on the two sides of the active slot (9), and the fixed plate (15) is fixedly connected between the two connecting plates (14).
4. The universal grabbing device for large and medium sized silicon wafer boxes according to claim 3, characterized in that, A spring (19) is arranged between the bottom of the active slot (9) and one end of the hanging rod (11) located in the active slot (9).
5. A universal gripping device for large and medium size silicon wafer cassettes as defined in claim 4, wherein, One end of the hanging rod (11) located in the active slot (9) is fixedly connected with a follower plate (18), a limiting plate (17) is fixedly arranged on the inner wall of the active slot (9), and the follower plate (18) can be in contact with the limiting plate (17) during rotation of the hanging rod (11).
6. A universal gripping device for large and medium size silicon wafer cassettes as defined in claim 1, wherein, A notch (12) is arranged on the hanging rod (11) and located on the side of the hook (13).
7. A universal gripping device for large and medium size silicon wafer cassettes as defined in claim 1, wherein, The substrate (6) is fixedly connected with the first baffle (3) and the second baffle (5) through fastening bolts (8).
8. A universal gripping device for large and medium size silicon wafer cassettes as defined in claim 1, wherein, On the mounting rod (1), a distance is left between two adjacent grabbing mechanisms (2) or the two grabbing mechanisms (2) are attached to each other.